CN201064933Y - Diamond thread saw - Google Patents

Diamond thread saw Download PDF

Info

Publication number
CN201064933Y
CN201064933Y CNU2007200075535U CN200720007553U CN201064933Y CN 201064933 Y CN201064933 Y CN 201064933Y CN U2007200075535 U CNU2007200075535 U CN U2007200075535U CN 200720007553 U CN200720007553 U CN 200720007553U CN 201064933 Y CN201064933 Y CN 201064933Y
Authority
CN
China
Prior art keywords
metal wire
diamond abrasive
wire base
diamond
abrasive grain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2007200075535U
Other languages
Chinese (zh)
Inventor
张小军
韩权利
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CNU2007200075535U priority Critical patent/CN201064933Y/en
Application granted granted Critical
Publication of CN201064933Y publication Critical patent/CN201064933Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Polishing Bodies And Polishing Tools (AREA)

Abstract

The utility model discloses a novel diamond wire saw, which comprises a metal wire base body and diamond abrasive grains, a side grain is arranged on the metal wire base body along the length direction, and the diamond abrasive grains are fixed on the side grain by means of braze welding. The utility model can realize the single ended spread of the diamond abrasive grains on the metal wire base body through the side grain, thus acquiring rather narrow saw sawn joints, and the workpiece can be processed accurately in a greater degree. The braze welding empowers the metal wire base body with high holding force to the diamond abrasive grains, the exposing degree of the diamond abrasive grains is high, the service life of the wire saw is extended, and the processing efficiency of the wire saw can be improved obviously.

Description

Diamond jigsaw
Technical field
The utility model relates to the hard brittle material manufacture field, is applicable to cut-out, jacking and the profiled holes Surface Machining of crisp and hard materials such as agate, jade, marble, granite, glass, pottery, monocrystalline silicon.
Background technology
Diamond wire saw is a kind of hard brittle material cutting equipment fast-developing over past ten years, according to the motion mode and the machine tool structure of silk saw, can be divided into reciprocating type and unidirectional silk saw, according to the abrasive particle user mode of silk saw, can be divided into free abrasive and fixed grain silk saw.Free abrasive silk saw, because the high loss of abrasive particle and base slurry (being collectively referred to as defibrination), and defibrination is to the restriction of the factors such as pollution of environment, its giving priority to real needs status is replaced by fixed grain silk saw gradually.Fixed grain silk saw has that joint-cutting is narrower, cost depletions is low and the advantage little to ambient influnence.Fixed grain silk saw mainly contains abrasive particle roll-down type and electrodeposition-type two classes, and wherein abrasive particle roll-down type silk saw embeds diamond abrasive grain in the silk saw matrix by the roll extrusion mode, can reduce silk saw matrix strength like this, uses uncommon; Electrodeposition-type silk saw is owing to diamond abrasive grain needs to be cemented on the metal wire base by the mode of electroplating, diamond abrasive grain just mechanically is embedded between coating and the metal wire base, therefore the coat of metal is little to the hold of diamond abrasive grain, in addition, because coating is thick, the exposed degree of diamond abrasive grain is low, and chip space is less, just cause the service life of silk saw shorter, and working (machining) efficiency is lower.And existing diamond wire saw, the cross section of its metal wire base is generally circle, because circle does not possess directionality, add man-hour, diamond abrasive grain can only complete cycle be arranged and can't single ender in metal wire base, need precision machined workpiece for some, just can produce because of the narrow inadequately situation that can't use of saw kerf.
The utility model content
The purpose of this utility model provides a kind of long service life, working (machining) efficiency height and the narrower diamond jigsaw of saw kerf.
The technical solution of the utility model is such: diamond jigsaw, comprise metal wire base and diamond abrasive grain, and its length direction of above-mentioned metal wire base upper edge is provided with a side grain, and above-mentioned diamond abrasive grain is consolidated on this side grain by brazing mode.
The cross section of above-mentioned metal wire base is square, and above-mentioned diamond abrasive grain is brazed on the face of this square metal silk matrix.
The cross section of above-mentioned metal wire base is trapezoidal, and above-mentioned diamond abrasive grain is brazed on the bottom surface of this trapezoidal metal wire base.
The cross section of above-mentioned metal wire base is arc, and above-mentioned diamond abrasive grain is brazed on the side grain at string place of this arc metal wire base.
After adopting such scheme, diamond jigsaw of the present utility model, its length direction is provided with a side grain in the metal wire base upper edge, diamond abrasive grain is consolidated in this side grain by brazing mode, like this, just can realize the single ender of diamond abrasive grain, thereby obtain narrower saw kerf, can carry out accurate more processing workpiece.And soldering makes the hold height of metal wire base to diamond abrasive grain, and the exposed degree of diamond abrasive grain is high, and the service life of a saw is long and can significantly improve the working (machining) efficiency that silk is sawed.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment one.
Fig. 2 is the structural representation of the utility model embodiment two.
Fig. 3 is the structural representation of the utility model embodiment three.
Fig. 4 is the structural representation of the utility model embodiment four.
The specific embodiment
Diamond jigsaw of the present utility model, embodiment one comprise the metal wire base 2 that diamond abrasive grain 1 and cross section are square as shown in Figure 1, and diamond abrasive grain 1 is brazed in metal wire base 2 and is positioned on the face on the square long limit.
Diamond jigsaw of the present utility model, embodiment two comprise that diamond abrasive grain 1 and cross section are trapezoidal metal wire base 3 as shown in Figure 2, and diamond abrasive grain 1 is brazed on the bottom surface of metal wire base 3.
Diamond jigsaw of the present utility model, embodiment three comprise that diamond abrasive grain 1 and cross section are arc metal wire base 4 as shown in Figure 3, and diamond abrasive grain 1 is brazed on the side grain at string place of metal wire base 4.
Diamond jigsaw of the present utility model, embodiment four as shown in Figure 4, comprise the metal wire base 2 that diamond abrasive grain 1 and cross section are square, in order to obtain narrower saw kerf, diamond abrasive grain 1 is brazed in metal wire base 2 is positioned on the face on the square minor face.

Claims (4)

1. diamond jigsaw comprises metal wire base and diamond abrasive grain, it is characterized in that: its length direction of above-mentioned metal wire base upper edge is provided with a side grain, and above-mentioned diamond abrasive grain is consolidated on this side grain by brazing mode.
2. diamond jigsaw according to claim 1 is characterized in that: the cross section of above-mentioned metal wire base is square, and above-mentioned diamond abrasive grain is brazed on the face of this square metal silk matrix.
3. diamond jigsaw according to claim 1 is characterized in that: the cross section of above-mentioned metal wire base is trapezoidal, and above-mentioned diamond abrasive grain is brazed on the bottom surface of this trapezoidal metal wire base.
4. diamond jigsaw according to claim 1 is characterized in that: the cross section of above-mentioned metal wire base is arc, and above-mentioned diamond abrasive grain is brazed on the side grain at string place of this arc metal wire base.
CNU2007200075535U 2007-07-03 2007-07-03 Diamond thread saw Expired - Fee Related CN201064933Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2007200075535U CN201064933Y (en) 2007-07-03 2007-07-03 Diamond thread saw

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2007200075535U CN201064933Y (en) 2007-07-03 2007-07-03 Diamond thread saw

Publications (1)

Publication Number Publication Date
CN201064933Y true CN201064933Y (en) 2008-05-28

Family

ID=39482095

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2007200075535U Expired - Fee Related CN201064933Y (en) 2007-07-03 2007-07-03 Diamond thread saw

Country Status (1)

Country Link
CN (1) CN201064933Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101704276B (en) * 2009-11-09 2012-01-04 南京航空航天大学 Brazing diamond fret saw with grinding materials being arranged in order in spiral shape and manufacturing process thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101704276B (en) * 2009-11-09 2012-01-04 南京航空航天大学 Brazing diamond fret saw with grinding materials being arranged in order in spiral shape and manufacturing process thereof

Similar Documents

Publication Publication Date Title
CN101066614A (en) Diamond jigsaw
CN201283606Y (en) Superfine diamond cutting wire
CN101195257B (en) Diamond soldering appliance
CN103506964A (en) Modified diamond abrasive tool and manufacturing method thereof
CN202079511U (en) Diamond saw blade with abrasives directionally arranged in multiple layers
CN202006517U (en) Caking type diamond cutting blade
CN202639371U (en) Polycrystalline cubic boron nitride (PCBN) cutter for machining cylinder body
CN201064933Y (en) Diamond thread saw
CN102975292A (en) Multi-layer soldering diamond string bead
CN203696796U (en) Improved diamond abrasive tool
CN206185712U (en) Superhard abrasive material instrument
CN106625294A (en) Superhard abrasive tool and manufacturing method thereof
CN102225536A (en) Diamond saw blade with abrasives under multi-layer orientation arrangement
CN109551386B (en) Multifunctional diamond grinding wheel for grinding and cutting
CN201415284Y (en) Brazing diamond tool
CN202656328U (en) Diamond rope zigzag bead string
CN101195256B (en) Diamond bead with curve or stepped configuration
CN107379277B (en) Diamond saw blade
CN206519622U (en) A kind of special circular saw blade of hard alloy
CN209240268U (en) Deep layer helical arrangement is brazed diamond bead
CN212666411U (en) Diamond cutter head for cutting granite marble and various stones
KR101234572B1 (en) Diamond Tool and Method for Manufacturing the Diamond Tool
CN201500825U (en) Ultra-hard material saw blade
CN201030623Y (en) Novel braze welding diamond bead and wire saw using the same
CN201261232Y (en) Sparse serration brazing diamond tool block

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
EE01 Entry into force of recordation of patent licensing contract

Assignee: Quanzhou Keen Diamond Tool Co., Ltd.

Assignor: Zhang Xiaojun

Contract record no.: 2010350000307

Denomination of utility model: Diamond jigsaw

Granted publication date: 20080528

License type: Exclusive License

Record date: 20101208

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080528

Termination date: 20130703