CN201267082Y - Thin type radiating device - Google Patents

Thin type radiating device Download PDF

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Publication number
CN201267082Y
CN201267082Y CNU2008201348657U CN200820134865U CN201267082Y CN 201267082 Y CN201267082 Y CN 201267082Y CN U2008201348657 U CNU2008201348657 U CN U2008201348657U CN 200820134865 U CN200820134865 U CN 200820134865U CN 201267082 Y CN201267082 Y CN 201267082Y
Authority
CN
China
Prior art keywords
heat
pipe
condensation segment
radiating subassembly
radiation device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2008201348657U
Other languages
Chinese (zh)
Inventor
林士渊
黄孟正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chaun Choung Technology Corp
Original Assignee
Chaun Choung Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chaun Choung Technology Corp filed Critical Chaun Choung Technology Corp
Priority to CNU2008201348657U priority Critical patent/CN201267082Y/en
Application granted granted Critical
Publication of CN201267082Y publication Critical patent/CN201267082Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A thin heat dissipating device comprises a heat pipe, a heat dissipating component and two heat conducting bases, wherein, the pipe body of the heat pipe is formed in whole and provided with two evaporation ends and a condensation segment, wherein, the evaporation ends are arranged at the two ends of the heat pipe body and the condensation segment is arranged at local part of the heat pipe body for the heat dissipating component to be arranged on the condensation segment; the heat conducting bases are arranged on the evaporation ends respectively. In the thin heat dissipating device, the heat dissipating component is only connected with a single heat pipe, and therefore, the space occupied by the heat dissipating component is reduced.

Description

The thin heat radiation device
Technical field
The utility model relates to a kind of radiator, relates in particular to a kind of thin heat radiation device by hot swapping.
Background technology
Helping this radiator that is used on the computer by heat pipe (Heat pipe) and dispel the heat, has been present common a kind of technological means.Especially on as inner space occasions with limited such as mobile computers, heat pipe can conduct heat under no mobile component, the pipe shaft inactive state and characteristic such as flexible because of having, thereby does not more take up room.
As shown in Figure 1, be applied to as the heat abstractor 1a in the mobile computer for a kind of.This heat abstractor 1a has two heat pipe 10a, and is connected to altogether on the radiating subassembly 11a who is formed by the fin storehouse as the condensation end of two heat pipe 10a, and the evaporation ends of this two heat pipe 10a then connects a heat conducting base 12a respectively.By above structure, can make a respectively corresponding electronic heating source of two heat conducting base 12a, for example south bridge and north bridge are with the heat that two electronic heating sources are produced, conduct on this radiating subassembly 11a by two heat pipe 10a respectively earlier, dispel the heat with this radiating subassembly 11a in the lump again.
Yet, because all needing to do hot the biography with this radiating subassembly 11a, two heat pipe 10a combine, so this radiating subassembly 11a also must provide the contact site at two places, so can be incorporated on this radiating subassembly 11a for the common heat biography of two heat pipe 10a.But hold as described above, as the heat abstractor that is often is applied to as on the inner space occasions with limited such as mobile computer, if this radiating subassembly 11a must account for the bigger volumetric spaces of tool, then probably there are problems such as the application scenario is inapplicable to produce, also can influence the size that to install fan because of limited space.
Summary of the invention
Main purpose of the present utility model, be to provide a kind of thin heat radiation device, it provides two heat conducting bases to be connected in series with single heat pipe, and meaning is about to two ends of heat pipe as evaporation ends, a selected appropriate location provides a radiating subassembly setting in the heat pipe middle section in addition, and as condensation segment; So, can make radiating subassembly only need to be connected, to reduce its required volumetric spaces that takies with single heat pipe.
To achieve the above object, the utility model provides a kind of thin heat radiation device, comprises a heat pipe, a radiating subassembly and two heat conducting bases; Wherein, the pipe shaft of heat pipe is formed in one, and has two evaporation ends that lay respectively at its two ends place and be positioned at a condensation segment in its pipe shaft one local place, is located on its condensation segment two heat conducting bases for radiating subassembly and then is located at respectively on its two evaporation ends; For this reason, can obtain a described thin heat radiation device, and reach above-mentioned purpose.
Beneficial functional of the present utility model is that the thin heat radiation device makes radiating subassembly only need to be connected with single heat pipe, to reduce the required volumetric spaces that takies of radiating subassembly.
Below in conjunction with the drawings and specific embodiments the utility model is described in detail, but not as to qualification of the present utility model.
Description of drawings
Fig. 1 is the schematic appearance of existing a kind of heat abstractor;
Fig. 2 is the three-dimensional exploded view of the utility model first embodiment;
Fig. 3 is the three-dimensional combination figure of the utility model first embodiment;
Fig. 4 is the local user mode figure of the utility model first embodiment;
Fig. 5 is the 5-5 cross-section cutaway view of Fig. 4;
Fig. 6 is the cross-section cutaway view of the utility model second embodiment;
Fig. 7 is the cross-section cutaway view of the utility model the 3rd embodiment.
Wherein, Reference numeral
Prior art
Heat abstractor 1a
Heat pipe 10a radiating subassembly 11a
Heat conducting base 12a
The utility model
Heat abstractor 1
Heat pipe 10 evaporation ends 100
Condensation segment 101 radiating subassemblies 11
Fin 110 breach 111
Notch part 112 perforation 113
Heat conducting base 12 grooves 120
Mobile computer 2
Air outlet 20
Electronic heating source 3
Embodiment
In order to make your juror further understand feature of the present utility model and technology contents, see also following about detailed description of the present utility model and accompanying drawing, yet appended graphic only provide with reference to and the explanation usefulness, be not to be used for the utility model is limited.
See also Fig. 2 and Fig. 3, be respectively three-dimensional exploded view and the three-dimensional combination figure of the utility model first embodiment.The utility model provides a kind of thin heat radiation device, and this heat abstractor 1 comprises a heat pipe 10, a radiating subassembly 11 and two heat conducting bases 12; Wherein:
This heat pipe (Heat pipe) 10 is to be vacuum in the pipe shaft and to have capillary structure and the termal conductor module of working fluid, and the pipe shaft of this heat pipe 10 is one-body molded and have certain suitable length, with in its two end respectively as an evaporation ends 100, on pipe shaft one specific portion position then as a condensation segment 101.In addition, this heat pipe 10 can be flat person at the pipe shaft place at described two evaporation ends 100 and a condensation segment 101 places at least, contacts so that do larger area heat conduction with aforementioned radiating subassembly 11 and heat conducting base 12 respectively; And the utility model for each embodiment in, all pipe shafts of this heat pipe 10 all are flat person.Certainly, the pipe shaft of this heat pipe 10 also can be kept its original pipe shape person.
This radiating subassembly 11 heat pass and are linked on the condensation segment 101 of above-mentioned heat pipe 10, so that required that this condensation segment 101 cools is provided.And the utility model for each embodiment in, this radiating subassembly 11 is one with a plurality of fin 110 transversely arranged stacking-type radiators that form; And in the present embodiment, each fin 110 can inwardly concave a breach 111 on the one lateral margin, the shape of this breach 111 just is flat surface configuration with heat pipe 10 pipe shafts and conforms to, after making each fin 110 storehouse, form the notch part 112 that contacts for the condensation segment 101 surface work heat biographies of heat pipe 10 by its breach 111, and be positioned at the first half on condensation segment 101 surfaces.
This two heat conducting base 12 heat biography respectively is linked on two evaporation ends 100 of above-mentioned heat pipe 10, and by the extension and the bending of heat pipe 10 pipe shafts, and can with two heat conducting bases 12 in order to respectively corresponding one desire to provide on the electronic heating source 3 (as shown in Figure 4) of heat radiation, conducting the heat that two electronic heating sources 3 are produced simultaneously, and provide cooling by this radiating subassembly 2 in the lump by this heat pipe 10.And the utility model for each embodiment in, all be concaved with the groove 120 that the evaporation ends 100 of heating tube 10 is imbedded on this two heat conducting base 12, to make its evaporation ends 100 must combine and increase the contact area of the two, be beneficial to heat conduction with heat conducting base 12.
So,, can obtain the utility model thin heat radiation device by above-mentioned contexture.
In view of the above, as Fig. 4 and shown in Figure 5, when in the occasion that this heat abstractor 1 is applied to be restricted as mobile computer 2 equal altitudes spaces, because adopting single described heat pipe 10, it provide the heat of two heat conducting bases 12 to pass required, so also only needing to make the heat biography with the single described condensation segment 101 of heat pipe 10, this radiating subassembly 11 contacts, can must not distinguish corresponding two heat pipes because of two heat conducting bases 12, cause this radiating subassembly 11 on volumetric spaces increase and influence its institute's restriction such as applicable occasion, to avoid taking mobile computer 2 inner spaces.And, this radiating subassembly 11 is arranged on positions such as air outlet 20 corresponding to mobile computer 2, and can further install a centrifugal radiator fan 13 additional, so that this radiating subassembly 11 is carried out the effect that expels of thermal current, make radiating subassembly 13 heat pipe 10 can be conducted to heat on the condensation segment 101 by evaporation ends 100, force to discharge by air outlet 20 by this radiator fan 13.
Moreover, because only needing the condensation segment 101 of single described heat pipe 10 to make heat, this radiating subassembly 11 passes contact, so the connected structure of 11 of heat pipe 10 and radiating subassemblies is also comparatively simple.As shown in Figure 6, promptly further set up another radiating subassembly 11, being located at the Lower Half on condensation segment 101 surfaces, so that the condensation segment 101 of two radiating subassemblies 11 by its notch part 112 opposite heat tubes 10 gives upper and lower inserting and putting in the condensation segment 101 of heat pipe 10; In addition, more as shown in Figure 7, this radiating subassembly 11 also can directly be provided with a perforation 113 on its each fin 110, be arranged in the perforation 113 by each fin 110 on the condensation segment 101 of heat pipe 10.
Therefore, by the utility model thin heat radiation device, owing to be connected in series two heat conducting bases 12 by single described heat pipe 10, thus can make radiating subassembly 12 only need to be connected with this single heat pipe 10, to reduce the radiating subassembly 12 required volumetric spaces that take.
Certainly; the utility model also can have other various embodiments; under the situation that does not deviate from the utility model spirit and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the utility model, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the utility model.

Claims (10)

1, a kind of thin heat radiation device is characterized in that, comprising:
One heat pipe, its pipe shaft is one-body molded, and has two evaporation ends that lay respectively at its two ends place and be positioned at the condensation segment that its pipe shaft one part is located;
One radiating subassembly is located on the condensation segment of this heat pipe; And
Two heat conducting bases are located at respectively on two evaporation ends of this heat pipe.
2, thin heat radiation device according to claim 1 is characterized in that, the pipe shaft of this heat pipe all is flat in described two evaporation ends and described condensation segment place.
3, thin heat radiation device according to claim 2 is characterized in that, the pipe shaft of this heat pipe all is flat in remainder.
4, thin heat radiation device according to claim 1 is characterized in that, this radiating subassembly is one with the transversely arranged stacking-type radiator that forms of a plurality of fins.
5, thin heat radiation device according to claim 4 is characterized in that, respectively this fin is provided with a perforation, and the condensation segment of this heat pipe wears this perforation and this radiating subassembly is located on the described condensation segment.
6, thin heat radiation device according to claim 4, it is characterized in that, respectively this fin inwardly concaves a breach on the one lateral margin, the shape of this breach conforms to the surface configuration of the pipe shaft of this heat pipe, these breach form a notch part, and this notch part contacts with the condensation segment surface work heat biography of this heat pipe.
7, thin heat radiation device according to claim 6 is characterized in that, this radiating subassembly is positioned at the first half on described condensation segment surface.
8, thin heat radiation device according to claim 7 is characterized in that, also further comprises another radiating subassembly, and this radiating subassembly is positioned at the Lower Half on described condensation segment surface.
9, thin heat radiation device according to claim 1 is characterized in that, all is concaved with a groove on this two heat conducting base, and two evaporation ends of this heat pipe are imbedded the groove of this two heat conducting base respectively.
10, thin heat radiation device according to claim 1 is characterized in that, also comprises a radiator fan, and this radiating subassembly is provided with relatively.
CNU2008201348657U 2008-09-26 2008-09-26 Thin type radiating device Expired - Fee Related CN201267082Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008201348657U CN201267082Y (en) 2008-09-26 2008-09-26 Thin type radiating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008201348657U CN201267082Y (en) 2008-09-26 2008-09-26 Thin type radiating device

Publications (1)

Publication Number Publication Date
CN201267082Y true CN201267082Y (en) 2009-07-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2008201348657U Expired - Fee Related CN201267082Y (en) 2008-09-26 2008-09-26 Thin type radiating device

Country Status (1)

Country Link
CN (1) CN201267082Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103961210A (en) * 2013-06-09 2014-08-06 深圳市天时威电子有限公司 Head-mounted bag-type miniature semiconductor cooling ice belt
CN104780738A (en) * 2014-01-15 2015-07-15 奇鋐科技股份有限公司 Heat pipe structure and heat dissipation module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103961210A (en) * 2013-06-09 2014-08-06 深圳市天时威电子有限公司 Head-mounted bag-type miniature semiconductor cooling ice belt
CN104780738A (en) * 2014-01-15 2015-07-15 奇鋐科技股份有限公司 Heat pipe structure and heat dissipation module

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090701

Termination date: 20091026