CN200990726Y - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN200990726Y CN200990726Y CN 200620016782 CN200620016782U CN200990726Y CN 200990726 Y CN200990726 Y CN 200990726Y CN 200620016782 CN200620016782 CN 200620016782 CN 200620016782 U CN200620016782 U CN 200620016782U CN 200990726 Y CN200990726 Y CN 200990726Y
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- pcb
- simulated domain
- numeric area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a printing circuit board applied to reduce the electromagnetic radiation of a sound component, comprises a circuit layer which is divided into a simulating area and a numeric area by a parting line, the sound component is arranged in the simulating domain of the circuit layer, the simulating area is connected with the numeric area through a lead in the place near the sound component. The printing circuit board reduces the electromagnetic radiation of the sound component.
Description
Technical field
The utility model relates to a kind of printed circuit board (PCB), particularly about a kind of printed circuit board (PCB) that reduces the electromagnetic radiation of audio element.
Background technology
Printed circuit board (PCB) generally is made up of at least three layers of circuit layer, one deck is as bus plane, another layer is as ground plane, and with the wiring layer of surface (front or reverse side) as holding wire, and electronic component is front or the reverse side that places printed circuit board (PCB), and its signal end, power end and earth terminal is connected to another electronic component, bus plane and the ground plane on surface respectively.Electronic component is distinguished into simulation electronic component and digital electronic component according to its characteristics of signals, and wherein, simulation electronic component is mainly the audio element, as audio chip and audio output port etc.; Digital electronic component is digital signal processor and microprocessor or the like.The noise that is produced for fear of the digital electronic component power supply signal is to the influence of the power supply signal of simulation electronic component, generally be that bus plane with printed circuit board (PCB) marks an area of isolation, part in the area of isolation scope is a simulated domain, area of isolation is outward a numeric area, and simulated domain and numeric area do not have electric connection fully, the noise that digital electronic component produced can't have influence on the normal operation of simulation electronic component like this, similarly, other circuit layer also is divided into two zones like this.
Yet, when simulation electronic component (for example audio chip) carries out the signal transmission, if the electronic component operating state changes, may produce electromagnetic interference (EMI), because simulated domain and numeric area separate, the circuit that electromagnetic interference is imported ground connection is limited, and electromagnetic interference may pass from the audio output port, thereby causes electromagnetic radiation.
Summary of the invention
In view of above content, be necessary to provide a kind of printed circuit board (PCB) that reduces the electromagnetic radiation of audio element.
A kind of printed circuit board (PCB), be used to reduce the electromagnetic radiation of audio element, it comprises a circuit layer, described circuit layer is divided into a simulated domain and a numeric area by a cut-off rule, one audio element is arranged at the simulated domain of described circuit layer, and described simulated domain is connecting described numeric area near near the described audio element by a lead.
A kind of printed circuit board (PCB), be used to reduce the electromagnetic radiation of audio element, it comprises a circuit layer, described circuit layer is divided into a simulated domain and a numeric area by a cut-off rule, one audio componentry is arranged at the simulated domain of described circuit layer, and described simulated domain is connecting described numeric area near near the described audio element by a lead.
Compared to prior art, the simulated domain of described printed circuit board (PCB) is connecting described numeric area near near the described audio element by a lead, in described simulated domain, there is electromagnetic interference, described electromagnetic interference can be delivered in the described numeric area by this lead, thereby the electromagnetic interference of the described audio element of influence is reduced.
Description of drawings
The utility model will be further described in conjunction with execution mode with reference to the accompanying drawings.
Fig. 1 is the utility model preferred embodiment printed circuit board (PCB) schematic diagram.
Fig. 2 is another preferred embodiment printed circuit board (PCB) schematic diagram of the utility model.
Embodiment
See also Fig. 1, the signals layer of the utility model preferred embodiment printed circuit board (PCB) 20 is divided into two zones by a cut-off rule 30: a simulated domain 22 and a numeric area 24, the analog signal pin of one audio chip 26 is in the described simulated domain 22, and its digital signal pin is in the described numeric area 24; Described simulated domain 22 is being provided with two tie points 222,224 near near the described audio chip 26, and described two tie points 222,224 are near described cut-off rule 30; Described numeric area 24 is near being respectively equipped with the tie point 242,244 corresponding with described tie point 222,224 near the described cut-off rules 30; Described tie point 222 connects described tie point 242 by a lead 202, and described tie point 224 connects described tie point 244 by a capacitor C 1.
When described audio chip 26 because operating state changes (as overwork), may produce electromagnetic interference, at this moment, part electromagnetic interference can be delivered in the described numeric area 24 by described lead 202, a part is coupled in the described numeric area 24 by described capacitor C 1, thereby the electromagnetic interference in the described simulated domain 22 is reduced, and helps the integrality of sound signal transmission.
See also Fig. 2, the signals layer of another preferred embodiment printed circuit board (PCB) 20 ' of the utility model is divided into two zones by a cut-off rule 30 ': a simulated domain 22 ' and a numeric area 24 ', one audio output port 26 ' is in the described simulated domain 22 ', described simulated domain 22 ' is being provided with two tie points 222 ', 224 ' near near the described audio output port 26 ', described two tie points, 222 ', 224 ' close described cut-off rule 30 '; Described numeric area 24 ' is near being respectively equipped with the tie point 242 ', 244 ' corresponding with described tie point 222 ', 224 ' near the described cut-off rule 30 '; Described tie point 222 ' connects described tie point 242 ' by a lead 202 ', and described tie point 224 ' connects described tie point 244 ' by a capacitor C 2.
When there is electromagnetic interference in described simulated domain 22 ' inside, at this moment, a part of electromagnetic interference of described simulated domain 22 ' can be delivered in the described numeric area 24 ' by described lead 202 ', a part is coupled in the described numeric area 24 ' by described capacitor C 2, thereby the electromagnetic interference that described audio output port 26 ' spreads out of is reduced, and helps the integrality of sound signal transmission.
In above-mentioned two embodiment, bus plane and ground plane all can be divided into simulated domain and numeric area with cut-off rule, simulated domain near near the described audio element by lead and the electric capacity numeric area that is connected in parallel, reduce the electromagnetic radiation purpose to reach.
Claims (8)
1. printed circuit board (PCB), be used to reduce the electromagnetic radiation of audio element, it comprises a circuit layer, described circuit layer is divided into a simulated domain and a numeric area by a cut-off rule, one audio element is arranged at the simulated domain of described circuit layer, it is characterized in that: described simulated domain is connecting described numeric area near near the described audio element by a lead.
2. printed circuit board (PCB) as claimed in claim 1 is characterized in that: described simulated domain also is connected described numeric area by one with the electric capacity of described lead parallel connection.
3. printed circuit board (PCB) as claimed in claim 1 or 2 is characterized in that: described audio element is an audio output port.
4. printed circuit board (PCB) as claimed in claim 1 is characterized in that: described circuit layer is a signals layer.
5. printed circuit board (PCB), be used to reduce the electromagnetic radiation of audio element, it comprises a circuit layer, described circuit layer is divided into a simulated domain and a numeric area by a cut-off rule, one audio componentry is arranged at the simulated domain of described circuit layer, it is characterized in that: described simulated domain is connecting described numeric area near near the described audio element by a lead.
6. printed circuit board (PCB) as claimed in claim 5 is characterized in that: described simulated domain also is connected described numeric area by one with the electric capacity of described lead parallel connection.
7. as claim 5 or 6 described printed circuit board (PCB)s, it is characterized in that: described audio element is an audio chip.
8. printed circuit board (PCB) as claimed in claim 5 is characterized in that: described circuit layer is a signals layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620016782 CN200990726Y (en) | 2006-12-27 | 2006-12-27 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620016782 CN200990726Y (en) | 2006-12-27 | 2006-12-27 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN200990726Y true CN200990726Y (en) | 2007-12-12 |
Family
ID=38941753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620016782 Expired - Fee Related CN200990726Y (en) | 2006-12-27 | 2006-12-27 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN200990726Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102340926A (en) * | 2010-07-26 | 2012-02-01 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| CN102340925A (en) * | 2010-07-26 | 2012-02-01 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| CN102483941A (en) * | 2009-09-17 | 2012-05-30 | 惠普发展公司，有限责任合伙企业 | Apparatus and method for reproducing audio signal |
| US8612034B2 (en) | 2010-07-22 | 2013-12-17 | Hon Hai Precision Industry Co., Ltd. | Printed circuit board |
-
2006
- 2006-12-27 CN CN 200620016782 patent/CN200990726Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102483941A (en) * | 2009-09-17 | 2012-05-30 | 惠普发展公司，有限责任合伙企业 | Apparatus and method for reproducing audio signal |
| CN102483941B (en) * | 2009-09-17 | 2014-12-17 | 惠普发展公司，有限责任合伙企业 | Apparatus and method for reproducing audio signal |
| US8612034B2 (en) | 2010-07-22 | 2013-12-17 | Hon Hai Precision Industry Co., Ltd. | Printed circuit board |
| CN102340926A (en) * | 2010-07-26 | 2012-02-01 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| CN102340925A (en) * | 2010-07-26 | 2012-02-01 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: CO-PATENTEE TO: FOXCONN PRECISE INDUSTRY STOCK CO., LTD. ^ |
|
| CU01 | Correction of utility model |
Correction item: Co-patentee Correct: Hon Hai Precision Industry Co Number: 50 Page: The title page Volume: 23 |
|
| CU03 | Publication of corrected utility model |
Correction item: Co-patentee Correct: Hon Hai Precision Industry Co Number: 50 Volume: 23 |
|
| ERR | Gazette correction |
Free format text: CORRECT: CO-PATENTEE; FROM: NONE ^ TO: FOXCONN PRECISE INDUSTRY STOCK CO., LTD. ^ |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071212 Termination date: 20100127 |