CN201287407Y - Fluid spray pipe - Google Patents
Fluid spray pipe Download PDFInfo
- Publication number
- CN201287407Y CN201287407Y CNU2008200782418U CN200820078241U CN201287407Y CN 201287407 Y CN201287407 Y CN 201287407Y CN U2008200782418 U CNU2008200782418 U CN U2008200782418U CN 200820078241 U CN200820078241 U CN 200820078241U CN 201287407 Y CN201287407 Y CN 201287407Y
- Authority
- CN
- China
- Prior art keywords
- jet pipe
- guiding
- fluid
- uniform
- uniform distributing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a fluid jet pipe, belonging to the technical field of semiconductor wafer cutting special equipment accessories, which comprises a positioning block, an uniform distributing jet pipe, and a guiding jet pipe, wherein the uniform distributing jet pipe is sheathed and connected with the guiding jet pipe, whose ends at same side are respectively provided with a sealing block; the positioning block is fixed with the other end of the guiding jet pipe; the wall of the guiding jet nozzle is longitudinally and uniformly provided with a row of spray holes; and the wall of the uniform distributing jet pipe is longitudinally provided with a strip hole. The uniform distributing jet pipe can closure fluids via a plurality holes, and the sum section of the holes equals to the section of the inner hole of the jet pipe, therefore, the fluid can reach the whole inner shell of the jet pipe, and the fluid jet pipe can avoid defective conditions such as eddy current and closure of the whole fluid.
Description
Technical field
The utility model relates to a kind of fluid jet pipe, belongs to semiconductor wafer cutting special equipment attachment technique field.
Background technology
In the known semiconductor special equipment, the wafer cutting equipment is common a kind of equipment, its cutting cooling segment is normal to adopt simple groove shape structure to carry out the cutting fluid sprinkling, take such measure not only easily to cause the cutting fluid waste, and the cutting fluid of spraying can not evenly distribute, and it can influence the crudy of section.
Summary of the invention
The purpose of this utility model is to provide a kind of cutting fluid that helps improving the semiconductor wafer cut quality to spray the fluid jet pipe of uniform cutting equipment special use.
The utility model adopts following technical scheme:
The utility model comprises locating piece, uniform jet pipe and guiding jet pipe, said uniform jet pipe is sleeved on together with the guiding jet pipe and is connected, and it is fixed with the other end that end respectively is provided with a plugging block, locating piece and guiding jet pipe, tube wall along the guiding jet pipe vertically is evenly equipped with row's spray hole, vertically is provided with a strip hole along the tube wall of uniform jet pipe.
The utility model good effect is as follows: the uniform jet pipe of the utility model adopts porous mode convection cell to dam, and simultaneously, the sectional area sum of each aperture is that the jet pipe inner hole section is long-pending, thereby makes fluid can reach the whole inner casing of jet pipe.And bad phenomenon such as integral body can not cause eddy current, dam.
Guiding jet pipe of the present utility model is connected with uniform spout threads, and with plugging block between all adopt and be threaded, between locating piece and guiding jet pipe also for being threaded, like this can for convenience detach, cleaning.Stop the welding back and cleaned inconvenient phenomenon.
The strip hole of the uniform jet pipe of the utility model is a dredging flow groove, and its sectional area and uniform jet pipe inner hole section are long-pending to be equated.
The structure of the utility model locating piece has guaranteed to install simple, and the level of jet pipe is had good maintenance function.
Description of drawings
Fig. 1 looks the sectional structure schematic diagram for the master of a kind of embodiment of the utility model.
In the accompanying drawings: 1 plugging block, 2 uniform jet pipes, 3 spray holes, 4 locating pieces, 5 guiding jet pipes, 6 strip holes, 7 plugging block.
Tool is stopped embodiment
The utility model is described in further detail below in conjunction with the embodiment accompanying drawing:
Referring to accompanying drawing, comprise locating piece 4 in the formation of fluid jet pipe provided by the utility model, uniform jet pipe 2 and guiding jet pipe 5, uniform jet pipe 2 and guiding jet pipe 5 are sleeved on together and are threaded, it is with the end plugging block 1,7 that respectively is threaded, tube wall along guiding jet pipe 5 vertically is provided with the uniform spray hole 3 of a row, vertically is provided with a slotted hole 6 along the tube wall of uniform jet pipe 2, and locating piece 4 and 5 of the jet pipes of leading are for being threaded.This fluid jet pipe is to be specially the supporting parts of semiconductor equipment to be used for the cutting fluid that contains silicon-carbide particles is carried out uniform sprinkling specially.Uniform the playing a decisive role of shunting of uniform jet pipe 2 convection cells, guiding small aperture of jet pipe and spacing need the flow, pressure according to fluid etc. to calculate.
Claims (1)
1, a kind of fluid jet pipe, it is characterized in that it comprises locating piece (4), uniform jet pipe (2) and guiding jet pipe (5), said uniform jet pipe (2) is sleeved on together with guiding jet pipe (5) and is connected, and common ends respectively is provided with a plugging block (1,7), locating piece (4) is fixed with the other end of guiding jet pipe (5), vertically is evenly equipped with row's spray hole (3) along the tube wall of guiding jet pipe (5), vertically is provided with a strip hole (6) along the tube wall of uniform jet pipe (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200782418U CN201287407Y (en) | 2008-08-12 | 2008-08-12 | Fluid spray pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200782418U CN201287407Y (en) | 2008-08-12 | 2008-08-12 | Fluid spray pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201287407Y true CN201287407Y (en) | 2009-08-12 |
Family
ID=40979079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200782418U Expired - Fee Related CN201287407Y (en) | 2008-08-12 | 2008-08-12 | Fluid spray pipe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201287407Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102626955A (en) * | 2012-02-14 | 2012-08-08 | 上海五同机械制造有限公司 | Double-guide roll linear silicon wafer cutting system |
| CN102626957A (en) * | 2012-02-14 | 2012-08-08 | 上海五同机械制造有限公司 | Silicon wafer linear cutting equipment with uniform slurry spraying device |
| CN103802225A (en) * | 2012-11-14 | 2014-05-21 | 扬州协鑫光伏科技有限公司 | Mortar nozzle used for multi-wire cutting machine |
-
2008
- 2008-08-12 CN CNU2008200782418U patent/CN201287407Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102626955A (en) * | 2012-02-14 | 2012-08-08 | 上海五同机械制造有限公司 | Double-guide roll linear silicon wafer cutting system |
| CN102626957A (en) * | 2012-02-14 | 2012-08-08 | 上海五同机械制造有限公司 | Silicon wafer linear cutting equipment with uniform slurry spraying device |
| CN103802225A (en) * | 2012-11-14 | 2014-05-21 | 扬州协鑫光伏科技有限公司 | Mortar nozzle used for multi-wire cutting machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090812 Termination date: 20130812 |