CN201115021Y - Etching device for dipping circuit board - Google Patents
Etching device for dipping circuit board Download PDFInfo
- Publication number
- CN201115021Y CN201115021Y CNU2007201762794U CN200720176279U CN201115021Y CN 201115021 Y CN201115021 Y CN 201115021Y CN U2007201762794 U CNU2007201762794 U CN U2007201762794U CN 200720176279 U CN200720176279 U CN 200720176279U CN 201115021 Y CN201115021 Y CN 201115021Y
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- CN
- China
- Prior art keywords
- jet pipe
- circuit board
- etching
- feeding
- immersion type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The utility model relates to a circuit wafer etching equipment of soaking type. The equipment comprises etchants which are contained in an etching groove; a plurality of transporting axles which can transport and move a circuit wafer are arranged transversally inside the etching groove; two removed guiding rollers are arranged between two transporting axles. The equipment of the utility model applies the pressure generated by a nozzle soaked in the etching groove during spraying out the etchant toward the circuit wafer to drive the etchant in the etching groove to flow between two adjacent guiding rollers, thus the etchant etching the copper foils on the circuit wafer in a concentrated and even way, the occurrence of damaged lines and excess etching is effectively reduced, and the shaping of lines is more reliable.
Description
Technical field
The utility model relates to a kind of flow direction of guiding etching solution, makes Copper Foil on the circuit board be able to the immersion type circuit board Etaching device of uniform etching.
Background technology
When conducting transmission line disposes on the circuit board; be prior to sticking the layer of copper paillon foil on the substrate; and cover the protective layer of circuit pattern thereon with the light shield visualization way; utilize etching solution that the Copper Foil position that is not provided with protective layer is corroded again; again protective layer is removed at last, made Copper Foil on the substrate present the pattern of circuit.
Existing immersion type circuit board Etaching device; as No. 89212368 " Thin copper sheet etching machine structure " a case of the novel patent of TaiWan, China or No. 95221546 " immersion type etching machine " a case of novel patent; it is to fill more than the etching bath inside of etching solution in one; the following double-deck mode transverse row that overlaps is shown several feeding axles; which is provided with some delivery wheels; make a circuit board be able to clamping in last; move between the delivery wheel of lower floor and in etching bath; be arranged at intervals with jet pipe between the feeding axle; be arranged at intervals with several shower nozzles on each jet pipe respectively; the liquid level of etching solution is higher than the nozzle position of the jet pipe on upper strata in this etching bath; borrow shower nozzle towards circuit board direction ejection etching solution; utilize the interior etching solution of etching solution pressure drive etching bath of shower nozzle ejection to flow; so that the Copper Foil position that is not provided with protective layer is corroded, make Copper Foil on the substrate present the pattern of circuit.
And still there is the shortcoming of the Copper Foil uniform etching that can't make on the circuit board in the immersion type circuit board Etaching device of this prior art, referring to shown in Figure 5, be some jet pipes of being located between the feeding axle 60 70, borrow the shower nozzle 71 on it to spray etching solution towards the circuit board direction, when the etching solution in the etching solution pressure drive etching bath of shower nozzle 71 ejections flows, can make etching solution flow arbitrarily towards different directions, cause the less position of part hydraulic pressure to produce residual foot phenomenon because of corroding deficiency, cause forming between circuit short circuit, or the bigger position of part hydraulic pressure produced erosion to circuit board, the structural strength deficiency that causes circuit, cause when using in the future and can pass through to produce the heating phenomenon because of electric current, even after procedure of processing in burst apart and produce and open circuit, so the circuit board Etaching device of prior art truly has it can further improve part.
The utility model content
Technical problem underlying to be solved in the utility model is, overcomes the above-mentioned defective that prior art exists, and a kind of immersion type circuit board Etaching device is provided, and it can further make etching solution concentrate and uniformly the Copper Foil on the circuit board is corroded.
The technical scheme that its technical problem that solves the utility model adopts is:
A kind of immersion type circuit board Etaching device, include an etching bath, several feeding axles, several jet pipes and several guide roller, wherein, be loaded with etching solution in this etching bath, its two opposite sides are formed with an inlet and an outlet respectively, this is more than feeding axle, the following double-deck mode that overlaps is transversely arranged in etching bath inside, be interval with several delivery wheels on it, this jet pipe is located at the opposite side of feeding axle with respect to the feeding axle of another layer at interval, be interval with the shower nozzle that several communicate with jet pipe on each jet pipe, its opening is with respect between two feeding axles, and the liquid level of etching solution is higher than the nozzle position of the jet pipe on upper strata in the etching bath, it is characterized in that: be provided with two at interval guide roller mutually respectively between two adjacent feeding axles and near the feeding axle place of another layer.
Aforesaid immersion type circuit board Etaching device, wherein the mutual vertical arrangement of jet pipe and feeding axle is arranged on the jet pipe and shower nozzle is oblique.
Aforesaid immersion type circuit board Etaching device, wherein jet pipe and feeding axle are located between two feeding axles in parallel to each other at interval, are arranged on the jet pipe and shower nozzle is oblique.
Aforesaid immersion type circuit board Etaching device, wherein each jet pipe can drive shower nozzle and together swings.
Aforesaid immersion type circuit board Etaching device wherein is provided with two dash rollers respectively in the inlet of etching bath and the place, inboard of outlet.
Configuration by said structure, when a circuit board is entered in the etching bath by entrance side, and be held between the feeding axle of upper and lower layer when moving toward outlet side, utilize the etching solution of shower nozzle in the etching solution pressure drive etching bath of circuit board ejection to flow, and further borrow two adjacent and parallel guide roller direct etch liquid therebetween to flow, make etching solution concentrate and uniformly the Copper Foil on the circuit board is corroded, with the residual sufficient and mistake erosion phenomenon of effective reduction circuit, make the moulding of circuit more certain.
The beneficial effects of the utility model are, it can further make etching solution concentrate and uniformly the Copper Foil on the circuit board is corroded.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is a side cutaway view of the present utility model.
Fig. 2 is the side cutaway view of another embodiment of the utility model.
Fig. 3 is the part assembly enlarged diagram of another embodiment of the utility model.
Fig. 4 is a part assembly plan view of the present utility model.
Fig. 5 is the part assembly plan view of prior art.
The number in the figure explanation:
10 etching baths, 11 inlets
12 outlets, 13 dash rollers
20 feeding axles, 21 delivery wheels
30,30 ' jet pipe, 31 shower nozzles
40 guide roller, 50 circuit boards
60 feeding axles, 70 jet pipes
71 shower nozzles
Embodiment
Referring to shown in Figure 1, be immersion type circuit board Etaching device of the present utility model, it includes an etching bath 10, several feeding axles 20, several jet pipes 30 and several guide roller 40, wherein:
Be loaded with etching solution in the etching bath 10, its two opposite sides are formed with an inlet 11 and one outlet 12 respectively, and in inlet 11 and export place, 12 inboard and be provided with two dash rollers 13 respectively, to avoid etching solution by inlet 11 or export 12 and overflow etching bath 10;
Feeding axle 20 with perpendicular to inlet 11 to outlet 12 online direction and transversely arranged in etching bath 10 inside in the upper and lower double-deck mode that overlaps, be interval with some delivery wheels 21 on it, so that a circuit board 50 that enters etching bath 10 by inlet 11 sides is able to clamping between the delivery wheel 21 of upper and lower layer and move towards outlet 12 in etching bath 10 inside;
Cooperation is referring to Fig. 3 and shown in Figure 4, one group and be located at spaced reciprocally between the two adjacent feeding axles 20 and in twos of guide roller 40 near feeding axle 20 places of another layer, and turn in the same direction with feeding axle 20, move towards the outlet 12 of etching bath 10 to drive clamping circuit board 50 therebetween, and when shower nozzle 31 towards the circuit board 50 ejection etching solutions of 20 of feeding axles to drive etching solution in the etching bath 10 when mobile, can borrow guide roller 40 further direct etch liquid to flow in 40 of two adjacent guide roller, make etching solution concentrate and uniformly the Copper Foil on the circuit board 50 is corroded, residual sufficient and cross the generation lose phenomenon with effective reduction circuit, make the moulding of circuit more certain.
Claims (5)
1. immersion type circuit board Etaching device, include an etching bath, several feeding axles, several jet pipes and several guide roller, wherein, be loaded with etching solution in this etching bath, its two opposite sides are formed with an inlet and an outlet respectively, this is more than feeding axle, the following double-deck mode that overlaps is transversely arranged in etching bath inside, be interval with several delivery wheels on it, this jet pipe is located at the opposite side of feeding axle with respect to the feeding axle of another layer at interval, be interval with the shower nozzle that several communicate with jet pipe on each jet pipe, its opening is with respect between two feeding axles, and the liquid level of the interior etching solution of etching bath is higher than the nozzle position of the jet pipe on upper strata, it is characterized in that:
Between two adjacent feeding axles and near the feeding axle place of another layer, be provided with two at interval guide roller mutually respectively.
2. immersion type circuit board Etaching device according to claim 1 is characterized in that the mutual vertical arrangement of described jet pipe and feeding axle, is arranged on the jet pipe and shower nozzle is oblique.
3. immersion type circuit board Etaching device according to claim 1 is characterized in that described jet pipe and feeding axle be located between two feeding axles at interval in parallel to each other, is arranged on the jet pipe and shower nozzle is oblique.
4. immersion type circuit board Etaching device according to claim 2 is characterized in that described each jet pipe can drive shower nozzle and together swing.
5. according to claim 3 or 4 described immersion type circuit board Etaching devices, it is characterized in that the inlet of the etching bath that is set forth in and the place, inboard of outlet are provided with two dash rollers respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201762794U CN201115021Y (en) | 2007-09-07 | 2007-09-07 | Etching device for dipping circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201762794U CN201115021Y (en) | 2007-09-07 | 2007-09-07 | Etching device for dipping circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201115021Y true CN201115021Y (en) | 2008-09-10 |
Family
ID=39966772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201762794U Expired - Lifetime CN201115021Y (en) | 2007-09-07 | 2007-09-07 | Etching device for dipping circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201115021Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102786226A (en) * | 2011-05-19 | 2012-11-21 | 吉富新能源科技(上海)有限公司 | Etching technology capable of improving solar conductive glass efficiency |
| CN107552254A (en) * | 2017-08-08 | 2018-01-09 | 武汉华星光电半导体显示技术有限公司 | A kind of developing apparatus and developing method |
| CN109451673A (en) * | 2018-11-16 | 2019-03-08 | 深圳崇达多层线路板有限公司 | A kind of production method of high-precision internal layer circuit |
| CN113207233A (en) * | 2020-02-03 | 2021-08-03 | 睿明科技股份有限公司 | Vertical substrate wet processing device |
-
2007
- 2007-09-07 CN CNU2007201762794U patent/CN201115021Y/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102786226A (en) * | 2011-05-19 | 2012-11-21 | 吉富新能源科技(上海)有限公司 | Etching technology capable of improving solar conductive glass efficiency |
| CN107552254A (en) * | 2017-08-08 | 2018-01-09 | 武汉华星光电半导体显示技术有限公司 | A kind of developing apparatus and developing method |
| CN109451673A (en) * | 2018-11-16 | 2019-03-08 | 深圳崇达多层线路板有限公司 | A kind of production method of high-precision internal layer circuit |
| CN113207233A (en) * | 2020-02-03 | 2021-08-03 | 睿明科技股份有限公司 | Vertical substrate wet processing device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20080910 |
|
| CX01 | Expiry of patent term |