CN201062422Y - Composite floor - Google Patents
Composite floor Download PDFInfo
- Publication number
- CN201062422Y CN201062422Y CNU2007201466362U CN200720146636U CN201062422Y CN 201062422 Y CN201062422 Y CN 201062422Y CN U2007201466362 U CNU2007201466362 U CN U2007201466362U CN 200720146636 U CN200720146636 U CN 200720146636U CN 201062422 Y CN201062422 Y CN 201062422Y
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- CN
- China
- Prior art keywords
- surface layer
- composite floor
- floor board
- holes
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a compound floor, which at least comprises an upper surface layer and a lower facing layer, wherein the contact planes of the upper surface layer and the lower facing layer are provided with adhesive agent, and the lower facing layer is equipped with a plurality of through holes vertical to the planes. The through holes can be circular holes, oval shaped holes, diamond shaped holes and polygonal holes. The lower facing layer is a wood chip integrated plate, and also can be a bamboo scrap integrated plate. The compound floor of the utility model has the advantages that the integrated plates provided with a plurality of through holes vertical to the planes are used for the lower facing layer of the compound floor, therefore the raw material can be saved, the production cost can be reduced, and the benefit can be improved.
Description
Technical field
The utility model relates to a kind of floor that lay the flooring, specifically a kind of composite floor board of being used for.
Background technology
In the prior art, be used for the floor that lay the flooring, have full wood flooring, full bamboo floor, in order to save material, also produce composite floor board, the upper surface layer of composite floor board adopts raw-material section, following surface layer is suppressed integrated plate after can adopting raw material to pulverize again.Its weak point is, suppresses the plate that integrated plate is a physical form again, from the angle that saves material, still seems abundant inadequately.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, and a kind of composite floor board that more can save material is provided.
The technical scheme of the utility model composite floor board which comprises at least upper surface layer, following surface layer, and the contact plane of upper surface layer and following surface layer has adhesive, and described surface layer down is provided with many through holes perpendicular to the plane.Described through hole can be a circular port, also can be slotted eye, can also be diamond hole, can also be tri-angle-holed, can also be polygonal holes.Described surface layer down is the integrated plate of wood chip, also can be that bamboo is considered integrated plate to be worth doing.
The beneficial effect of the utility model composite floor board is to have many integrated plates perpendicular to the plane through hole, is used for the following surface layer of composite floor board, can save material, reduces production costs, increase the benefit.
Description of drawings
Fig. 1 is the front view of the utility model composite floor board first embodiment;
Fig. 2 is the upward view of Fig. 1;
Fig. 3 is the front view of the utility model composite floor board second embodiment;
Fig. 4 is the upward view of Fig. 3.
The specific embodiment
First embodiment.
Fig. 1, shown in Figure 2 be first embodiment of the utility model composite floor board, it comprises upper surface layer 1, surface layer 2 down, the contact plane of upper surface layer 1 and following surface layer 2 has adhesive, described following surface layer 2 is provided with many through holes 3 perpendicular to the plane.Described through hole 3 is circular ports.Described surface layer 2 down is the integrated plates of wood chip.
Second embodiment.
Fig. 3, shown in Figure 4 be second embodiment of the utility model composite floor board, it comprises upper surface layer 1, following surface layer 2, undersurface layer 4, the contact plane of upper surface layer 1 and following surface layer 2 and undersurface layer 4 has adhesive, and described surface layer 2 down is provided with many through holes 3 perpendicular to the plane.Described through hole 3 is circular ports.Described surface layer 2 down is the integrated plates of wood chip.
Claims (8)
1. a composite floor board which comprises at least upper surface layer (1), following surface layer (2), and the contact plane of upper surface layer (1) and following surface layer (2) has adhesive, it is characterized in that, described surface layer (2) down is provided with many through holes perpendicular to the plane (3).
2. composite floor board according to claim 1 is characterized in that, described through hole (3) is a circular port.
3. composite floor board according to claim 1 is characterized in that, described through hole (3) is a slotted eye.
4. composite floor board according to claim 1 is characterized in that, described through hole (3) is a diamond hole.
5. composite floor board according to claim 1 is characterized in that, described through hole (3) is tri-angle-holed.
6. composite floor board according to claim 1 is characterized in that, described through hole (3) is a polygonal holes.
7. composite floor board according to claim 1 is characterized in that, described surface layer (2) down is the integrated plate of wood chip.
8. composite floor board according to claim 1 is characterized in that, described surface layer (2) down is that bamboo is considered integrated plate to be worth doing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201466362U CN201062422Y (en) | 2007-04-14 | 2007-04-14 | Composite floor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201466362U CN201062422Y (en) | 2007-04-14 | 2007-04-14 | Composite floor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201062422Y true CN201062422Y (en) | 2008-05-21 |
Family
ID=39450793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201466362U Expired - Fee Related CN201062422Y (en) | 2007-04-14 | 2007-04-14 | Composite floor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201062422Y (en) |
-
2007
- 2007-04-14 CN CNU2007201466362U patent/CN201062422Y/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C57 | Notification of unclear or unknown address | ||
| DD01 | Delivery of document by public notice |
Addressee: Han Jichu Document name: Notification of Termination of Patent Right |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080521 |