CN201038158Y - Audion lead wire frame - Google Patents

Audion lead wire frame Download PDF

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Publication number
CN201038158Y
CN201038158Y CN 200720108483 CN200720108483U CN201038158Y CN 201038158 Y CN201038158 Y CN 201038158Y CN 200720108483 CN200720108483 CN 200720108483 CN 200720108483 U CN200720108483 U CN 200720108483U CN 201038158 Y CN201038158 Y CN 201038158Y
Authority
CN
China
Prior art keywords
lead frame
triode
section
chip
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 200720108483
Other languages
Chinese (zh)
Inventor
曹光伟
段华平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NINGBO KANGQIANG ELECTRONICS CO Ltd
Original Assignee
NINGBO KANGQIANG ELECTRONICS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NINGBO KANGQIANG ELECTRONICS CO Ltd filed Critical NINGBO KANGQIANG ELECTRONICS CO Ltd
Priority to CN 200720108483 priority Critical patent/CN201038158Y/en
Application granted granted Critical
Publication of CN201038158Y publication Critical patent/CN201038158Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Lead Frames For Integrated Circuits (AREA)

Abstract

The utility model discloses a triode lead frame, comprising a chip part(1), a positioning hole(2), a side wing part(3), a middle pin(5), and side pin(4) and a middle reinforcement(6); the left side and the right side of the positive panel of the chip part(1) are respectively provided with a vertical concave trough(7) which longitudinally passes through all height of the positive panel of the chip part(1); the two longitudinal concave troughs(7) are symmetrically arranged between the external side of the positioning hole(2) and the internal side of the side wing part(3); the cross sections of the two concave troughs are rectangles with obverse openings; the depth of the two concave troughs(7) fully complies with the width of the two concave troughs(7). The utility model overcomes the shortages of the prior art that the smoothness of the chip art is affected as traction force is produced by the deformation of the material in the pressing manufacture process of the similar triode lead frame, ensures the smoothness of the chip part of the triode lead frame, thus ensuring the quality of performance of the triode lead frame in application.

Description

A kind of lead frame of triode
Technical field
The utility model relates to a kind of semi-conductor discrete device, especially for a kind of lead frame of triode of making semiconductor element.
Background technology
The TO-126A of prior art (industry universal models) lead frame of triode comprises chip section, location hole, flank section, interim pins, side pipe pin and middle muscle, and this kind lead frame of triode is a continuous overall structure, obtains by Sheet Metal Forming Technology.But this kind lead frame of triode has following shortcoming: in the process of raw material being carried out punching press formation location hole, flank section, interim pins and side pipe pin, because the effect of the tractive effort during material deformation, the evenness of chip section is affected, thereby has influenced the serviceability of lead frame.
The utility model content
The technical problems to be solved in the utility model is, overcomes the shortcoming of above prior art, and a kind of evenness that increases the lead frame chip section is provided, thereby improves a kind of (model is TO-126A, down with) lead frame of triode of its serviceability.
The utility model is to solve the problems of the technologies described above the technical scheme that is adopted to be: a kind of lead frame of triode with following structure is provided, comprise chip section, location hole, flank section, interim pins, side pipe pin and in muscle, be characterized in: on the front panel of described chip section a vertical groove arranged each side.
After adopting above structure, the utility model compared with prior art has the following advantages:
Owing to each side be provided with a groove longitudinally in the three-way lead frame chip section of this kind, thereby in the process of punching press, overcome material deformation and produced the shortcoming that tractive effort influences the chip section evenness, guarantee the evenness of the three-way lead frame chip section of this kind, thereby guaranteed the three-way lead frame of this kind quality and performance in use.
As improvement, described groove vertically runs through whole height of the front panel of chip section, makes the evenness of chip section higher like this.
As further improvement, described two longitudinally groove be symmetrically distributed between the inboard of the outside of location hole and flank section, the evenness of chip section is further improved.
As further improving, the cross section of described two grooves is positive and is the rectangle of opening, is the evenness that further improves chip section equally.
As further improving, the degree of depth of described two grooves is identical again, and the width of two grooves is also identical, has so further guaranteed the evenness of chip section.
Description of drawings
Fig. 1 is the structural representation of a kind of lead frame of triode of the utility model.
Fig. 2 is the sectional structure schematic diagram along A-A line among Fig. 1.
Fig. 3 is a kind of lead frame of triode structural representation of prior art.
Shown in the figure 1, chip section, 2, location hole, 3, flank section, 4, the side pipe pin, 5, interim pins, 6, middle muscle, 7, groove.
Embodiment
The utility model is described in further detail below in conjunction with the drawings and specific embodiments.
In Fig. 3, the chip section 1 of the TO-126A of prior art (industry universal models) lead frame of triode is vertical rectangle, and its four angles are circular arc.Location hole 2 is located at the horizontal centre of chip section 1 and vertically vertical by last position.Two flank section 3 are in the both sides of vertical rectangle chip section 1, and its two free ends symmetry is projection forward, and the plane included angle of its lug boss and chip section 1 front panel is 90~110 degree.Interim pins 5 is extended downward vertically from the horizontal centre of chip section 1 bottom, and the middle muscle 6 of level and interim pins 5 be 90 degree each other.The both sides pin 4 parallel with interim pins 5 is located at the left and right sides of interim pins 5 symmetrically, the upper end of both sides pin 4 all has its width (to also have the structure of part lead frame not show below 3 pins greater than the head of side pipe pin 4 width, because it is irrelevant with the utility model, so beaten oblique line below, expression is omitted).This lead frame is a continuous overall structure.
As shown in Figure 1 and Figure 2, a kind of TO-126A of being lead frame of triode of the present utility model is the improvement to the TO-126A lead frame of triode of above-mentioned prior art, its chip section 1, location hole 2, flank section 3, interim pins 5, side pipe pin 4 and in the structure of muscle 6 be all identical with above prior art of shape and annexation thereof.
The characteristics of a kind of lead frame of triode of the present utility model are, on the front panel of described chip section 1 a vertical groove 7 are arranged each side.Described groove 7 vertically runs through whole height of the front panel of chip section 1, described two longitudinally groove 7 be symmetrically distributed between the inboard 3 of the outside of location hole 2 and flank section, the cross section of described two grooves 7 is the front and is "  " shape for the rectangle of opening, the degree of depth of described two grooves 7 identical (unanimity), the width of two grooves 7 is also identical.The width that the degree of depth of two grooves 7 is generally 0.05~0.2mm, two grooves 7 is generally 0.3~0.5mm.Described two grooves 7 and lead frame of triode disposable integral punch forming simultaneously.
Concrete structure of the present utility model allows variation, as: as described in groove 7 can vertically not run through whole height of the front panel of chip section 1; Described two longitudinally groove 7 also can undemandingly be symmetrically distributed; The cross section of described two grooves 7 also can be positive other shape beyond the rectangle of opening that is; The degree of depth of described two grooves 7 and width also can have deviation slightly; The degree of depth of two grooves 7 and width also can be other sizes etc.These variations all fall in the protection range of the present utility model.

Claims (5)

1. lead frame of triode, comprise chip section (1), location hole (2), flank section (3), interim pins (5), side pipe pin (4) and in muscle (6), it is characterized in that: on the front panel of described chip section (1) a vertical groove (7) arranged each side.
2. a kind of lead frame of triode according to claim 1 is characterized in that: described groove (7) vertically runs through whole height of the front panel of chip section (1).
3. a kind of lead frame of triode according to claim 1 and 2 is characterized in that: described two longitudinally groove (7) be symmetrically distributed between the inboard of the outside of location hole (2) and flank section (3).
4. a kind of lead frame of triode according to claim 3 is characterized in that: the cross section of described two grooves (7) is the rectangle of opening for the front.
5. a kind of lead frame of triode according to claim 4 is characterized in that: the degree of depth of described two grooves (7) is identical; The width of two grooves (7) is also identical.
CN 200720108483 2007-04-23 2007-04-23 Audion lead wire frame Expired - Lifetime CN201038158Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200720108483 CN201038158Y (en) 2007-04-23 2007-04-23 Audion lead wire frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200720108483 CN201038158Y (en) 2007-04-23 2007-04-23 Audion lead wire frame

Publications (1)

Publication Number Publication Date
CN201038158Y true CN201038158Y (en) 2008-03-19

Family

ID=39210678

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200720108483 Expired - Lifetime CN201038158Y (en) 2007-04-23 2007-04-23 Audion lead wire frame

Country Status (1)

Country Link
CN (1) CN201038158Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103000604A (en) * 2012-11-19 2013-03-27 无锡九条龙汽车设备有限公司 Improved frame plating structure of three-terminal regulator
CN103779287A (en) * 2014-02-11 2014-05-07 扬州江新电子有限公司 Packaged chip and method for ultrathin miniature SMD micro-power consumption sound control sensor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103000604A (en) * 2012-11-19 2013-03-27 无锡九条龙汽车设备有限公司 Improved frame plating structure of three-terminal regulator
CN103779287A (en) * 2014-02-11 2014-05-07 扬州江新电子有限公司 Packaged chip and method for ultrathin miniature SMD micro-power consumption sound control sensor
CN103779287B (en) * 2014-02-11 2016-10-12 扬州江新电子有限公司 Ultra-thin micro paster Micro Energy Lose voice operated sensor encapsulation chip and method for packing thereof

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CX01 Expiry of patent term
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Granted publication date: 20080319