CN201287282Y - Full-automatic plane grinding machine - Google Patents
Full-automatic plane grinding machine Download PDFInfo
- Publication number
- CN201287282Y CN201287282Y CNU2008201410516U CN200820141051U CN201287282Y CN 201287282 Y CN201287282 Y CN 201287282Y CN U2008201410516 U CNU2008201410516 U CN U2008201410516U CN 200820141051 U CN200820141051 U CN 200820141051U CN 201287282 Y CN201287282 Y CN 201287282Y
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- CN
- China
- Prior art keywords
- bistrique
- full
- lapping machine
- axis
- axle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model relates to a full automatic lapping machine, which comprises a body provided with a digital control system, wherein the digital control system is provided with a Z axle capable of moving up and down, a Z axle capable of moving left and right, and a Y axle capable of moving front and back, while the motions of the axles are controlled by a control terminal; the lower end of the Z axle is provided with a grinding head provided with a cooling water nozzle; a water flume is provided under the grinding head and is fixed on the X axle and the Y axle; and a clamp is fixed in the water flume for fixing a glass slide. The full automatic lapping machine can grind eight samples in five minutes via software automatic control and the special design of the clamp, to improve working efficiency by 3 times nearly; and since the clamp has creative design, the glass slide can avoid vacuum suction, thereby reducing noise in working condition and avoiding exchanging vacuum pump oil frequently, to bring convenient operation and improve working efficiency significantly.
Description
Technical field
The utility model relates to the capital equipment that R﹠D institutions such as a kind of oil, geology, metallurgy do the film-making of rock ore deposit, particularly, is a kind of full-automatic wafer lapping machine.
Background technology
At present, the device category of rock ore deposit film-making is a lot, is substantially to adopt manually direct abrasive disc or easy slide anchor clamps to utilize the vacuum suction core wafer to carry out mechanical abrasive disc.Manually abrasive disc efficient is extremely low, and personnel's workload is big; Simple and easy mechanical abrasive disc is because anchor clamps and bistrique limitation of design can only be finished the abrasive disc of three samples in five minutes.
The utility model content
It is easy to operate that technical problem to be solved in the utility model provides a kind of staff, abrasive disc efficient height, the full-automatic wafer lapping machine that precision is high.
The utility model solves the problems of the technologies described above the technical scheme that is adopted: full-automatic wafer lapping machine, comprise body, body is provided with digital control system, but digital control system has the X-axis of Z axle move left and right moving up and down under control terminal control, the Y-axis that can move forward and backward, described Z axle lower end is provided with bistrique, and the bistrique place also is provided with water-cooling-sprayer, and the bistrique below is provided with tank, tank is fixedly installed on X-axis and the Y-axis, is fixed with the anchor clamps that are used for fixing slide in the described tank.
Above-mentioned cnc mechanism comprises the Z-motion that utilizes the software control bistrique, the X of slide anchor clamps, Y-motion, utilize software design abrasive disc gauge according to abrasive disc needs characteristic, above-mentioned Z axle (column) mechanism is used to finish the axially reciprocating with bistrique Z, above-mentioned X-axis mechanism is used to finish with the plate holder X axis and moves back and forth, above-mentioned Y-axis mechanism be used to finish with the plate holder Y-axis to reciprocating motion, water-cooling-sprayer is used to cool off bistrique, the dust that core wafer and elimination abrasive disc produce, tank is used to compile and discharge cooling water, the utility model is controlled bistrique under the condition of opening cooling water automatically by the software control digital control system on the control terminal, bistrique is in X-axis, Y-axis, the reciprocating motion wear down core wafer of Z-direction reaches the core wafer thickness of setting.
Described water-cooling-sprayer is by water pipe and water source or water supply installation connection.
Described anchor clamps comprise jig main body, the upper surface that jig main body is positioned at the bistrique below is provided with the groove that several are used to place slide, the top that is positioned at the groove homonymy is provided with pressing plate, has the adjusting nut of regulating spacing between pressing plate and the jig main body upper surface on the pressing plate.
Described groove is 8.
Described jig main body is provided with the fitting recess with jig main body and the installation of tank sealing and fixing.
Described control terminal is a computer, the slide that is stained with core wafer is installed on the anchor clamps, automatically control bistrique under the condition of opening cooling water by control terminal, digital control system, bistrique reaches the core wafer thickness of setting at the reciprocating motion wear down core wafer of X-axis, Y-axis, Z-direction.
Described bistrique is that one or more rock core bistriques are formed.
To sum up, the beneficial effects of the utility model are:
Full-automatic wafer lapping machine of the present utility model is easy to operate, abrasive disc efficient height, precision height; Utilize the unique design of automatic control of software and anchor clamps, can finish the abrasive disc of eight samples in five minutes, operating efficiency improves 3 times nearly; Simultaneously because the innovation of jig Design, slide need not to adopt vacuum suction, has not only reduced the noise of working environment but also has saved the trouble of frequent replacing pumping fluid, and is not only convenient but also improved operating efficiency greatly concerning the operator.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is the structural representation of anchor clamps among Fig. 1.
The specific embodiment
Extremely shown in Figure 2 referring to Fig. 1, the full-automatic wafer lapping machine of full-automatic wafer lapping machine of present embodiment comprises body, body is provided with digital control system, but digital control system has the X-axis 3 of Z axle 2 move left and right moving up and down under control terminal 1 control, the Y-axis 4 that can move forward and backward, described Z axle lower end is provided with bistrique 5, and bistrique 5 places also are provided with water-cooling-sprayer 7, and bistrique 5 belows are provided with tank 8, tank 8 is fixedly installed on X-axis 3 and the Y-axis 4, is fixed with the anchor clamps 6 that are used for fixing slide in the described tank 8; Described water-cooling-sprayer 7 is by water pipe and water source or water supply installation connection; Described anchor clamps 6 comprise jig main body 13, the upper surface that jig main body 13 is positioned at bistrique 5 belows is provided with the groove 10 that several are used to place slide, the top that is positioned at groove 10 homonymies is provided with pressing plate 11, has the adjusting nut 9 of regulating spacing between pressing plate 11 and jig main body 13 upper surfaces on the pressing plate 11; Particularly, the groove 10 of present embodiment is 8, and its number can be adjusted as the case may be; Described jig main body 13 is provided with the fitting recess 12 that jig main body 13 and tank 8 sealing and fixing are installed, and this fitting recess 12 is positioned at the jig main body bottom, is symmetrical arranged; Described control terminal is a computer, the slide that is stained with core wafer is installed on the anchor clamps 6, automatically control bistrique under the condition of opening cooling water by control terminal 1, digital control system, bistrique reaches the core wafer thickness of setting at the reciprocating motion wear down core wafer of X-axis, Y-axis, Z-direction; Described bistrique 5 is that one or more rock core bistriques are formed.
The wood utility model is simple to operate, and concrete operations are as follows:
Turn on the power switch during use, whether unlatching computer test digital control system X-axis mechanism, Y-axis body, Z axis mechanism move normally.
Normal back slide clamp mechanism is loaded onto slide.
The rock core bistrique is determined the abrasive disc initial value by PgUp, PgDn.
Cooling water mechanism inserts running water.
Digital control system mechanism sets rotating speed, calls in the program operation.
Claims (7)
1, full-automatic wafer lapping machine, comprise body, it is characterized in that being, body is provided with digital control system, but digital control system has Z axle moving up and down (2) under control terminal (1) control the X-axis (3) of move left and right, the Y-axis (4) that can move forward and backward, described Z axle lower end is provided with bistrique (5), bistrique (5) locates also to be provided with water-cooling-sprayer (7), bistrique (5) below is provided with tank (8), tank (8) is fixedly installed on X-axis (3) and the Y-axis (4), is fixed with the anchor clamps (6) that are used for fixing slide in the described tank (8).
2, full-automatic wafer lapping machine according to claim 1 is characterized in that, described water-cooling-sprayer (7) is by water pipe and water source or water supply installation connection.
3, full-automatic wafer lapping machine according to claim 1, it is characterized in that, described anchor clamps (6) comprise jig main body (13), the upper surface that jig main body (13) is positioned at bistrique (5) below is provided with several grooves that is used to place slide (10), the top that is positioned at groove (10) homonymy is provided with pressing plate (11), has the adjusting nut (9) of spacing between adjusting pressing plate (11) and jig main body (13) upper surface on the pressing plate (11).
4, full-automatic wafer lapping machine according to claim 3 is characterized in that, described groove (10) is 8.
5, full-automatic wafer lapping machine according to claim 3 is characterized in that, described jig main body (13) is provided with the fitting recess (12) that jig main body (13) and tank (8) sealing and fixing are installed.
6, according to any described full-automatic wafer lapping machine of claim 1 to 5, it is characterized in that, described control terminal is a computer, the slide that is stained with core wafer is installed on the anchor clamps (6), automatically control bistrique under the condition of opening cooling water by control terminal (1), digital control system, bistrique reaches the core wafer thickness of setting at the reciprocating motion wear down core wafer of X-axis, Y-axis, Z-direction.
7, full-automatic wafer lapping machine according to claim 1 is characterized in that, described bistrique (5) is that one or more rock core bistriques are formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201410516U CN201287282Y (en) | 2008-10-30 | 2008-10-30 | Full-automatic plane grinding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201410516U CN201287282Y (en) | 2008-10-30 | 2008-10-30 | Full-automatic plane grinding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201287282Y true CN201287282Y (en) | 2009-08-12 |
Family
ID=40978955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201410516U Expired - Fee Related CN201287282Y (en) | 2008-10-30 | 2008-10-30 | Full-automatic plane grinding machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201287282Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107584350A (en) * | 2017-09-26 | 2018-01-16 | 中国海洋石油总公司 | A kind of portable petrographic thin section grinding device and its grinding method |
| CN108927544A (en) * | 2018-07-27 | 2018-12-04 | 安徽海蚨祥橡胶有限公司 | A kind of drilling part machine |
| CN110052959A (en) * | 2019-05-28 | 2019-07-26 | 中国科学院力学研究所 | A kind of thin slice polishing and burnishing machine |
-
2008
- 2008-10-30 CN CNU2008201410516U patent/CN201287282Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107584350A (en) * | 2017-09-26 | 2018-01-16 | 中国海洋石油总公司 | A kind of portable petrographic thin section grinding device and its grinding method |
| CN108927544A (en) * | 2018-07-27 | 2018-12-04 | 安徽海蚨祥橡胶有限公司 | A kind of drilling part machine |
| CN110052959A (en) * | 2019-05-28 | 2019-07-26 | 中国科学院力学研究所 | A kind of thin slice polishing and burnishing machine |
| CN110052959B (en) * | 2019-05-28 | 2020-11-13 | 中国科学院力学研究所 | Sheet polishing and grinding machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090812 Termination date: 20091130 |