CN201167093Y - 侧视型的发光二极管结构 - Google Patents
侧视型的发光二极管结构 Download PDFInfo
- Publication number
- CN201167093Y CN201167093Y CNU2007203101851U CN200720310185U CN201167093Y CN 201167093 Y CN201167093 Y CN 201167093Y CN U2007203101851 U CNU2007203101851 U CN U2007203101851U CN 200720310185 U CN200720310185 U CN 200720310185U CN 201167093 Y CN201167093 Y CN 201167093Y
- Authority
- CN
- China
- Prior art keywords
- emitting diode
- groove
- light
- conductive connecting
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Led Device Packages (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2007203101851U CN201167093Y (zh) | 2007-12-20 | 2007-12-20 | 侧视型的发光二极管结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2007203101851U CN201167093Y (zh) | 2007-12-20 | 2007-12-20 | 侧视型的发光二极管结构 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201167093Y true CN201167093Y (zh) | 2008-12-17 |
Family
ID=40192484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2007203101851U Expired - Fee Related CN201167093Y (zh) | 2007-12-20 | 2007-12-20 | 侧视型的发光二极管结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201167093Y (zh) |
-
2007
- 2007-12-20 CN CNU2007203101851U patent/CN201167093Y/zh not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: EVERLIGHT ELECTRONICS( SUZHOU) CO., LTD. Free format text: FORMER OWNER: EVERLIGHT ELECTRONICS INDUSTRIAL STOCK CO., LTD. Effective date: 20091225 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20091225 Address after: No. 2135, West Zone, Wujiang Economic Development Zone, Jiangsu, Zhongshan North Road, China: 212000 Patentee after: Billion Optoelectronics (Suzhou) Co., Ltd. Address before: 25, Lane 76, three middle road, Tu Cheng Road, Taipei County, Taiwan, china: Patentee before: Everlight Electronics Co.,Ltd. |
|
C56 | Change in the name or address of the patentee |
Owner name: YIGUANG ELECTRONICS (CHINA) CO., LTD. Free format text: FORMER NAME: YIGUANG ELECTRONICS (SUZHOU) CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: Wujiang City, Jiangsu province 215000 Songling Town Economic Development Zone No. 2135 Zhongshan North Road west division operation Patentee after: Everlight Electronics (China) Co.,Ltd. Address before: 212000, Jiangsu, Wujiang Economic Development Zone, West 2135, Zhongshan North Road Patentee before: Everlight Electronics (Suzhou) Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081217 Termination date: 20151220 |
|
EXPY | Termination of patent right or utility model |