CN201303329Y

CN201303329Y - Small-package dustproof module capable of hot plug

Info

Publication number: CN201303329Y
Application number: CNU2007201962555U
Authority: CN
Inventors: 刘毅
Original assignee: ZTE Corp
Current assignee: ZTE Corp
Priority date: 2007-12-21
Filing date: 2007-12-21
Publication date: 2009-09-02
Anticipated expiration: 2017-12-21

Abstract

The utility model discloses a small-package dustproof module capable of hot plug, which is characterized in that the module comprises a shell and a golden finger, wherein the shell is the same as the shell of an optical module; the golden finger is fixed in the shell; the contact pin end of the golden finger is used for closely contacting with a metal spring leaf in the slot of the optical module when in inserting, and the other end thereof is vacant without electrical connection. When in use, the dustproof module is only inserted in an SFP optical-port slot that is not used, thereby effectively preventing the dust from entering; moreover, the golden finger of the dustproof module is closely contacted with the metal spring leaf of an SFP socket, thereby preventing the metal spring leaf from being oxygenized owing to dust and moisture; compared with an SFP optical module with normal function, the small-package dustproof module is not provided with a laser component and an electronic component, therefore, the price is low, and the cost of communication equipment is not obviously increased, while the long-running reliability of the communication equipment is greatly improved.

Description

The hot-swappable dustproof module of little encapsulation

Technical field

The utility model relates to the communication equipment technical field, relates in particular to the applied technical field of the hot-swappable optical module of the little encapsulation of SFP (SFP optical module, Small Form-factor Pluggable, the hot-swappable optical module of little encapsulation).

Background technology

The requirement that the SFP optical module meets INFMSA multi-source agreement (MultiSource Agreement) has been born photoelectricity/electric light and has been changed this indispensable key player in communication apparatus, because the SFP optical module has little, hot-swappable these two advantages of encapsulation.Encapsulate for a short time, then in the design of integrated circuit board, can design a plurality of use SFP optical module optical interfaces on the integrated circuit board; Hot-swappable, then on the panel of integrated circuit board, will leave and can come the optical interface of maintain communications equipment easily by hot plug operations for the groove position of optical module plug.

The SFP optical module uses in the Optical Fiber Interface Board of communication equipment usually, and Optical Fiber Interface Board has a plurality of optical interfaces usually, the Optical Fiber Interface Board of 4,8 or 16 for example common light mouths.It is not the situation that full configuration is put use that SFP Optical Fiber Interface Board with many light mouth might occur in use, under specific environment, only use one of them or several SFP light mouth, remaining several light mouth is temporarily on the shelf, but these light mouths use also will keep in order to later message capacity dilatation the time.

Because the consideration cost factor, so temporary transient obsolete light mouth is not generally inserted optical module, might be long-term idle, when using this light mouth, plug by needs optical module again.Therefore, following two problems can appear in the light mouth of vacancy SFP optical module:

1) the inner SFP socket of Optical Fiber Interface Board is exposed in the air;

2) the Optical Fiber Interface Board panel leaves dead slot owing to not inserting optical module, is revealed as a cavity on the panel, and is not attractive in appearance.

Along with the continuous increase of message capacity, therefore the power consumption of each integrated circuit board of communication equipment also constantly increases and causes caloric value to increase, and in order to be beneficial to heat radiation, the integrated circuit board in the communication equipment all requires to work under good circulation of air.Leave SFP optical module dead slot on the Optical Fiber Interface Board, extraneous dust and aqueous vapor are easy to enter, if things go on like this, the metal spring leaf of idle SFP golden finger slot is easy to be subjected to erosion, the oxidation of dust and aqueous vapor on the integrated circuit board, when inserting the SFP optical module when the needs dilatation, may cause the metal spring leaf loose contact of the golden finger and the integrated circuit board SFP slot of SFP optical module, break down.Therefore, need a kind of device of design, prevent that above-mentioned failure condition from taking place, the outward appearance of also beautifying communication equipment simultaneously.

The utility model content

In order to solve SFP optical module socket is etched oxidation easily in not using for a long time problem, the utility model provides a kind of little encapsulation hot-swappable dustproof module, has realized the dustproof and anti-oxidation of the idle socket of the SFP on the integrated circuit board.

The hot-swappable dustproof module of the little encapsulation that the utility model proposes comprises: shell, golden finger; Described shell is identical with the shell of optical module; Described golden finger is fixing in the enclosure; Closely contact with the metal spring leaf of optical module slot when the contact pin end of golden finger is used for inserting, the other end is vacant, is not electrically connected.

Preferably, described module also comprises fixing dustproof plug in the enclosure, sealing light mouth when this dustproof plug is used to insert.

Preferably, on described shell, also be provided with pull bar, and the color of this pull bar or shape are different from optical module.

The dustproof module of the SFP that the utility model proposes in use, as long as be inserted on the idle obsolete SFP light mouth slot, can prevent effectively that promptly dust from entering, and, can prevent the pollution oxidation of metal spring leaf because of dust and aqueous vapor because the golden finger of dustproof module closely contacts with the metal spring leaf of the SFP socket of integrated circuit board.And the dustproof module of the SFP that the utility model proposes compares normally functioning SFP optical module, do not have laser components and parts and electronic devices and components, and is cheap, can significantly not increase the cost of communication equipment, but improved the reliability of communication equipment long-time running greatly.

Description of drawings

Fig. 1 is the dustproof module profile schematic diagram of SFP that the utility model proposes;

Fig. 2 is the dustproof module golden finger structural representation of SFP that the utility model proposes;

Fig. 3 is the dustproof plug structural representation of the dustproof module of SFP that the utility model proposes.

Embodiment

Below in conjunction with accompanying drawing and by specific embodiment the utility model is elaborated.

As shown in Figure 1, the SFP that the utility model proposes module of preventing dust, its profile is identical with common SFP optical module, meets the requirement of SFP MSA multi-source agreement.For the convenience of manufacturing, adopt and the identical mechanical cover of common SFP optical module.

Mainly comprise in the shell of the dustproof module of the SFP that the utility model proposes: golden finger and dustproof plug.Any laser components and parts and electronic devices and components are not set in the shell.Wherein, the structure of golden finger as shown in Figure 2, the structure of dustproof plug is as shown in Figure 3.

Use 20 pin golden fingers in the present embodiment, also be to adopt printed circuit board (PCB, the printed circuit board) design identical, but any electronic devices and components are not installed on the PCB with common SFP optical module.Figure 2 shows that one side 10 pin golden fingers.Closely contact with the metal spring leaf of optical module slot when the contact pin end of golden finger is used for inserting, the other end is vacant, does not carry out any being electrically connected.

The Guang Kou position of dustproof module disposes dustproof plug as shown in Figure 3, and sealing light mouth when this dustproof plug is used to insert prevents that dust etc. from entering dustproof module.

In addition, for normally functioning common SFP optical module difference, the pull bar color of the dustproof module of SFP needs special requirement, with the pull bar color of existing definition in the MSA multi-source agreement of SFP can not be identical.For example, in order to separate with the normal optical block region, the pull bar definitions of color of dustproof module is a white, and white is not in the range of definition of MSA multi-source agreement.

From above structure as can be seen because the dustproof module of the SFP that the utility model proposes has been saved expensive Laser Devices and internal electronic component, so dustproof optical module cost reduce greatly, simple in structure, easy to operate.

Above content be in conjunction with concrete preferred implementation to further describing that the utility model is done, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, under the prerequisite that does not break away from the utility model design, can also make some simple deduction or replace, all should be considered as belonging to protection range of the present utility model.

Claims

1. the hot-swappable dustproof module of little encapsulation is characterized in that described module comprises: shell, golden finger; Described shell is identical with the shell of optical module; Described golden finger is fixing in the enclosure; Closely contact with the metal spring leaf of optical module slot when the contact pin end of golden finger is used for inserting, the other end is vacant, is not electrically connected.

2. the hot-swappable dustproof module of little encapsulation according to claim 1 is characterized in that, described module also comprises fixing dustproof plug in the enclosure, sealing light mouth when this dustproof plug is used to insert.

3. the hot-swappable dustproof module of little encapsulation according to claim 1 and 2 is characterized in that, also is provided with pull bar on described shell, and the color of this pull bar or shape are different from optical module.