CN101539957B - Method for computing optimal array space between light emitting diode encapsulation units - Google Patents
Method for computing optimal array space between light emitting diode encapsulation units Download PDFInfo
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- CN101539957B CN101539957B CN2008100868907A CN200810086890A CN101539957B CN 101539957 B CN101539957 B CN 101539957B CN 2008100868907 A CN2008100868907 A CN 2008100868907A CN 200810086890 A CN200810086890 A CN 200810086890A CN 101539957 B CN101539957 B CN 101539957B
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 58
- 238000000034 method Methods 0.000 title claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 19
- 238000005457 optimization Methods 0.000 claims description 27
- 239000011295 pitch Substances 0.000 claims description 21
- 238000004020 luminiscence type Methods 0.000 claims description 19
- 238000010586 diagram Methods 0.000 description 9
- VIKNJXKGJWUCNN-XGXHKTLJSA-N norethisterone Chemical compound O=C1CC[C@@H]2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1 VIKNJXKGJWUCNN-XGXHKTLJSA-N 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
The invention provides a method for computing optimal array space between light emitting diode encapsulation units, which comprises the following steps of: firstly, providing a brightness value of a backlight module required by a customer and material information on what material the backlight module is made of; secondly, determining the brightness level and the number of the light emitting diode chip encapsulation units by a designer according to the brightness value and the material information of the backlight module provided by the customer; and finally, equally arranging the light emitting diode chip encapsulation units determined by the designer on an incident part of the backlight module to define the optimal array space between each two light emitting diode chip encapsulation units. The method can compute the optimal array space through accurate information.
Description
Technical field
The present invention relates to a kind of aligning method of light-emitting diode chip for backlight unit encapsulation unit, relate in particular to a kind of method that calculates the optimization arrangement pitches of LED encapsulation unit.
Background technology
The arrangement of general light-emitting diode chip for backlight unit encapsulation unit is carried out according to its experience by the deviser.That is, the deviser according to its practical experience of process make spacing (pitch) between per two light-emitting diode chip for backlight unit encapsulation units.Yet this kind not only can't accurately calculate optimized spacing according to the arrangement mode of experience, more because different deviser's human factor, and produces sizable error.
Be with, as from the foregoing, the distance computation method between present known light-emitting diode chip for backlight unit encapsulation unit obviously has inconvenience and defective, remains to be improved.
Summary of the invention
The inventor thinks that above-mentioned defective can improve, thus according to the correlation experience of being engaged in for many years in this respect, the concentrated observation and research, and cooperate the utilization of the principles of science, and propose a kind of reasonable in design and effectively improve the present invention of above-mentioned defective.
A kind of method that calculates the optimization arrangement pitches of LED encapsulation unit that provides is provided.The present invention is by the brightness value (brightnessvalue) and the employed material information of this backlight module (material information) of the required backlight module (backlight module) of client, decide employed brightness degree of light-emitting diode chip for backlight unit encapsulation unit (brightness level) and number (amount), and then define the optimization spacing between per two light-emitting diode chip for backlight unit encapsulation units.
According to wherein a kind of scheme of the present invention, a kind of method that calculates the optimization arrangement pitches of LED encapsulation unit is provided, it comprises the following steps: at first, provides the required brightness of backlight module value of client and this backlight module to use the material information of which kind of material; Then, the deviser needs to use the light-emitting diode chip for backlight unit encapsulation unit of what brightness degree and how many numbers according to this brightness of backlight module value and material information that this client provided with decision; At last, the branch ground (dividedly) such as light-emitting diode chip for backlight unit encapsulation unit that this deviser determined are arranged at the light inlet of this backlight module, to define the optimization spacing between per two light-emitting diode chip for backlight unit encapsulation units.
Aforementioned calculation goes out in the method for optimization arrangement pitches of LED encapsulation unit, this backlight module can by luminescence unit, light guide plate, reflecting plate, diffuser plate, prism plate, and the light emitting diode Polarizer form.
Aforementioned calculation goes out in the method for optimization arrangement pitches of LED encapsulation unit, this luminescence unit can be made up of the light-emitting diode chip for backlight unit encapsulation unit that this deviser determined, and the light beam that this luminescence unit produced can directly be invested this light guide plate or invest this light guide plate indirectly by the reflection of this reflecting plate.
Aforementioned calculation goes out in the method for optimization arrangement pitches of LED encapsulation unit, this reflecting plate can have first reflecting plate and second reflecting plate, and this first reflecting plate is used to reflect the light beam that this luminescence unit produces, and this second reflecting plate is used to reflect the light beam through this light guide plate.
Aforementioned calculation goes out in the method for optimization arrangement pitches of LED encapsulation unit, this light guide plate can be arranged at the side of this luminescence unit, in order to receive the light beam that this luminescence unit produces, and this diffuser plate can be arranged at the upper end of this light guide plate, this prism plate can be arranged at the upper end of this diffuser plate, and this light emitting diode Polarizer can be arranged at the upper end of this prism plate.
Therefore, the aligning method of light-emitting diode chip for backlight unit encapsulation unit of the present invention can calculate the optimization arrangement pitches by accurate information.
Reach technology, means and the effect that predetermined purpose is taked in order further to understand the present invention, see also following about detailed description of the present invention and accompanying drawing, believe that purpose of the present invention, feature and characteristics are when obtaining therefrom deeply and concrete understanding, yet accompanying drawing is only for reference and explanation, is not to be used for the present invention is limited.
Description of drawings
Fig. 1 calculates the process flow diagram of method of the optimization arrangement pitches of LED encapsulation unit for the present invention;
Fig. 2 is the synoptic diagram of backlight module of the present invention;
Fig. 3 A is the synoptic diagram of first kind of arrangement of light-emitting diode chip for backlight unit encapsulation unit of the present invention; And
Fig. 3 B is the synoptic diagram of second kind of arrangement of light-emitting diode chip for backlight unit encapsulation unit of the present invention.
Wherein, description of reference numerals is as follows:
The B backlight module
10 luminescence units
100 light-emitting diode chip for backlight unit encapsulation units
11 light guide plate
12 reflecting plates
121 first reflecting plates
122 second reflecting plates
13 diffuser plates
14 prism plates
15 light emitting diode Polarizers
The L light beam
Embodiment
See also shown in Figure 1ly, it calculates the process flow diagram of method of the optimization arrangement pitches of LED encapsulation unit for the present invention.By the process flow diagram of Fig. 1 as can be known, the invention provides a kind of method that calculates the optimization arrangement pitches of LED encapsulation unit, it comprises the following steps: at first to provide the required brightness of backlight module value of client and this backlight module to use the material information of which kind of material at step S100; Then at step S102, the deviser is according to this brightness of backlight module value and material information that this client provided, and decision needs to use the light-emitting diode chip for backlight unit encapsulation unit of what brightness degree and how many numbers; At last at step S104, with branches such as light-emitting diode chip for backlight unit encapsulation unit that this deviser determined be arranged at the light inlet of this backlight module, to define the optimization spacing between per two light-emitting diode chip for backlight unit encapsulation units.
See also shown in Fig. 2, Fig. 3 A and Fig. 3 B, it is respectively synoptic diagram, and the synoptic diagram of second kind of arrangement of light-emitting diode chip for backlight unit encapsulation unit of the present invention of first kind of arrangement of the synoptic diagram of backlight module of the present invention, light-emitting diode chip for backlight unit encapsulation unit of the present invention.By above-mentioned each figure as can be known, this backlight module B by luminescence unit (light emitting unit) 10, light guide plate (light guiding board) 11, reflecting plate (reflective board) 12, diffuser plate (diffusing board) 13, prism plate (prism board) 14, and light emitting diode Polarizer (LED light polarizing board) 15 form.This luminescence unit 10 is made up of the light-emitting diode chip for backlight unit encapsulation unit 100 that this deviser determined, and the light beam L that this luminescence unit 10 produced directly (directly) invest this light guide plate 11 or by the reflection of this reflecting plate 12 indirectly (indirectly) invest this light guide plate 11.
In addition, this reflecting plate 12 has first reflecting plate (first reflective board), 121 and second reflecting plate (second reflective board) 122, and this first reflecting plate 121 is used to reflect the light beam L that this luminescence unit 10 is produced, and this second reflecting plate 122 is used to reflect the light beam L through this light guide plate 11.In addition, this light guide plate 11 is arranged at the side of this luminescence unit 10, in order to receive the light beam L that this luminescence unit 10 is produced, and this diffuser plate 13 is arranged at the upper end of this light guide plate 11, this prism plate 14 is arranged at the upper end of this diffuser plate 13, and this light emitting diode Polarizer 15 is arranged at the upper end of this prism plate 14.
Therefore, the example that is arranged as with the light-emitting diode chip for backlight unit encapsulation unit shown in above-mentioned Fig. 3 A figure, illustrate that the present invention calculates the method for the optimization arrangement pitches of LED encapsulation unit, it comprises the following steps: at first, the brightness value of the backlight module B that the client is required is 5500 briliancy (nit), and the structure of this backlight module B and material are as shown in Figure 2; Then, the material information of the brightness value of deviser's foundation 5500 briliancy and the backlight module B of this Fig. 2 decides the light-emitting diode chip for backlight unit encapsulation units 100 that use 27 1200 milli candle lights (mcd); At last, with light-emitting diode chip for backlight unit encapsulation unit 100 branches such as grade of these 27 1200 milli candle lights (mcd) be arranged at the light inlet of this backlight module B, be 5.5 millimeters (mm) with the optimization spacing that defines between per two light-emitting diode chip for backlight unit encapsulation units 100.
In addition, the example that is arranged as with the light-emitting diode chip for backlight unit encapsulation unit shown in above-mentioned Fig. 3 B, the present invention calculates the method for the optimization arrangement pitches of LED encapsulation unit, it comprises the following steps: at first, the brightness value of the backlight module B that the client is required is 3600 briliancy, and the structure of this backlight module B and material are as shown in Figure 2; Then, the material information of the brightness value of deviser's foundation 3600 briliancy and the backlight module B of this Fig. 2 decides the light-emitting diode chip for backlight unit encapsulation units 100 that use 18 1200 milli candle lights (mcd); At last, with light-emitting diode chip for backlight unit encapsulation unit 100 branches such as grade of these 18 1200 milli candle lights (mcd) be arranged at the light inlet of this backlight module B, the optimization spacing that defines between per two light-emitting diode chip for backlight unit encapsulation units 100 is 8.5 millimeters (mm).
In sum, the present invention is by required brightness of backlight module value and the employed material information of this backlight module of client, decide employed brightness degree of light-emitting diode chip for backlight unit encapsulation unit and number, and then define the optimization spacing between per two light-emitting diode chip for backlight unit encapsulation units.Therefore, the aligning method of light-emitting diode chip for backlight unit encapsulation unit of the present invention can calculate the optimization arrangement pitches by accurate information.
Yet the above only is the detailed description and the accompanying drawing of one of best specific embodiment of the present invention, but feature of the present invention is not limited thereto, be not that above explanation is in order to restriction the present invention, all scopes of the present invention should be as the criterion with the claims scope, all embodiment spiritual and variation similar with it that meets claim scope of the present invention all should be contained in the category of the present invention, any those skilled in the art are in the field of the invention, and variation that can run away with or modification all can be contained within the scope of the present invention.
Claims (5)
1. a method that calculates the optimization arrangement pitches of LED encapsulation unit is characterized in that, comprises the following steps:
Provide the required brightness of backlight module value of client and this backlight module to use the material information of which kind of material;
The deviser decides the light-emitting diode chip for backlight unit encapsulation unit that needs to use what brightness degree and how many numbers according to this brightness of backlight module value and material information that this client provided; And
With branches such as light-emitting diode chip for backlight unit encapsulation unit that this deviser determined be arranged at the light inlet of this backlight module, to define the optimization spacing between per two light-emitting diode chip for backlight unit encapsulation units.
2. the method that calculates the optimization arrangement pitches of LED encapsulation unit as claimed in claim 1 is characterized in that: this backlight module by luminescence unit, light guide plate, reflecting plate, diffuser plate, prism plate, and the light emitting diode Polarizer form.
3. the method that calculates the optimization arrangement pitches of LED encapsulation unit as claimed in claim 2, it is characterized in that: this luminescence unit is made up of the light-emitting diode chip for backlight unit encapsulation unit that this deviser determined, and the light beam that this luminescence unit produced is directly invested this light guide plate or invest this light guide plate indirectly by the reflection of this reflecting plate.
4. the method that calculates the optimization arrangement pitches of LED encapsulation unit as claimed in claim 2, it is characterized in that: this reflecting plate has first reflecting plate and second reflecting plate, and this first reflecting plate is used to reflect the light beam that this luminescence unit produces, and this second reflecting plate is used to reflect the light beam through this light guide plate.
5. the method that calculates the optimization arrangement pitches of LED encapsulation unit as claimed in claim 2, it is characterized in that: this light guide plate is arranged at the side of this luminescence unit, in order to receive the light beam that this luminescence unit produces, and this diffuser plate is arranged at the upper end of this light guide plate, this prism plate is arranged at the upper end of this diffuser plate, and this light emitting diode Polarizer is arranged at the upper end of this prism plate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2008100868907A CN101539957B (en) | 2008-03-20 | 2008-03-20 | Method for computing optimal array space between light emitting diode encapsulation units |
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| CN2008100868907A CN101539957B (en) | 2008-03-20 | 2008-03-20 | Method for computing optimal array space between light emitting diode encapsulation units |
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| CN101539957A CN101539957A (en) | 2009-09-23 |
| CN101539957B true CN101539957B (en) | 2011-08-03 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200947144Y (en) * | 2006-07-11 | 2007-09-12 | 深圳帝光电子有限公司 | Vertical backlight module of LED dispersed arrangement |
| CN101042501A (en) * | 2006-09-14 | 2007-09-26 | 友达光电股份有限公司 | Back light unit and light-emitting diode packaging structure |
| CN200969348Y (en) * | 2006-10-17 | 2007-10-31 | 宏齐科技股份有限公司 | Package structure for luminous diode chip |
-
2008
- 2008-03-20 CN CN2008100868907A patent/CN101539957B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200947144Y (en) * | 2006-07-11 | 2007-09-12 | 深圳帝光电子有限公司 | Vertical backlight module of LED dispersed arrangement |
| CN101042501A (en) * | 2006-09-14 | 2007-09-26 | 友达光电股份有限公司 | Back light unit and light-emitting diode packaging structure |
| CN200969348Y (en) * | 2006-10-17 | 2007-10-31 | 宏齐科技股份有限公司 | Package structure for luminous diode chip |
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| CN101539957A (en) | 2009-09-23 |
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