CN201171049Y - Luminous semiconductor component - Google Patents
Luminous semiconductor component Download PDFInfo
- Publication number
- CN201171049Y CN201171049Y CN 200720177043 CN200720177043U CN201171049Y CN 201171049 Y CN201171049 Y CN 201171049Y CN 200720177043 CN200720177043 CN 200720177043 CN 200720177043 U CN200720177043 U CN 200720177043U CN 201171049 Y CN201171049 Y CN 201171049Y
- Authority
- CN
- China
- Prior art keywords
- light
- packaging
- base plate
- chip
- conductor components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Led Device Packages (AREA)
Abstract
The utility model relates to a light-emitting semiconductor component. The light-emitting semiconductor component comprises a packaging substrate, a plurality of flip chip connected chips, a heat conducting substrate and insulating material, wherein, the flip chip connected chips are fixed and electrically connected with the packaging substrate. The heat conducting substrate comprises a bulge used for bearing the packaging substrate. The insulating material comprises an opening sleeved in the bulge, and comprises a plurality of contacts electrically connected with the packaging substrate. The light-emitting semiconductor component adopts the flip chip connected technology to package light-emitting semiconductor chip, and to replace the multi-chip light-emitting semiconductor packaging technology in the prior wire bonding technology. Not only the arrangement space length of chips is effectively reduced, but also the light mixing effect among the light-emitting semiconductor chips is enhanced. The number of matrixes in the unit area of the packaging substrate can be increased through the separation design of the high heat conducting substrate and the circuit. Even if a static protection component is arranged on the packaging substrate to meet the higher power light mixing requirement, the obvious dimension increasing of the packaging substrate can not be caused, and the reliability of the product is greatly improved.
Description
Technical field
The utility model relates to a kind of light-emitting semi-conductor components, particularly a kind of light-emitting semi-conductor components with red, green, yellow (RGB) three color chip mixed lights.
Background technology
Light-emitting semi-conductor components has low power consumption, lower calorific value, operation lifetime length, impact resistance, volume is little, reaction speed is fast, no mercury and the good light electrical characteristics such as coloured light that can send wavelength stabilization, progress along with photoelectricity science and technology, light-emitting semi-conductor components has been regarded as one of preferable selection of light source of new generation promoting the existing significant progress in aspects such as luminous efficiency, useful life and brightness.
With white light emitting diode (Light Emitting diode; LED) assembly is an example, and traditional package design is to adopt bonding wire (Wirebonding) to carry out the serial connection of chip.Yet because of technologic restriction, must reserve between chip and the chip pitch of weld from, thereby cause the uneven phenomenon of mixed light, and the problem of polarisation or colour cast.Moreover the serial connection of chip design, usually have the excessive problem of reverse bias, and need increase the protection design of backward current extraly at light-emitting diode component encapsulating structure avris, for example km Zener diode static (Electrostatic discharge such as (Zener diode) is set in light-emitting diode component module end outer rim; EDS) therefore guard assembly also causes the encapsulating structure size significantly to increase, and has limited the structure dress quantity of chip matrix.
Therefore having to provide a kind of simple in structure, package dimension is less, relative mixed light power is preferable high-power light emitting semiconductor subassembly.
The utility model content
The purpose of this utility model is, a kind of simple in structure, light-emitting semi-conductor components that package dimension is little is provided.
The utility model adopts following technical scheme:
A kind of light-emitting semi-conductor components comprises: base plate for packaging (Submount), a plurality of chip bonding chip (Flip Chip), heat-conducting substrate and insulating sheet material.Wherein these chip bonding chips are fixed and are conducted electricity and are linked on the base plate for packaging.Heat-conducting substrate has a protuberance in order to the carrying base plate for packaging.Insulating sheet material has an opening sleeve and is connected among the protuberance, and has a plurality of contacts and base plate for packaging conduction and be connected.
The utility model adopts the chip bonding technology that luminous semiconductor chip is encapsulated, and replaces the multi-chip light emitting semiconductor packaging of existing bonding wire craft.Not only shorten the spacing of arrangements of chips effectively, and promoted the mixed light effect between the luminous semiconductor chip.In addition, by the design that high thermal conductive substrate separates with circuit, more can improve the matrix number (capacity) of base plate for packaging unit are chips.Even in order to reach more high-power mixed light demand, and the electrostatic defending assembly is set on base plate for packaging, also can cause the encapsulating structure size significantly to increase, increased substantially the reliability of product.
Further specify the present invention below in conjunction with drawings and Examples.
Description of drawings
Fig. 1 is an example structure decomposing schematic representation of the present utility model;
Fig. 2 is the section of structure according to light-emitting diode component shown in Figure 1;
Fig. 3 is the structure vertical view of light-emitting diode component shown in Figure 1;
Fig. 4 is another example structure generalized section of the present utility model.
Label declaration
100: light-emitting diode component 101: base plate for packaging
102: light-emitting diode chip for backlight unit 103: heat-conducting substrate
104: insulating sheet material 105: protuberance
106: opening 107: contact
108: lead 109: weld pad
110: intraconnections 111: weld pad
112: external electronic components 113: mixed light light cup
114: speculum 115: projection
200: light-emitting diode component 215: light-emitting diode chip for backlight unit
216: bonding wire B: blue led chips
G: green LED chip R: red light emitting diodes chip
Embodiment
Further specify the utility model below in conjunction with drawings and Examples.But it should be noted that the following technical characterictic that provides also is applicable to other light-emitting semi-conductor components, for example High Power LED chip or laser diode chip etc.
Please refer to Fig. 1 and Fig. 2, Fig. 1 is the STRUCTURE DECOMPOSITION figure of the light-emitting diode component 100 drawn according to a preferred embodiment of this creation.Fig. 2 is the section of structure of the light-emitting diode component 100 drawn according to Fig. 1.Light-emitting semi-conductor components 100 comprises: the light-emitting diode chip for backlight unit 102 of base plate for packaging 101, a plurality of chip bondings, heat-conducting substrate 103 and insulating sheet material 104.
These light-emitting diode chip for backlight unit 102 are to fix and conduct electricity by chip bonding technology to be linked on the base plate for packaging 101.Preferably, these light-emitting diode chip for backlight unit 102 are fixed and are conducted electricity in the mode of symmetric arrays and are connected on the base plate for packaging 101.Among present embodiment, light-emitting diode chip for backlight unit 102 is to fix and conduct electricity in the arranged mode of nine palace lattice to be connected on the base plate for packaging 101.That be positioned at wherein that middle position installs is blue led chips B, is adjacent to the position around the blue led chips B, and green LED chip G is set.Remaining position is then filled up with red light emitting diodes chip R.
In the present embodiment, base plate for packaging 100 is the silicon substrates that have multiple conducting wires 108 in a kind of, wherein an end of each root lead 108 is connected with a weld pad 109, and the other end then extends the edge as for base plate for packaging 101, to form contact or the solder joint that is connected with the external module conduction.102 of each light-emitting diode chip for backlight unit are connected on the weld pad 109 of base plate for packaging 101 by a plurality of projection 115 sets and conduction.
Preferably, heat-conducting substrate 103 is a kind of aluminium base via electroplating processes.Heat-conducting substrate 103 has a protuberance 105 in order to carrying base plate for packaging 101.In the present embodiment, base plate for packaging 101 is to merge (Eutectic) technology by eutectic, has a side of light-emitting diode chip for backlight unit 102 to combine with heat-conducting substrate 103 set not.
Preferably, insulating sheet material 104 is for having the ceramic substrate of at least one intraconnections 110 in a kind of.This ceramic substrate has an opening 106, is used for being socketed among the protuberance 105 of carrying base plate for packaging 101.Wherein an end of each bar intraconnections 110 of insulating sheet material 104 is adjacent to opening 106 edges, and is exposed to outward to form contact 107, is connected with lead 108 conductions of base plate for packaging 100; The other end then prolongs the edge that is exposed to insulating sheet material 104, is connected with external electronic components 112 conductions to form weld pad 111 usefulness.For example, in an embodiment, external electronic components 112 can be a power supply unit, is used to provide driven for emitting lights diode chip for backlight unit 102 needed electric power.
In addition, light-emitting diode component 100 in the present embodiment also can include an alternative mixed light light cup 113 that uses and be surrounded on base plate for packaging 101.Please refer to Fig. 3, Fig. 3 is the structure vertical view of Fig. 1 light-emitting diode component 100.In Fig. 3, the inside side walls of mixed light light cup 113 has a plurality of speculums 114, and the optical design of the multipath reflection face that can be used to arrange in pairs or groups fully mixes the coloured light of all kinds of 102 outgoing of light-emitting diode chip for backlight unit, produces better optical effect.
Because light-emitting diode chip for backlight unit 102 adopts the chip bonding technology to be linked on the base plate for packaging 101, so the spacing that can significantly reduce each light-emitting diode chip for backlight unit 102, not only can promote the mixed light effect of each light-emitting diode chip for backlight unit 102, and can increase the chip matrix number in the unit are of base plate for packaging 101.Add adding of mixed light light cup 113 and take advantage of effect, can obviously promote the luminous power of light-emitting diode component 100.
Please refer to Fig. 4, Fig. 4 is the section of structure of the light-emitting diode component 200 drawn according to another embodiment of the present utility model.Wherein the structure of light-emitting diode component 200 is similar to light-emitting diode component 100, and wherein both identical assemblies will be represented with identical Reference numeral.Both difference only is, light-emitting diode component 200 comprises that also at least one passes through surface mount technology, is attached to the light-emitting diode chip for backlight unit 215 on the base plate for packaging.In the present embodiment, light-emitting diode chip for backlight unit 215 is adjacent to the periphery of the light-emitting diode chip for backlight unit 102 of symmetric arrays.Because light-emitting diode chip for backlight unit 215 is located at the chip matrix outer rim of symmetric arrays, therefore can directly link by many bonding wires 216 with contact 107 conductions that are positioned on the insulating sheet material 104, this kind wire laying mode is unlikely to occupy too many wiring space, therefore can have the technological design elasticity and the cost consideration of mixed light effect and chip matrix concurrently.
According to above-described embodiment, technical characterictic of the present utility model is to adopt the chip bonding technology that luminous semiconductor chip is encapsulated, to replace the multi-chip light emitting semiconductor package body of existing bonding wire craft.Shorten the spacing of arrangements of chips in this way effectively, not only can promote the mixed light effect between each light-emitting diode chip for backlight unit, also can increase the chip matrix capacity of base plate for packaging unit are.Add the thermoelectric separate design that adopts high thermal conductive substrate and insulating sheet material, not only can significantly increase the radiating efficiency of light-emitting diode component, the size requirements that also can dwindle base plate for packaging.Therefore even, and the electrostatic defending assembly is set on base plate for packaging in order to reach more high-power mixed light demand, can not cause the encapsulating structure size significantly to increase yet, can significantly improve the reliability of product.Arrange in pairs or groups the again optical design of mixed light light cup multipath reflection face can fully mix the coloured light of all kinds of light-emitting diode chip for backlight unit institute outgoing again, produce better optical effect.
Above-described embodiment only is used to illustrate technological thought of the present utility model and characteristics, its purpose makes those skilled in the art can understand content of the present utility model and is implementing according to this, when can not only limiting claim of the present utility model with present embodiment, be all equal variation or modifications of doing according to the spirit that the utility model disclosed, still drop in the claim of the present utility model.
Claims (10)
1, a kind of light-emitting semi-conductor components is characterized in that comprising:
One base plate for packaging;
A plurality of chip bonding chips, fixing and conduction is linked on this base plate for packaging;
One heat-conducting substrate has one in order to carry the protuberance of this base plate for packaging;
One insulating sheet material has one and is socketed on the opening of this protuberance and a plurality of contacts that are connected with this base plate for packaging conduction.
2, light-emitting semi-conductor components according to claim 1 is characterized in that: described heat-conducting substrate is the aluminium base through electroplating processes, and this base plate for packaging merges technology by eutectic and combines with this aluminium base.
3, light-emitting semi-conductor components according to claim 1 is characterized in that: described base plate for packaging is a silicon substrate.
4, light-emitting semi-conductor components according to claim 1 is characterized in that: also comprise:
Be located at a plurality of weld pads on the described base plate for packaging, each described weld pad is provided with the projection of a conduction, and described chip bonding chip is fixed on this projection;
Multiple conducting wires, an end of each lead connects a described weld pad, and the other end is connected with a described contact conduction.
5, light-emitting semi-conductor components according to claim 1 is characterized in that: described chip bonding chip is to fix and conduct electricity in the mode of symmetric arrays to be connected on this base plate for packaging.
6, light-emitting semi-conductor components according to claim 5, it is characterized in that: also comprise at least one surface mount chip that is attached on this base plate for packaging, described surface mount chip is adjacent to the periphery of this chip bonding chip, and described surface mount chip links with described contact conduction respectively by many root beads line.
7, light-emitting semi-conductor components according to claim 6 is characterized in that: described contact is connected with external electronic components conduction via many intraconnections in this insulating sheet material respectively.
8, light-emitting semi-conductor components according to claim 7 is characterized in that: described external electronic components is one to be used to provide the power supply unit that drives the needed electric power of this light-emitting semi-conductor components.
9, light-emitting semi-conductor components according to claim 1 is characterized in that: also comprise a mixed light light cup around this base plate for packaging.
10, light-emitting semi-conductor components according to claim 1 is characterized in that: an inside side walls of described mixed light light cup has a plurality of speculums.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200720177043 CN201171049Y (en) | 2007-09-07 | 2007-09-07 | Luminous semiconductor component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200720177043 CN201171049Y (en) | 2007-09-07 | 2007-09-07 | Luminous semiconductor component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201171049Y true CN201171049Y (en) | 2008-12-24 |
Family
ID=40210098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200720177043 Expired - Lifetime CN201171049Y (en) | 2007-09-07 | 2007-09-07 | Luminous semiconductor component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201171049Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102865487A (en) * | 2012-10-11 | 2013-01-09 | 杭州友旺科技有限公司 | Light-emitting diode (LED) light source module |
-
2007
- 2007-09-07 CN CN 200720177043 patent/CN201171049Y/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102865487A (en) * | 2012-10-11 | 2013-01-09 | 杭州友旺科技有限公司 | Light-emitting diode (LED) light source module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20081224 |
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| CX01 | Expiry of patent term |