CN201038140Y - Integral CPU water-cooling radiator - Google Patents
Integral CPU water-cooling radiator Download PDFInfo
- Publication number
- CN201038140Y CN201038140Y CNU2007200206758U CN200720020675U CN201038140Y CN 201038140 Y CN201038140 Y CN 201038140Y CN U2007200206758 U CNU2007200206758 U CN U2007200206758U CN 200720020675 U CN200720020675 U CN 200720020675U CN 201038140 Y CN201038140 Y CN 201038140Y
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- China
- Prior art keywords
- water
- radiator
- water pump
- bin
- heat absorption
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an integrated CPU water cooling radiator, belonging to a part of semiconductors or other solid devices, in particular to a device for cooling. The integrated CPU water cooling radiator comprises a fan and a water pump. The utility model is characterized in that a metal endothermic shell is arranged on a water bin body to assemble an endothermic water bin with a water bin body cover; the water bin body is divided into a water pump bin which is provided with a water pump, and a water storage bin; the water storage bin; the water storage bin is connected with a water inlet pipe of the radiator; the water pump bin is connected with a water outlet pipe of the radiator; a fan is connected with the radiator. The utility model organically assembles the metal parts and the plastic parts together to exert respective advantages, and has the advantages of fast heat dissipation, good heat dissipation effect, high mechanical strength of equipment, and long service life, etc.
Description
Technical field
The utility model belongs to the parts of semiconductor or other solid state device, especially for the device of cooling
Background technology
The Chinese patent ZL200520081585.0 that being applied to the water-cooling heat radiating device of CPU in recent years has bigger progress to have discloses a kind of CPU water cooling plant with this radiator of radiator, comprise, water inlet pipe, outlet pipe, water injection hole, housing, its structure is: outer water tank and at least one internal layer water tank before and after being equipped with in the radiator casing, communicate by the string water hole between each water tank, there is louvre the housing top and bottom, water pump and motor are installed in one jiao in radiator and link to each other with outlet pipe, and water inlet pipe links to each other with water tank through aquaporin.Adopted the inner surface of multilayer waterbox design, particularly outer water tank that hollow radiating fin is arranged in the utility model, internal layer water tank front-back all has hollow radiating fin.Can increase the area of dissipation and the radiating efficiency of water tank greatly, can dwindle the volume of radiator, simultaneously water pump and hall electric machine have been installed in radiator inside and can reduce noise, reduce noise pollution, improve computernik's condition of work.But it is poor slightly for the high device heat radiation situation of heating by the natural airflow circulation not design fan.
The utility model content
The purpose of this utility model provides a kind of radiating efficiency height, the technical scheme of the novel integrated CPU water-filled radiator that plant machinery intensity is good.
The technical solution of the utility model is, a kind of integral type CPU water-filled radiator, comprise, fan, water pump, it is characterized in that: metal heat absorption shell is installed on the sump body forms the heat absorption sump with sump body lid, and described sump body is divided into water pump cabin and the water storehouse that water pump is housed, and water storehouse links to each other with the water inlet pipe of radiator, water pump cabin links to each other with the outlet pipe of radiator, and fan links to each other with radiator.
Described radiator is sheet string type or SMD radiator.
Described water pump is an immersible pump.
Described radiator plane parallel in or perpendicular to the heat absorption shell.
Described heat absorption shell is that integral body or centre have window.This window can embed the CPU shell and make and stick with glue or the welding manner shell that will absorb heat is fixedlyed connected with the CPU shell.
The metal heat absorption shell that the disclosed integral type CPU water-filled radiator of the utility model heat transfer efficiency is high directly contacts with CPU, heat transferred enters radiator effect at fan under hot water rapid cooling by water storehouse through water inlet pipe at hot water under the promotion of water pump and enters the heat that heat absorption sump absorption CPU distributes once more after standpipe arrives water pump cabin to the sump that absorbs heat.Because can be, and make and stick with glue or the welding manner shell that will absorb heat is fixedlyed connected with the CPU shell at heat absorption shell middle case window that can embed the CPU shell.The heat that distributes when CPU works like this is directly delivered in the cooling water of heat absorption sump, has improved radiating effect more.The utility model is organically combined performance strong point separately with metalwork and working of plastics, has the fast good heat dissipation effect of heat transfer, advantages such as the high long service life of plant machinery intensity.
Description of drawings
Accompanying drawing 1 is a structural representation of the present utility model,
Fig. 2 is the structural representation of another kind of embodiment,
Among the figure, 1. fan, 2. radiator, 3. water inlet pipe, 4. water storehouse, 5. sump body lid, 6. heat absorption sump, 7. heat absorption shell, 8. water pump, 9. water pump cabin, 10. sump body, 11. outlet pipes.
Embodiment
Embodiment of the present utility model is, as shown in the figure:
Claims (5)
1. integral type CPU water-filled radiator, comprise, fan, water pump, it is characterized in that: metal heat absorption shell is installed on the sump body forms the heat absorption sump with sump body lid, described sump body is divided into water pump cabin and the water storehouse that water pump is housed, water storehouse links to each other with the water inlet pipe of radiator, and water pump cabin links to each other with the outlet pipe of radiator, and fan links to each other with radiator.
2. according to the determined integral type CPU water-filled radiator of claim 1, it is characterized in that: described radiator is sheet string type or SMD radiator.
3. according to the determined integral type CPU water-filled radiator of claim 1, it is characterized in that: described water pump is an immersible pump.
4. according to the determined integral type CPU water-filled radiator of claim 1, it is characterized in that: described radiator plane parallel in or perpendicular to the heat absorption shell.
5. according to the determined integral type CPU water-filled radiator of claim 1, it is characterized in that: described heat absorption shell is that integral body or centre have window.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200206758U CN201038140Y (en) | 2007-04-24 | 2007-04-24 | Integral CPU water-cooling radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200206758U CN201038140Y (en) | 2007-04-24 | 2007-04-24 | Integral CPU water-cooling radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201038140Y true CN201038140Y (en) | 2008-03-19 |
Family
ID=39210660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200206758U Expired - Fee Related CN201038140Y (en) | 2007-04-24 | 2007-04-24 | Integral CPU water-cooling radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201038140Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106642870A (en) * | 2017-01-24 | 2017-05-10 | 武汉攀升鼎承科技有限公司 | Three-dimensional type water cooling heat dissipation device |
| CN108495539A (en) * | 2018-06-03 | 2018-09-04 | 东莞昂湃实业有限公司 | A kind of integrated liquid cooling heat radiation system |
-
2007
- 2007-04-24 CN CNU2007200206758U patent/CN201038140Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106642870A (en) * | 2017-01-24 | 2017-05-10 | 武汉攀升鼎承科技有限公司 | Three-dimensional type water cooling heat dissipation device |
| CN108495539A (en) * | 2018-06-03 | 2018-09-04 | 东莞昂湃实业有限公司 | A kind of integrated liquid cooling heat radiation system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080319 |