CN201078802Y - Device for placing TEM sample - Google Patents
Device for placing TEM sample Download PDFInfo
- Publication number
- CN201078802Y CN201078802Y CNU2007200691984U CN200720069198U CN201078802Y CN 201078802 Y CN201078802 Y CN 201078802Y CN U2007200691984 U CNU2007200691984 U CN U2007200691984U CN 200720069198 U CN200720069198 U CN 200720069198U CN 201078802 Y CN201078802 Y CN 201078802Y
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- CN
- China
- Prior art keywords
- copper mesh
- tem sample
- sample
- specimen cup
- wire netting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
A TEM sample placement device is provided, which comprises: a sample cup, which is provided with an opening and is positioned with a supporting part at the bottom; a metal net, which is used for placing sample to be measured; the device is characterized in that: the metal net is placed in the sample cup through a metal net frame, the metal net frame matches the supporting part of the sample cup and is fixed opposite to the sample cup; the metal net frame is provided with a horizontal marking line in a predetermined direction on the surface; the metal net is sleeved and connected with the metal net frame, the metal net can move in clockwise and counter-clockwise direction opposite to the metal net frame when being sleeved and connected on the metal net frame. By adopting the device to place TEM sample, horizontal TEM images can be obtained and analyzing accuracy rate can be improved.
Description
Technical field
The utility model relates to TEM sample apparatus for placing.
Background technology
In the manufacturing process of semiconductor device, need carry out the inefficacy of transmission electron microscope (TEM) test to the sample of focused ion beam (FIB) preparation with the device of analysis made.
The TEM image of the sample that the sample apparatus for placing of employing prior art obtains tilts.The TEM sample apparatus for placing that prior art generally adopts as depicted in figs. 1 and 2, comprising: specimen holder 4, and be used for the operator and grip, specimen cup 5 is used to place the copper mesh 2 that is loaded with sample.Fig. 1 is the copper mesh schematic diagram of prior art apparatus for placing, has carbon film 3 on the copper mesh 2, and testing sample 1 sticks on the carbon film.The copper mesh that is loaded with sample directly places specimen cup to carry out TEM and detects.
Adopt such apparatus for placing, the process of the TEM sample of placement FIB preparation is as follows: at first in (pickup) system of collection, utilize the Electrostatic Absorption of syringe needle and sample that sample is picked up from wafer, after move on the copper mesh shown in Figure 1, utilize the adhesion of carbon film and sample that sample is positioned on the copper mesh, clamp the edge of copper mesh at last with tweezers, put it in the cylindrical sample cup with circular open shown in Figure 2.
The imaging characteristics of TEM has determined that the image direction of its photo is consistent with the placement direction of sample, if promptly sample is (sample direction and specimen holder horizontal axis is angled) of tiltedly putting, the image of the TEM photo that obtains so is " tiltedly " also.And can't as SEM, obtain the photo (SEM can change the direction of electronic scanning) of any direction image.And in the process of above-mentioned placement sample, the direction of our uncontrollable sample makes its level in TEM.Because the adhesion at the Electrostatic Absorption power of utilizing syringe needle and carbon film is placed in the process of sample, the direction of sample on copper mesh is at random.And, put into the specimen cup process at copper mesh thereafter and also can't control the sample direction with the mode of using tweezers to rotate copper mesh because naked eyes can't be seen sample.Still obtain the TEM photo " tiltedly " often because the direction of uncontrollable sample in TEM, we can only obtain the photo that structure tilts.The photo of this image inclination brings some inconvenience to observation analysis owing to do not meet people's observation habit.And same sample put into for twice when observing in the TEM (as, mend and see sample) can obtain the different photo in angle of inclination, thereby increased analytical error.
Present solution is to install a device additional at the CCD of TEM, thus can image rotating to obtain the photo of level.The shortcoming of this method is the expense height, and all must be gain reference after having clapped at every turn, and promptly the action of the deduction of TEM software requirement image back of the body end noise greatly reduces the efficient that TEM takes pictures.
The utility model content
The technical problems to be solved in the utility model provides a kind of TEM sample apparatus for placing, can obtain to be used for the horizontal TEM image of the sample that FIB prepares by this device.
TEM sample apparatus for placing of the present utility model comprises:
Specimen cup is fixedlyed connected with specimen holder, and this specimen cup has opening, and its bottom is provided with the support portion;
Wire netting is used to place testing sample;
It is characterized in that,
Described wire netting places specimen cup by metal truss, and this metal truss matches with the support portion of described specimen cup, and fixes with respect to this specimen cup;
The horizontal mark line that one predetermined direction is arranged on described metal truss surface;
Described wire netting and described metal truss socket can be carried out clockwise or anticlockwise moving with respect to this metal truss when described wire netting is socketed on the metal truss.
According to sample of the present utility model is the thick rectangle sample that is about 10 μ m, 3 μ m and 100 μ m respectively of length and width for preparing with FIB.
According to the utility model, wire netting is a copper mesh, and metal truss is the copper mesh frame.
According to the utility model, the opening of specimen cup is circular or square.
According to the utility model, have groove on the support portion of specimen cup; Described metal truss has body and protrudes handle, and this body cooperates with the support portion of specimen cup, and this protrudes the groove interlock on the support portion in handle and the specimen cup.Groove can be provided with arbitrarily on the support portion, and preferably described groove is symmetrical arranged along the diametric(al) of support portion, and described protrusion handle is symmetrical arranged along diametric(al) in the outside of described annular body.
Groove can be any suitable shape, and protruding handle is shape corresponding with it, and preferably described groove is nearly rectangular recess, and described protrusion handle is the nearly rectangle corresponding with it.
More preferably, the groove on the described support portion is symmetrical arranged in the diametric(al) of support portion, and described protrusion handle is symmetrical arranged in the outer edge surface upper edge of described annular body diametric(al).
According to the utility model, when preferably described copper mesh placed on the copper mesh frame, the annular surface of copper mesh surface and copper mesh frame remained basically stable.The preferably copper netting gear has the copper mesh that is cross.
According to the utility model, preferably when the copper mesh frame was put into specimen cup and protruded handle and groove interlock, the horizontal mark line of copper mesh frame pointed to the horizontal axis direction of specimen holder.
Wire netting forms by metal grill with around the annular frame of this metal grill.
According to the utility model, carbon film is set on wire netting, this carbon film is used to adhere to testing sample.
Adopt TEM sample apparatus for placing of the present utility model, can be by promoting to place the copper mesh rotation of testing sample under light microscope, make sample parallel with the horizontal mark line of copper mesh frame upper surface, the sample direction that arbitrarily is placed on the copper mesh is adjusted into level, thereby obtain the TEM image of level, improve and analyze accuracy rate.
Description of drawings
Fig. 1 is the schematic diagram of the copper mesh of prior art.
Fig. 2 is the schematic diagram of the specimen holder of prior art.
Fig. 3 is the schematic diagram of an embodiment of specimen holder of the present utility model.
Fig. 4 is the schematic diagram of an embodiment of copper mesh frame of the present utility model.
Fig. 5 is the exploded view of the socket of copper mesh of the present utility model and copper mesh frame.
Fig. 6 is the schematic diagram after the socket of copper mesh of the present utility model and copper mesh frame.
Fig. 7 A～7D adopts TEM sample apparatus for placing of the present utility model, places the process schematic diagram of testing sample.
Description of reference numerals
1 testing sample
2 copper mesh
21 ring frames
22 copper mesh
3 carbon films
4 specimen holders
5 specimen cups
51 bodies
52 circular opens
53 support rings
54 grooves
6 copper mesh framves
61 annular body
62 support portions
63 protrude handle
64 horizontal mark lines
Embodiment
Below by specific embodiment the utility model is carried out comparatively detailed explanation.
The TEM sample apparatus for placing of TEM sample apparatus for placing of the present utility model and prior art relatively mainly improves specimen cup and copper mesh mechanism.
The device of placement TEM sample of the present utility model comprises:
Specimen holder 4, specimen cup 5, copper mesh frame 6 and copper mesh 2, wherein specimen cup 5 is fixedlyed connected with specimen holder 4, also can be one-body molded.
Carbon film 3 is arranged on the copper mesh 2;
Have groove 54 on the support ring 53 of described specimen cup 5;
Described copper mesh 2 places specimen cup 5 by copper mesh frame 6, this copper mesh frame 6 has annular body 61 and protrudes handle 63, this protrudes the groove 54 on the support ring 53 in the handle 63 counter sample cups 5, annular surface in this annular body 61 has horizontal mark line 64, has support ring 62 in the annular body 61, its size cooperates to support this copper mesh 2 with the ring frame 21 of copper mesh 2, the size of annular body 61 matches with the opening 52 and the support ring 53 thereof of specimen cup 5, and the horizontal mark line 64 of putting into specimen cup 5 and protrude handle 63 copper mesh frame 6 when snapping in groove 54 when copper mesh frame 6 points to a predetermined direction.
Fig. 3 is the schematic diagram of an embodiment of specimen cup of the present utility model.As shown in Figure 3, specimen cup 5 has the circular open 52 of perforation, its bottom is provided with support ring 53, have groove 54 on this support ring, this groove is opened symmetric position vertical with the horizontal axis of bar on the diametric support ring 53 of circular open, and it is the groove near rectangle;
Fig. 4 is the schematic diagram of the copper mesh frame of an embodiment of the present utility model.
As shown in Figure 5, copper mesh frame 6 has annular body 61, protrudes handle 63 and support ring 62.
Protrude on the diametric(al) of outer circumference surface that handle 63 is symmetricly set on annular body 61 and the nearly rectangular recess 54 on the support ring 53 in the counter sample cup 5.
Be symmetrically arranged with horizontal mark line 64 on the upper surface diametric(al) of annular body 61, it is vertical with the diametric(al) of protruding handle 63 places.
When the horizontal axis that the horizontal mark line 64 on the copper mesh frame 6 when snapping in groove 54 points to specimen holder as shown in Figure 4 put into specimen cup 5 and protrude handle 63 by copper mesh frame 6;
As shown in Figure 5, copper mesh 2 is socketed on the copper mesh frame, can carry out clockwise or is rotated counterclockwise with respect to the copper mesh frame.
According to the embodiment of another variation of the present utility model, the groove on the support ring in the specimen cup is arranged on the diametric any symmetric position of circular open, is any angle as the horizontal axis direction with specimen holder.
Horizontal mark line on the copper mesh frame is a corresponding angle with the protrusion handle.Fig. 6 is the schematic diagram after copper mesh and the socket of copper mesh frame.
When the copper mesh frame of socket copper mesh was put into specimen cup, the horizontal mark line on the copper mesh frame was consistent with the horizontal axis direction of specimen holder.
According to the embodiment of another variation of the present utility model, the groove in the specimen cup on the support ring also can be arranged on the symmetric position of the axis direction of specimen holder, and at this moment, the mark line on the copper mesh frame just is arranged on along on the direction of protruding handle.When the copper mesh frame of socket copper mesh was put into specimen cup, the horizontal mark line on the copper mesh frame was consistent with the horizontal axis direction of specimen holder.
In addition, other more similar settings can also be arranged, as long as after being placed on the copper mesh frame in the specimen cup, consistent the getting final product of horizontal axis direction of horizontal mark line and specimen holder.
Fig. 7 A～7E utilizes apparatus for placing of the present utility model to place the process schematic diagram of testing sample.
At first,, move on to then on the copper mesh,, utilize the adhesion of copper mesh carbon film and sample that sample is positioned on the copper mesh owing on the copper mesh carbon film is arranged when utilize the Electrostatic Absorption of syringe needle and sample that sample is picked up from wafer.
Because the adhesion at the Electrostatic Absorption power of utilizing syringe needle and carbon film is placed in the process of sample, the direction of sample on copper mesh is at random.
The copper mesh 2 that is loaded with testing sample 1 is socketed on the copper mesh frame 6, shown in Fig. 7 A.
Under light microscope, make copper mesh 2 with respect to copper mesh frame 6 (or clockwise) rotation counterclockwise by the ring frame 21 that promotes copper mesh 2, shown in Fig. 7 B, 7C, the direction of the horizontal mark line on the direction of sample and copper mesh frame parallels, shown in Fig. 7 D.
The copper mesh frame 6 that is loaded with testing sample 1 is placed specimen cup 5, and it is fixing that the protrusion handle 63 of copper mesh frame 6 is snapped in the groove 54 on the support ring 53 of specimen cup 5.
Put it into specimen holder and to carry out TEM scanning in the TEM sample stage.
Because the horizontal mark line on the copper mesh frame is always parallel with the horizontal axis of specimen holder 4, and that the direction of sample has been adjusted into is parallel with the direction of horizontal mark line, so the direction of sample is parallel with the direction of specimen holder.The image that scanning obtains through TEM is the image of level, thereby can reduce to analyze relative error (reducing owing to the inconsistent error that causes measurement image of the direction of image), thereby improves accuracy and the repeatability of analyzing.
Use traditional TEM sample apparatus for placing take the TEM photo, wherein image tilts.
Use TEM sample apparatus for placing of the present utility model take the TEM photo, wherein image is a level.
Though abovely the utility model has been carried out comparatively detailed explanation by specific embodiment; but be not limited only to these embodiment; under the condition that does not break away from design of the present utility model; more other equivalent embodiment can also be arranged, and protection range of the present utility model is by appended claim decision.
Claims (11)
1. TEM sample apparatus for placing comprises:
Specimen cup is fixedlyed connected with specimen holder, and this specimen cup has opening, and its bottom is provided with the support portion;
Wire netting is used to place testing sample;
It is characterized in that,
Described wire netting places specimen cup by metal truss, and this metal truss matches with the support portion of described specimen cup, and fixes with respect to this specimen cup;
The horizontal mark line that one predetermined direction is arranged on described metal truss surface;
Described wire netting and described metal truss socket can be carried out clockwise or anticlockwise moving with respect to this metal truss when described wire netting is socketed on the metal truss.
2. TEM sample apparatus for placing according to claim 1 is characterized in that described wire netting is a copper mesh, and described metal truss is the copper mesh frame.
3. TEM sample apparatus for placing according to claim 1 and 2 is characterized in that, the opening of described specimen cup is circular or square.
4. TEM sample apparatus for placing according to claim 3 is characterized in that, has groove on the support portion of specimen cup; Described metal truss has body and protrudes handle, and this body cooperates with the support portion of specimen cup, and this protrudes the groove interlock on the support portion in handle and the specimen cup.
5. TEM sample apparatus for placing according to claim 4 is characterized in that the groove on the described support ring is symmetrical arranged in the diametric(al) of support ring, and described protrusion handle is symmetrical arranged in the outer edge surface upper edge of described annular body diametric(al).
6. according to claim 4 or 5 described TEM sample apparatus for placing, it is characterized in that described groove is a rectangular recess, described protrusion handle is the rectangle corresponding with it.
7. TEM sample apparatus for placing according to claim 1 is characterized in that, described predetermined direction is the horizontal axis direction of specimen holder.
8. TEM sample apparatus for placing according to claim 1 and 2 is characterized in that, when described wire netting places on the metal truss, remain basically stable with the surface of metal truss in the wire netting surface.
9. TEM sample apparatus for placing according to claim 1 and 2 is characterized in that, wire netting forms by metal grill with around the annular frame of this metal grill.
10. TEM sample apparatus for placing according to claim 1 is characterized in that described metal grill is the cross grid.
11. TEM sample apparatus for placing according to claim 1 and 2 is characterized in that on the described wire netting carbon film is set, this carbon film is used to adhere to sample.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200691984U CN201078802Y (en) | 2007-04-23 | 2007-04-23 | Device for placing TEM sample |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200691984U CN201078802Y (en) | 2007-04-23 | 2007-04-23 | Device for placing TEM sample |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201078802Y true CN201078802Y (en) | 2008-06-25 |
Family
ID=39570868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200691984U Expired - Lifetime CN201078802Y (en) | 2007-04-23 | 2007-04-23 | Device for placing TEM sample |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201078802Y (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102236160A (en) * | 2010-04-29 | 2011-11-09 | 武汉新芯集成电路制造有限公司 | Sample observation grid and manufacturing method thereof |
| CN102384866A (en) * | 2010-09-03 | 2012-03-21 | 中芯国际集成电路制造(上海)有限公司 | Sample set for transmission electron microscope tests and fabrication method thereof |
| CN104616953A (en) * | 2015-02-02 | 2015-05-13 | 武汉新芯集成电路制造有限公司 | Bearing device and preparation method thereof |
| CN104730291A (en) * | 2013-12-19 | 2015-06-24 | 中芯国际集成电路制造(上海)有限公司 | TEM sample carrying net supporting film, preparation method of TEM sample carrying net supporting film, and TEM sample analysis method |
| CN105352768A (en) * | 2015-09-27 | 2016-02-24 | 上海华力微电子有限公司 | TEM sample positioning method |
| CN105910875A (en) * | 2016-05-27 | 2016-08-31 | 中国科学院微生物研究所 | Fixing device for sample-loading copper grid |
| CN109884102A (en) * | 2019-03-20 | 2019-06-14 | 湖北大学 | A method of improving scanning electron microscope X-ray energy spectrometer spatial resolution |
| CN110501356A (en) * | 2019-08-26 | 2019-11-26 | 上海华力集成电路制造有限公司 | The method for supporting film to influence TEM sample image quality to eliminate carbon |
| CN112198174A (en) * | 2020-08-25 | 2021-01-08 | 华东师范大学 | Sample loading device of transmission electron microscope |
| CN114235859A (en) * | 2021-12-31 | 2022-03-25 | 厦门超新芯科技有限公司 | Sample rod and sample net loading method suitable for three-dimensional reconstruction application |
-
2007
- 2007-04-23 CN CNU2007200691984U patent/CN201078802Y/en not_active Expired - Lifetime
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102236160B (en) * | 2010-04-29 | 2013-05-01 | 武汉新芯集成电路制造有限公司 | Sample observation grid and manufacturing method thereof |
| CN102236160A (en) * | 2010-04-29 | 2011-11-09 | 武汉新芯集成电路制造有限公司 | Sample observation grid and manufacturing method thereof |
| CN102384866A (en) * | 2010-09-03 | 2012-03-21 | 中芯国际集成电路制造(上海)有限公司 | Sample set for transmission electron microscope tests and fabrication method thereof |
| CN102384866B (en) * | 2010-09-03 | 2014-11-05 | 中芯国际集成电路制造(上海)有限公司 | Sample set for transmission electron microscope tests and fabrication method thereof |
| CN104730291B (en) * | 2013-12-19 | 2017-12-29 | 中芯国际集成电路制造(上海)有限公司 | TEM sample contained network supports film and preparation method thereof, TEM sample analysis method |
| CN104730291A (en) * | 2013-12-19 | 2015-06-24 | 中芯国际集成电路制造(上海)有限公司 | TEM sample carrying net supporting film, preparation method of TEM sample carrying net supporting film, and TEM sample analysis method |
| CN104616953A (en) * | 2015-02-02 | 2015-05-13 | 武汉新芯集成电路制造有限公司 | Bearing device and preparation method thereof |
| CN105352768A (en) * | 2015-09-27 | 2016-02-24 | 上海华力微电子有限公司 | TEM sample positioning method |
| CN105910875A (en) * | 2016-05-27 | 2016-08-31 | 中国科学院微生物研究所 | Fixing device for sample-loading copper grid |
| CN105910875B (en) * | 2016-05-27 | 2019-05-14 | 河南中镜科仪科技有限公司 | A kind of fixed device of load sample copper mesh |
| CN109884102A (en) * | 2019-03-20 | 2019-06-14 | 湖北大学 | A method of improving scanning electron microscope X-ray energy spectrometer spatial resolution |
| CN109884102B (en) * | 2019-03-20 | 2021-09-03 | 湖北大学 | Method for improving spatial resolution of X-ray energy spectrometer for scanning electron microscope |
| CN110501356A (en) * | 2019-08-26 | 2019-11-26 | 上海华力集成电路制造有限公司 | The method for supporting film to influence TEM sample image quality to eliminate carbon |
| CN112198174A (en) * | 2020-08-25 | 2021-01-08 | 华东师范大学 | Sample loading device of transmission electron microscope |
| CN112198174B (en) * | 2020-08-25 | 2023-01-13 | 华东师范大学 | Sample loading device of transmission electron microscope |
| CN114235859A (en) * | 2021-12-31 | 2022-03-25 | 厦门超新芯科技有限公司 | Sample rod and sample net loading method suitable for three-dimensional reconstruction application |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130208 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20130208 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone, Beijing Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20080625 |