CN201067832Y - Processing platform for laser machining - Google Patents
Processing platform for laser machining Download PDFInfo
- Publication number
- CN201067832Y CN201067832Y CN 200720121891 CN200720121891U CN201067832Y CN 201067832 Y CN201067832 Y CN 201067832Y CN 200720121891 CN200720121891 CN 200720121891 CN 200720121891 U CN200720121891 U CN 200720121891U CN 201067832 Y CN201067832 Y CN 201067832Y
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- CN
- China
- Prior art keywords
- base
- platform
- passing board
- light
- processing platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses a machining platform used for laser processing, comprising a base and a light penetration platform used for bearing a working piece; wherein, the base is an opening hollow cavity and the light penetration platform is arranged above the opening hollow cavity of the base in a crossing way. The utility model can prevent a working piece from being burnt by the laser reflected from the platform and improve processing quality.
Description
[technical field]
The utility model relates to a kind of processing platform, relates in particular to employed processing platform in a kind of Laser Processing.
[background technology]
The principle of Laser Processing is to shine on the workpiece to be machined after laser focusing by condenser system, and workpiece absorbs laser, makes its illuminated position produce high temperature and gasifies, thereby realize cutting or mark to workpiece.In the prior art, when using laser that workpiece is cut, the platform that is used to carry processing work generally all is a metal platform, metal platform can carry out reflective to laser, therefore when the laser penetration workpiece, can shine on the platform, because metal platform reflects laser, make the laser after the reflection shine the workpiece to be machined bottom, thereby form burn to the processing work bottom, influenced the crudy of processing work, when especially some materials (as soft-circuit board) being carried out Precision Machining, this burn directly causes processing work to become waste product, and this will cause the waste of material.
[utility model content]
The technical problems to be solved in the utility model provides the processing platform that a kind of Laser Processing is used, and can prevent that processing work from being burnt by the platform laser light reflected.
The technical scheme that the utility model adopted is:
The processing platform that a kind of Laser Processing is used comprises base and the light-passing board that is used to carry workpiece, and described base is an open cavity, and described light-passing board is across on the open cavity that is arranged at base.
Described light-passing board is a strip.
Described light-passing board has at least two, is arranged in parallel.
The processing platform that described a kind of Laser Processing is used, all have at least two pairs of breach respectively with spacing in both sides, base top, described each light-passing board two ends embed respectively in a pair of breach that is fixed in both sides, base top, have the aperture of the described cavity of a perforation at described base side wall.
The processing platform that described a kind of Laser Processing is used comprises that also an end connects the air intake duct interface of aperture, and it is fixed on the sidewall of described base, and the other end of described air intake duct interface connects negative pressure device.
The beneficial effects of the utility model are:
Processing platform of the present utility model carries processing work by adopting light-passing board, when the laser penetration processing work is mapped to platform, directly penetrates platform, avoids being reflexed on the workpiece by platform, with workpiece burn, has improved crudy; Keep spacing by making between each light-passing board, the negative pressure device that cooperates the air intake duct interface to connect can make the workpiece on the platform better be adsorbed, and it is fixing that workpiece is adsorbed when processed, thereby has improved the accuracy of processing.
[description of drawings]
The utility model will be further described in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is a processing platform schematic diagram of the present utility model.
[specific embodiment]
As shown in Figure 1, processing platform of the present utility model comprises base 2 and the light-passing board 1 that is used to carry workpiece, and described base 2 is an open cavity, and described light-passing board 1 is across on the open cavity that is arranged at base.Workpiece is being added man-hour, and workpiece directly is placed on the light-passing board 1, behind the laser penetration workpiece, directly penetrates in the cavity of light-passing board 1 directive base, thereby has avoided platform laser to be reflected the damage that brings to workpiece.
In order to make processing work better be fixed on the processing platform, processing platform of the present utility model also comprises an air intake duct interface 3, light-passing board 1 wherein is a strip, there are at least two and be arranged in parallel, all have at least two pairs of breach respectively in both sides, base 2 top with spacing, described each light-passing board 1 two ends embed respectively in a pair of breach that is fixed in both sides, base 2 top, have the aperture of the described cavity of a perforation at described base 2 sidewalls, be fixed with the air intake duct interface 3 that an end connects aperture on the base side wall at aperture place, the other end of described air intake duct interface 3 connects negative pressure device.When work, negative pressure device is extracted the interior air of cavity out by the air intake duct interface, makes it become negative pressure, airflow direction is shown in arrow among the figure, thereby it is fixing to make the spacing of workpiece between light-passing board form absorption, is attracted to comparatively securely on the processing platform, has improved the accuracy of processing.
It needs to be noted that the light-passing board in the utility model can be glass material, transparent plastic etc., the common ground of these materials all is laser is directly penetrated and can not reflect laser.
Claims (5)
1. processing platform that Laser Processing is used, the light-passing board that it is characterized in that comprising base He be used to carry workpiece, described base are an open cavity, described light-passing board is across on the open cavity that is arranged at base.
2. the processing platform that a kind of Laser Processing according to claim 1 is used is characterized in that: described light-passing board is a strip.
3. the processing platform that a kind of Laser Processing according to claim 2 is used is characterized in that: described light-passing board has at least two, is arranged in parallel.
4. the processing platform that a kind of Laser Processing according to claim 3 is used, it is characterized in that: all have at least two pairs of breach respectively in both sides, base top with spacing, described each light-passing board two ends embed respectively in a pair of breach that is fixed in both sides, base top, have the aperture of the described cavity of a perforation at described base side wall.
5. the processing platform that a kind of Laser Processing according to claim 4 is used is characterized in that: comprise that also an end connects the air intake duct interface of aperture, it is fixed on the sidewall of described base, and the other end of described air intake duct interface connects negative pressure device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200720121891 CN201067832Y (en) | 2007-07-30 | 2007-07-30 | Processing platform for laser machining |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200720121891 CN201067832Y (en) | 2007-07-30 | 2007-07-30 | Processing platform for laser machining |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201067832Y true CN201067832Y (en) | 2008-06-04 |
Family
ID=39489205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200720121891 Expired - Lifetime CN201067832Y (en) | 2007-07-30 | 2007-07-30 | Processing platform for laser machining |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201067832Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI637460B (en) * | 2014-02-05 | 2018-10-01 | 迪思科股份有限公司 | Holding table |
-
2007
- 2007-07-30 CN CN 200720121891 patent/CN201067832Y/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI637460B (en) * | 2014-02-05 | 2018-10-01 | 迪思科股份有限公司 | Holding table |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20080604 |