CN201233444Y - Solid-state detector for radiation detection - Google Patents

Solid-state detector for radiation detection Download PDF

Info

Publication number
CN201233444Y
CN201233444Y CNU2008201085238U CN200820108523U CN201233444Y CN 201233444 Y CN201233444 Y CN 201233444Y CN U2008201085238 U CNU2008201085238 U CN U2008201085238U CN 200820108523 U CN200820108523 U CN 200820108523U CN 201233444 Y CN201233444 Y CN 201233444Y
Authority
CN
China
Prior art keywords
radiation detection
solid probe
array solid
detection according
photodiode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2008201085238U
Other languages
Chinese (zh)
Inventor
赵书清
李元景
代主得
江年铭
张清军
姚楠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tsinghua University
Nuctech Co Ltd
Original Assignee
Tsinghua University
Nuctech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tsinghua University, Nuctech Co Ltd filed Critical Tsinghua University
Priority to CNU2008201085238U priority Critical patent/CN201233444Y/en
Application granted granted Critical
Publication of CN201233444Y publication Critical patent/CN201233444Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Abstract

An array solid detector for radiation detection comprises a plurality of sensors for detecting rays which radiate in the scheduled direction, each sensor is provided with an end surface for incident rays and a plurality of first boards which are almost arranged in parallel to form at least a row of space, a plurality of sensors are arranged in the space, wherein a plurality for first boards are formed by metals. The use of the structural form can constitute any multi-row array solid detector, thereby increasing the radiation detection speed of a large object under the situation of not sacrificing the spatial resolution and the contrast sensitivity of a scanned image.

Description

The array solid probe that is used for radiation detection
Technical field
The utility model relates to and is used for radiation detection (for example, radiation image-forming system) detector refers more particularly to large-sized object is carried out the used array solid probe of radiation detection.
Background technology
In radiation image-forming system, the effect of detector array is that X ray or the gamma-rays conversion of signals that will see through object to be detected are electric signal.In the large-sized object radiation image-forming system, generally be to adopt single-row detector array, comprising the gas detector of ionization chamber type and the solid probe of flicker build.The applicant discloses two kinds of radiant image solid probe technology in Chinese patent 02148670.0 and 200420009319.2, and the solid detector array of using these patented technologies has been widely used in the X ray container scanning system.The proposition of multiple row detector array is in order to adapt to the requirement that large-sized object radiation detection sweep velocity improves, such as to the radiation scanning detection of train etc.Improve the width of detector sensitive volume and can improve sweep velocity, yet the width of raising detector sensitive volume can be sacrificed the spatial resolution of radiation image-forming system, causes the scan image quality to descend in the direction of scanning.To satisfy the requirement that improves sweep velocity and scan image quality simultaneously, generally adopt the multiple row detector.Disclose a kind of multi-array detector modular structure that is used for radiant image in the Chinese patent 200520136585.6, but this patent does not point out how to make up the solid probe of multiple row.The coupling of scintillator and photodiode all is the side at the scintillator parallel with directions of rays in solid probe in the patent 02148670.0 and 200420009319.2 or the array solid probe, when making up the multiple row solid probe that surpasses 2 row with these two kinds of detectors, because photodiode and output circuit plate thereof can take up room, have at least the dead band between the two row detector sensitive volumes can be bigger, and bigger dead band can make the contrast sensitivity variation of scan image.
The example that many radiant image multiple row solid probes have been arranged in medical science detection and small article detection range is such as multi-Slice CT detector, flat panel detector etc.Yet these are the panel detector structure of small-sized object detection design and the radiant image detection that is not suitable for making up large-sized object, main cause is that these detectors are too low to the detection efficiency of high-energy ionization radiation (such as the pulsed X-ray that is produced by accelerator), and simultaneously too meticulous Pixel Dimensions makes that the construction and the maintenance cost that make up the large-sized object sense channel according to this are too high.
Fig. 1 is a synoptic diagram of using the radiation detection system for large body detector at present always.In the structure of this detector, the coupling surface of photodiode 102 and scintillator 101 is parallel to radiation exposure direction (shown in the arrow among the figure 105).Ionising radiation 105 produces visible light at scintillator 101 inside deposition energy, collect the back through reflecting material (being coated in scintillator surface) and enter photodiode 102 by coupling surface, become charge signal in photodiode 102 internal conversions, this charge signal outputs to follow-up signal through pcb board 103 backs by the socket on the pcb board 103 104 and amplifies and data acquisition circuit.The characteristics of this structure are that the energy deposition luminous point in the scintillator is closer from the light collection surface of photodiode, can also collect more visible light when the light transmission condition is bad in scintillator.
The utility model content
The array solid probe that provides a kind of radiant image to use is provided a purpose of the present utility model, this array solid probe can be built into the array solid probe of any multiple row, can improve large-sized object radiation detection speed under the situation of the spatial resolution of not sacrificing scan image.
The array solid probe that provides a kind of radiant image to use is provided another purpose of the present utility model, this array solid probe can be built into the array solid probe of any multiple row, can improve large-sized object radiation detection speed under the situation of spatial resolution of not sacrificing scan image and contrast sensitivity.
The array solid probe that provides a kind of radiant image to use is provided another purpose of the present utility model, utilizes the multiple row solid probe that this array solid probe makes up can maintaining a long-term stability property, is convenient to again make and maintenance.
According to one side of the present utility model, the utility model provides a kind of array solid probe that is used for radiation detection, this array solid probe comprises: detect along a plurality of sensors of the ray of predetermined direction radiation, described sensor has the end face of ray incident, with a plurality of first plates, described a plurality of first plates be arranged in parallel substantially, form delegation space at least, described a plurality of rows of sensors is listed in the described space, and wherein said a plurality of first plates are formed by metal.
According to one side of the present utility model, the described array solid probe that is used for radiation detection can also comprise: a plurality of second plates, described a plurality of second plate intersects with a plurality of first plates, thus, each row in described at least one row space is separated into a plurality of space arrays, in the described sensor each is arranged in of a plurality of space arrays, and wherein said a plurality of second plates are formed by metal.
Optimal way is that described a plurality of second plates are vertical substantially with a plurality of first plates.
Described sensor can comprise that reception is along the ray of predetermined direction radiation and ray is transformed into a plurality of scintillators of visible light, with a plurality of photodiodes, described a plurality of photodiode is coupled by coupling surface with described a plurality of scintillators respectively, make visible light enter photodiode, so that convert this visible light to charge signal.
Optimal way is that described coupling surface is substantially perpendicular to described predetermined direction.
Optimal way is that described a plurality of first plates and described a plurality of second plate surpass described end face predetermined length along stretching out in the opposite direction with described predetermined party, and form collimating apparatus.
Optimal way is, each in described a plurality of scintillators, except with the surface of photodiode coupling the surface all surround by reflecting material, this reflecting material is used to reflect described visible light.
Optimal way is that the refractive index of described reflecting material is less than the refractive index of described scintillator.
Optimal way is that the outermost plate in described a plurality of first plates and described a plurality of second plate forms first housing, to surround each side of extending along predetermined direction.
Can also comprise according to the array solid probe that is used for radiation detection of the present utility model: the printed circuit board (PCB) that is used to export the charge signal of described a plurality of photodiodes, and second housing of metal, described second housing centers on the part of described printed circuit board (PCB) at least.
Optimal way is that described a plurality of photodiodes are photodiodes of chip scale package structure.
Optimal way is that described a plurality of photodiodes are coupled with optical clear double sticky tape or optical clear glued membrane along coupling surface with corresponding described a plurality of scintillators.
Can also comprise according to the array solid probe that is used for radiation detection of the present utility model: the printed circuit board (PCB) that is used to export the charge signal of described a plurality of photodiodes, and be used for the elastic connector that to be connected between a plurality of photodiodes and the printed circuit board (PCB), this elastic connector is the electro-insulating rubber thin slice, and being provided with the conducting medium striped at described predetermined direction, this conducting medium striped is connected a plurality of photodiodes with printed circuit board (PCB).
Optimal way is that described photodiode falls into the projection of described scintillator on described predetermined direction substantially in the projection on the described predetermined direction.
Described a plurality of first plate and described a plurality of second plate can be formed by heavy metal.
Described heavy metal can be a kind of in tungsten, lead or the tantalum, or a kind of in the alloy that constitutes of tungsten, lead or tantalum.
Can construct the solid probe of any multiple row according to frame mode of the present utility model, satisfy and under the situation of not sacrificing scanning system spatial resolution and contrast sensitivity, improve the large-sized object radiant image needs of scanning fast.This detector also has the advantage of good reliability, convenient for assembly, maintenance except having functions such as protection against the tide, lucifuge, anti-electromagnetic interference (EMI).
Description of drawings
In order to understand characteristic of the present utility model and purpose more all sidedly, below the utility model is described in detail with reference to accompanying drawing.
Fig. 1 is a radiation detection system for large body detector principle schematic commonly used at present.
Fig. 2 is the utility model detector scintillator and photoelectric diode structure synoptic diagram.
Fig. 3 is the utility model detector housing structural representation.
Fig. 4 is scintillator and photodiode coupling surface synoptic diagram.
Fig. 5 is that photodiode and pcb board pass through the elastic connector connection diagram.
Fig. 6 is the synoptic diagram that increases the weight of metal partion (metp) between the scintillator passage.
Fig. 7 is the synoptic diagram that the heavy metal dividing plate extends forward between the scintillator passage.
Embodiment
Fig. 2 is the synoptic diagram of radiation detection system detector of the present utility model, and wherein this detector is the multiple row solid probe that comprises a plurality of scintillators and a plurality of photodiodes.As shown in Figure 2, comprise according to the array solid probe that is used for radiation detection of the present utility model: (for example receive along predetermined direction, radiation exposure direction 205) ray of radiation and ray is transformed into a plurality of scintillators 201 of visible light, with a plurality of photodiodes 202, described a plurality of photodiode is coupled by coupling surface with described a plurality of scintillators respectively, so that visible light enters photodiode 202 and converts this visible light to charge signal.Described coupling surface is substantially perpendicular to described predetermined direction.That is, the coupling surface of photodiode 202 and scintillator 201 is perpendicular to radiation exposure direction 205.Scintillator surface except with the photodiode coupling surface all have reflecting material to surround.Photodiode signal is by pcb board 203 outputs.The large item radiation detection system generally adopts the radiation source (such as electron linear accelerator, high-octane radioactive source) of higher-energy, corresponding with it detector requires that also this radiation is had higher detection efficiency, therefore the length of scintillator 201 can long (such as greater than 30mm) in the detector in the utility model, and in order to reach specific spatial resolution, each probe access is comparable less (such as less than 5mm perpendicular to the sensitive area of scintillator of radiation exposure direction 205 2).Scintillator 201 just presents a kind of elongated strip like this.Optimal way is to select the reflector material of its refractive index less than the refractive index of scintillator 201 for use, just can form a kind of optical waveguide structure in scintillator inside, this optical waveguide structure more helps the transmission of visible light that the emittance deposition produces is passed to two end faces of strip scintillator 201, when therefore photodiode 202 being coupling in the end face of scintillation crystal, although visible light can be farther than the side that photodiode is coupling in scintillation crystal in the transmission range of scintillation crystal inside, still can access abundant visible light signal.
Optimal way is that scintillator is columnar shape substantially.
As the sensor of sense radiation, except adopting above-mentioned a plurality of scintillators 201 and a plurality of photodiode 202, also can adopt other element that is fit to of this area: such as the compound semiconductor ray detector etc.
Fig. 3 is the synoptic diagram that the utility model detector adds metal shell.In the middle of wherein first housing 301 and second housing 302 are included in the scintillator shown in Fig. 2 201, photodiode 202 and a part of pcb board 203.The several side of first housing 301 except the plane of incidence 3011 vertical with radiation exposure direction 205 is made up of heavy metal material, perhaps is lined with heavy metal material.Heavy metal material can be W, Pb or Ta etc.Metal shell plays the effect of lucifuge, damp proof insulation to scintillator and photodiode, also can various elements or the part in the housing be played a supportive role simultaneously.The effect of heavy metal material is to weaken the influence of detector scattering ionising radiation on every side to multiple row detector module edge gateway.
Fig. 4 is the synoptic diagram of scintillator 201 and photodiode 202 coupling surfaces.According to an embodiment of the present utility model, the photodiode of the preferred CSP of photodiode (Chip Size Package chip size packages) structure.The characteristics of the photodiode of CSP structure be its sensitive volume and physical dimension much at one, and do not have wire jumper on the surface of photodiode, help improving the coupling efficiency of photodiode and scintillator, increase the signal sensitivity of probe access.In addition, as shown in Figure 4, a scintillator 201 and a photodiode 202 of intercoupling form a unit, and in each unit, described photodiode falls into the projection of described scintillator on described predetermined direction substantially in the projection on the described predetermined direction.
For the coupling of scintillator 201 and photodiode 202, another embodiment of the utility model preferably adopts optical clear double sticky tape or optical clear glued membrane.With general optical coupled glue, compare as optical clear epoxy resin or optical clear silicon rubber, its advantage be technology simple, be convenient to assembling and maintenance.
According to another embodiment of the present utility model, being connected of photodiode 202 and pcb board 203 adopts elastic connector to connect, referring to 501 among Fig. 5.Here the elastic connector of indication is meant the special electro-insulating rubber thin slice that only is embedded with conducting medium striped 5011 in a direction, and the pattern of these conducting medium stripeds is corresponding to reach the purpose of conductive electrical current signal with the golden contacts patterns on photodiode 202 and the pcb board 203 respectively.Use this elasticity interconnection technique and can make the encapsulation of detector array easier, do not need welding to wait the high temperature operation, and be convenient to safeguard.
Shown in Fig. 6-7, in another embodiment of the present utility model, comprise according to the array solid probe that is used for radiation detection of the present utility model: (for example detect along a plurality of sensors of the ray of radiation exposure direction 205 radiation, a plurality of scintillators 201, with a plurality of photodiodes 202), sensor has the end face (upper surface among Fig. 7) of ray incident, with a plurality of first plates 601, described a plurality of first plate be arranged in parallel substantially, form delegation space at least, described a plurality of rows of sensors are listed in the described space.
Can also comprise a plurality of second plate (not shown)s according to the array solid probe that is used for radiation detection of the present utility model, described a plurality of second plate intersects with a plurality of first plates 601, thus, each row in described at least one row space is separated into a plurality of space arrays, and each in the described sensor is arranged in of a plurality of space arrays.Described a plurality of second plate can be vertical substantially with a plurality of first plates 601, or form for example angle of 80-100 degree.
That is, a scintillator and a photodiode of intercoupling form a unit, are provided with the dividing plate (i.e. first and second plates) of heavy metal between the adjacent described unit.That is, between each scintillator and photodiode passage, increase heavy metal dividing plate, shown in 601 among Fig. 6 as first plate.First plate 601 can be eliminated crosstalking of passage of scintillation light between two adjacent with it passages substantially, also can alleviate ionising radiation crosstalking between two passages simultaneously, makes the spatial resolution of scan image improve.The heavy metal separator material can be tungsten (W), plumbous (Pb) or tantalum (Ta) metal or the main alloy material that is made of these metals.
According to another embodiment of the present utility model, above-mentioned heavy metal dividing plate can also stretch out the front end face of scintillator towards the direction opposite with radiation exposure direction 205, shown in 701 among Fig. 7.In fact the heavy metal dividing plate that these protract has formed one group of grid collimating apparatus (having only the heavy metal dividing plate of a direction to stretch out) or grid collimating apparatus (the heavy metal dividing plate of both direction all stretches out forward), these collimating apparatuss can reduce the scattered ray that enters the multiple row detector, and then improve the contrast sensitivity of scan image.
In the above-described embodiments, metal shell 301 forms separately, also can form metal shell 301 by outermost first plate 601 and second plate as selecting, to surround each side of extending along predetermined direction.
In addition, although above-mentioned be in the example, be provided with the dividing plate (i.e. first and second plates) of heavy metal between the adjacent described unit, but dividing plate (i.e. first and second plates) also can be lighttight material, the effect of dividing plate (i.e. first and second plates) is to isolate light like this.In addition, dividing plate (i.e. first and second plates) also can be an ordinary metallic material, and the effect of dividing plate (i.e. first and second plates) is to isolate light, electricity and magnetic like this.Under the situation that adopts heavy metal material, the effect of dividing plate (i.e. first and second plates) is to isolate light, electricity, magnetic and ionising radiation.
Although described the situation that array solid probe of the present utility model is used for radiant image in the foregoing description, this detector also can be used for other radiation detecting system or equipment.

Claims (17)

1. array solid probe that is used for radiation detection is characterized in that this array solid probe comprises:
Detection is along a plurality of sensors of the ray of predetermined direction radiation, described sensor has the end face of ray incident, with a plurality of first plates, described a plurality of first plate be arranged in parallel substantially, form delegation space at least, described a plurality of rows of sensors is listed in the described space, and wherein said a plurality of first plates are formed by metal.
2. the array solid probe that is used for radiation detection according to claim 1, it is characterized in that this array solid probe also comprises: a plurality of second plates, described a plurality of second plate intersects with a plurality of first plates, thus, each row in described at least one row space is separated into a plurality of space arrays, in the described sensor each is arranged in of a plurality of space arrays, and wherein said a plurality of second plates are formed by metal.
3. the array solid probe that is used for radiation detection according to claim 2 is characterized in that described a plurality of second plate is vertical substantially with a plurality of first plates.
4. the array solid probe that is used for radiation detection according to claim 3, it is characterized in that described sensor comprises: receive along the ray of predetermined direction radiation and ray is transformed into a plurality of scintillators of visible light, with a plurality of photodiodes, described a plurality of photodiode is coupled by coupling surface with described a plurality of scintillators respectively, so that visible light enters photodiode, so that convert this visible light to charge signal.
5. the array solid probe that is used for radiation detection according to claim 4 is characterized in that described coupling surface is substantially perpendicular to described predetermined direction.
6. the array solid probe that is used for radiation detection according to claim 2 is characterized in that: described a plurality of first plates and described a plurality of second plate surpass described end face predetermined length along stretching out in the opposite direction with described predetermined party, and form collimating apparatus.
7. the array solid probe that is used for radiation detection according to claim 5, it is characterized in that: each in described a plurality of scintillators, except with the surface of photodiode coupling the surface all surround by reflecting material, this reflecting material is used to reflect described visible light.
8. the array solid probe that is used for radiation detection according to claim 7 is characterized in that: the refractive index of described reflecting material is less than the refractive index of described scintillator.
9. the array solid probe that is used for radiation detection according to claim 6 is characterized in that the outermost plate in described a plurality of first plate and described a plurality of second plate forms first housing, to surround each side of extending along predetermined direction.
10. the array solid probe that is used for radiation detection according to claim 7, it is characterized in that this array solid probe also comprises: the printed circuit board (PCB) that is used to export the charge signal of described a plurality of photodiodes, and second housing of metal, described second housing centers on the part of described printed circuit board (PCB) at least.
11. the array solid probe that is used for radiation detection according to claim 10 is characterized in that described a plurality of photodiode is the photodiode of chip scale package structure.
12. the array solid probe that is used for radiation detection according to claim 11 is characterized in that described a plurality of photodiode and corresponding described a plurality of scintillators are coupled with optical clear double sticky tape or optical clear glued membrane along coupling surface.
13. the array solid probe that is used for radiation detection according to claim 12, it is characterized in that this array solid probe also comprises: the printed circuit board (PCB) that is used to export the charge signal of described a plurality of photodiodes, and be used for the elastic connector that to be connected between a plurality of photodiodes and the printed circuit board (PCB), this elastic connector is the electro-insulating rubber thin slice, and being provided with the conducting medium striped at described predetermined direction, this conducting medium striped is connected a plurality of photodiodes with printed circuit board (PCB).
14. the array solid probe that is used for radiation detection according to claim 13 is characterized in that: described photodiode falls into the projection of described scintillator on described predetermined direction substantially in the projection on the described predetermined direction.
15. the array solid probe that is used for radiation detection according to claim 1 is characterized in that: described a plurality of first plates are formed by heavy metal.
16. the array solid probe that is used for radiation detection according to claim 2 is characterized in that: described a plurality of first plates and described a plurality of second plate are formed by heavy metal.
17. according to claim 15 or the 16 described array solid probes that are used for radiation detection, it is characterized in that: described heavy metal is a kind of in tungsten, lead or the tantalum, or a kind of in the alloy that constitutes of tungsten, lead or tantalum.
CNU2008201085238U 2008-06-12 2008-06-12 Solid-state detector for radiation detection Expired - Fee Related CN201233444Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008201085238U CN201233444Y (en) 2008-06-12 2008-06-12 Solid-state detector for radiation detection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008201085238U CN201233444Y (en) 2008-06-12 2008-06-12 Solid-state detector for radiation detection

Publications (1)

Publication Number Publication Date
CN201233444Y true CN201233444Y (en) 2009-05-06

Family

ID=40619826

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2008201085238U Expired - Fee Related CN201233444Y (en) 2008-06-12 2008-06-12 Solid-state detector for radiation detection

Country Status (1)

Country Link
CN (1) CN201233444Y (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101604023A (en) * 2008-06-12 2009-12-16 清华大学 The array solid probe that is used for radiation detection
CN108121014A (en) * 2017-12-07 2018-06-05 公安部第三研究所 Perspective view scatters array detection system and method
CN110124213A (en) * 2019-05-15 2019-08-16 上海联影医疗科技有限公司 A kind of multi-leaf optical grating and the radiotherapy unit with the multi-leaf optical grating
CN110691624A (en) * 2017-05-30 2020-01-14 西部制药服务有限公司(以色列) Vertical assembly of PCB
US11819666B2 (en) 2017-05-30 2023-11-21 West Pharma. Services IL, Ltd. Modular drive train for wearable injector

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101604023A (en) * 2008-06-12 2009-12-16 清华大学 The array solid probe that is used for radiation detection
CN101604023B (en) * 2008-06-12 2012-11-14 清华大学 Array solid probe for radiation detection
CN110691624A (en) * 2017-05-30 2020-01-14 西部制药服务有限公司(以色列) Vertical assembly of PCB
CN110691624B (en) * 2017-05-30 2020-10-27 西部制药服务有限公司(以色列) Vertical assembly of PCB
US11819666B2 (en) 2017-05-30 2023-11-21 West Pharma. Services IL, Ltd. Modular drive train for wearable injector
CN108121014A (en) * 2017-12-07 2018-06-05 公安部第三研究所 Perspective view scatters array detection system and method
CN110124213A (en) * 2019-05-15 2019-08-16 上海联影医疗科技有限公司 A kind of multi-leaf optical grating and the radiotherapy unit with the multi-leaf optical grating
CN110124213B (en) * 2019-05-15 2020-12-11 上海联影医疗科技股份有限公司 Multi-leaf collimator and radiotherapy device with same
US11331517B2 (en) 2019-05-15 2022-05-17 Shanghai United Imaging Healthcare Co., Ltd. Multi-leaf collimator and radiation therapy device

Similar Documents

Publication Publication Date Title
CN101604023B (en) Array solid probe for radiation detection
CN101893718B (en) There is the radiation detector of the stacked body of scintillator elements and photodiode array
CN100492053C (en) X-ray linear array detector
CN105723243B (en) Two-sided organic photodetector in flexible substrates
JP4974130B2 (en) Device for detecting ionizing radiation
CN201233444Y (en) Solid-state detector for radiation detection
US20070158574A1 (en) Solid state detector packaging technique
CN104285162A (en) Multi-layer horizontal computed tomography (CT) detector array with at least one thin photosensor array layer disposed between at least two scintillator array layers
GB2446185A (en) Optical assembly and method of assembly
JP2001027673A (en) X-ray detector and x-ray ct apparatus using the same
CN107045138A (en) Back scattering detecting module
CN211043685U (en) Array type nuclear radiation detector based on GAGG scintillator
US7138632B2 (en) Radiation detector
CN109581466B (en) Linear array detector detection module
CN117308773A (en) Three-dimensional position sensitive scintillation detector and scintillation imaging detector
CN110477942B (en) PET detector and medical imaging equipment
CN206906590U (en) Back scattering detecting module
CN111522052B (en) X-ray detector structure and working method thereof
CN209878625U (en) X-ray detector and imaging system thereof
JPH11344573A (en) Radiation semi-conductor detector, and radiation semi-conductor detector array
CN204556842U (en) Linear array detector
CN107390255B (en) Novel CT discrete detector
CN216696694U (en) Detector and medical imaging equipment with same
CN112987072B (en) CT detector module based on dark silicon detector module
CN214503419U (en) CT detector module based on dark silicon detector module

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090506

Termination date: 20130612