CN201312306Y

CN201312306Y - Radio-frequency module

Info

Publication number: CN201312306Y
Application number: CNU2008202048842U
Authority: CN
Inventors: 黄勇
Original assignee: Individual
Current assignee: Suzhou Bohai Microsystem Co Ltd
Priority date: 2008-12-05
Filing date: 2008-12-05
Publication date: 2009-09-16
Anticipated expiration: 2018-12-05

Abstract

A radio-frequency module comprises a multilayer circuit board, a shielding case, a radio-frequency port, a radio-frequency circuit covered by the shielding case, and feeders connected between the radio-frequency port and the radio-frequency circuit; the multilayer circuit board is provided with an upper ground plane, a lower ground plane and at least one circuit layer; the upper ground plane is exposed and located on the upper end surface of the multilayer circuit board; the circuit layer is located between the upper and the lower ground planes; all the feeders are located on the same circuit layer; the multilayer circuit board comprises a first groove and a second groove; the circuit layer, on which the feeders are located, forms the groove bottoms of the first and the second grooves; the radio-frequency port is arranged in the first groove; the radio-frequency circuit is arranged in the second groove; and the shielding case is connected with the upper ground plane of the multilayer circuit board and encloses a closed space with the second groove. The radio-frequency module can be applied to the situation where the shielding case and the upper end surface of a circuit board are connected in a hermetically sealed manner, and ensure the quality of radio-frequency transmission.

Description

Radio-frequency module

Technical field

The utility model relates to radio-frequency module, relates in particular to the feed structure in the radio-frequency module.

Background technology

Existing radio-frequency module, normally the regional area at a multilayer circuit board makes up the passive or active radio circuit with certain function.This multilayer circuit board can be a printed circuit board (PCB), also can be a LTCC (LTCC) plywood.This radio circuit has last ground plane exposure, that be positioned at upper end face, exposes or be not exposed to the following ground plane of rear surface, and this upper and lower ground plane connects by the metal aperture that connects usually.And, in order to ensure the radio circuit operate as normal, also can the upper end face setting with should on the radome that is connected of ground plane.And this radio circuit can be arranged on this upper end face, also can be on one or more line layer that is provided with between this upper and lower ground plane.

This radio-frequency module in order to realize feed, is provided with a radio frequency connectivity port in place on the multilayer circuit board, outside the radome coverage, usually in order to be electrically connected with external equipment/circuit.This radio frequency connectivity port can be a pad, also can be a radio frequency connector.This radio frequency connectivity port used a feed line to link to each other with this radio circuit.The simplest structure of feed line, it is the microstrip line that forms at same one deck with last ground plane, this can bring a problem, that is exactly, between radome and multilayer circuit board, can form the slit in the place that microstrip line passes through radome, thereby this structure can't be applied to make the scene that is connected positive confinement of radome and the upper end face of multilayer circuit board.At such application scenarios, existing common implementation method is, in the order, line layer between the following ground plane has one deck line layer at least, like this, the structure of feed line is roughly divided into and to be exposed to upper end face, join with the radio frequency connectivity port first section, line layer in the middle of being positioned at is to pass through second section of radome and to be exposed to upper end face, join with radio circuit the 3rd section, as seen, this structure, to there be two metallization via holes on the feed line, than the simplest above-mentioned feeder structure, can increase radio frequency loss and interference, influence the quality of radio frequency transmission.

As seen, the radio-frequency module of prior art will satisfy the situation that is connected the application scenarios that seals fully of radome and the upper end face of multilayer circuit board, be able to radio frequency transmission quality drop to cost.

Summary of the invention

The technical problems to be solved in the utility model is at the deficiencies in the prior art part, and proposes the radio-frequency module that is connected the scene that seals fully a kind of quality with good radio frequency transmission, that can be applied to radome and the upper end face of circuit board.

The technical scheme in the invention for solving the above technical problem is, manufacture and design a kind of radio-frequency module, comprise multilayer circuit board, radome, prevention at radio-frequency port, the radio circuit that covers by this radome and be connected in feed line between this prevention at radio-frequency port and the radio circuit; This multilayer circuit board has last ground plane that expose, that be positioned at upper end face, once a ground plane and at least one line layer between this upper and lower ground plane; This feed line is positioned at same line layer, this multilayer circuit board comprises first groove and second groove, the line layer at this feed line place constitutes the bottom land of this first groove and this second groove, this prevention at radio-frequency port is arranged in this first groove, this radio circuit is arranged in this second groove, and this radome links to each other with the last ground plane of this multilayer circuit board and surrounds out a confined space with this second groove.

Compare with prior art, radio-frequency module of the present utility model, radome is connected with multilayer circuit board is airtight, and feed line is positioned at same line layer, thereby, can be applied to radome and circuit board upper end face be connected the scene that seals fully, and guarantee the quality of radio frequency transmission.

Description of drawings

Fig. 1 is the cross section structure schematic diagram of radio-frequency module embodiment of the present utility model.

Fig. 2 is the plan structure schematic diagram of radio-frequency module embodiment of the present utility model.

Fig. 3 has removed the structural representation behind the radome among Fig. 2.

Embodiment

Be described in further detail below in conjunction with the most preferred embodiment shown in the accompanying drawing.

Radio-frequency module of the present utility model as shown in Figure 1 to Figure 3, comprising: multilayer circuit board 1, radome 2, prevention at radio-frequency port 3, the radio circuit 4 that is covered by this radome 2 and be connected in feed line 5 between this prevention at radio-frequency port 3 and the radio circuit 4; This multilayer circuit board 1 is printed circuit board (PCB) or the ltcc layer stack plate that has three-layer metal layer and the two layer medium layer between this three-layer metal layer at least.

Referring to Fig. 1, this multilayer circuit board 1 has last ground plane 11 exposure, that be positioned at upper end face, the following ground plane 12 that exposes, be positioned at rear surface, a line layer between this upper and lower ground plane is at first dielectric layer 13 between last ground plane 11 and the line layer and second dielectric layer 14 between following ground plane 12 and line layer; This feed line 5 is positioned at this line layer.

This multilayer circuit board 1 comprises first groove 15 and second groove 16, the line layer at these feed line 5 places constitutes the bottom land of this first groove 15 and this second groove 16, this prevention at radio-frequency port 3 is arranged in this first groove 15, this radio circuit 4 is arranged in this second groove 16, these radome 2 airtight last ground planes 12 that are connected in this multilayer circuit board 1, and this radome 2 surrounds out a confined space with this second groove 16.

Referring to Fig. 2 and Fig. 3, feed line 5 comprises first section 51, be positioned under first dielectric layer 13, pass through radome 2 second section 52 and the 3rd section 53.As seen, first section 51 is directly to expose, and second section 52 is to be embedded under the wall that the sidewall 161 by the sidewall 151 of adjacent, first groove 15 and second groove 16 constitutes, and the 3rd section 53 are exposed to radome 2 times.Need to prove, in Fig. 3, second section 52 actual can't see, thereby be represented by dotted lines.

Further, one the 3rd groove 17 can be set, and radio circuit 4 is arranged in the 3rd groove 17 at the bottom land place of this second groove 16.And, can adopt lead 6 to connect the 3rd section 53 and radio circuit 4 of this feed line 5.

This prevention at radio-frequency port 3 can only be a simple pad, preferably, in the present embodiment, is a radio frequency connector, can link to each other with external equipment/circuit by radio frequency cable 7.

Radio-frequency module embodiment of the present utility model, no matter be in microwave or Millimeter Wave Applications situation, radome is connected with multilayer circuit board is airtight, and feed line is positioned at same line layer, thereby, can be applied to radome and circuit board upper end face be connected the scene that seals fully, and guarantee the quality of radio frequency transmission.

Claims

1, a kind of radio-frequency module comprises multilayer circuit board, radome, prevention at radio-frequency port, the radio circuit that is covered by this radome and be connected in feed line between this prevention at radio-frequency port and the radio circuit; This multilayer circuit board has last ground plane that expose, that be positioned at upper end face, once a ground plane and at least one line layer between this upper and lower ground plane; This feed line is positioned at same line layer, it is characterized in that, this multilayer circuit board comprises first groove and second groove, the line layer at this feed line place constitutes the bottom land of this first groove and this second groove, this prevention at radio-frequency port is arranged in this first groove, this radio circuit is arranged in this second groove, and this radome links to each other with the last ground plane of this multilayer circuit board and surrounds out a confined space with this second groove.

2, radio-frequency module as claimed in claim 1 is characterized in that, this radio-frequency module also comprises the 3rd groove at the bottom land place that is arranged on this second groove and in order to connect the lead of this feed line and radio circuit, described radio circuit is arranged in the 3rd groove.

3, radio-frequency module as claimed in claim 1 is characterized in that, the following ground plane on this multilayer circuit board be expose, be positioned at rear surface.

4, radio-frequency module as claimed in claim 1 is characterized in that, this prevention at radio-frequency port is a radio frequency connector.

5, radio-frequency module as claimed in claim 1 is characterized in that, this prevention at radio-frequency port is a radio frequency connection pad.

6, radio-frequency module as claimed in claim 1 is characterized in that, this multilayer circuit board is a printed circuit board (PCB).

7, radio-frequency module as claimed in claim 1 is characterized in that, this multilayer circuit board is the ltcc layer stack plate.

As the arbitrary described radio-frequency module of claim 1 to 7, it is characterized in that 8, this radio-frequency module is a microwave module.

As the arbitrary described radio-frequency module of claim 1 to 7, it is characterized in that 9, this radio-frequency module is a millimeter wave module.