CN201228928Y - LED module packaged by plastic sucking and thermal sealing - Google Patents
LED module packaged by plastic sucking and thermal sealing Download PDFInfo
- Publication number
- CN201228928Y CN201228928Y CNU2008200993476U CN200820099347U CN201228928Y CN 201228928 Y CN201228928 Y CN 201228928Y CN U2008200993476 U CNU2008200993476 U CN U2008200993476U CN 200820099347 U CN200820099347 U CN 200820099347U CN 201228928 Y CN201228928 Y CN 201228928Y
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- heat sealing
- led
- sealing die
- led module
- module
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Abstract
The utility model discloses an LED module which is encapsulated through plastic sucking heat sealing, which comprises an LED luminophor, and further comprises a heat sealing module I and a heat sealing module II, wherein the heat sealing module I is equipped with a cavity which has a profile modeling with the LED luminophor, the LED luminophor is encapsulated in the cavity, and the encapsulation mode uses that the heat sealing module I and the heat sealing module I are sucked and sealed. The LED module can overcome the defects of outer encapsulation mode currently, the installment is easy, the operation is convenient, the anti-burn waterproof effects are excellent, the cost is low, and the LED module is suitable to be generalized and used.
Description
Technical field
The utility model relates to the LED encapsulation field, particularly a kind of plastic uptake heat seal encapsulated LED module.
Background technology
In recent years, along with the continuous discovery and the use of new material, new technology, the luminous intensity of LED is greatly improved, and has brought up to several thousand milli candle lights from several milli candle lights, and luminous efficiency has also surpassed incandescent lamp.Along with improving constantly of LED brightness, the particularly appearance of ultra-bright LED, make LED obtain using widely, progressively develop into fields such as being applied to traffic lights, automobile signal light, backlight, indoor and outdoor large screen display from traditional indoor instrument signal of only doing, and gradually to lighting field deeply.
At present, LED generally is that its chip has carried out encapsulation back product in the imaging, be that LED is made up of its chip and interior encapsulation header, be packaged with in it dark, in, shallow branch, in LED penetrates during dark encapsulation light be diverging light, in in when encapsulation the light that penetrates be approximate directional light, the place ahead of LED can obtain a real image during interior shallow encapsulation.
When LED uses out of doors, for waterproof and prevent short circuit, and ensure its electric property, need carry out outer package to it.But present outer package generally is to use the method for external application epoxy resin, the benefit of this method is that packaging effect is good, can play the anti-flaming effect of waterproof, but its encapsulation process is comparatively loaded down with trivial details, be difficult to after the encapsulation LED element is taken out, and cost is also higher.
Therefore, need a kind of plastic uptake heat seal encapsulated LED module, can overcome the deficiency of present outer package mode, be easy to install, easy to operate, anti-flaming good water-proof effect, and cost is lower, is fit to promote on a large scale and use.
The utility model content
In view of this, the purpose of this utility model provides a kind of plastic uptake heat seal encapsulated LED module, can overcome the deficiency of present outer package mode, is easy to install, and is easy to operate, anti-flaming good water-proof effect, and cost is lower, is fit to promote on a large scale and use.
Plastic uptake heat seal encapsulated LED module of the present utility model, comprise the LED illuminator, also comprise heat sealing die I and heat sealing die II, described heat sealing die I is provided with the cavity with the profiling of LED illuminator, described LED illuminator is encapsulated in the cavity, and packaged type adopts heat sealing die I and the heat seal of heat sealing die II plastic uptake;
Further, described LED illuminator is LED lamp pearl or LED lamp group;
Further, also be provided with connecting line profiling cavity on the described heat sealing die II;
Further, on described heat sealing die II, also be provided with antistatic layer, described antistatic layer when encapsulation between LED illuminator and heat sealing die I.
The beneficial effects of the utility model are: by the setting of heat sealing die I and heat sealing die II, the LED illuminator can place inside modules easily, carry out the heat seal encapsulation by heat-sealing machine, time saving and energy saving, and owing to use the heat seal module, anti-flaming good waterproof effect is outstanding, simultaneously, when needs take out the LED illuminator, only need tool using that the heat seal module is opened and get final product, compare original packaged type, the taking-up process is not only time saving and energy saving, and can not cause damage to the LED illuminator, the LED of taking-up can utilize again; Be built-in with antistatic layer, can prevent that LED from taking place because of generation static causes the accident of LED damage, increased the security of this module when heat seal or use; The utility model has overcome the deficiency of present outer package mode, and cost is lower, is fit to promote on a large scale and use.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further described.
Fig. 1 is the utility model structural representation;
Fig. 2 the utility model encapsulation typing schematic diagram.
The specific embodiment
Fig. 1 is the utility model structural representation; Fig. 2 the utility model encapsulation typing schematic diagram.As shown in the figure:
On described heat sealing die II3, also be provided with antistatic layer 6, described antistatic layer 6 when encapsulation between LED illuminator 1 and heat sealing die I2.
Heat sealing die I1 and heat sealing die II2 all use the PVC plate to make, and antistatic layer 6 adopts anti-static material to make.
Explanation is at last, above embodiment is only unrestricted in order to the explanation the technical solution of the utility model, although the utility model is had been described in detail with reference to preferred embodiment, those of ordinary skill in the art is to be understood that, can make amendment or be equal to replacement the technical solution of the utility model, and not breaking away from the aim and the scope of the technical program, it all should be encompassed in the middle of the claim scope of the present utility model.
Claims (5)
1. plastic uptake heat seal encapsulated LED module, comprise LED illuminator (1), it is characterized in that: also comprise heat sealing die I (2) and heat sealing die II (3), described heat sealing die I (2) is provided with the cavity (4) with LED illuminator (1) profiling, described LED illuminator (1) is encapsulated in the cavity (4), and packaged type adopts heat sealing die I (2) and heat sealing die II (3) plastic uptake heat seal.
2. plastic uptake heat seal encapsulated LED module according to claim 1 is characterized in that: described LED illuminator (1) is LED lamp pearl or LED lamp group.
3. according to claim 1 or 2 any described plastic uptake heat seal encapsulated LED modules, it is characterized in that: also be provided with connecting line profiling cavity (5) on the described heat sealing die II (2).
4. plastic uptake heat seal encapsulated LED module according to claim 1 and 2 is characterized in that: also be provided with antistatic layer (6) on described heat sealing die II (3), described antistatic layer (6) is positioned between LED illuminator and the heat sealing die I (2) when encapsulation.
5. plastic uptake heat seal encapsulated LED module according to claim 3 is characterized in that: also be provided with antistatic layer (6) on described heat sealing die II (3), described antistatic layer (6) is positioned between LED illuminator and the heat sealing die I (2) when encapsulation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200993476U CN201228928Y (en) | 2008-07-04 | 2008-07-04 | LED module packaged by plastic sucking and thermal sealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200993476U CN201228928Y (en) | 2008-07-04 | 2008-07-04 | LED module packaged by plastic sucking and thermal sealing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201228928Y true CN201228928Y (en) | 2009-04-29 |
Family
ID=40633875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200993476U Expired - Fee Related CN201228928Y (en) | 2008-07-04 | 2008-07-04 | LED module packaged by plastic sucking and thermal sealing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201228928Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10082252B2 (en) | 2015-10-28 | 2018-09-25 | GE Lighting Solutions, LLC | LED signal module with light-absorbing textured pattern |
-
2008
- 2008-07-04 CN CNU2008200993476U patent/CN201228928Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10082252B2 (en) | 2015-10-28 | 2018-09-25 | GE Lighting Solutions, LLC | LED signal module with light-absorbing textured pattern |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090429 Termination date: 20100704 |