CN201083548Y - Heat conducting measurement equipment - Google Patents
Heat conducting measurement equipment Download PDFInfo
- Publication number
- CN201083548Y CN201083548Y CNU2007202005575U CN200720200557U CN201083548Y CN 201083548 Y CN201083548 Y CN 201083548Y CN U2007202005575 U CNU2007202005575 U CN U2007202005575U CN 200720200557 U CN200720200557 U CN 200720200557U CN 201083548 Y CN201083548 Y CN 201083548Y
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- China
- Prior art keywords
- hygrosensor
- heat
- measuring equipment
- temperature
- mainboard
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- Expired - Fee Related
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Abstract
The utility model provides a heat transfer measuring device, comprising a temperature detector for measuring the temperature of an air inlet of a chassis, wherein, the temperature detector is arranged on a cardinal plate inside the chassis and is close to the air inlet, the temperature detector is next to a heating element on the cardinal plate which is provided with a notch between the temperature detector and the heating element, the temperature detector is separated from the heating element by the notch in order to reduce the heat exchange between the heating element and the temperature detector. The notch which is arranged between the temperature detector and a central processor and the surrounding heating element greatly reduces the influence of the central processor and the surrounding heating element on the temperature obtain of the temperature; meanwhile, the system cost is not increased and the notch also helps to solve the problems of heat dissipation and noise of the computer system.
Description
Technical field
The utility model relates to a kind of heat and passes measuring equipment, particularly passes measuring equipment about a kind of heat that is applied to electronic product.
Background technology
Computer system generally solves heat dissipation problem by fan and heating radiator, and in the heat radiation process, computer system must require and the noise requirement according to heat radiation, finishes this process according to the fan control curve that prior formulation is good.Therefore, the two is the comparison difficulty will to take into account heat radiation and noise aspect computer system heat radiation simultaneously, in order to take into account heat radiation and noise, traditional implementation method is on computer system motherboard or a certain local hygrosensor of installing of cabinet inside front end air inlet obtains temperature in the current system, thereby regulates rotation speed of the fan to realize formulating good fan control curve in advance.
Yet if in a certain position of cabinet inside air inlet a hygrosensor is installed, this detector is to be connected on the computer system motherboard by a winding displacement, comes Data transmission with this.This mode can accurately obtain the internal system intake air temperature, and can not influence temperature variation because the main board part is overheated, but increase a winding displacement, increased the system design cost, and it also can increase assembly cost and part management cost as assembling parts.Another method is directly hygrosensor to be installed on the mainboard as surface mount elements, can effectively reduce the cost of each side with respect to preceding a kind of mode, but hygrosensor is positioned at above the mainboard, and other heater elements above the mainboard can influence the accuracy that hygrosensor obtains temperature.
Summary of the invention
In view of above content, be necessary to provide a kind of again can be when reducing cost by mainboard on other the heat of heater element influence pass measuring equipment.
A kind of heat passes measuring equipment, it comprises one in order to measure the hygrosensor of cabinet intake air temperature, described hygrosensor is arranged on the interior mainboard of a cabinet, and position near air inlet, heater element on described hygrosensor and the described mainboard is adjacent, described mainboard offers a breach between described hygrosensor and described heater element, described breach is isolated described hygrosensor and described heater element and reduced the heat conduction of described heater element to described hygrosensor.
Compared to prior art, the breach of offering between described hygrosensor and described central processing unit and the peripheral heater element thereof greatly reduces the Temperature Influence that described heater element obtains described hygrosensor, do not increase simultaneously system cost again, offer help yet for the solution of computer system heat radiation and noise problem.
Description of drawings
The utility model will be further described in conjunction with embodiment with reference to the accompanying drawings.
Fig. 1 is the synoptic diagram that the utility model heat passes the measuring equipment preferred embodiment.
Fig. 2 is another synoptic diagram that the utility model heat passes the measuring equipment preferred embodiment.
Embodiment
See also Fig. 1, the better embodiment that the utility model heat passes measuring equipment comprises three hygrosensors 12,14 and 16 that are arranged on the mainboard 10.
Middle position and its peripheral heater element that described hygrosensor 12 roughly is positioned on the described mainboard 10 are fewer, in order to measure the environment temperature in the cabinet.Described hygrosensor 14 is positioned on the described mainboard 10 on the topmost heater element central processing unit 13, the temperature when measuring described central processing unit 13 work.Around described central processing unit 13, also be provided with other heater element, as CMOS (Complementary Metal Oxide Semiconductor, complementary metal oxide semiconductor (CMOS)) etc.Described hygrosensor 16 is positioned at the position of contiguous cabinet air inlet on the described mainboard 10, in order to measure the temperature of air inlet in the cabinet.Central processing unit 13 and peripheral heater element thereof on described hygrosensor 16 and the described mainboard 10 are adjacent, described mainboard 10 offers a breach 17 between described hygrosensor 16 and these heater elements, described breach 17 is lived described hygrosensor 16 semi-surroundings, in order to isolating of the heat conduction of these heater elements, thereby guarantee the accuracy of described hygrosensor 16 measuring temperatures to described hygrosensor 16.
Please consult Fig. 2 simultaneously, be provided with a fan 18, be used for reducing the temperature of air inlet in the cabinet in cabinet air inlet position.On described central processing unit 13, be provided with a heating radiator 15 that has a fan, be used for reducing the temperature of described central processing unit 13.Power supply fan 20 that is installed in the air outlet place in the cabinet is used for reducing the power supply temperature in the cabinet, and the hot-air in the cabinet is discharged.After the power-on, super I/O chip 19 on the described mainboard 10 reads the temperature of diverse location in described hygrosensor 12, the 14 and 16 acquired cabinets, according to the fan control curve that configures, described super I/O chip 19 will be according to the rotating speed of these fans of adjustment that record.Because the isolation of described breach 17, make described central processing unit 13 and on every side heater element the influence of described hygrosensor 16 is reduced, described hygrosensor 16 measures temperature value more accurately.
In the system environments temperature is 25 ℃, respectively the computer system of not offering described breach 17 (improve before) and offering described breach 17 (improving afterwards) is tested, the intake air temperature that described hygrosensor 16 records is by original 34 ℃ 27.4 ℃ of being reduced to after the improvement, rotation speed of the fan in two computer systems also has bigger difference, test data (unit: rev/min) as shown in the table.
| The cabinet internal fan | Before the improvement | After the improvement |
| The air inlet fan | 2289 | 1933 |
| Radiator fan | 3822 | 2980 |
| Power supply fan | 2581 | 2558 |
As can be seen from the above table, after the improvement, described central processing unit 13 and peripheral heater element thereof reduce the influence of described hygrosensor 16, described hygrosensor 16 gets access to intake air temperature value more accurately, fan is controlled in more suitable rotation speed operation, thereby can not cause the waste of cabinet internal fan resource, also help to reduce system noise.
Claims (6)
1. a heat passes measuring equipment, it comprises one in order to measure the hygrosensor of cabinet intake air temperature, described hygrosensor is arranged on the interior mainboard of a cabinet, and position near air inlet, heater element on described hygrosensor and the described mainboard is adjacent, it is characterized in that: described mainboard offers a breach between described hygrosensor and described heater element, and described breach is isolated described hygrosensor and described heater element and reduced the heat conduction of described heater element to described hygrosensor.
2. heat as claimed in claim 1 passes measuring equipment, and it is characterized in that: hygrosensor is stated in described breach semi-surrounding residence.
3. heat as claimed in claim 1 passes measuring equipment, it is characterized in that: described heat passes measuring equipment and also comprises another in order to measure the hygrosensor of environment temperature in the cabinet, and described hygrosensor roughly is positioned at the central authorities and the fewer position of peripheral heater element of described mainboard.
4. heat as claimed in claim 1 passes measuring equipment, it is characterized in that: described heat passes measuring equipment and also comprises another in order to measure the hygrosensor of the central processor temperature on the described mainboard, and described hygrosensor is positioned on the described central processing unit.
5. pass measuring equipment as claim 1 or 3 or 4 described heat, it is characterized in that: described mainboard is provided with a super I/O chip, described super I/O chip reads the temperature value that the described hot hygrosensor that passes measuring equipment has obtained, and according to the rotation speed of the fan in these temperature values adjusting cabinets.
6. heat as claimed in claim 1 passes measuring equipment, and it is characterized in that: described heater element is the central processing unit on the described mainboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007202005575U CN201083548Y (en) | 2007-06-28 | 2007-06-28 | Heat conducting measurement equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007202005575U CN201083548Y (en) | 2007-06-28 | 2007-06-28 | Heat conducting measurement equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201083548Y true CN201083548Y (en) | 2008-07-09 |
Family
ID=39626015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007202005575U Expired - Fee Related CN201083548Y (en) | 2007-06-28 | 2007-06-28 | Heat conducting measurement equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201083548Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105486426A (en) * | 2016-02-15 | 2016-04-13 | 浪潮电子信息产业股份有限公司 | Inlet air temperature detection implementation method |
| CN105698967A (en) * | 2016-02-15 | 2016-06-22 | 浪潮电子信息产业股份有限公司 | Method for detecting inlet air temperature of rack product |
| CN110763359A (en) * | 2019-10-29 | 2020-02-07 | 英业达科技有限公司 | Temperature sensing device and server |
-
2007
- 2007-06-28 CN CNU2007202005575U patent/CN201083548Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105486426A (en) * | 2016-02-15 | 2016-04-13 | 浪潮电子信息产业股份有限公司 | Inlet air temperature detection implementation method |
| CN105698967A (en) * | 2016-02-15 | 2016-06-22 | 浪潮电子信息产业股份有限公司 | Method for detecting inlet air temperature of rack product |
| CN105698967B (en) * | 2016-02-15 | 2018-04-06 | 浪潮电子信息产业股份有限公司 | Method for detecting inlet air temperature of rack product |
| CN110763359A (en) * | 2019-10-29 | 2020-02-07 | 英业达科技有限公司 | Temperature sensing device and server |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080709 |