CN201278610Y - 通信设备 - Google Patents

通信设备 Download PDF

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Publication number
CN201278610Y
CN201278610Y CNU2008203020558U CN200820302055U CN201278610Y CN 201278610 Y CN201278610 Y CN 201278610Y CN U2008203020558 U CNU2008203020558 U CN U2008203020558U CN 200820302055 U CN200820302055 U CN 200820302055U CN 201278610 Y CN201278610 Y CN 201278610Y
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CN
China
Prior art keywords
microphone
circuit board
conductiving point
communication equipment
dust ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2008203020558U
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English (en)
Inventor
骆新田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CNU2008203020558U priority Critical patent/CN201278610Y/zh
Priority to US12/411,358 priority patent/US20100061570A1/en
Application granted granted Critical
Publication of CN201278610Y publication Critical patent/CN201278610Y/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Telephone Set Structure (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

一种通信设备，包括麦克风和电路板。麦克风包括主体、麦克风套、防尘环和多个导电点，主体安装于麦克风套中。麦克风套、防尘环及所述导电点一体成型，所述防尘环的高度略高于所述导电点的高度。电路板与所述导电点电性连接。其中，所述导电点被密封在防尘环和电路板之间。因麦克风设计了防尘环，从而外界的粉尘不会进入导电点和电路板之间的导通界面，使得麦克风和电路板之间处于一个稳定的导通状态，避免了接触不良和噪音的产生。

Description

通信设备
技术领域
本实用新型涉及一种通信设备，尤其涉及一种通信设备的麦克风。
背景技术
在语音通信设备中，必须设置麦克风和扬声器亦允许用户与另一个人使用的另一个兼容设备来发送和接收音频信号。
然而，在使用过程中，外界的粉尘可经由通信设备的一些开口进入其内部，而现有的麦克风没有防尘设计，从而这些粉尘很容易进入麦克风和通信设备的电路板之间的导通界面，使得麦克风与电路板处于一个极不稳定的导通状态，从而产生接触不良和噪音。
实用新型内容
有鉴于此，需提供一种使麦克风具有良好防尘的通信设备。
一种通信设备，包括麦克风和电路板。麦克风包括主体、麦克风套、防尘环和多个导电点，主体安装于麦克风套中。麦克风套、防尘环及所述导电点一体成型，所述防尘环的高度略高于所述导电点的高度。电路板与所述导电点电性连接。其中，所述导电点被密封在防尘环和电路板之间。
因麦克风设计了防尘环，从而外界的粉尘不会进入导电点和电路板之间的导通界面，使得麦克风和电路板之间处于一个稳定的导通状态，避免了接触不良和噪音的产生。
附图说明
图1为本实用新型的通信设备的立体分解图。
图2为本实用新型的通信设备的立体组装图。
具体实施方式
请参照图1和图2，揭示了本实用新型实施方式的通信设备100。所述通信设备100包括麦克风20及电路板30。
电路板30具有用于麦克风20的电路。电路板30包括多个导通界面32，用于电性连接电路板30和麦克风20。
麦克风20包括主体22、麦克风套24、防尘环26及多个导电点28。麦克风套24、防尘环26及所述导电点28一体成型。
麦克风套24呈圆柱状，主体22安装于所述麦克风套24中。防尘环26从麦克风套24一端部的四周延伸而成。在本实施方式中，麦克风套24和防尘环26为可导电的皮套。
导电点28从麦克风套24的同一端底部凸出，导电点28的高度略小于防尘环26的高度。安装后，所述导电点28分别透过导通界面32与电路板30电性连接。
麦克风套24的另一端部开设孔240，以使得周围的音频信号透过孔240被接受和处理并被其内部组件转换为电信号。
安装时，主体22安装于所述麦克风套24中。麦克风套24、防尘环26及主体22组成的一体被焊接或固定到电路板30，同时所述导电点28与电路板30电性连接且被密封在防尘环26内。
因导电点28被密封在防尘环26内，从而外界的粉尘不会进入导电点28和电路板30之间的导通界面32，使得麦克风20和电路板30之间处于一个稳定的导通状态，避免了接触不良和噪音的产生。

Claims (5)

1.一种通信设备，其特征在于，包括：
麦克风，包括主体、麦克风套、防尘环和多个导电点，所述主体安装于所述麦克风套中，所述麦克风套、所述防尘环及所述导电点一体成型，所述防尘环的高度略高于所述导电点的高度；及
电路板，与所述导电点电性连接；
其中所述导电点被密封在所述防尘环和所述电路板之间。
2.如权利要求1所述的通信设备，其特征在于，所述麦克风套和所述防尘环为导电皮套。
3.如权利要求1所述的通信设备，其特征在于，所述导电点从所述麦克风套的一端底部凸出，所述防尘环从所述麦克风套的同一端部的四周延伸而成。
4.如权利要求3所述的通信设备，其特征在于，所述麦克风套的另一端部开设孔。
5.如权利要求1所述的通信设备，其特征在于，所述电路板包括多个导通界面，用于电性连接所述电路板和所述导电点。
CNU2008203020558U 2008-09-09 2008-09-09 通信设备 Expired - Fee Related CN201278610Y (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CNU2008203020558U CN201278610Y (zh) 2008-09-09 2008-09-09 通信设备
US12/411,358 US20100061570A1 (en) 2008-09-09 2009-03-25 Communication device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008203020558U CN201278610Y (zh) 2008-09-09 2008-09-09 通信设备

Publications (1)

Publication Number Publication Date
CN201278610Y true CN201278610Y (zh) 2009-07-22

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ID=40896200

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2008203020558U Expired - Fee Related CN201278610Y (zh) 2008-09-09 2008-09-09 通信设备

Country Status (2)

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US (1) US20100061570A1 (zh)
CN (1) CN201278610Y (zh)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7062058B2 (en) * 2001-04-18 2006-06-13 Sonion Nederland B.V. Cylindrical microphone having an electret assembly in the end cover
US20090097687A1 (en) * 2007-10-16 2009-04-16 Knowles Electronics, Llc Diaphragm for a Condenser Microphone

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Publication number Publication date
US20100061570A1 (en) 2010-03-11

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C17 Cessation of patent right
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Granted publication date: 20090722