CN201174822Y - Damp-proof structure of circuit board - Google Patents
Damp-proof structure of circuit board Download PDFInfo
- Publication number
- CN201174822Y CN201174822Y CNU2008200629475U CN200820062947U CN201174822Y CN 201174822 Y CN201174822 Y CN 201174822Y CN U2008200629475 U CNU2008200629475 U CN U2008200629475U CN 200820062947 U CN200820062947 U CN 200820062947U CN 201174822 Y CN201174822 Y CN 201174822Y
- Authority
- CN
- China
- Prior art keywords
- circuit board
- glass powder
- quartz sand
- damp
- proof
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The utility model discloses a moistureproof structure for a circuit board, which is provided with the moistureproof structure, namely the surfaces of a circuit board and electrical apparatus elements are provided with a layer of fine quartz sand or glass powder; and the fine quartz sand or the glass powder is adhered to the surfaces of the circuit board and the electrical apparatus elements and forms a solid isolation layer. The moistureproof structure for the circuit board has a simple structure, improves high temperature resistant and flame-retardant performances based on ensuring that the circuit board has good moisture resistance, salt fog resistance and mildew resistance, and is applicable to all circuit boards.
Description
Technical field
The utility model relates to a kind of circuit board, especially has the circuit board of moisture-proof construction.
Background technology
Circuit board is a part that often uses in various electrical equipment, the equipment.Circuit board is normally exposed, therefore can be short-circuited under high temperature, high humidity or salt mist environment condition, accident such as electric leakage, causes electrical equipment, device damage, may cause the personal security accident when serious.
Chinese patent CN2165580 number disclosed " bathroom moisture proof telephone " patent (application number: 93211198.X), be the film that is coated with one deck sealing and moistureproof usefulness on the electronical elements surface on the circuit board in the phone support; Can be under any abominable wet environment, guarantee speech quality, and do not influence the normal use of its machine with its machine and time spent.The weak point of this patent is: cover the film of moistureproof usefulness on the electronical elements surface, can only solve problems such as electronic component and electronic component, electronic component and circuit board are short-circuited, electric leakage, can't solve problems such as circuit board is short-circuited, electric leakage.
Chinese patent CN2836067 number disclosed " the LonWorks network intelligence controller of high temperature resistance high humidity, salt air corrosion " patent (application number: 200620070831.7), comprise casing and be arranged on interior circuit board of casing and the electric elements that are arranged on the circuit board, it is characterized in that on the outer surface of casing, being provided with one deck military green acrylic baking paint overcoat, be provided with one deck DJB-823 solid film protective agent overcoat on the surface of circuit board and electric elements; Being provided with of overcoat guaranteed that circuit board has good moisture proof, anti-salt fog and mould proof performance.The weak point of this patent is: the DJB-823 solid film has good Corrosion Protection greasy property and electric property, but inflammable, has therefore increased fire risk.
Summary of the invention
The purpose of this utility model is exactly that a kind of damp-proof structure of circuit board simple in structure will be provided, and is guaranteeing that circuit board has on the basis of good moisture proof, anti-salt fog and mould proof property, increases fire-retardant fail safe.
In order to achieve the above object, the damp-proof structure of circuit board that the utility model provides has moisture-proof construction, promptly is provided with thin quartz sand of one deck or glass powder on the surface of circuit board and electric elements; Thin quartz sand or glass powder are bonded in the surface of circuit board and electric elements and form the solid separator.
The damp-proof structure of circuit board that the utility model provides compared with prior art has positive effect: thin quartz sand or glass powder are bonded in the surface of circuit board and electric elements and form the solid separator, and be simple in structure, takies volume and the space is little; Guaranteeing that circuit board has on the basis of good moisture proof, anti-salt fog and mould proof property, increase high temperature resistant and fire resistance, be applicable to all circuit boards.
Description of drawings
The utility model will be further described in conjunction with the accompanying drawings, please referring to accompanying drawing:
Accompanying drawing 1 expression schematic diagram of the present utility model.
Structure shown in the accompanying drawing 1 comprises: electric elements 1, moisture-proof construction 2, circuit board 3.
Embodiment
The damp-proof structure of circuit board that the utility model provides has moisture-proof construction 2, promptly is provided with thin quartz sand of one deck or glass powder on the surface of circuit board 3 and electric elements 1; Thin quartz sand or glass powder are bonded in the surface of circuit board 3 and electric elements 1 and form the solid separator.
The utility model protection range relates to all changes form recited above.
Claims (1)
1, a kind of damp-proof structure of circuit board is characterized in that: have moisture-proof construction (2), promptly be provided with thin quartz sand of one deck or glass powder on the surface of circuit board (3) and electric elements (1); Thin quartz sand or glass powder are bonded in the surface of circuit board (3) and electric elements (1) and form the solid separator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200629475U CN201174822Y (en) | 2008-04-13 | 2008-04-13 | Damp-proof structure of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200629475U CN201174822Y (en) | 2008-04-13 | 2008-04-13 | Damp-proof structure of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201174822Y true CN201174822Y (en) | 2008-12-31 |
Family
ID=40201953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200629475U Expired - Fee Related CN201174822Y (en) | 2008-04-13 | 2008-04-13 | Damp-proof structure of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201174822Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102711386A (en) * | 2012-05-11 | 2012-10-03 | 倪新军 | Method for manufacturing high-frequency circuit board |
-
2008
- 2008-04-13 CN CNU2008200629475U patent/CN201174822Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102711386A (en) * | 2012-05-11 | 2012-10-03 | 倪新军 | Method for manufacturing high-frequency circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081231 |