CN200979701Y - The structure and shape of a memory card - Google Patents
The structure and shape of a memory card Download PDFInfo
- Publication number
- CN200979701Y CN200979701Y CN 200620002930 CN200620002930U CN200979701Y CN 200979701 Y CN200979701 Y CN 200979701Y CN 200620002930 CN200620002930 CN 200620002930 CN 200620002930 U CN200620002930 U CN 200620002930U CN 200979701 Y CN200979701 Y CN 200979701Y
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- memory card
- shape
- utility
- model
- board substrate
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Abstract
The utility model discloses a memory card's structure and shape. The utility model especially relates to a manufacturing method that a plurality of memory cards with integrity electric facility is formed by providing a plurality of groups of passive elements, flash memories, controlling chips, and or the like on the presetting places of the whole circuit board and utilizing die molds to mould the whole circuit board thereby sealing the chips and passive elements, moreover, grooves are formed between each memory card and the neighboring memory card while being molded, and after cutting, the sides and angles of each memory card directly shape into chamfer angles without being abraded , thereby being the best structure of the memory card and shape design.
Description
Technical field
The utility model relates to a kind of structure and shape of doing the memory card that data access uses for computing machine or its interfacing equipment of using.
Background technology
Because the innovation progress of science and technology now, frivolous, short and small sci-tech product becomes the development main flow of information products gradually, and also is tending towards mini more in order to the storing media of being used as the digital periphery product thereupon.
Wherein, the access media is made by flash memory at present, it is little that it has a drive unit, in light weight, low voltage operating, low power consumption, characteristics such as high reliability and zero access, and because flash memory system belongs to non-voltile memory, can directly see through electric current change data (as DRAM), data still can keep (as ROM) after power supply disappears, and it is big to have capacity simultaneously, read-write fast, quiet power saving, shatter-proof, protection against the tide or the like numerous advantages, therefore be widely used in embedded system, on portable information product and the consumption electronic products, and become the market mainstream gradually, wherein with digital camera, digital camera, it is topmost demand that the electronics of PDA is shot with video-corder commodity.
In the memory card for competition day by day, except that design be tending towards mini, therefore the topmost reduction cost of manufacture that still focuses on minimum processing procedure, operation, not only can increase outer, the reduction cost of manufacture that more can be related of production capacity.
The production method of present memory card; be on the board substrate that is shaped for many group circuit board makings; default many groups are laid some chip modules of being made up of passive component, flash memory and control chip in predetermined position; utilize mould to carry out full slice system pressing mold or some glue, print glue then; with chip on the Feng Miqi and passive component; and the circuit blocks of the complete electric function of formation many groups tools; to organize circuit blocks more afterwards again and suitably cut, and obtain indivedual monomers (memory card) of organizing the complete electric function of tools more.
These are by indivedual memory cards of cutting resin adhesive layer gained, be to cut memory card by laser, in cut finish after, need again the memory card avris to be modified, make it become chamfering or R angle, by this to promote whole fluency, and the electronic product of avoiding scratch to peg graft, but these ways must outside not only taking time and effort, more increase cost of manufacture through machining clearance repeatedly.
Because known memory card production method has these to denounce,, generation of the present utility model is arranged finally through the utility model people continual design improved of burning the midnight oil.
The utility model content
The utility model fundamental purpose provides a kind of in producing, can be when the full wafer board substrate cut, and all sides do not need to implement structure and the shape that secondary processing can have the memory card of chamfering again.
Another purpose of the utility model provides a kind of can the location with small size in the full wafer board substrate in the mill, but in order to do making each memory card cut the Shi Nenggeng structure and the shape of memory card accurately.
The another purpose of the utility model provides a kind of can making and shape in the structure of the memory card that reduces cost of manufacture.
For achieving the above object, solution of the present utility model is: a kind of structure of memory card and shape, tie up to and lay some core assembly sheet modules on the full wafer board substrate, and carry out the full slice system pressing mold with mould and encapsulate the chip module of driving fit on it, to form the memory cards of the complete electric function of many group tools, wherein between each memory card when mold die, be formed with groove in the place of cutting, after cutting, make directly to form chamfering on the limit, angle of each memory card and must not grind again; And cut the wiring board of each memory card on the full wafer board substrate, and just cutting two limits or the straight line more than two limits with one-step punching, curved side is then cut with laser.
The all sides of described board substrate are provided with several pilot holes.
Groove between described memory card is the imploded arcs shape.
Groove between described memory card is the V-arrangement shape.
After adopting such scheme, the utility model ties up in establishing a plurality of memory card partial contours in full wafer board substrate upper punch in advance, and on this full wafer board substrate except that being provided with the pilot hole at each angle, and be provided with pilot hole in the memory card side, utilize mould to carry out full wafer board substrate pressing mold then, how group will be some by passive component so that the resin adhesive layer will be furnished with, the chip module envelope that flash memory and control chip etc. are formed is close on board substrate, to form the circuit blocks of the complete electric function of many group tools, and the adhesive layer on each circuit blocks is to be formed with groove by the compacting of mould along all examples of circuit blocks, this groove can be designed to circular groove with the kind and the position of memory card, v-depression ... etc., at last again by laser to cut the circuit blocks curved side, in order to do directly being formed with chamfering on the memory card that makes gained.
With on take off formation, the utility model memory card is because of the design of structure and shape, make overall process simply accurate, price is minimized, and its process design can generally be applicable to the memory card making of present most of kinds, in order to do reducing production process and saving cost of manufacture, to meet the E-consumer market that is tending towards small profits now gradually.
Description of drawings
Fig. 1 is the structural drawing of the utility model one preferred embodiment;
Fig. 2 is the cut-open view of the utility model one preferred embodiment;
Fig. 3 is another angular views of the utility model;
Fig. 4-6 is the making schematic flow sheet of the utility model one preferred embodiment;
Fig. 7 is the diagrammatic cross-section of Fig. 6.
The element numbers explanation
1 ... memory card 2 ... the conducting metal material
3 ... chip module R ... lead angle
10 ... board substrate 101 ... pilot hole
20 ... resin adhesive layer 30 ... groove
Embodiment
As for detailed structure of the present utility model, the explanation then done with reference to following adjoint, can obtain cognitive completely:
For allowing your juror can more understand technology contents of the present utility model, now with preferred embodiment explanation as back:
Fig. 1,2 is the structural drawing and the cut-open view thereof of the utility model one preferred embodiment, and please together with reference to other each figure, can know structure and the shape of learning the utility model memory card, be can be on the board substrate 10 of full slice system, lay some many groups by passive component in predetermined position, the chip module 3 that flash memory and control chip are formed, utilize mould to carry out the full slice system pressing mold then with the close chip on it of resin adhesive layer 20 envelopes, spare part such as passive component .. and be embedded with electronic product and do the conducting metal material 2 that telecommunication is connected, and form the circuit blocks of the complete electric function of many group tools.
Be provided with the part external form profile (as shown in Figure 4) of most memory cards at first in advance in board substrate 10 upper punches, wherein, these board substrate 10 all sides cooperate the number of memory card 1 and are provided with most pilot holes 101, by this with promote constituent parts memory card 1 on the board substrate 10 in cut, accuracy when encapsulating, to avoid board substrate 10 when being formed with the block of memory card partial contour, produce the perk or the situation of skew and take place.
Be to lay on each block some passive components then; flash memory and control chip etc.; and utilize mould to carry out full slice system pressing mold or some glue; seal glue; go up chip and passive component with Feng Miqi; form the circuit blocks (as shown in Figure 5) of the complete electric function of many group tools; wherein; in between each circuit blocks, be provided with groove 30; system is provided with it along the place of cutting of each circuit blocks; this groove 30 is a straight forming when lying in mold die and on resin adhesive layer 20; the concave shape of its groove 30 can be along with the kind of memory card 1; specification; size and set difference and change form the indent arcuation; or the V-arrangement shape etc.; by cutting the circuit blocks curved side, laser forms complete memory card 1 external form profile (as shown in Figure 6) again; because the above external form profile in memory card 1 two limits or two limits is with cheap die-cut being finished of processing procedure expense in previous; only the reserved part curved side is cut at last by the laser cutting of processing procedure costliness; therefore effectively reduce cost of manufacture; and because the setting (as shown in Figure 7) of each circuit blocks fluted 30; so that at the edge of the memory card 1 that cuts each circuit blocks gained; directly be formed with R angle (please refer to shown in Figure 1), and saved by this that conventional process needs edging in addition after cutting and the production process that forms chamfering or R angle again.
The utility model with on take off technological means, make its memory card of finishing, production process is simple, fast, not only can omit the multiple tracks procedure of processing, and can effectively reduce Production Time and cost; Hereat, the utility model is the structure that a kind of memory card is provided and the design of shape, and the quality and the cost of memory card truly have positive benefit on the market at present.
In sum, the structure that the utility model disclosed by former times is not had, and really can reach the effect of expection, and tool can supply industry applications, meets the utility model patent important document fully, requests your juror and examines the gift patent, to encourage innovation, does not have the moral sense of appointing.
Only, above-mentioned disclosed diagram, explanation only are preferred embodiments of the present utility model, are familiar with this skill personage generally, and modification or the equivalence done according to this case spirit category change, and must be included in this case claim.
Claims (4)
1, a kind of structure of memory card and shape tie up on the full wafer board substrate and to lay some core assembly sheet modules, and carry out the full slice system pressing mold and encapsulate the chip module of driving fit on it with mould, to form the memory cards of the complete electric function of many group tools, it is characterized in that:
The edge of each memory card is smooth, and the lead angle profile does not have polishing scratch.
2, the structure of memory card as claimed in claim 1 and shape is characterized in that: all sides of board substrate are provided with several pilot holes.
3, the structure of memory card as claimed in claim 1 and shape is characterized in that: the groove between memory card is the imploded arcs shape.
4, the structure of memory card as claimed in claim 1 and shape is characterized in that: the groove between memory card is the V-arrangement shape.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200620002930 CN200979701Y (en) | 2006-01-20 | 2006-01-20 | The structure and shape of a memory card |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200620002930 CN200979701Y (en) | 2006-01-20 | 2006-01-20 | The structure and shape of a memory card |
Publications (1)
Publication Number | Publication Date |
---|---|
CN200979701Y true CN200979701Y (en) | 2007-11-21 |
Family
ID=38980082
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200620002930 Expired - Fee Related CN200979701Y (en) | 2006-01-20 | 2006-01-20 | The structure and shape of a memory card |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN200979701Y (en) |
-
2006
- 2006-01-20 CN CN 200620002930 patent/CN200979701Y/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071121 |