CN201314470Y - LED lamp body and lamp casing with high heat dissipation mechanism - Google Patents
LED lamp body and lamp casing with high heat dissipation mechanism Download PDFInfo
- Publication number
- CN201314470Y CN201314470Y CNU200820136560XU CN200820136560U CN201314470Y CN 201314470 Y CN201314470 Y CN 201314470Y CN U200820136560X U CNU200820136560X U CN U200820136560XU CN 200820136560 U CN200820136560 U CN 200820136560U CN 201314470 Y CN201314470 Y CN 201314470Y
- Authority
- CN
- China
- Prior art keywords
- lamp
- outer casing
- light emitting
- emitting diode
- lamp body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model relates to an LED lamp body and lamp casing with a high heat dissipation mechanism, comprising a lamp body and a casing. The lamp body comprises more than one LED units, an independent lamp base and a heat radiation layer cooling surface. The internal side of the lamp casing is a heat absorption end, and the external side of the lamp casing is a heat dissipation end. The utility model has another implement mode that an elastic high heat transmission structure body is arranged between the LED lamp body and the lamp casing. The heat dissipation of the utility model is carried out by providing the heat radiation layer cooling surface or the elastic high heat transmission structure body between the LED lamp body and the lamp casing, and therefore, the heat resistance status among the independent structures can be reduced, and the effect of rapid and reliable heat exhaust can be realized.
Description
Technical field
The utility model relates to the light emitting diode lamp body, is specifically related to a kind of light emitting diode lamp body and lamp outer casing with high radiator structure.
Background technology
Along with improving constantly of light emitting diode (LED) power, the waste heat of its work increases relatively, and because of the discharging of waste heat influences the service life and the bright intensity of diode relatively, therefore heat radiation becomes the key technology of light emitting diode.At present, the heat dissipation technology of led lamp has following, is example with the LED street lamp:
1, High Power LED is concentrated on the changeable type lamp socket, owing to adopt the street lamp of this mode to need high illuminance and higher water proof and dust proof requirement, this replacing formula lamp socket LED light lamp need be enclosed within the lamp housing of IP65, causes to dispel the heat bad and serious problems that damage fast or burn;
2, for trying to achieve the good heat radiating condition of large-power light-emitting diodes, the way of knowing at present is that a plurality of light emitting diodes directly are installed on the shell lamp body, discharges heat by the radiating fin at the shell back side again.But this The Application of Technology when the part light emitting diode damages, needs whole lamp body is pulled down replacing or trimming, and engineering is huge and spend high.
Summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency of the prior art, and a kind of light emitting diode lamp body and lamp outer casing with high heat sinking mechanism is provided.
The purpose of this utility model is achieved through the following technical solutions.
A kind of light emitting diode lamp body and lamp outer casing with high heat sinking mechanism, comprise lamp body and shell, described lamp body has one above light emitting diode, has independently lamp socket, lamp body also has the heat radiation layer radiating surface, the inboard of described lamp outer casing is a heat absorbing end, and the outside of lamp outer casing is a radiating end.
The heating end surfaces of light emitting diode lamp body is provided with radiating fin; Perhaps, be provided with plane or shrinkage pool or protruding grain or porous crack or Sponge hole, select one kind of structure at the heating end.
Constitute the material of LED light lamp body heat radiating layer, be selected from diamond, class and bore at least a in carbon (DLC), Nano diamond, CNT, nano carbon microsphere, little carbon granules, boron nitride, aluminium nitride, the carborundum; Perhaps at least a in the high molecular polymer of above-mentioned substance.
The heat absorbing end surface of lamp outer casing inboard is provided with fin; Perhaps, plane or shrinkage pool or protruding grain or porous crack or Sponge hole are set on the heat absorbing end surface, select one kind of structure.
Constitute the material of the inboard heat absorbing end surface heat of lamp outer casing absorbed layer, be selected from least a in little carbon granules, carbon black, the titanium dioxide powder; Perhaps at least a in the high molecular polymer of above-mentioned substance.
The radiating end surface of lamp outer casing outside is provided with fin; Perhaps, plane or shrinkage pool or protruding grain or porous crack or Sponge hole are set on the radiating end surface, select one kind of structure.
Constitute the heat radiation layer of the outside radiating end of lamp outer casing, its material is selected from diamond, class and bores at least a in carbon (DLC), Nano diamond, CNT, nano carbon microsphere, little carbon granules, boron nitride, aluminium nitride, the carborundum; Perhaps at least a in the high molecular polymer of above-mentioned substance.
This light emitting diode lamp body has more than one light emitting diode, has independently lamp socket and radiating surface, lamp outer casing, and it is inner to be that heat absorption end face, outside are the heat radiation end face; Flexible high heat transfer structure body in the middle of light emitting diode lamp body and lamp outer casing.
The radiating end surface of described lamp outer casing outside is provided with radiating fin, or on heating end, the plane is set, shrinkage pool, protruding grain, porous crack or Sponge hole, select a kind of of said structure as heat radiation layer.
The high heat transfer structure body of described elasticity is settled the location by fixed mount, and touches the heat absorption end face of the inside of the heat radiation end face of light emitting diode lamp body and lamp outer casing.
The utility model passes the heat radiation connect mechanism of body structure by a kind of tool heat radiation layer structure or tool elasticity heat are provided between the lamp body of light emitting diode and lamp outer casing, can reduce the thermal resistance state between each absolute construction body, reach the positive effect that heat is reliably discharged and discharged fast.
Description of drawings
Fig. 1 is a kind of embodiment of the utility model---the light emitting diode lamp body of heat radiation layer structure and the profile of lamp outer casing;
Fig. 2 is the another kind of embodiment of the utility model---have the light emitting diode lamp body of elasticity heat transfer structure body and the profile of lamp outer casing.
Among the figure: 1, light emitting diode lamp body, 11, light emitting diode, 12, radiating surface, 13, radiating fin, 14, heat radiation layer, 15, independent lamp socket, 2, lamp outer casing, 21, the shell radiating fin, 22, the shell heat radiation layer, 23, lamp socket joint, 24, cloche, 25, shell heat absorption layer, 26, lamppost, 27, enclosure heat absorption end face, 3, elasticity heat transfer structure body.
The specific embodiment
Referring to Fig. 1, Fig. 2, the light emitting diode lamp body and the lamp outer casing of the utility model tool high heat sinking mechanism, be that a kind of mechanism of dispelling the heat and linking is provided between light emitting diode lamp body and lamp outer casing, to reduce the thermal resistance state between each absolute construction body, reach really and the usefulness of discharge fast heat.
Referring to Fig. 1, light emitting diode lamp body and lamp outer casing with the high heat radiation of heat radiation layer structure, comprise: one has an above light emitting diode 11, the lamp body 1 of independent lamp socket 15 and radiating surface, the heat-delivery surface 12 of this lamp heating end is provided with radiating fin 13, or on the heating end, the plane is set, shrinkage pool, protruding grain, porous crack or Sponge hole are selected wherein a kind of structure, and in this body structure surface with evaporation, sputter, electroplate, sintering or spraying method select one to make heat radiation layer 14, and the material system of this heat radiation layer 14 is selected from diamond, class is bored carbon (DLC), Nano diamond, CNT, nano carbon microsphere, little carbon granules, boron nitride, aluminium nitride, at least a kind of material of carborundum or above-mentioned material and polymer conjugate.One have inboard for heat absorbing end and the outside be the lamp outer casing 2 of radiating end: this heat absorbing end surface, inboard is provided with radiating fin 21, or plane, shrinkage pool, protruding grain, porous crack or Sponge hole are set on end face select wherein a kind of structure, and select one to make heat radiation layer 22 with evaporation, sputter, plating, sintering or spraying method in this body structure surface, the material system of this heat absorption layer is selected from little carbon granules, carbon black, titanium dioxide powder etc. or above-mentioned material and macromolecular material bond;
This radiating end surface, outside is provided with radiating fin, or plane, shrinkage pool, protruding grain, porous crack or Sponge hole are set on heating end select wherein a kind of structure, and select one to make heat radiation layer with evaporation, sputter, plating, sintering or spraying method in this body structure surface, the material system of this heat radiation layer is selected from diamond, class is bored carbon (DLC), Nano diamond, CNT, nano carbon microsphere, little carbon granules, boron nitride, aluminium nitride, carborundum or above-mentioned material and macromolecular material bond.
Implementation method one:
Consult shown in Figure 1ly, a kind of mechanism of tool heat radiation binder couse is provided between light emitting diode lamp body 1 and lamp outer casing 2.This light emitting diode lamp body 1 has the lamp body of an above light emitting diode 11, independent lamp socket 15 and radiating surface 12, and lamp heating end surfaces is provided with radiating fin 13 or heat radiation layer 14 structures of high surface are set on the heating end.Lamp outer casing 2 tools are inboard to be that the heat absorbing end and the outside are radiating end, and this heat absorbing end surface, inboard is provided with the shell heat absorption structure sheaf 25 of fin or high surface, and radiating end surface, the outside is provided with shell radiating fin 21 or heat radiation layer 22 structures.Therefore the heat that produced of LED lamp unit 11, fin 13 surface heat radiating layers 14 through light emitting diode lamp body 1 are discharged lamp body, the radiant heat of this discharge absorbs via the heat absorption layer 25 on the inner heat absorbing end of lamp outer casing surface, be passed to outside radiating end by lamp housing, discharge by the radiating end surface of shell fin 21 or making shell heat radiation layer 22 again, therefore should design reduce the thermal resistance state between each absolute construction body, make to reach really and the usefulness of discharge fast heat.
Another embodiment of the utility model: tool elasticity heat passes the light emitting diode lamp body and the lamp outer casing of the high heat radiation of body structure, comprising:
One has the lamp body of an above light emitting diode, independent lamp socket and radiating surface;
One has the lamp outer casing unit of inner heat absorption end face and outside heat radiation end face, this radiating end surface, outside is provided with radiating fin 21, shrinkage pool, protruding grain, porous crack or Sponge hole and selects wherein a kind of structure, and select one to make heat radiation layer 22 with evaporation, sputter, plating, sintering or spraying method in this body structure surface, the material system of this heat radiation layer is selected from diamond, class is bored carbon (DLC), Nano diamond, CNT, nano carbon microsphere, little carbon granules, boron nitride, aluminium nitride, carborundum or above-mentioned material and macromolecular material bond;
One has around property and flexible high heat transfer structure body 3, and this flexible high heat transfer structure body 3 is settled through fixed mount, and the inside heat absorption end face 27 of the radiating surface of contact light emitting diode lamp body and lamp outer casing.
Implementation method two:
See also Fig. 2, between light emitting diode lamp body 1 and lamp outer casing 2, provide a kind of and have, as the mechanism of heat radiation binding around property and flexible high heat transfer structure body.This light emitting diode lamp body 1 has the lamp body of an above light emitting diode 11, independent lamp socket 15 and radiating surface 12; Lamp outer casing 2 has the lamp outer casing unit of enclosure heat absorption end face 27 and outside heat radiation end face, and this radiating end surface, outside is provided with shell heat radiation layer 22 structures of shell radiating fin 21 or high surface; One has around property and elasticity heat transfer structure body 3, and this elasticity heat transfer structure body 3 is settled through fixed mount, and the inside heat absorption end face 27 of the radiating surface 13 of contact light emitting diode lamp body 1 and lamp outer casing.
Therefore the heat that produced of LED lamp unit 11, fin 13 surface contacts through light emitting diode lamp body 1 have elasticity heat transfer structure body 3, this elasticity heat transfer structure body 3 contacts with 27 bindings of the inner heat absorption of lamp outer casing end face again, the heat of this discharge absorbs via the inner heat absorbing end superficial layer of lamp housing, be passed to outside radiating end by lamp housing, discharge by the radiating end surface of shell fin 21 or making shell heat radiation layer 22 again, to remove the thermal resistance state between each absolute construction body.
Claims (7)
1. a light emitting diode lamp body and lamp outer casing with high heat sinking mechanism, comprise lamp body and shell, it is characterized in that: described lamp body has one above light emitting diode, has independently lamp socket, lamp body also has the heat radiation layer radiating surface, the inboard of described lamp outer casing is a heat absorbing end, and the outside of lamp outer casing is a radiating end.
2. light emitting diode lamp body and the lamp outer casing with high heat sinking mechanism according to claim 1 is characterized in that: the heating end surfaces of light emitting diode lamp body is provided with radiating fin; Perhaps, be provided with plane or shrinkage pool or protruding grain or porous crack or Sponge hole, select one kind of structure at the heating end.
3. light emitting diode lamp body and the lamp outer casing with high heat sinking mechanism according to claim 1 is characterized in that: the heat absorbing end surface of lamp outer casing inboard is provided with fin; Perhaps, plane or shrinkage pool or protruding grain or porous crack or Sponge hole are set on the heat absorbing end surface, select one kind of structure.
4. light emitting diode lamp body and the lamp outer casing with high heat sinking mechanism according to claim 1 is characterized in that: the radiating end surface of lamp outer casing outside is provided with fin; Perhaps, plane or shrinkage pool or protruding grain or porous crack or Sponge hole are set on the radiating end surface, select one kind of structure.
5. a light emitting diode lamp body and lamp outer casing with high heat sinking mechanism, it is characterized in that: this light emitting diode lamp body has more than one light emitting diode, has independently lamp socket and radiating surface, lamp outer casing, it is inner to be that heat absorption end face, outside are the heat radiation end face; Flexible high heat transfer structure body in the middle of light emitting diode lamp body and lamp outer casing.
6. light emitting diode lamp body and the lamp outer casing with high heat sinking mechanism according to claim 5, it is characterized in that: the radiating end surface of described lamp outer casing outside is provided with radiating fin, plane, shrinkage pool, protruding grain, porous crack or Sponge hole perhaps are set on the heating end, select a kind of of said structure as heat radiation layer.
7. light emitting diode lamp body and the lamp outer casing with high heat sinking mechanism according to claim 5, it is characterized in that: the high heat transfer structure body of described elasticity, settle the location by fixed mount, and touch the heat absorption end face of the inside of the heat radiation end face of light emitting diode lamp body and lamp outer casing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200820136560XU CN201314470Y (en) | 2008-09-16 | 2008-09-16 | LED lamp body and lamp casing with high heat dissipation mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200820136560XU CN201314470Y (en) | 2008-09-16 | 2008-09-16 | LED lamp body and lamp casing with high heat dissipation mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201314470Y true CN201314470Y (en) | 2009-09-23 |
Family
ID=41126263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU200820136560XU Expired - Fee Related CN201314470Y (en) | 2008-09-16 | 2008-09-16 | LED lamp body and lamp casing with high heat dissipation mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201314470Y (en) |
-
2008
- 2008-09-16 CN CNU200820136560XU patent/CN201314470Y/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| IES20050086A2 (en) | A utility lamp | |
| CN101963337B (en) | Lighting device | |
| JP2009182327A (en) | Led illuminating device, led light source module, and led support member | |
| CN101943381A (en) | LED heat radiation module | |
| CN202144956U (en) | Novel LED light fixture | |
| CN101694290A (en) | LED lamp liquid radiator | |
| CN101358722A (en) | LED lamp body and lamp case with high heat sinking mechanism | |
| CN201314470Y (en) | LED lamp body and lamp casing with high heat dissipation mechanism | |
| CN201425284Y (en) | Embedded radiator with a new structure and light emitting diode and light emitting diode light | |
| CN201739874U (en) | Integrated LED bulb | |
| CN201314509Y (en) | Heat-dissipating structure of porous-material lampshade | |
| CN201696926U (en) | LED lamp for built-in heat-conducting piece of lampshade | |
| CN203165947U (en) | Novel LED heat radiation structure | |
| TWI358515B (en) | Heat dissipation structure for light-emitting comp | |
| CN203349028U (en) | Integral light source heat-dissipating module of LED (Light Emitting Diode) lamp | |
| CN202580946U (en) | Novel light-emitting diode (LED) street lamp | |
| CN201858554U (en) | LED illuminating lamp | |
| CN207146118U (en) | A kind of LED electricity-saving lamps for lamp box label | |
| CN101625086A (en) | High-power led energy-saving lamp | |
| CN105371123A (en) | Large-power LED (light-emitting diode) module | |
| CN201141578Y (en) | Heat conduction structure and heat radiating device of LED lamp | |
| CN210069798U (en) | LED driving power panel of lighting lamp | |
| CN201072050Y (en) | Heat radiating device of road lamp | |
| CN2797872Y (en) | LED solid illumination device with heat radiation module | |
| CN106322129B (en) | Lamp fitting |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090923 Termination date: 20130916 |