CN201049965Y - Semiconductor laser melting and coating working head - Google Patents
Semiconductor laser melting and coating working head Download PDFInfo
- Publication number
- CN201049965Y CN201049965Y CN 200720149224 CN200720149224U CN201049965Y CN 201049965 Y CN201049965 Y CN 201049965Y CN 200720149224 CN200720149224 CN 200720149224 CN 200720149224 U CN200720149224 U CN 200720149224U CN 201049965 Y CN201049965 Y CN 201049965Y
- Authority
- CN
- China
- Prior art keywords
- powder
- working head
- pedestal
- semiconductor laser
- axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Laser Beam Processing (AREA)
Abstract
The utility model discloses a semiconductor laser cladding work head which belongs to the semiconductor laser cladding field. The utility model comprises a work head base (17), a powder feeding nozzle base (9), a powder output nozzle (6), a powder input port (7), a shielding gas input port (10), a shielding gas proof curtain (14) and positioning pins (2); wherein, the positioning pins (2) are used to ensure the powder output nozzle (6) to be arranged in the fast axis direction of the semiconductor laser bean; the powder feeding nozzle base (9) is inlaid in the work head base (17); the powder output nozzle (6) axis and the laser bean central line form an angle of 45 degrees, and the powder output nozzle (6) is connected with the work head base (17) through a rotating shaft (15); the shielding gas proof curtain and shielding plates are used to prevent the optical elements of the semiconductor laser from damage by the laser reflected energy, the heat energy produced by the cladding layer radiation and the splashes in the cladding process. The utility model has compact structure and is applicable to the semiconductor laser cladding process.
Description
Technical field
The utility model relates to a kind of semiconductor laser cladding working head, belongs to semiconductor laser cladding field.
Background technology
Laser melting and coating technique can carry out the surface abrasion reparation of metal parts as a kind of advanced person's laser processing technology.The laser apparatus of laser melting and coating technique use at present mostly is CO2 laser apparatus and YAG laser apparatus.Shortening along with optical maser wavelength increases to the specific absorption of laser owing to metallic substance, compares with solid statelaser with the CO2 laser apparatus, and the wavelength of semiconductor laser is the shortest, so metallic substance is higher to the semi-conductor laser absorption rate.The volume of semiconductor laser is little, and is in light weight, easy to install, is fit to very much the field and carries out the cladding repair.
Because semiconductor laser beam has fast axle and two of slow axis to disperse direction on the propagation direction, on quick shaft direction, beam quality is a basic mode, and at slow-axis direction, beam quality is a multimode.It is rectangle that semiconductor laser beam focuses on the back hot spot, so use semiconductor laser to do melting and coating process, the cladding direction should be quick shaft direction.So the installation direction to powder-feeding nozzle in the cladding head has the unicity requirement.
In addition, because semiconductor laser beam dispersion angle on slow-axis direction is big, so semiconductor laser beam is not suitable for using the optic path system.Under the situation of not using the optic path system, the optics of the noise spectra of semiconductor lasers luminescence unit that splashes that produces in heat energy that laser reflected energy, cladding layer radiation produce in the laser cladding process and the cladding process can make a big impact, and this also becomes the restriction semiconductor laser and uses one of factor of laser melting and coating process.
The utility model content
The purpose of this utility model provides a kind of cladding working head of suitable semiconductor laser beam characteristics.
The concrete technical scheme that the utility model adopts is referring to Fig. 1～Fig. 2, comprise working head pedestal 17 and powder-feeding nozzle pedestal 9, also comprise dead ring 1, steady brace 2, connecting cylinder 3, spring 4, cover plate 5, powder delivery nozzle 6, powder input port 7, sealing plate 8, protection gas input port 10,2 protection gas curtain input ports 13, protection gas curtain 14, turning axle 15, locking screw 16 and set screw 18; Wherein, protection gas curtain 14 is installed in working head pedestal 17 axis both sides with powder-feeding nozzle pedestal 9; connecting cylinder 3 is connected working head pedestal 17 tops; dead ring 1 is enclosed between connecting cylinder 3 and the working head pedestal 17; steady brace 2 is fixed on the connecting cylinder 3; its position is positioned at the plane of powder delivery nozzle axis with working head pedestal 17 axis; guarantee that the powder delivery nozzle is positioned at the quick shaft direction of semiconductor laser; working head pedestal 17 has production well at protection gas curtain 14 gas outbound courses; and inlet mouth 12 is being arranged perpendicular to protection gas curtain 14 gas outbound courses; powder delivery nozzle 6 tops connect with sealing plate 8; by cover plate 5 sealing plate 8 and powder delivery nozzle 6 are fixed in the powder-feeding nozzle pedestal 9; powder delivery nozzle 6 axis intersect with laser beam foucing; powder input port 7 is fixedly connected with sealing plate 8; protection gas input port 10 is fixedly connected on the powder-feeding nozzle pedestal 9; its axis is parallel with powder input port 7 axis; its gas passage communicates with powder delivery nozzle 6 protection gas passages; powder-feeding nozzle pedestal 9 is inlayed and is installed in the working head pedestal 17; powder delivery nozzle 6 axis become 45 degree with the laser beam medullary ray; and link together with working head pedestal 17 by turning axle 15, the vertical axis with powder delivery nozzle 6 of the axial direction due of turning axle 15 is with the plane of laser beam axis composition.In mounting spring 4 above the turning axle 15, between powder-feeding nozzle pedestal 9 is with working head pedestal 17; and in spring 4 both sides installation set screw 18; regulate the angle of rotation of powder-feeding nozzle pedestal 9; upper-lower position at turning axle 15 is installed locking screw 16; the locking direction is parallel to the axial direction due of turning axle 15; powder-feeding nozzle pedestal 9 is lock onto working head pedestal 17, and protecting sheet 11 is installed in working head pedestal 17 belows, is positioned at the quick shaft direction of semiconductor laser beam.The purpose that protecting sheet 11 is set is the harm that causes for the optics that reduces the noise spectra of semiconductor lasers luminescence unit that splashes that produces in heat energy that laser reflected energy in the laser cladding process, cladding layer radiation produce and the cladding process.
Described protection gas curtain 14 includes and sprays cavity and hold-down arm; spray cavity 20 by double team between left hold-down arm 19 and right hold-down arm 21; its position is in a left side; the left end of right hold-down arm; a left side; the right-hand member bottom of right hold-down arm is connected with auxiliary baffle plate 22; spoke helps baffle plate to be provided with to be used for the auxiliary baffle plate circular hole 23 that laser beam passes through; spraying the inner chamber of cavity is made up of for 26 sections 25 sections in straight chamber and De Laval noz(zle) structure chamber; the inner chamber left port communicates with the threaded hole that is connected airway 27 on spraying cavity; 26 sections parts in De Laval noz(zle) structure chamber in the inner chamber of injection cavity 20; its inner bottom surface is the plane, and inner top surface is a Laval structure curved surface.
The output port of described powder delivery nozzle 6 is a rectangle, and its both sides are respectively d1=0.8～1.2mm, d2=3.5～4.5mm, and the length of rectangle pipeline is 5～20mm.
The outside of described powder delivery nozzle 6 is provided with 10～14 shielding gas paths vertically, and each path is along the circumferential uniform distribution of powder delivery nozzle 6.The outside of powder delivery nozzle 6 is as the shielding gas path, and internal memory is as the powder output channel.
A kind of semiconductor laser cladding working head of the utility model has been taken all factors into consideration the light beam characteristics and the light beam output characteristic of semiconductor laser.This cladding working head compact construction is reasonable, both can be used for the semiconductor laser melting and coating process, also can be used for the semiconductor laser remelting processing.
Description of drawings
Fig. 1 semiconductor laser cladding working head front view
The A-A sectional view of Fig. 2 Fig. 1
Fig. 3 powder delivery nozzle vertical view
The A-A sectional view of Fig. 4 Fig. 2
Fig. 5 welding protection gas curtain synoptic diagram
The A-A cross-sectional view of Fig. 6 Fig. 5
Among the figure: 1; dead ring, 2; steady brace, 3; connecting cylinder; 4; spring, 5; cover plate, 6; the powder delivery nozzle; 7; the powder input port, 8; sealing plate, 9; the powder-feeding nozzle pedestal; 10; protection gas input port, 11; protecting sheet, 12; inlet mouth; 13; protection gas curtain input port, 14; the protection gas curtain, 15; turning axle; 16; locking screw, 17; the working head pedestal, 18; set screw; 19; left side hold-down arm, 20; spray cavity, 21; right hold-down arm; 22; auxiliary baffle plate; 23; auxiliary baffle plate circular hole, 24; open holes, 25; straight chamber; 26; De Laval noz(zle) structure chamber, 27; the threaded hole that connects airway.
Embodiment
Describe embodiment of the present utility model in detail below in conjunction with Fig. 1～Fig. 6.
A kind of semiconductor laser cladding working head of the utility model; Design and Machining according to Fig. 1～Fig. 2; assembling; main element is working head pedestal 17 and powder-feeding nozzle pedestal 9; working head pedestal 17 is a square part; and logical water coolant; protection gas curtain 14 is installed in working head pedestal 17 axis both sides with powder-feeding nozzle pedestal 9; connecting cylinder 3 is connected working head pedestal 17 tops; dead ring 1 is enclosed between connecting cylinder 3 and the working head pedestal 17; steady brace 2 is fixed on the connecting cylinder 3; its position is positioned at the plane of powder delivery nozzle axis with working head pedestal 17 axis; guarantee that the powder delivery nozzle is positioned at the quick shaft direction of semiconductor laser; working head pedestal 17 has production well on protection gas curtain 14 gas outbound courses; and on perpendicular to protection gas curtain 14 gas outbound courses, inlet mouth 12 is arranged; powder delivery nozzle 6 tops connect with sealing plate 8; by cover plate 5 sealing plate 8 and powder delivery nozzle 6 are fixed in the powder-feeding nozzle pedestal 9; powder delivery nozzle 6 axis intersect with laser beam foucing; powder input port 7 is threaded with sealing plate 8; protection gas input port 10 is threaded on the powder-feeding nozzle pedestal 9; its axis is parallel with powder input port 7 axis; its gas passage communicates with powder delivery nozzle 6 protection gas passages; powder-feeding nozzle pedestal 9 is inlayed and is installed in the working head pedestal 17; powder delivery nozzle 6 axis become 45 degree with the laser beam medullary ray; and link together with working head pedestal 17 by turning axle 15; the plane that the axial direction due of turning axle 15 axis vertical and powder delivery nozzle 6 is formed with laser beam axis; be rotated counterclockwise on the direction at powder-feeding nozzle pedestal 9; mounting spring 4 between powder-feeding nozzle pedestal 9 is with working head pedestal 17; and in spring 4 both sides installation set screw 18; regulate the angle of rotation of powder-feeding nozzle pedestal 9; thereby regulate the drop point site of powder output line on workpiece surface, guarantee that the stable of melting and coating process carries out.Upper-lower position at turning axle is installed locking screw 16, and the locking direction is parallel to the axial direction due of turning axle 15, and powder-feeding nozzle pedestal 9 is lock onto on the working head pedestal 17.
The output port of powder delivery nozzle 6 is a rectangle, and its both sides are respectively d1=1mm, d2=4mm, and the length of rectangle pipeline is 15mm.
The outside of powder delivery nozzle 6 is provided with 12 shielding gas paths vertically, and each path is along the circumferential uniform distribution of powder delivery nozzle 6.The outside of powder delivery nozzle 6 is as the shielding gas path, and internal memory is as the powder output channel.
Protecting sheet 11 is installed in the quick shaft direction of semiconductor laser beam, under the prerequisite that does not influence laser beam output, farthest reduces cladding process reflected light and thermal radiation damage and the influence to semiconductor optical device.
Present embodiment is that a kind of principle of design is reasonable, reliable semiconductor laser cladding working head structure.
Claims (5)
1. a semiconductor laser cladding working head is characterized in that: comprise working head pedestal (17), powder-feeding nozzle pedestal (9), dead ring (1), steady brace (2), connecting cylinder (3), spring (4), cover plate (5), powder delivery nozzle (6), powder input port (7), sealing plate (8), protection gas input port (10), protection gas curtain input port (13), protection gas curtain (14), turning axle (15), locking screw (16) and set screw (18); Wherein, protection gas curtain (14) is installed in working head pedestal (17) axis both sides with powder-feeding nozzle pedestal (9), connecting cylinder (3) is connected working head pedestal (17) top, dead ring (1) is enclosed between connecting cylinder (3) and the working head pedestal (17), steady brace (2) is fixed on the connecting cylinder (3), its position is positioned at the plane of powder delivery nozzle axis with working head pedestal (17) axis, working head pedestal (17) has production well on protection gas curtain (14) gas outbound course, and on perpendicular to protection gas curtain (14) gas outbound course, inlet mouth (12) is arranged, the same sealing plate in powder delivery nozzle (6) top (8) connects, by cover plate (5) sealing plate (8) and powder delivery nozzle (6) are fixed in the powder-feeding nozzle pedestal (9), (6 axis intersect with laser beam foucing the powder delivery nozzle, the same sealing plate of powder input port (7) (8) is fixedly connected, protection gas input port (10) is fixedly connected on the powder-feeding nozzle pedestal (9), its axis is parallel with powder input port (7) axis, its gas passage communicates with powder delivery nozzle (6) protection gas passage, powder-feeding nozzle pedestal (9) is inlayed and is installed in the working head pedestal (17), powder delivery nozzle (6) axis becomes 45 degree with the laser beam medullary ray, and link together the plane that the axial direction due of turning axle (15) is formed with laser beam axis perpendicular to the axis of powder delivery nozzle (6) with working head pedestal (17) by turning axle (15); Above turning axle 15, mounting spring (4) between powder-feeding nozzle pedestal (9) is with working head pedestal (17), the set screw (18) that is used to regulate powder-feeding nozzle pedestal (9) angle of rotation is installed in spring (4) both sides, at the upper-lower position of turning axle (15) locking screw (16) is installed respectively, the locking direction is parallel to the axial direction due of turning axle (15).
2. a kind of semiconductor laser cladding working head according to claim 1 is characterized in that: in working head pedestal (17) below protecting sheet (11) is installed, protecting sheet (11) is positioned at the quick shaft direction of semiconductor laser beam.
3. a kind of semiconductor laser cladding working head according to claim 1; it is characterized in that: described protection gas curtain includes and sprays cavity and hold-down arm; spray cavity (20) by double team between left hold-down arm (19) and right hold-down arm (21); its position is in a left side; the left end of right hold-down arm; a left side; the right-hand member bottom of right hold-down arm is connected with auxiliary baffle plate (22); spoke helps baffle plate to be provided with to be used for the auxiliary baffle plate circular hole (23) that laser beam passes through; spraying the inner chamber of cavity is made up of straight chamber (25) section and De Laval noz(zle) structure chamber (26) section; the inner chamber left port communicates with the threaded hole that is connected airway (27) on spraying cavity; section part in De Laval noz(zle) structure chamber (26) in the inner chamber of injection cavity (20); its inner bottom surface is the plane, and inner top surface is a Laval structure curved surface.
4. a kind of semiconductor laser cladding working head according to claim 1, it is characterized in that: the output port of described powder delivery nozzle (5) is a rectangle, its both sides value is respectively d1=0.8～1.2mm, d2=3.5～4.5mm, the length L 1=5 of rectangle pipeline～20mm.
5. a kind of semiconductor laser cladding working head according to claim 1; it is characterized in that: the outside of described powder delivery nozzle (5) is provided with 10～14 shielding gas paths vertically, and each path is along the circumferential uniform distribution of powder delivery nozzle (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200720149224 CN201049965Y (en) | 2007-05-21 | 2007-05-21 | Semiconductor laser melting and coating working head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200720149224 CN201049965Y (en) | 2007-05-21 | 2007-05-21 | Semiconductor laser melting and coating working head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201049965Y true CN201049965Y (en) | 2008-04-23 |
Family
ID=39336447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200720149224 Expired - Fee Related CN201049965Y (en) | 2007-05-21 | 2007-05-21 | Semiconductor laser melting and coating working head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201049965Y (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013173955A1 (en) * | 2012-05-22 | 2013-11-28 | 山东能源机械集团大族再制造有限公司 | Laser cladding method |
| CN103526199A (en) * | 2013-09-25 | 2014-01-22 | 中国科学院半导体研究所 | Paraxial powder-feeding working head for laser powder processing |
| CN103567636A (en) * | 2013-09-22 | 2014-02-12 | 北京工业大学 | Coaxial laser welding working head |
| CN108181267A (en) * | 2017-12-18 | 2018-06-19 | 浙江省计量科学研究院 | A kind of small-sized forward scattering visibility meter calibration system |
| CN108436256A (en) * | 2018-04-24 | 2018-08-24 | 同高先进制造科技（太仓）有限公司 | Battery case with defencive function encapsulates laser galvanometer scanning protection-gas welding apparatus |
| CN108817716A (en) * | 2018-09-18 | 2018-11-16 | 上海交通大学 | A kind of dust feeder suitable for laser overlaying welding in small dimension hole |
| CN109351973A (en) * | 2018-12-18 | 2019-02-19 | 苏州大学 | A kind of three-dimensional space any direction cladding forming method |
| CN109365813A (en) * | 2018-12-18 | 2019-02-22 | 苏州大学 | A kind of three-dimensional space any direction laser cladding apparatus |
| CN110592583A (en) * | 2019-10-24 | 2019-12-20 | 江苏点金激光科技有限公司 | Laser cladding working head protection device |
| CN110744191A (en) * | 2019-10-22 | 2020-02-04 | 大族激光科技产业集团股份有限公司 | Welding device and welding method for inhibiting laser welding plume and controlling weld formation |
| CN111299850A (en) * | 2019-10-31 | 2020-06-19 | 佛山市宏石激光技术有限公司 | Laser processing method |
| CN114574855A (en) * | 2022-03-02 | 2022-06-03 | 上海米右智能科技有限公司 | Laser cladding equipment |
| CN117802497A (en) * | 2024-02-29 | 2024-04-02 | 陕西中科中美激光科技有限公司 | Laser plating anti-splashing device and plating system |
-
2007
- 2007-05-21 CN CN 200720149224 patent/CN201049965Y/en not_active Expired - Fee Related
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013173955A1 (en) * | 2012-05-22 | 2013-11-28 | 山东能源机械集团大族再制造有限公司 | Laser cladding method |
| CN103567636A (en) * | 2013-09-22 | 2014-02-12 | 北京工业大学 | Coaxial laser welding working head |
| CN103567636B (en) * | 2013-09-22 | 2015-12-02 | 北京工业大学 | A kind of coaxial laser welding job head |
| CN103526199A (en) * | 2013-09-25 | 2014-01-22 | 中国科学院半导体研究所 | Paraxial powder-feeding working head for laser powder processing |
| CN103526199B (en) * | 2013-09-25 | 2015-08-12 | 中国科学院半导体研究所 | A kind of laser powder processing paraxonic powder feeding operation head |
| CN108181267A (en) * | 2017-12-18 | 2018-06-19 | 浙江省计量科学研究院 | A kind of small-sized forward scattering visibility meter calibration system |
| CN108436256A (en) * | 2018-04-24 | 2018-08-24 | 同高先进制造科技（太仓）有限公司 | Battery case with defencive function encapsulates laser galvanometer scanning protection-gas welding apparatus |
| CN108436256B (en) * | 2018-04-24 | 2024-05-10 | 同高先进制造科技（太仓）有限公司 | Battery box packaging laser vibrating mirror scanning welding protection gas device with protection function |
| CN108817716B (en) * | 2018-09-18 | 2020-12-11 | 上海交通大学 | Powder feeding device suitable for small-size hole laser build-up welding |
| CN108817716A (en) * | 2018-09-18 | 2018-11-16 | 上海交通大学 | A kind of dust feeder suitable for laser overlaying welding in small dimension hole |
| CN109351973A (en) * | 2018-12-18 | 2019-02-19 | 苏州大学 | A kind of three-dimensional space any direction cladding forming method |
| CN109365813A (en) * | 2018-12-18 | 2019-02-22 | 苏州大学 | A kind of three-dimensional space any direction laser cladding apparatus |
| CN110744191B (en) * | 2019-10-22 | 2021-10-29 | 大族激光科技产业集团股份有限公司 | Welding device and welding method for inhibiting laser welding plume and controlling weld formation |
| CN110744191A (en) * | 2019-10-22 | 2020-02-04 | 大族激光科技产业集团股份有限公司 | Welding device and welding method for inhibiting laser welding plume and controlling weld formation |
| CN110592583A (en) * | 2019-10-24 | 2019-12-20 | 江苏点金激光科技有限公司 | Laser cladding working head protection device |
| CN111299850A (en) * | 2019-10-31 | 2020-06-19 | 佛山市宏石激光技术有限公司 | Laser processing method |
| CN111299850B (en) * | 2019-10-31 | 2021-06-15 | 广东宏石激光技术股份有限公司 | Laser processing method |
| CN114574855A (en) * | 2022-03-02 | 2022-06-03 | 上海米右智能科技有限公司 | Laser cladding equipment |
| CN114574855B (en) * | 2022-03-02 | 2024-02-09 | 深圳市众联激光智能装备有限公司 | Laser cladding equipment |
| CN117802497A (en) * | 2024-02-29 | 2024-04-02 | 陕西中科中美激光科技有限公司 | Laser plating anti-splashing device and plating system |
| CN117802497B (en) * | 2024-02-29 | 2024-05-28 | 陕西中科中美激光科技有限公司 | Laser plating anti-splashing device and plating system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201049965Y (en) | Semiconductor laser melting and coating working head | |
| US8153928B2 (en) | Method and installation for laser cutting/welding | |
| CN1788917B (en) | Nose-piece for a laser-beam drilling or machining head | |
| WO2013002165A1 (en) | Device and method for cutting brittle member, and cut brittle member | |
| CN204825050U (en) | Laser cladding head for hole | |
| CN107604355B (en) | A kind of the broadband laser cladding coaxial powder-feeding nozzle and its manufacturing method of adjustable anti-splashing | |
| JP2009511273A5 (en) | ||
| CN110039178B (en) | Laser welding head | |
| CN210683941U (en) | High-speed laser cladding head | |
| CN113695766B (en) | Laser cutting head with variable light spot track shape and cutting process thereof | |
| CN112207433A (en) | Gas protection device and method for continuous laser welding | |
| CN101920400A (en) | Gas protection device for laser-arc hybrid welding and laser-arc hybrid welding machine | |
| CN105728940A (en) | Laser welding coaxial protection device | |
| CN106141437A (en) | A kind of laser and double plasma arc composite welding apparatus | |
| CN203900735U (en) | Laser welding air curtain protection device | |
| CN103464897A (en) | Inert gas protecting device for laser welding machine | |
| CN112894129A (en) | Nondestructive cutting nozzle device for solar cell | |
| CN111761213A (en) | Cutting gas circuit device of laser head | |
| CN103464896B (en) | Optical element protecting device for laser welding machine | |
| CN216473480U (en) | Laser cladding device with gas protection | |
| CN115740740A (en) | Vacuum laser welding system and method | |
| CN106735942B (en) | A kind of combustion chamber Fuel Injector Bar micropore cold forming process method | |
| CN104593768A (en) | Optical-fiber laser coaxial powder-feeding nozzle | |
| CN211522319U (en) | Laser cladding working head protection device | |
| KR101864905B1 (en) | Air nozzle for laser device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080423 |