CN201251153Y - Heat radiation structure for LED lamp - Google Patents

Heat radiation structure for LED lamp Download PDF

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Publication number
CN201251153Y
CN201251153Y CNU2008201253483U CN200820125348U CN201251153Y CN 201251153 Y CN201251153 Y CN 201251153Y CN U2008201253483 U CNU2008201253483 U CN U2008201253483U CN 200820125348 U CN200820125348 U CN 200820125348U CN 201251153 Y CN201251153 Y CN 201251153Y
Authority
CN
China
Prior art keywords
board
led lamp
shell body
radiator structure
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2008201253483U
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Chinese (zh)
Inventor
叶长青
张嘉智
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NINGXIANG TECHNOLOGY Co Ltd
Original Assignee
NINGXIANG TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to CNU2008201253483U priority Critical patent/CN201251153Y/en
Application granted granted Critical
Publication of CN201251153Y publication Critical patent/CN201251153Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model discloses a heat radiation structure for an LED lamp. The heat radiation structure comprises an outer shell, the periphery of a position of an assembly hole of the outer shell is provided with a circle of positioning flange, an accommodation hole is arranged in the positioning flange, two open sides of the accommodation hole are jointed by a first jointing plate and a second jointing plate, the first jointing plate or the second jointing plate is provided with a control wafer, the second jointing plate is also provided with the LED lamp, and the accommodation hole with the two open sides closed by the first jointing plate and the second jointing plate is provided with a control wafer, filling stuff or a temperature sensing unit.

Description

The radiator structure of LED lamp
Technical field
The utility model relates to a kind of lighting device, is specifically related to a kind of radiator structure of LED lamp.
Background technology
LED has high brightness, power saving, can not glimmer, the long little advantage of volume again of life-span, therefore more and more light fixtures, all develop towards the direction of LED light fixture, to realize environmental protection, energy-conservation target, yet, the LED lamp uses in the luminescence process, can send a large amount of heat energy simultaneously, those heat energy can influence the life-span of LED lamp and associated wafer group if do not get rid of for a long time, therefore are provided with the structure of heat transmission on the LED light fixture on the market, and use LED lamp, also all arranging in pairs or groups has the use of wafer set, and itself also can send heat energy these wafer set, also is provided with radiator structure.
LED lamp in the past, the wafer set radiator structure, mostly be by at the LED lamp, the binding site of wafer set is provided with the attaching of a heat radiating metal piece, with heat radiating metal piece energy fast Absorption heat energy, and heat energy is spread in the air by the radiating fin on the heat radiating metal piece, yet, the heat radiation function of the simple attaching of this kind heat radiating metal piece is limited, can't effectively carry out heat loss through conduction, especially be commonly used to be arranged at the displaying cabinet, the concentrated form height brightness displaying lamp of showing case, though these show that lamp body is long-pending little, but but can send high brightness, and concentrated the irradiation in a place, and more because of the brightness height, the heat energy that it produced also improves relatively, the volume of these light fixtures is little, and LED lamp and wafer set all are closed in the inside again, and heat radiating structure can be long-pending still less with the heat radiating metal structure interface, and wafer set is outside usually, with back side contact heat radiating metal, cause heat radiation more difficult, overheated situation takes place in long-time use the easily.
As from the foregoing, present existing LED lamp radiator structure, the structure of its heating and heat radiating metal structure interface are long-pending few, the heat energy that is produced is difficult to be transmitted on the heat radiating metal structure, therefore how to increase the contact area of heat radiation, promoting the radiating effect of LED lamp and wafer set, and dispel the heat at LED lamp and wafer set simultaneously in limited space, is the problem that need solve at present.
The utility model content
Technical problem to be solved in the utility model provides a kind of radiator structure of LED lamp, and it can utilize unique radiator structure to increase radiating efficiency at the use energising of LED lamp, the living heat problem of luminescence process.
For solving the problems of the technologies described above, the technical solution of the radiator structure of the utility model LED lamp is:
Comprise: shell body, first board, second board, LED lamp and an amount of filler, wherein, the shell body surface has radiating fin, inside has a dispensing hole, a position periphery is provided with a delineation position flange in this dispensing hole, make and form a containing hole in this locating flange, first board is provided with the control wafer, first board is containing hole one side that is attached at shell body, second board provides the setting of LED lamp, second board is the containing hole opposite side that is attached at shell body, and filler is arranged in the containing hole, both sides and by first board, the sealing of second board.
The technique effect that the utility model can reach is:
(1) the utility model is by being provided with a delineation position flange in the dispensing hole of this shell body, and in this locating flange, form a containing hole, can provide the filler setting in this containing hole, locating flange both sides and with the sealing of first board and second board, can utilize the plasticity of filler significantly to increase the heat radiation contact area of first board, second board, control wafer and LED lamp, better heat-radiation effect by this.
(2) the utility model is established a delineation position flange by a position periphery in the dispensing hole of this shell body, and formation one containing hole provides an amount of filler setting in this locating flange, when making first board and second board by this by both sides applying and sealing, can utilize filler to reach the heat radiation of first board and second board simultaneously, usability is better.
(3) the utility model is established a delineation position flange by a position periphery in the dispensing hole of this shell body, and formation one containing hole provides an amount of filler setting in this locating flange, the control wafer of first board more can be arranged on towards containing hole side by this, make the control wafer dispel the heat better heat-radiation effect by the filler that is subjected to complete and gross area.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model is described in further detail:
Fig. 1 is the three-dimensional combination figure of the radiator structure of the utility model LED lamp;
Fig. 2 is three-dimensional the decomposition and part sectioned view of the present utility model;
Fig. 3 is a combination section of the present utility model;
Fig. 4 is that the utility model uses the radiating state schematic diagram;
Fig. 5 controls the wafer diverse location in conjunction with schematic diagram on the utility model first board;
Fig. 6 is the combination section of another embodiment of the utility model.
Among the figure, 10 shell bodies, 11 radiating fins, 12 dispensing holes, 13 locating flanges, 14 containing holes, 15 lockholes, 16 positioning convex points, 17 engaging edge, 20 first boards, 21 control wafers, 22 lockholes, 30 bottoms, 31 pins, 40 second boards, 41 lockholes, 42 locating holes, 50 LED lamps, 60 photomasks, 61 penetrate the hole, 62 engaging edge, 70 screws, 80 fillers, A temp-sensing element.
The specific embodiment
As Fig. 1, shown in Figure 2, the radiator structure of the utility model LED lamp, comprise: shell body 10, first board 20, bottom 30, second board 40, LED lamp 50, photomask 60, two screws 70 and an amount of filler 80, wherein, shell body 10 surfaces have radiating fin 11, inside has a dispensing hole 12, a position periphery is provided with a location flange 13 in the dispensing hole 12, make and form a containing hole 14 in this locating flange 13, two lockholes 15 have also been provided on the locating flange 13, locating flange also convexes with at least one positioning convex point 16 for 13 times, the dispensing hole 12 1 square end edge of shell body 10 are also cut and are provided with engaging edge 17, first board 20 is provided with a control wafer 21 and has provided two lockholes 22, bottom 30 is to cooperate shell body 10 1 sides to be provided with, and be provided with the pin 31 that electrically connects first board 20, and pin 31 is perpendicular to first board 20, second board 40 has provided two lockholes 41 and two locating holes 42, LED lamp 50 is to be arranged on second board 40, photomask 60 is to present the large bamboo hat with a conical crown and broad brim shape, miner diameter end is provided with and penetrates hole 61, bigger diameter end is the open end, outer peripheral edges also convex with engaging edge 62, filler 80 is for liquid, paste or glue, and have the characteristic of heat absorption.
As Fig. 1, shown in Figure 3, first board 20 is to be provided with by dispensing hole 12 1 sides of shell body 10 to fit in locating flange 13, to seal this containing hole 14 1 open side, filler 80 flows into the containing hole 14 of shell body 10,22 pairs of the lockholes of first board 20 are established the lockhole 15 of shell body 10, second board 40 is to be provided with by dispensing hole 12 the opposing party of shell body 10 to fit in locating flange 13, with sealing containing hole 14 another open side, filler 80 is closed in the containing hole 14 by first board 20 and second board 40, filler 80 and to first board 20 and the 40 inboard comprehensive engagements of second board, 41 pairs of the lockholes of second board 40 are located at the lockhole 15 of shell body 10,42 pairs of the locating holes of second board 40 are stuck in the positioning convex point 16 of shell body 10, screw 70 is the lockholes 22 by first board 20, the lockhole 41 of second board 40 is established with the lockhole of shell body 10 15 locks, photomask 60 is fixing by dispensing hole 12 combinations of shell body 10, and with engaging edge 17,62 cooperate, photomask 60 is covered with to penetrate hole 61 cooperated with LED lamps 50, bottom 30 be by dispensing hole 12 the opposing party of shell body 10 in conjunction with fixing, establish first board 20 and pass to connect with pin 31 power supply source lines.
As shown in Figure 4, light LED lamp 50 when first board 20 and the energising of second board 40 and can produce high temperature, high temperature can be by being transmitted to shell body 10 and the filler 80 that is contacted all around respectively, filler 80 is to first board 20 and the 40 inboard comprehensive engagements of second board, and directly contact with shell body 10 again, so first board 20, second board 40 can be conducted with maximum area with the high temperature of LED lamp 50, and the high temperature of filler 80 is to conduct with direct contact of shell body 10 again, most high temperature can both be dispersed, to reach the effect of best heat radiation by the radiating fin 11 of shell body 10.
First board 20 is provided with control wafer 21, control wafer 21 can be arranged at a side or the opposite side of first board 20 to containing hole 14, as shown in Figures 1 to 4, control wafer 21 is to be arranged at the side of first board 20 to containing hole 14, so behind first board, 20 applying locating flanges 13, control wafer 21 is in the containing hole 14 and immerses in the filler 80; As shown in Figure 5, control wafer 21 also can be arranged at a side or the opposite side of second board 40 to containing hole 14.
As shown in Figure 6, first board 20 or second board 40 are to cooperate containing hole 14 places to be provided with a temp-sensing element A, and temp-sensing element A can detect the temperature in the containing hole 14.
First board 20 and second board 40 can be aluminium bases.
First board 20 and second board 40 also can be circuit boards.
Said structure has following advantage:
(1) it establishes a location flange 13 in the dispensing hole 12 of shell body 10, and in locating flange 13, form a containing hole 14, after locating flange 13 both sides are respectively with first board 20 and 40 sealings of second board, the containing hole 14 of a sealing can be obtained, filler 80, control wafer 21 or temp-sensing element A setting can be supply with the containing hole 14 of this sealing.
(2) its sealing locating flange 13 by shell body 10 can be provided with for filler 80, filler 80 can significantly increase the heat radiation contact area of first board 20, second board 40, control wafer 21 and LED lamp 50, making the high temperature that is produced can be transmitted to shell body 10 short time is dispersed by radiating fin 11, better heat-radiation effect, and can increase service life of each element.
(3) its sealing locating flange 13 by shell body 10 can be provided with for filler 80, when first board 20 and second board 40 are fitted by both sides and during sealing, can be utilized filler 80 to contact heat radiation at first board 20 with second board 40 simultaneously.
(4) its sealing locating flange 13 by shell body 10 can be provided with for filler 80, more can be arranged in the containing hole 14 by control wafer 21, control wafer 21 can be absorbed heat by the filler 80 that be subjected to complete and gross area, have the advantage of better heat-radiation effect.

Claims (10)

1, a kind of radiator structure of LED lamp comprises: a shell body, one first board, one second board and a LED lamp is characterized in that:
Described shell body inside has a dispensing hole, is provided with a location flange in this dispensing hole, makes and forms a containing hole in this locating flange;
Described first board fits in described locating flange by the dispensing hole one side setting of described shell body, to seal described containing hole one open side;
Described second board fits in described locating flange by dispensing hole the opposing party setting of described shell body, to seal another open side of described containing hole; And
Described LED lamp is to be arranged on second board.
2, the radiator structure of LED lamp according to claim 1 is characterized in that: described shell body surface has radiating fin.
3, the radiator structure of LED lamp according to claim 1, it is characterized in that: also comprise an amount of filler, described filler is arranged in the containing hole of described shell body, and is sealed by described first board and second board that described containing hole both-side opening is fitted.
4, the radiator structure of LED lamp according to claim 3 is characterized in that: described filler is to be liquid, paste or glue, and has the characteristic of heat absorption.
5, the radiator structure of LED lamp according to claim 3 is characterized in that: described filler has the characteristic of heat absorption.
6, the radiator structure of LED lamp according to claim 1, it is characterized in that: the locating flange place of described shell body has provided two lockholes, described first board has provided two lockholes, described second board has provided two lockholes, and cooperate two-screw to use, the lockhole of described first board is to establishing the lockhole of described shell body, and the lockhole of described second board is to establishing the lockhole of described shell body, and described screw is established by described lockhole lock.
7, the radiator structure of LED lamp according to claim 1, it is characterized in that: the locating flange place of described shell body convexes with at least one positioning convex point, described second board is provided with at least one locating hole, and the locating hole of described second board is to blocking the positioning convex point of described shell body.
8, the radiator structure of LED lamp according to claim 1 is characterized in that: described first board and described second board are aluminium base or circuit board.
9, the radiator structure of LED lamp according to claim 1 is characterized in that: described first board or described second board are provided with a control wafer in the side to this containing hole.
10, the radiator structure of LED lamp according to claim 1 is characterized in that: described first board or second board are provided with a temp-sensing element in the side to described containing hole.
CNU2008201253483U 2008-07-02 2008-07-02 Heat radiation structure for LED lamp Expired - Fee Related CN201251153Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008201253483U CN201251153Y (en) 2008-07-02 2008-07-02 Heat radiation structure for LED lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008201253483U CN201251153Y (en) 2008-07-02 2008-07-02 Heat radiation structure for LED lamp

Publications (1)

Publication Number Publication Date
CN201251153Y true CN201251153Y (en) 2009-06-03

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2008201253483U Expired - Fee Related CN201251153Y (en) 2008-07-02 2008-07-02 Heat radiation structure for LED lamp

Country Status (1)

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CN (1) CN201251153Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013063963A1 (en) * 2011-10-31 2013-05-10 深圳市电明科技有限责任公司 Heat sink and lighting device having same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013063963A1 (en) * 2011-10-31 2013-05-10 深圳市电明科技有限责任公司 Heat sink and lighting device having same

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090603

Termination date: 20130702