CN201181345Y - Array waveguide optical grating chip with bended cutting shape - Google Patents

Abstract

The utility model provides an arrayed waveguide grating (AWG) chip which has the bent cutting shape and is characterized in that the AWG chip is provided with boundary contours in bent shape. The AWG chip belongs to the bent-type AWG chip, so that more AWG chips can be produced from the commensurate silicon wafer, thereby greatly reducing cost.

Description

Array waveguide grid chip with crooked cutting profile

Technical field

The utility model belongs to optical communication device.

Background technology

Array waveguide grating (English name Arrayed waveguide grating is called for short AWG) is based on the important optical device of planar optical waveguide integrated technology.AWG can realize multi-functional module with other combination of devices except basic multiplex/demultiplex function, monitor simultaneously etc. as optical cross connect, multi-wavelength, and this device has purposes very widely with its superior function.In recent years and since the continuous growth of IP data service and various wideband switch-in business emerge in large numbers the unlimited demand of having brought bandwidth, dense wave division multipurpose (DWDM) technology has obtained flourish under this demand.Planar optical waveguide (planar light wavecircuit, PLC) technology low with its cost, be convenient to batch process, good stability, be easy to many characteristics such as integrated, be considered to the rising star of dwdm optical communication system industry.The making of optical waveguide is mainly at LiNbO at present ₃, finish wherein silica-based SiO on the glass, backing materials such as InP, Si ₂Advantages such as the optical waveguide integrated technology is owing to having ripe semiconductor process techniques basis, and is good with optical coupling efficiency, with low cost are subjected to extensive attention.An important application of planar optical waveguide integrated device is array waveguide grating (AWG).

AWG type multiplexing demultiplexing device is a kind of plane waveguiding device, is the array waveguide grating of making on single chip.The characteristics of AWG type DWDM device be channel spacing little, insert the little and good uniformity of loss, the multipling channel number is many, volume is little, it is integrated or the like to be easy to other device.And owing to be the waveguide integrated device, be easy to scale, automated production, certain advantage is arranged on cost.The AWG device has purposes very widely with its superior performance, and has very big market outlook.

The structure of AWG type device as shown in Figure 1.AWG type device is made up of the waveguide array that has constant path length difference between N input waveguide, a M output waveguide and two waveguide star-type couplers and adjacent waveguide.Input light is from the same input waveguide input of the input end of first star-type coupler, this coupling mechanism is assigned to luminous power in each Waveguide array, because the waveguide length in the waveguide array does not wait, produce different phase delay, coherence stack in the star-like coupled waveguide of output, thereby show the function and the characteristic of grating, output port and wavelength, are appeared on the different waveguide port according to the difference of wavelength after array waveguide grating transmits by relation-different optical wavelength are formed one to one incident beam.Accurately the length difference of array of designs waveguide can make the signal of different wave length export from different output ports, thereby plays the effect of demodulation multiplexer.

As shown in Figure 1, the AWG device pattern generally is the bending of " ∧ " shape.The manufacturing materials of AWG device is a silicon chip.At first on the polished surface of silicon chip, make layer of silicon dioxide as under-clad layer, then with the core material of growth one deck doping silicon dioxides such as PECVD or flame hydrolysis.Utilize the AWG mask AWG device pattern to be copied to core material, be etched in by RIE or ICP again and form the AWG pattern on the sandwich layer by the method for photoetching.Cover one deck doping silicon dioxide material at last as top covering on sandwich layer, the annealing back forms formal AWG device.

Many AWG figures of can arranging on the silicon chip, the quantity of arranging depends on the size of size of AWG own and silicon chip.For AWG being packaged into the practicability device, method that must be by cutting is AWG pattern-cut rectangularity fritter one by one, and the AWG pattern is complete is kept at (generally being rectangular block) in these blockages.In the AWG product in the market, the AWG chip all is a rectangular block, is called rectangle AWG chip.We find, in rectangle AWG chip, the effective coverage is " ∧ " shape AWG pattern, and many chip areas all do not have the AWG pattern, are actually to have slatterned, if can be by adopting crooked cutting technique, along the AWG edge, only the AWG pattern is scaled off, obtain curved shape AWG chip, then onesize silicon chip may output go out more AWG device, reduces cost greatly.

Summary of the invention

The purpose of this utility model provides a kind of array waveguide grid chip with crooked cutting profile, obtains curved shape AWG chip, and the then onesize more AWG device of silicon chip possibility output reduces cost greatly.

The technical solution of the utility model is: a kind of array waveguide grid chip with crooked cutting profile is characterized in that: it has the boundary contour of curved shape.

Aforesaid array waveguide grid chip with crooked cutting profile is characterized in that: crooked boundary contour part is along the edge of AWG pattern, or all along the bending of AWG pattern edge.

Aforesaid array waveguide grid chip with crooked cutting profile is characterized in that: all along the boundary contour of AWG pattern edge bending, shape is as " ∧ " shape.

Aforesaid array waveguide grid chip with crooked cutting profile is characterized in that: crooked boundary contour and AWG pattern keep the safe distance of 800-15000 micron.

Array waveguide grid chip with crooked cutting profile of the present utility model is by adopting crooked cutting technique, along the AWG edge, only the AWG pattern is scaled off, obtain flexure type AWG chip, the then onesize more AWG device of silicon chip possibility output reduces cost greatly.

Description of drawings

Fig. 1 is existing rectangle AWG chip synoptic diagram.

Fig. 2 is a Fig. 1 rectangle AWG chip and fiber array coupling synoptic diagram.

Fig. 3 is the flexure type AWG chip synoptic diagram of the utility model embodiment 1.

Fig. 4 is Fig. 3 flexure type AWG chip and fiber array coupling figure.

Fig. 5 is the flexure type AWG chip synoptic diagram of the utility model embodiment 2.

Fig. 6 is Fig. 5 flexure type AWG chip and fiber array coupling figure.

Fig. 7 is the flexure type AWG chip synoptic diagram of the utility model embodiment 3.

Fig. 8 is Fig. 7 flexure type AWG chip and fiber array coupling figure.

Fig. 9 is arranging on silicon chip before existing rectangle AWG chip is cut.

Figure 10 is arranging on silicon chip before flexure type AWG chip of the present utility model is cut.

Embodiment

The explanation of mark among Fig. 1: 1-planar waveguide; 2-AWG; The 3-channel waveguide.

The explanation of mark among Fig. 2: 4-AWG component graphics; The 5-AWG chip; The 6-fiber array; The 7-glass sheet.

The explanation of mark among Fig. 3: L1-curved boundaries outline line.L2-straight border outline line.

The single AWG component graphics of the explanation of mark: 4-among Fig. 9; 8-6 inch silicon chip.

Referring to Fig. 3, the array waveguide grid chip with crooked cutting profile of the utility model embodiment 1 is characterized in that: it has the boundary contour of curved shape.It has the portion boundary outline line is curved boundaries outline line L1.

Referring to Fig. 7, the flexure type AWG chip synoptic diagram of the utility model embodiment 3, its all boundary contours all are curved boundaries outline line L1.

Referring to Fig. 9, existing rectangle AWG chip is cut preceding arranging on silicon chip.On the silicon chip a large amount of places that does not have the AWG device pattern is arranged, these all have been wasted.

Array waveguide grid chip with crooked cutting profile of the present utility model, when adopting boundary contour shown in Figure 7, can adopt layout shown in Figure 10, arranging on silicon chip, AWG device pattern on the silicon chip can be densely arranged, do not have the place of pattern to significantly reduce, the then onesize more AWG device of silicon chip possibility output reduces cost greatly.

Accompanying drawing 1-10 has described the technology contents of whole utility model.

The technology of cutting silicon chip comprises cut, and WATER-JET water is cut, etc. method.If the AWG edge of crooked cutting is not really smooth, can adopt chemically treated method smooth with its change, so that test by jerk during encapsulation.Generally speaking, during curvilinear cut AWG pattern, the distance of cut edge and AWG pattern will keep a safe distance, and is as 1000 microns, perhaps nearer or farther.Can the more AWG chip of output for onesize silicon chip, " ∧ " shape AWG chip generally will be arranged in parallel, or other high density is arranged mode.

The AWG chip must just can be used with the fiber array coupling.Can be earlier crooked cutting AWG chip, obtain the AWG chip of curved shape after, again with the fiber array coupling, also can be earlier and fiber array be coupled, carry out bending cutting again.

Claims (4)

1, a kind of array waveguide grid chip with crooked cutting profile, it is characterized in that: it has the boundary contour of curved shape.

2, the array waveguide grid chip with crooked cutting profile as claimed in claim 1 is characterized in that: crooked boundary contour part is along the edge of AWG pattern, or all along the bending of AWG pattern edge.

3, the array waveguide grid chip with crooked cutting profile as claimed in claim 2 is characterized in that: all along the boundary contour of AWG pattern edge bending, shape is as " ∧ " shape.

4, as claim 1 or 2 or 3 described array waveguide grid chips with crooked cutting profile, it is characterized in that: crooked boundary contour and AWG pattern keep the safe distance of 800-15000 micron.

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