CN201208716Y - Grinding wheel flanged disc for cutting large sapphire crystal on circular grinding machine - Google Patents
Grinding wheel flanged disc for cutting large sapphire crystal on circular grinding machine Download PDFInfo
- Publication number
- CN201208716Y CN201208716Y CNU2008201080075U CN200820108007U CN201208716Y CN 201208716 Y CN201208716 Y CN 201208716Y CN U2008201080075 U CNU2008201080075 U CN U2008201080075U CN 200820108007 U CN200820108007 U CN 200820108007U CN 201208716 Y CN201208716 Y CN 201208716Y
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- CN
- China
- Prior art keywords
- cutting
- abrasive wheel
- sapphire crystal
- grinding wheel
- chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to the cutting field of the sapphire, in particular to an abrasive wheel flange used for cutting a sapphire crystal with the large size on an external grinder, which comprises a locking bolt, an upper chuck, an abrasive wheel and a lower chuck. A thin abrasive wheel with the large diameter is laid between the upper chuck and the lower chuck; the locking nut is arranged on the upper chuck and in threaded connection with the lower chuck, so as to fix the abrasive wheel and the upper chuck. Through improving the abrasive wheel flange of the external grinder, after matching the thin abrasive wheel with the large diameter, the abrasive wheel flange can realize the cutting of the sapphire crystal on the external grinder, so that the cutting effect is good, and the no crack on the cutting surface exist. Furthermore, the abrasive wheel flange has the advantages of simple structure, easy installation and use, high cutting efficiency and low cost.
Description
Technical field
The utility model relates to sapphire cutting field, is specifically related to a kind of grinding wheel flange dish that is used for the cutting large size sapphire crystal on the cylindrical grinder.
Background technology
Sapphire hardness is very high, reaches 9 grades of Morse hardness, and wearability is good, has good mechanics mechanical performance, and sapphire fragility is also very big, is easy to generate crackle in the process of processing, and this has just determined sapphire difficulty of processing very big.Cutting equipment commonly used has band saw lathe, inner circle cutting machine and cylindrical cutting machine, but these methods are in the cutting large size sapphire crystal, cutting efficiency is not high, and blade wear is serious, make cutting cost become very high, band saw and cylindrical cutting also cause crystal cleavage easily, have reduced the utilization rate of crystal; And the main application of cylindrical grinder is round as a ball processing at present, can not be used for the sapphire crystal cutting.
Summary of the invention
The utility model provides a kind of grinding wheel flange dish that is used for the cutting large size sapphire crystal on the cylindrical grinder, comprising: locking nut, upper chuck, emery wheel, lower chuck.It is characterized in that: emery wheel lies against in the middle of upper chuck and the lower chuck, and locking nut places on the upper chuck.
The external diameter of described upper chuck and lower chuck is 150-170mm.
Thickness≤the 5mm of described emery wheel.
Described locking nut adopts with lower chuck and is threaded.
The beneficial effects of the utility model are: by improving the grinding wheel flange dish of cylindrical grinder, cooperate the thin grinding wheel of major diameter again after, on cylindrical grinder, successfully cut the sapphire crystal that diameter surpasses 170mm, good cutting effect, the cut surface flawless exists; Simple in structure, be easy to install and use; The cutting efficiency height, cost is low.
Description of drawings
Fig. 1 is the structural representation of grinding wheel flange dish.
Number in the figure:
The 1-locking nut; The 2-upper chuck; The 3-emery wheel; The 4-lower chuck.
The specific embodiment
The utility model provides a kind of grinding wheel flange dish that is used for the cutting large size sapphire crystal on the cylindrical grinder, below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is the structural representation of grinding wheel flange dish.The thin emery wheel 3 of major diameter lies against in the middle of upper chuck 2 and the lower chuck 4, and locking nut 1 places on the upper chuck 2, is threaded fixed emery wheel 3 and upper chuck 2 with employing between the lower chuck 4; The thickness of emery wheel is 5mm, the grinding wheel flange dish of improved is fixed on the cylindrical grinder, crystal to be cut be fixed on the rotation of grinding wheel 3 front ends top on, under the situation of crystal rotation, slowly advance grinding wheel 3 to cut; When crystal is cut the remaining 10mm left and right sides of the diameter of position, stop cutting, withdrawing is changed the littler grinding wheel of thickness, simultaneously crystal from rotating top taking off, be fixed on and continue cutting on the iron stand, up to cutting off crystal.Low-cost, high efficiency cutting large size sapphire crystal on cylindrical grinder have been realized; The cut surface that is cut crystal is complete, and is flawless.
Claims (4)
1. grinding wheel flange dish that is used for the cutting large size sapphire crystal on the cylindrical grinder, comprising: locking nut, upper chuck, emery wheel, lower chuck is characterized in that: emery wheel lies against in the middle of upper chuck and the lower chuck, and locking nut places on the upper chuck.
2. the grinding wheel flange dish that is used for the cutting large size sapphire crystal on the cylindrical grinder according to claim 1 is characterized in that: the external diameter of described upper chuck and lower chuck is 150-170mm.
3. the grinding wheel flange dish that is used for the cutting large size sapphire crystal on the cylindrical grinder according to claim 1 is characterized in that: the thickness≤5mm of described emery wheel.
4. the grinding wheel flange dish that is used for the cutting large size sapphire crystal on the cylindrical grinder according to claim 1 is characterized in that: described locking nut adopts with lower chuck and is threaded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201080075U CN201208716Y (en) | 2008-05-22 | 2008-05-22 | Grinding wheel flanged disc for cutting large sapphire crystal on circular grinding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201080075U CN201208716Y (en) | 2008-05-22 | 2008-05-22 | Grinding wheel flanged disc for cutting large sapphire crystal on circular grinding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201208716Y true CN201208716Y (en) | 2009-03-18 |
Family
ID=40479442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201080075U Expired - Fee Related CN201208716Y (en) | 2008-05-22 | 2008-05-22 | Grinding wheel flanged disc for cutting large sapphire crystal on circular grinding machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201208716Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104084881A (en) * | 2014-06-27 | 2014-10-08 | 陆冬艳 | Grinding tool convenient to detach |
| CN104476372A (en) * | 2014-12-05 | 2015-04-01 | 蓝思科技股份有限公司 | Sapphire cutting process employing horizontal CNC (computer numerical control) machine |
-
2008
- 2008-05-22 CN CNU2008201080075U patent/CN201208716Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104084881A (en) * | 2014-06-27 | 2014-10-08 | 陆冬艳 | Grinding tool convenient to detach |
| CN104476372A (en) * | 2014-12-05 | 2015-04-01 | 蓝思科技股份有限公司 | Sapphire cutting process employing horizontal CNC (computer numerical control) machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: BEIJING GUOJING INFRARED OPTICAL TECHNOLOGY CO., L Free format text: FORMER OWNER: BEIJING CENTRAL INST.OF THE NONFERROUS METAL Effective date: 20130820 Free format text: FORMER OWNER: BEIJING GUOJING INFRARED OPTICAL TECHNOLOGY CO., LTD. Effective date: 20130820 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20130820 Address after: 100088, 2, Xinjie street, Haidian District, Beijing Patentee after: Beijing Guojing Infrared Optical Technology Co., Ltd. Address before: 100088, 2, Xinjie street, Haidian District, Beijing Patentee before: General Research Institute for Nonferrous Metals Patentee before: Beijing Guojing Infrared Optical Technology Co., Ltd. |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20151225 Address after: 065000 No. 4 Lily Road, Langfang Development Zone, Hebei, China Patentee after: Youyan Photoelectric New Material Co.,Ltd. Address before: 100088, 2, Xinjie street, Haidian District, Beijing Patentee before: Beijing Guojing Infrared Optical Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090318 Termination date: 20170522 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |