CN201270247Y - Cutting clip for semi-conductor wafer - Google Patents
Cutting clip for semi-conductor wafer Download PDFInfo
- Publication number
- CN201270247Y CN201270247Y CNU2008201498156U CN200820149815U CN201270247Y CN 201270247 Y CN201270247 Y CN 201270247Y CN U2008201498156 U CNU2008201498156 U CN U2008201498156U CN 200820149815 U CN200820149815 U CN 200820149815U CN 201270247 Y CN201270247 Y CN 201270247Y
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- CN
- China
- Prior art keywords
- fixture
- semiconductor
- production
- semi
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model relates to a tool, in particular to a fixture for cutting semiconductor wafers. The semiconductor wafer cutting fixture comprises a fixture body, which is characterized in that one side of the fixture body is provided with a plurality of slots which can be meshed into the thickness of a semiconductor and a convex is provided between each two slots. Via the structure, the fixture eliminates auxiliary material and medium clamped at middle, to reduce production process, and avoids graphite technique, to realize clean and sanitary production, to protect environment. The production has the advantages of stable quality, high rate of finished products, high quality percentage, and high production efficiency.
Description
Technical field
The utility model relates to a kind of instrument, specifically relates to a kind of anchor clamps used when semiconductor wafer is cut.
Background technology
In the semi-conductive course of processing, the semiconductor of full wafer need be cut into semiconductor---the crystal grain of fritter, it is the effective way of boosting productivity that the semiconductor stack of some full wafers is cut; At present, employed method is: some chip semiconductor wafers are coated with to be spread the graphite composition and leads electrolyte or pad and go up metal sandwich and be welded on the anchor clamps, and such anchor clamps with some chip semiconductor full wafers are called crystal column; Crystal column placed on the electric spark Digit Control Machine Tool cut, can once cut out polylith crystal grain; The structure of above-mentioned anchor clamps is that a side of anchor clamps has a groove, side after the semiconductor stack has the lug boss that the groove with anchor clamps matches, this lug boss just is welded on the anchor clamps groove and cuts, because such anchor clamps make such production technology have shortcomings such as efficient is low, operation trouble, existence pollution, waste resource.
Summary of the invention
The purpose of this utility model is to provide the semiconductor wafer cutting clamper that a kind of operation is simple, efficient is high.
The purpose of this utility model is achieved in that semiconductor wafer cutting clamper, comprises chuck body, it is characterized in that: a side of chuck body has the groove of some engagement one block semiconductor thickness, between two grooves projection is arranged.
The beneficial effects of the utility model are: because such anchor clamps have been taked above structure, make it have the following advantages:
(1), saved the auxiliary material and the medium of original intermediate demand pad folder, reduced production process;
(2), owing to realized no graphite technology, produce sanitation and hygiene, more environmental protection more;
(3), the quality of producing is more stable, rate of finished products, quality percentage are higher;
(4), production efficiency is higher.
Description of drawings
Fig. 1 is the structural representation of the utility model semiconductor wafer cutting clamper
Wherein, 1, chuck body 2, groove 3, projection
Embodiment
The utility model will be further described below in conjunction with accompanying drawing.
As shown in Figure 1, semiconductor wafer cutting clamper comprises chuck body 1, and a side of chuck body 1 has projection 3 is arranged between 2, two grooves 2 of groove of some engagement one block semiconductor thickness.
Described groove can have 10-100.
During use, a side of some semiconductor chips that need cutting with the conducting resinl welding or be bonded in groove 2 places of chuck body 1, is made crystal column, fixedly crystal column cutting gets final product on the electric spark Digit Control Machine Tool.
Such anchor clamps can be used for clamping semi-conducting materials such as bismuth telluride and cut.
Claims (1)
1, semiconductor wafer cutting clamper comprises chuck body (1), it is characterized in that a side of chuck body (1) has the groove (2) of some engagement one block semiconductor thickness, has projection (3) between two grooves (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201498156U CN201270247Y (en) | 2008-10-21 | 2008-10-21 | Cutting clip for semi-conductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201498156U CN201270247Y (en) | 2008-10-21 | 2008-10-21 | Cutting clip for semi-conductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201270247Y true CN201270247Y (en) | 2009-07-08 |
Family
ID=40842855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201498156U Expired - Fee Related CN201270247Y (en) | 2008-10-21 | 2008-10-21 | Cutting clip for semi-conductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201270247Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104900789A (en) * | 2015-06-19 | 2015-09-09 | 佛山市国星半导体技术有限公司 | Flip LED chip and preparing method thereof |
-
2008
- 2008-10-21 CN CNU2008201498156U patent/CN201270247Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104900789A (en) * | 2015-06-19 | 2015-09-09 | 佛山市国星半导体技术有限公司 | Flip LED chip and preparing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090708 Termination date: 20111021 |