CN201151217Y - Brazed and sintered multilayer diamond tools for optimizing arrangement of abradant - Google Patents
Brazed and sintered multilayer diamond tools for optimizing arrangement of abradant Download PDFInfo
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- CN201151217Y CN201151217Y CNU2007201312843U CN200720131284U CN201151217Y CN 201151217 Y CN201151217 Y CN 201151217Y CN U2007201312843 U CNU2007201312843 U CN U2007201312843U CN 200720131284 U CN200720131284 U CN 200720131284U CN 201151217 Y CN201151217 Y CN 201151217Y
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- abrasive
- diamond
- diamond abrasive
- soldering
- stair shape
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Abstract
The utility model relates to the material processing field, in particular relates to a multi-layer diamond abrasive tool with braze welding and sintering of the optimized abrasive arrangement, which comprises a drill bit, a saw bit, an abrasive wheel, a string of beads, and other diamond abrasive tool, and is mainly used for the drilling, cutting and grinding processing of the materials such as the metal, the stone, the concrete, the glass, the ceramics, the crystal, the horniness alloy, the silicone chip, the magnetic materials, etc. The basic structure of the working zones of the diamond abrasive drill bit, saw bit, abrasive wheel and the string of beads is designed to be a ladder-shaped stage structure; a V-shaped groove is processed on the stage surface so as to fix the diamond abrasive, so that the sharp end or the seamed edge of the diamond abrasive stays at the highest end; the diamond abrasive braze welding is fixed inside the V-shaped groove and on the stage surface; the casing materials are sintered inside a valley that is arranged between two ladder-shaped teeth; the tool abrasive is optimized to be arranged, and integrates the advantages of the braze welding and the sintering; the abrasive is put into application step by step; the abrasive tool has a multi-layer structure; the abrasive tool has the advantages such as high processing efficiency, long service life, good processing quality, etc. during the drilling, cutting and grinding processing.
Description
Technical field
The utility model relates to material processing field, be specifically related to a kind of have the soldering that abrasive material optimization arranges and the multi-layer diamond instrument of sintering, it comprises diamond tools such as drill bit, saw blade, emery wheel, beading, be mainly used in materials such as metal, stone material, concrete, glass, pottery, crystal, carbide alloy, silicon chip, magnetic material brill, cut, grind processing.
Background technology
At present, the metal-bonded diamond abrasive material tools can be divided into three types of plating, sintering, soldering.Plating diamond tool only depends on the embedding of coating machinery to inlay diamond abrasive; on diamond and coating interface, there is not bond strength; sintered diamond tool mixes the pressed compact sintering with metal dust to be made with diamond abrasive grains, and neither soaking on impregnated with diamond abrasive material and carcass material interface does not have bond strength yet.The diamond abrasive of these two kinds of instruments all can be because of hold comes off inadequately too early when the heavy load operation, and the abrasive material utilization rate is low, and life tools are short.Electroplate for solving, it is low that the sintered diamond tool abrasive material is controlled intensity, the problem that comes off too early, closely during the last ten years, research is both at home and abroad made the diamond abrasive instrument with method for brazing, because active element such as Cr in diamond abrasive and the fusing solder, reactions such as Ti, this reaction has improved the wetting climbing ability of fusing soldering component to abrasive surface, make compatible enhancing the between bond and the diamond abrasive, promoted and adhered to adhesion strength, solved the not enough problem of diamond abrasive hold on the instrument, brazed diamond tool has obtained application more and more widely, and the market share promotes just steadily.Because of the single layer soldering diamond tool is made easily, at present, material processing field is based on the single layer soldering diamond tool, these single layer soldering diamond tools in use expose some problems, restricted the rapid popularization of brazed diamond tool at manufacture field, problem mainly shows as: 1, because braze welding diamond cylindrical drill, saw blade, emery wheel, the face of beading bonding diamond is respectively the end face of cylindrical drill matrix, the outer circumference surface of saw bit matrix, the external cylindrical surface of emery wheel and beading matrix, diamond abrasive grain on these faces is almost participated in simultaneously and is cut grinding, almost behind the while blunt, cause and the high difficult drop-off of bond bond strength, increase with the processing object contact area, instrument is difficult to provide the pressure of appropriateness to exercise effective grinding, cutting efficiency and crudy reduce, if reduce the diamond quantity of tool surfaces, though cutting force is little, the cutting efficiency height, life tools are short.2, regular diamond abrasive is hexahedron or octahedron or dodecahedron, and the surface mostly is the face that is parallel to each other, diamond abrasive swims in liquid phase solder top layer in brazing process, under liquid metal solder surface tension effects, the diamond particles tension power effect of tool surfaces, make the plane surface of diamond abrasive be parallel to the tool base surface, cut during the grinding, Ding Wei new abrasive material in this way, its effect is equal to the old abrasive material on the big plane of wearing and tearing, and sharp top and seamed edge fails to obtain fine utilization.Diamond abrasive often occupies sizable part in the tool making cost, and the documents and materials of report still do not have the report that the most expensive composition diamond grit optimization is utilized in the instrument.Can each tool advantage of diamond tool that 3, plating, sintering, soldering processes are made carry out their advantages integratedly, learns from other's strong points to offset one's weaknesses, and makes the excellent more instrument of performance, still do not have bibliographical information.
Summary of the invention
The purpose of this utility model provides the soldering that a kind of abrasive material optimization arranges and the multi-layer diamond abrasive material tools of sintering, comprise matrix, diamond abrasive, stair shape step, on matrix, have a plurality of stair shape steps, on step surface, have the V-type groove, the diamond abrasive soldering is fixed on V-type groove and the step surface, the tip or the seamed edge that are fixed on the diamond abrasive of V-type groove are in most significant end, bore, cut, grind and add man-hour, reduced the contact area of diamond abrasive and processing object, grinding force is little, the working (machining) efficiency height can overcome the deficiencies in the prior art part effectively.
The purpose of this utility model realizes with following technical scheme: the soldering that a kind of abrasive material optimization is arranged and the multi-layer diamond instrument of sintering, comprise matrix, diamond abrasive, stair shape step, it is characterized in that: matrix is provided with the stair shape step, on the step surface of stair shape step, have the V-type groove, diamond abrasive is fixed on the step surface of V-type groove and stair shape step by the soldering binding agent braze welding, the height of single step is the 60%-90% of diamond particle diameter yardstick, and sintering has the filling carcass material in the trench of two stair shape between cog.
The soldering that described abrasive material optimization is arranged and the multi-layer diamond instrument of sintering, matrix is provided with a plurality of stair shape steps, direct soldering fixed diamond abrasive material on the step surface of stair shape step.
The soldering that described abrasive material optimization is arranged and the multi-layer diamond instrument of sintering, on matrix, have a plurality of stair shape steps, on the step surface of stair shape step, have the V-type groove, diamond abrasive is fixed on V-type groove and the stair shape step surface by the soldering binding agent braze welding, diamond abrasive fixing in the V-type groove makes its tip or seamed edge be in most significant end, the degree of depth of V-type groove is less than or equal to the size of diamond particle diameter, and angle is at least 50 °, is preferably 120 °.
The utility model has the advantages that: diamond brazing drill bit, saw blade, emery wheel workspace basal body structure are designed to the ledge structure that stair shape has the V-type groove, the diamond abrasive soldering is fixed on V-type groove and the step surface, V-type groove location diamond abrasive makes the tip of diamond abrasive or seamed edge be in most significant end, bore, cut, grind and add man-hour, reduced the contact area of diamond abrasive and processing object, grinding force is little, the working (machining) efficiency height; The diamond abrasive that is in stair shape step top is started working earlier, along with adamantine wearing and tearing, diamond on the step surface is progressively devoted oneself to work, this makes that having the multi-layer diamond abrasive material on this diamond tool works, and the vertical side of step and horizontal plane, V-type groove face have supporting role to diamond abrasive, adding is that soldering is fixed, and diamond abrasive is in conjunction with fixation, and life tools are long; Stability when sintering filling carcass material can the instrument of significantly improving be cut grinding in the trench of two staircases, slow down or avoid machined material collapse the limit phenomenon, improve crudy.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples:
Fig. 1 is the cutaway view of preferred V-type groove step scheme of the present utility model and the contrast of pure step scheme;
Fig. 2 is the cutaway view of the utility model stair shape V-type groove step and diamond abrasive position relation;
Fig. 3 is the cutaway view of mutual alignment relation between diamond abrasive after the utility model soldering, soldering bond, stair shape step V-type groove, the matrix;
Fig. 4 is the utility model cutaway view behind the sintering filling carcass material in the trench of two stair shape between cog;
Fig. 5 is the cutaway view after the finishing of the utility model sintering filling carcass material;
Among the figure: 1. matrix, 2. diamond abrasive, 3. step, 4.V type groove, 5. soldering bond, 6. sintering carcass material, 7. trench
The specific embodiment
As shown in Figure 1, contrasted the difference of prior art and the utility model technology, 2 solderings of prior art diamond abrasive are on the matrix plane, when soldering, adamantine plane surface is pulled to the plane surface 3 of matrix 1 by the soldering bond, therefore, cut the diamond face that is exposed to workpiece during the grinding and be flat surface, be not suitable for sharp of the wedge angle of effectively cutting.The utility model is by the V-type groove 4 of 120 ° of open angle, form the wedge angle sword that exposes, the open angle of groove is at least 50 °, be preferably 120 °, the width of groove wants big must be enough to make abrasive material to stay in one or both sides of fine ditch groove, can make groove by the method to matrix chemical etching or electric spark or machining.
As shown in Figure 2, process stair shape step 3 in matrix 1 working region, a V-type groove is arranged on each step 3, diamond grinding material sequential arraying is on the combinatorial surface of V-type groove and step.Preferred single shoulder height is the 60%-90% of diamond particle diameter yardstick, and step surface and V-type groove face can go out with Wire EDM and other processing method time processing.
As shown in Figure 3, the diamond abrasive of fixing in the V-type groove 42 makes its tip or seamed edge be in most significant end, and the side of step forms firm support to diamond.
As shown in Figure 4, hot pressed sintering filling carcass material 6 in the trench 7 of two stair shape between cog.
As shown in Figure 5, the filling carcass material 6 of hot pressed sintering is after finishing in the trench 7 of two stair shape between cog, and the purpose of finishing is the exposure that obtains desired shape and ground floor abrasive material, method finishing dressings such as available emery wheel, finishing pen, electric spark, electrolysis.
The soldering that a kind of abrasive material optimization is arranged and the multi-layer diamond instrument of sintering, comprise that matrix 1, diamond abrasive 2, stair shape step 3, matrix are provided with stair shape step 3, on the step surface of stair shape step 3, have V-type groove 4, diamond abrasive 2 is fixed on the step surface of V-type groove 4 and stair shape step 3 by 5 solderings of soldering bond, the height of single step is the 60%-90% of diamond particle diameter yardstick, and sintering has filling carcass material 6 in the trench 7 of two stair shape between cog.
The soldering that described abrasive material optimization is arranged and the multi-layer diamond instrument of sintering, matrix 1 is provided with a plurality of stair shape steps 3, direct soldering fixed diamond abrasive material 2 on the step surface of stair shape step 3.
The soldering that described abrasive material optimization is arranged and the multi-layer diamond instrument of sintering, have a plurality of stair shape steps 3 on the matrix 1, on the step surface of stair shape step 3, have V-type groove 4, diamond abrasive 2 is fixed on the face of V-type groove 4 and stair shape step 3 by 5 solderings of soldering bond, diamond abrasive 2 fixing in the V-type groove 4 makes its tip or seamed edge be in most significant end, the degree of depth of V-type groove 4 is less than or equal to the size of diamond particle diameter, and angle is at least 50 °, is preferably 120 °.
Claims (3)
1. the abrasive material optimization soldering of arranging and the multi-layer diamond instrument of sintering, comprise matrix (1), diamond abrasive (2), stair shape step (3), it is characterized in that: matrix (1) is provided with stair shape step (3), on the step surface of stair shape step (3), have V-type groove (4), diamond abrasive (2) is fixed on the step surface of V-type groove (4) and stair shape step (3) by soldering bond (5) soldering, the height of single step is the 60%-90% of diamond particle diameter yardstick, and sintering has filling carcass material (6) in the trench (7) of two stair shape between cog.
2. the soldering that abrasive material optimization according to claim 1 is arranged and the multi-layer diamond instrument of sintering, it is characterized in that: matrix (1) is provided with a plurality of stair shape steps (3), direct soldering fixed diamond abrasive material (2) on the step surface of stair shape step (3).
3. the soldering that abrasive material optimization according to claim 1 is arranged and the multi-layer diamond instrument of sintering, it is characterized in that: have a plurality of stair shape steps (3) on the matrix (1), on the step surface of stair shape step (3), have V-type groove (4), diamond abrasive (2) is fixed on V-type groove (4) and stair shape step (3) face by soldering bond (5) soldering, diamond abrasive (2) fixing in the V-type groove (4) makes its tip or seamed edge be in most significant end, the degree of depth of V-type groove (4) is less than or equal to the size of diamond particle diameter, angle is at least 50 °, is preferably 120 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201312843U CN201151217Y (en) | 2007-12-07 | 2007-12-07 | Brazed and sintered multilayer diamond tools for optimizing arrangement of abradant |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201312843U CN201151217Y (en) | 2007-12-07 | 2007-12-07 | Brazed and sintered multilayer diamond tools for optimizing arrangement of abradant |
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| Publication Number | Publication Date |
|---|---|
| CN201151217Y true CN201151217Y (en) | 2008-11-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201312843U Expired - Fee Related CN201151217Y (en) | 2007-12-07 | 2007-12-07 | Brazed and sintered multilayer diamond tools for optimizing arrangement of abradant |
Country Status (1)
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| CN (1) | CN201151217Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101824968A (en) * | 2010-05-13 | 2010-09-08 | 中国地质大学（北京） | Novel brazed impregnated diamond bit |
| CN102225536A (en) * | 2011-05-06 | 2011-10-26 | 福建万龙金刚石工具有限公司 | Diamond saw blade with abrasives under multi-layer orientation arrangement |
| CN101704277B (en) * | 2009-06-12 | 2012-10-03 | 厦门东南新石材工具有限公司 | Manufacture method of multi-layer diamond brazing body |
| CN103506964A (en) * | 2013-09-17 | 2014-01-15 | 广东省电力线路器材厂 | Modified diamond abrasive tool and manufacturing method thereof |
| CN107775193A (en) * | 2017-10-24 | 2018-03-09 | 长沙理工大学 | A kind of method and system of double light beam laser soldering diamond |
-
2007
- 2007-12-07 CN CNU2007201312843U patent/CN201151217Y/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101704277B (en) * | 2009-06-12 | 2012-10-03 | 厦门东南新石材工具有限公司 | Manufacture method of multi-layer diamond brazing body |
| CN101824968A (en) * | 2010-05-13 | 2010-09-08 | 中国地质大学（北京） | Novel brazed impregnated diamond bit |
| CN102225536A (en) * | 2011-05-06 | 2011-10-26 | 福建万龙金刚石工具有限公司 | Diamond saw blade with abrasives under multi-layer orientation arrangement |
| CN103506964A (en) * | 2013-09-17 | 2014-01-15 | 广东省电力线路器材厂 | Modified diamond abrasive tool and manufacturing method thereof |
| CN107775193A (en) * | 2017-10-24 | 2018-03-09 | 长沙理工大学 | A kind of method and system of double light beam laser soldering diamond |
| CN107775193B (en) * | 2017-10-24 | 2019-07-19 | 长沙理工大学 | A kind of method and system of double light beam laser soldering diamond |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081119 Termination date: 20131207 |