CN201114760Y

CN201114760Y - A solid conductive microphone

Info

Publication number: CN201114760Y
Application number: CNU2007201724364U
Authority: CN
Inventors: 陈虎; 温志锋; 吴宗汉
Original assignee: SHENZHEN HORN ELECTROACOUSTIC TECHNOLOGY Co Ltd
Current assignee: Shenzhen Horn Audio Co Ltd
Priority date: 2007-10-12
Filing date: 2007-10-12
Publication date: 2008-09-10
Anticipated expiration: 2017-10-12

Abstract

The utility model discloses a solid conductive microphone which comprises an outer casing, a piezoelectric plate, a copper ring and a circuit board component. The piezoelectric plate, the copper ring and the circuit board are sequentially arranged in the outer casing. The circuit board component comprises a circuit board. The outer casing is opening on one end and closed on the other end to form a barrel shape, and the opening part is equipped with a flanging which is inwardly arranged. The piezoelectric plate is arranged on the closed end of the outer casing and is closely arranged to the bottom of the outer casing. The circuit board is arranged at the opening part of the outer casing. The copper ring is clamped between the circuit board and the piezoelectric plate. The solid conductive microphone of the utility model which adopts the technical proposal is not equipped with a sound inlet hole on the outer casing and composes an enclosed structure with the circuit board. The outer casing directly transmitting required vibration signals to the piezoelectric plate and converting into electrical signals, therefore, the interference of acoustic signals in external air can be effectively isolated.

Description

A kind of solid conduction microphone

Technical field

The utility model relates to the microphone field, is specifically related to a kind of solid conduction microphone.

Background technology

Along with development of modern industry, how in having the environment of noisy background noise, to extract the required vibration small-signal of a few thing, become the difficult problem that an exigence solves.Traditional way is to adopt single microphone that points to collect signal, carries out processing and amplifying again.But the directive property of existing microphone is general, is difficult for collecting needed vibration signal; Even can collect required vibration signal sometimes, also will inevitably introduce many ambient noises, make the signal that collects be subjected to very big interference, mask sometimes even by the noisy background noise in the environment.

Summary of the invention

The technical problems to be solved in the utility model is the above-mentioned defective that remedies prior art, and a kind of solid conduction microphone is provided.

Technical problem of the present utility model adopts following technical scheme to be solved:

This solid conduction microphone comprises that shell and order place piezoelectric patches, copper ring and the circuit board assemblies in the shell, and described circuit board assemblies comprises circuit board, and described shell is the barrel-like structure of end opening other end sealing, and opening part has inside crimping; Described piezoelectric patches places an end of shell seal and is close to the bottom of shell; Described circuit board is positioned at the shell aperture place; Described copper ring is clipped between circuit board and the piezoelectric patches.

In the optimized technical scheme, described piezoelectric patches have two and more than, and mutually series connection.

Further, described piezoelectric patches comprises piezoceramics layer, and the first metal layer and second metal level of being close to the piezoceramics layer lower surface of being close to the piezoceramics layer upper surface.

Further, the diameter of described piezoceramics layer and the first metal layer is less than the diameter of second metal level.

Further again, described piezoelectric patches also comprises insulated ring, and described insulated ring is positioned at the outer of piezoceramics layer.

In the optimized technical scheme, also be provided with through hole on the described circuit board, and the diameter of through hole is less than 0.3 millimeter.

Further, also be filled with sound-absorbing material in the described copper ring.

In the optimized technical scheme, also comprise metallic plate, described metallic plate is clipped between piezoelectric patches and the copper ring, and is close to piezoelectric patches.

Further in the optimized technical scheme, also comprise cavity, described cavity is between the inwall of metallic plate, copper ring and shell.

In the optimized technical scheme, the output that described circuit board assemblies also comprises the amplifier that is installed on the circuit board inboard and is arranged on the circuit board outside.

The beneficial effect that the utility model is compared with the prior art is:

Shell is not offered sound hole, and (common microphone is typically provided with sound hole at outer casing bottom, to allow sound to arrive diaphragm by this sound hole, and cause that diaphragm vibrates, and finally acoustical signal is converted to the signal of telecommunication), and form the structure of sealing with circuit board, directly required vibration signal is conducted to piezoelectric patches by shell and to convert the signal of telecommunication to, thereby can effectively completely cut off the interference of external sound signal.And shell adopts metal material to make, and almost completely by metal enclosed, capability of electromagnetic shielding is splendid for whole microphone, and anti-power frequency magnetic field disturbs and anti-radio frequency degree of disturbing very competent, for current EMC Design provides a fabulous selection.

Owing to adopt two and above piezoelectric patches series connection, on the basis of not changing material, can increase output signal, improve the sensitivity of solid conduction microphone.

Because it is the piezoelectric patches that adopts two metal layers therebetween piezoceramics layer to make, simple in structure, cost is low and effective.

Owing to make the diameter of the diameter of piezoceramics layer and the first metal layer, can guarantee unlikely contact of the first metal layer and cause short circuit with the inwall of shell less than second metal level.

Owing to the insulated ring of insulating material is set in the piezoceramics layer outer, piezoceramics layer is played a protective role.

Owing on circuit board, offer through hole, and the diameter of through hole can keep the consistency of inside and outside air pressure of microphone less than 0.3 millimeter, the distortion when eliminating microphone work when shell vibrates.

Owing in copper ring, be filled with highdensity sound-absorbing material, make that the noise signal that enters microphone inside is absorbed as much as possible, the noise signal that finally acts on the piezoelectric patches is extremely small, the degree that people's ear can not be felt in the time of can being reduced to playback to noise signal.

Owing between piezoelectric patches and copper ring, be provided with metallic plate, piezoelectric patches tightly is pressed in outer casing bottom, keep between outer casing bottom and the piezoelectric patches, and be electrically connected reliably between copper ring and the piezoelectric patches.

Owing to be provided with cavity, metallic plate, copper ring contact with outer casing inner wall in the time of can effectively preventing to assemble, and cause the microphone short circuit, thereby are implemented in the practicality of producing in enormous quantities in the factory.

Owing on circuit board, be provided with amplifier and output, will amplify from the ultra-weak electronic signal of piezoelectric patches, finally can supply the signal of telecommunication of client utilization by output output.

Description of drawings

Fig. 1 is the cutaway view of the utility model embodiment;

Fig. 2 is the A-A partial enlarged drawing of the utility model embodiment;

Fig. 3 is the vertical view of piezoelectric patches in the utility model embodiment;

Fig. 4 is the vertical view of the utility model embodiment.

Embodiment

As shown in Figure 1, the solid conduction microphone of this embodiment comprises: output 1, circuit board 2, electronic component 3, copper ring 4, shell 5, sound-absorbing material 6, cavity 7, piezoelectric patches 8 and metallic plate 9.

Wherein shell 5 is made by magnadure or packfong, is the cylindric of end sealing, other end opening.Piezoelectric patches 8 and cavity 7 have been placed in the cylinder-like shell 5 successively, and then in cavity 7, put into metallic plate 9 and copper ring 4 successively, in copper ring 4, put into sound-absorbing material 6 again, use the opening of circuit board 2 closures 5 at last, by flanging process the opening part of shell 5 is carried out the crimping encapsulation then.

The inner surface of shell 5 bottoms is very smooth, can closely reliably contact with it to guarantee piezoelectric patches placed on it 8.Metallic plate 9 be positioned at piezoelectric patches 8 directly over, its effect is that piezoelectric patches 8 can be closely closely contacted with the inner surface of shell 5 bottoms, can react in time when shell 5 receives external vibration, farthest vibration signal is converted to the signal of telecommunication.

As shown in Figures 2 and 3, piezoelectric patches 8 comprises two metal layers and is clipped in piezoceramics layer 82 between the two metal layers, promptly is positioned at the first metal layer 81 above the piezoceramics layer 82 and is positioned at second metal level 83 below it.One circle insulated ring 84 is arranged between the outer edge of piezoceramics layer 82 and the first metal layer 81 and second metal level 83, cover the outer edge of piezoelectric ceramic 82, it is shielded.

Cavity 7 adopts insulating material, and its effect makes fixing metal pole plate 9 and conductive copper 4, and can prevent pole plate 9, conductive copper 4 from contacting with shell 5 in assembling and the short circuit that causes, thereby is implemented in the usability of producing in enormous quantities in the factory.

Electronic devices and components 3 are arranged on the inside one side of circuit board 2, comprise electric capacity, resistance and signal amplifier, signal amplifier herein adopts the J-FET tube core usually, and the ultra-weak electronic signal that piezoelectric patches 8 is produced amplifies, and finally exports to client by the output 1 that is positioned on the circuit board 2.

As Fig. 1 or shown in Figure 4, also offer small through hole 10 on the circuit board 2, its effect is to make the inside and outside acoustic pressure of microphone reach consistent, thereby improves the high frequency response of microphone, reduces distortion.The effect of sound-absorbing material 6 is the extraneous acoustical signals that absorb through hole 10, and by adopting highdensity sound-absorbing material 6, people's ear does not play the stage of induction in the time of can being reduced to playback to the interference noise that comes from the outside.

Through hole 10 is generally the circular hole of diameter below 0.3 millimeter, unlikely too strong and cause sound-absorbing material 6 can not absorb outside noise fully with the extraneous acoustical signal that guarantees to enter microphone inside, thus cause the vibration microphone can not effectively eliminate the interference of extraneous acoustical signal.

In addition,, can adopt two and the above piezoelectric patches 8 mutual modes that are connected in series, reach the effect that improves sensitivity thereby increase output signal if want to improve sensitivity.

Above content be in conjunction with concrete preferred implementation to further describing that the utility model is done, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, under the prerequisite that does not break away from the utility model design, can also make some simple deduction or replace, all should be considered as belonging to protection range of the present utility model.

Claims

. a kind of solid conduction microphone, comprise that shell (5) and order place piezoelectric patches (8), copper ring (4) and the circuit board assemblies in the shell (5), described circuit board assemblies comprises circuit board (2), it is characterized in that, described shell (5) is the barrel-like structure of end opening other end sealing, and opening part has inside crimping; Described piezoelectric patches (8) places an end of shell (5) sealing and is close to the bottom of shell (5); Described circuit board (2) is positioned at shell (5) opening part; Described copper ring (4) is clipped between circuit board (2) and the piezoelectric patches (8).
2. solid conduction microphone according to claim 1 is characterized in that, described piezoelectric patches (8) have two and more than, and mutually series connection.
3. solid conduction microphone according to claim 1 and 2 is characterized in that, described piezoelectric patches (8) comprises piezoceramics layer (82), and is close to the first metal layer (81) of its upper surface and is close to second metal level (83) of its lower surface.
4. solid conduction microphone according to claim 3 is characterized in that, the diameter of described piezoceramics layer (82) and the first metal layer (81) is less than the diameter of second metal level (83).
5. solid conduction microphone according to claim 4 is characterized in that, described piezoelectric patches (8) also comprises insulated ring (84), and described insulated ring (84) is positioned at the outer of piezoceramics layer (82).
6. solid conduction microphone according to claim 5 is characterized in that, also is provided with through hole (10) on the described circuit board (2), and the diameter of through hole (10) is less than 0.3 millimeter.
7. solid conduction microphone according to claim 1 is characterized in that, also is provided with through hole (10) on the described circuit board (2), and the diameter of through hole (10) is less than 0.3 millimeter.
8. solid conduction microphone according to claim 6 is characterized in that, also is filled with sound-absorbing material (6) in the described copper ring (4).
9. according to any described solid conduction microphone in the claim 1,7,8, it is characterized in that also comprise metallic plate (9), described metallic plate (9) is clipped between piezoelectric patches (8) and the copper ring (4), and is close to piezoelectric patches (8).
10. solid conduction microphone according to claim 9 is characterized in that, also comprises cavity (7), and described cavity (7) is positioned between the inwall of metallic plate (9), copper ring (4) and shell (5).