CN200947144Y - Vertical backlight module of LED dispersed arrangement - Google Patents
Vertical backlight module of LED dispersed arrangement Download PDFInfo
- Publication number
- CN200947144Y CN200947144Y CN 200620120894 CN200620120894U CN200947144Y CN 200947144 Y CN200947144 Y CN 200947144Y CN 200620120894 CN200620120894 CN 200620120894 CN 200620120894 U CN200620120894 U CN 200620120894U CN 200947144 Y CN200947144 Y CN 200947144Y
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- China
- Prior art keywords
- led
- circuit board
- light
- dispersed arrangement
- light guide
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Abstract
The utility model relates to a straight backlight module dispersedly arranged on a light-emitting diode (LED), which comprises a circuit board used to fix the LED and a connecting wire; and a plurality of LEDs; wherein, the circuit board is at least provided with a through hole, a light guide heat dissipation material, a dispersing board, and a light guide board as well as a metal shell; wherein, each LED is regularly and arranged on the circuit board in the equal-distance way or regularly arranged in the approximately equal-distance way to promote 10 percent to 20 percent of brightness for the backlight source and also reduce the working temperature of the utility model.
Description
Technical field
The utility model relates to a kind of down straight aphototropism mode set of light emitting diode dispersed arrangement, is one efficiently luminous, and good module backlight dispels the heat.
Background technology
Module backlight is the assembly that light source is provided to the LCD product, is one of its key component, has been widely used in all many-sides such as mobile phone, digital camera, video camera, computer display screen, flat-surface television, plane outdoor advertising at present.Module backlight is arranged at the below of display screen, with provide evenly disperse and the light of certain brightness to display screen, form the colour picture of different brightness, different color and different gray scales by the pixel electrode on the control display screen.And module backlight is divided into straight-down negative module (light source places under the display screen) and side-light type module (light source places the display screen side) according to the light source position.Because the light source of direct-light-type backlight module under display screen, therefore can satisfy the demand of higher brightness or large-size display screen.
Fig. 1 is that known module backlight three looks (R, G, B) LED arranges synoptic diagram.
As shown in Figure 1, module backlight commonly used all is that red (R), green (G), one group of LED of blue (B) three looks are concentrated and put together, arranges according to certain rules between every group, because three LED spacings are very near, luminous total efficiency is relatively poor; Radiating condition also is restricted, and makes the temperature of LED raise very fast.
Summary of the invention
The purpose of this utility model is to provide a kind of down straight aphototropism mode set of LED dispersed arrangement, be in red (R), green (G), the down straight aphototropism mode set of blue (B) three-color LED as light source, under the condition that does not increase LED quantity, the side light of three-color LED is applied more fully, the luminous total efficiency of LED is improved, increase the brightness of module backlight.Improve the radiating condition of LED on circuit board, reduce the temperature of module backlight.
To achieve these goals, the utility model provides a kind of down straight aphototropism mode set of LED dispersed arrangement, comprising: circuit board is fixed with LED and line on it; Some LED that light source is provided are fixed on the described circuit board, equidistant dispersion distribution on circuit board between every LED; Offer the via hole that at least one is used for discharging heat that module backlight produces at the LED periphery on the circuit board; The leaded light heat sink material is poured into LED and goes up sealing LED, and discharges the heat that LED produces by via hole; Light guide plate places between leaded light heat sink material and the diffuser plate, and the light scattering that LED is produced is to diffuser plate; Diffuser plate places on the light guide plate, and the light scattering that LED produces is exported.
Further preferred version of the present utility model is that this module backlight also includes shell, places with the upper module outside, and is coated with upper module, and circuit board, diffuser plate, light guide plate and leaded light scattering material are fixed.
Further preferred version of the present utility model is that the material of described shell is a metal.
Further preferred version of the present utility model is staggered regularly dispersion distribution on circuit board between LED.
The utility model can improve the brightness 10%～20% of backlight, and the working temperature of backlight source module is descended.
Above-mentioned and additional features, advantage of the present utility model can further be understood by the detailed description below in conjunction with accompanying drawing.
Description of drawings
Fig. 1 is that existing three-color LED is concentrated arrangement backlight source module synoptic diagram;
Fig. 2 is that the utility model LED distributing is arranged the backlight source module diagrammatic cross-section
Fig. 3 .1 is that the utility model LED distributing is arranged one of backlight source module synoptic diagram (rounded projections arranged);
Fig. 3 .2 is two (square arrangement) that the utility model LED distributing is arranged the backlight source module synoptic diagram;
Description of reference numerals: circuit board 10; Via hole 11; LED 20; Leaded light heat sink material 30; Light guide plate 40; Diffuser plate 50; Shell 60.
Embodiment
As shown in Figure 2, the utility model provides a kind of down straight aphototropism mode set of LED dispersed arrangement, comprising: one is used for fixing the circuit board 10 that LED and line are used, several light emitting diodes (LED) 20; Have a via hole 11 near each LED 20 on the circuit board at least, perfusion leaded light heat sink material 30 on LED 20 with the LED sealing, and is communicated with perfusion leaded light heat sink material 30 in 11 and is beneficial to heat radiation with shell 60.Light guide plate 40 and diffuser plate 50 place leaded light heat sink material 30 upper ends, all are fixed on the shell 60.Light guide plate 40 places between leaded light heat sink material 30 and the diffuser plate 50, and the light scattering that LED 20 is produced is to diffuser plate 50; Diffuser plate 50 places on the light guide plate 40, and the light scattering that LED 20 produces is exported.Shell 60 is to place with the upper module outside, and is coated with upper module, and circuit board 10, diffuser plate 50, leaded light heat sink material 30 and light guide plate 40 is fixing.
20 equidistant dispersion distributions on circuit board 10 of LED, or staggered regularly distribution, the total quantity of dispersed arrangement backlight source module LED 20, the total quantity of the used LED of no more than existing backlight source module of disperseing; The light of LED 20 is through leaded light heat sink material 30, light guide plate 40 and diffuser plate 50 outputs.20 of LED are bigger because of distance, and radiating condition is better, so temperature rise is less.Less temperature rise then by leaded light heat sink material 30 and via hole 11 to external world's heat radiation, or perfusion leaded light heat sink material 30 in 11 is communicated with shell 60, shell has promptly played the effect of the heat sink of LED 20.
Generally speaking, the total quantity of the dispersed arrangement backlight source module LED of same size, the total quantity of the used LED of no more than known backlight source module.Red (R), green (G), blue (B) LED spread pattern on circuit board such as the equidistant dispersion distribution of Fig. 3 .1 and Fig. 3 .2, or the clocklike staggered of other form disperses to distribute.And the position and the requirement of the thickness of perfusion leaded light heat sink material and leaded light scattering material, diffuser plate are all constant.
Consult Fig. 3 .1 and Fig. 3 .2, the utility model distributing is arranged backlight source module LED and is arranged synoptic diagram, and via hole 11 can according to the size in line gap, be opened 1 hole or a plurality of hole, in order to the discharge of heat at the periphery of LED.Perfusion leaded light heat sink material 30 in 11 is communicated with shell 60, and shell has promptly played the effect of the heat sink of LED.
Be to be understood that, below explanation in conjunction with the embodiments is for the utility model illustrative and nonrestrictive just, in not breaking away from spirit and scope of the present utility model, can make many changes and modification to the utility model, it all will drop in the scope of the present utility model defined by the claims.
Claims (4)
1. the down straight aphototropism mode set of a LED dispersed arrangement is characterized in that, comprising:
Circuit board is fixed with LED and line on it;
Some LED that light source is provided are fixed on the described circuit board, equidistant dispersion distribution on circuit board between every LED;
Offer the via hole that at least one is used for discharging heat that module backlight produces at the LED periphery on the circuit board;
The leaded light heat sink material is poured into LED and goes up sealing LED, and discharges the heat that LED produces by via hole;
Light guide plate places between leaded light heat sink material and the diffuser plate, and the light scattering that LED is produced is to diffuser plate;
Diffuser plate places on the light guide plate, and the light scattering that LED produces is exported.
2. the down straight aphototropism mode set of LED dispersed arrangement as claimed in claim 1 is characterized in that: this module backlight also includes shell, places with the upper module outside, and is coated with upper module, and circuit board, diffuser plate, light guide plate and leaded light scattering material are fixed.
3. the down straight aphototropism mode set of LED dispersed arrangement as claimed in claim 2 is characterized in that: the material of described shell is a metal.
4. the down straight aphototropism mode set of LED dispersed arrangement as claimed in claim 1 is characterized in that: staggered regularly dispersion distribution on circuit board between LED.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620120894 CN200947144Y (en) | 2006-07-11 | 2006-07-11 | Vertical backlight module of LED dispersed arrangement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620120894 CN200947144Y (en) | 2006-07-11 | 2006-07-11 | Vertical backlight module of LED dispersed arrangement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN200947144Y true CN200947144Y (en) | 2007-09-12 |
Family
ID=38734208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620120894 Expired - Lifetime CN200947144Y (en) | 2006-07-11 | 2006-07-11 | Vertical backlight module of LED dispersed arrangement |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN200947144Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009082871A1 (en) * | 2007-12-27 | 2009-07-09 | Shenzhen Diguang Electronics Co., Ltd. | A led light source module having a heat conduction system and a heat radiation system |
| WO2010130212A1 (en) * | 2009-05-14 | 2010-11-18 | 浙江西子光电科技有限公司 | Led illuminator and led module |
| CN101539957B (en) * | 2008-03-20 | 2011-08-03 | 宏齐科技股份有限公司 | Method for computing optimal array space between light emitting diode encapsulation units |
-
2006
- 2006-07-11 CN CN 200620120894 patent/CN200947144Y/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009082871A1 (en) * | 2007-12-27 | 2009-07-09 | Shenzhen Diguang Electronics Co., Ltd. | A led light source module having a heat conduction system and a heat radiation system |
| CN101539957B (en) * | 2008-03-20 | 2011-08-03 | 宏齐科技股份有限公司 | Method for computing optimal array space between light emitting diode encapsulation units |
| WO2010130212A1 (en) * | 2009-05-14 | 2010-11-18 | 浙江西子光电科技有限公司 | Led illuminator and led module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20070912 |
|
| EXPY | Termination of patent right or utility model |