CN201207317Y - Contact pin construction for electronic component - Google Patents
Contact pin construction for electronic component Download PDFInfo
- Publication number
- CN201207317Y CN201207317Y CNU2008200844039U CN200820084403U CN201207317Y CN 201207317 Y CN201207317 Y CN 201207317Y CN U2008200844039 U CNU2008200844039 U CN U2008200844039U CN 200820084403 U CN200820084403 U CN 200820084403U CN 201207317 Y CN201207317 Y CN 201207317Y
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- components
- haptic element
- electronic devices
- electronic component
- component
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Abstract
The utility model discloses a pin structure for an electronic component, which belongs to the electronic component technical field, and is composed of a component body and pins which are connected at the lower end of the component body. The pin structure is characterized in that the pins present the bent curve shape structure, and can adopt the corrugated structure, or at least a transverse V-shaped structure with the opening rightwards. The electronic component pin structure has the advantages that the design is novel; the structure is reasonable; the bent curve structure is the main body, so as to guarantee the component to connect and fix with a printed circuit board and can be applied to various electronic components such as a capacitor, a resistor, a diode, an audion and the like, thereby simply controlling the plug height and the PCB extending length of the electronic component and effectively preventing the electric component on the PCB from dropping; the production process can be simplified; the production efficiency, the first-time qualification rate and the production quality can be improved, and the production cost can be reduced.
Description
Technical field
The utility model belongs to technical field of electronic components, is specifically related to a kind of electronic devices and components haptic element structure.
Background technology
Must use a lot of electronic devices and components in electronic product, for example electric capacity, resistance, diode, triode or the like, these components and parts are directly to be welded on the printed substrate (being called for short PCB) basically.In the electric ballast of electricity-saving lamp, especially can use the electronic devices and components of a lot of all sizes, general electronic devices and components need be inserted in advance one the good circuit of cloth, accomplish fluently on the PCB of components and parts fixing hole, carry out scolding tin through manual immersed solder or mistake wave-soldering again, need after scolding tin is finished with solder joint below overlength the components and parts haptic element prune smooth so that next step assembly working.
It is cylindrical that traditional electronic devices and components haptic element is thin vertical bar, the length of haptic element is generally in tens of millimeter, therefore in the sub-components and parts process of plug-in, all electronic devices and components directly can only be inserted into the end, for the electronic devices and components that the grafting requirement for height is arranged, can only locate by the sleeve pipe that puts suitable height in the haptic element bottom,, just increase the operation of sleeve pipe together so virtually to satisfy the control requirement of the height of pegging graft.In addition, components and parts are plugged on PCB, and upward the back is elongated because of its haptic element, its pin length of the fixing back of welding must be sheared, also bring a lot of problems if make short pin, two haptic elements can't be fixed in the spliced eye of PCB, electronic devices and components are tumbled, are shaken easily and come off easily in moving process, cross the rolling of Yin Xibo in the wave-soldering and come off etc.Problems the such as therefore efficient that in use caused of traditional haptic element structure of electronic devices and components is low, first-time qualification rate is low, operation is many are more and more outstanding.
The utility model content
The utility model aims to provide a kind of electronic devices and components haptic element structure technology scheme based on the bending curved configuration, to overcome problems of the prior art.
Described electronic devices and components haptic element structure comprises the haptic element that components and parts body and lower end thereof connect, and it is characterized in that haptic element embayment warpage linear structure.
Described electronic devices and components haptic element structure is characterized in that described haptic element becomes vertical syndeton with components and parts body connecting portion.
Described electronic devices and components haptic element structure is characterized in that described haptic element becomes the oblique syndeton with components and parts body connecting portion.
Described electronic devices and components haptic element structure is characterized in that described haptic element waviness structure.
Described electronic devices and components haptic element structure is characterized in that described haptic element is connected and composed by "＜" shape structure more than.
Above-mentioned electronic devices and components haptic element structural framing novelty, rational in infrastructure, based on the bending curved configuration, can guarantee being connected of components and parts and printed substrate better with fixing, applicable to all kinds of electronic devices and components such as electric capacity, resistance, diode, triodes.Utilize the bending curved configuration of haptic element the electronic devices and components locator card can be connected in the installing hole of PCB during grafting, can control the grafting height of electronic devices and components and the length of stretching out PCB easily, prevent that effectively electronic devices and components from coming off from PCB, simplify production process, enhance productivity, first-time qualification rate and product quality, reduce manufacturing cost.
Description of drawings
Fig. 1 is the utility model structural representation;
Fig. 2 is a haptic element structure for amplifying schematic diagram shown in Figure 1;
Fig. 3 is another example structure schematic diagram of the utility model;
Fig. 4 shows haptic element structure for amplifying schematic diagram for Fig. 3.
Among the figure: 1-components and parts body, 2-haptic element, 3-printed substrate.
Embodiment
Now, describe embodiment of the present utility model in detail in conjunction with Figure of description:
As shown in the figure, comprise the haptic element 2 that components and parts body 1 and lower end thereof connect, haptic element 2 embayment warpage linear structures are to guarantee being connected and fixing of components and parts and printed substrate better.Haptic element 2 becomes vertical syndeton with components and parts body 1 connecting portion, perhaps becomes the oblique syndeton.During grafting, in the installing hole that is stuck in printed substrate 3 that the trench of bending shaped form haptic element can be more firm with electronic devices and components, as Fig. 1, shown in Figure 3, can control the grafting height of electronic devices and components and the length of stretching out printed substrate 3 easily, prevent that effectively electronic devices and components from coming off and simplify production process from printed substrate 3, need not to re-use locating sleeve control and peg graft highly, need not to prune again haptic element length after welding is fixing, can directly enter follow-up assembling procedure.
Above-mentioned haptic element 2 embayment warpage linear structures can adopt wavy shaped configuration, or haptic element 2 are connected and composed by "＜" shape structure more than.
Electronic devices and components haptic element structure described in the utility model is applicable to all kinds of electronic devices and components such as electric capacity, resistance, diode, triodes.
Claims (5)
1. electronic devices and components haptic element structure comprises the haptic element (2) that components and parts body (1) and lower end thereof connect, and it is characterized in that haptic element (2) embayment warpage linear structure.
2. electronic devices and components haptic element structure as claimed in claim 1 is characterized in that described haptic element (2) becomes vertical syndeton with components and parts body (1) connecting portion.
3. electronic devices and components haptic element structure as claimed in claim 1 is characterized in that described haptic element (2) becomes the oblique syndeton with components and parts body (1) connecting portion.
4. as claim 1 or 2 or 3 described electronic devices and components haptic element structures, it is characterized in that described haptic element (2) waviness structure.
5. as claim 1 or 2 or 3 described electronic devices and components haptic element structures, it is characterized in that described haptic element (2) is connected and composed by "＜" shape structure more than.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200844039U CN201207317Y (en) | 2008-03-21 | 2008-03-21 | Contact pin construction for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200844039U CN201207317Y (en) | 2008-03-21 | 2008-03-21 | Contact pin construction for electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201207317Y true CN201207317Y (en) | 2009-03-11 |
Family
ID=40466374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200844039U Expired - Fee Related CN201207317Y (en) | 2008-03-21 | 2008-03-21 | Contact pin construction for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201207317Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102832045A (en) * | 2012-09-11 | 2012-12-19 | 昆山微容电子企业有限公司 | Electric appliance element pin with bushing limiting structure and electric appliance element |
| CN102984891A (en) * | 2012-11-26 | 2013-03-20 | 晶锋集团股份有限公司 | Electronic device convenient to weld and position |
| CN103280315A (en) * | 2013-06-19 | 2013-09-04 | 孙维 | Capacitor |
| CN107086120A (en) * | 2017-03-27 | 2017-08-22 | 上海永铭电子有限公司 | A kind of sheet type aluminum electrolytic electric capacity without seat board |
-
2008
- 2008-03-21 CN CNU2008200844039U patent/CN201207317Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102832045A (en) * | 2012-09-11 | 2012-12-19 | 昆山微容电子企业有限公司 | Electric appliance element pin with bushing limiting structure and electric appliance element |
| CN102984891A (en) * | 2012-11-26 | 2013-03-20 | 晶锋集团股份有限公司 | Electronic device convenient to weld and position |
| CN103280315A (en) * | 2013-06-19 | 2013-09-04 | 孙维 | Capacitor |
| CN107086120A (en) * | 2017-03-27 | 2017-08-22 | 上海永铭电子有限公司 | A kind of sheet type aluminum electrolytic electric capacity without seat board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Hangzhou Tiger Electron & Electric Co., Ltd. Assignor: Wang Peicheng Contract record no.: 2011330000817 Denomination of utility model: Contact pin construction for electronic component Granted publication date: 20090311 License type: Exclusive License Record date: 20110627 |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090311 Termination date: 20120321 |