CN200946897Y - Residual heat recovering type water heater system - Google Patents
Residual heat recovering type water heater system Download PDFInfo
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- CN200946897Y CN200946897Y CN 200620052056 CN200620052056U CN200946897Y CN 200946897 Y CN200946897 Y CN 200946897Y CN 200620052056 CN200620052056 CN 200620052056 CN 200620052056 U CN200620052056 U CN 200620052056U CN 200946897 Y CN200946897 Y CN 200946897Y
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- Instantaneous Water Boilers, Portable Hot-Water Supply Apparatuses, And Control Of Portable Hot-Water Supply Apparatuses (AREA)
Abstract
An afterheat recycling electric water heater system is provided, which comprises of a tap water inlet, a deliverability device, a spray thrower, a waster water filter and a single chip electronic controller. The deliverability device of the utility model provides the deliverability device which adopts integral fin high- power semiconductor thermoelectricity chip components, the middle between an outlet side of a hot side water channel of the deliverability device and the spray thrower is connected and communicated with a hot water storage tank, a cold side water recycling channel of the deliverability device is parallelly connected with a heat exchanger and a cold side recycle pump. The utility model has a small size, a high thermal efficiency, which can save energies and powers and has a good safety.
Description
Technical field:
The utility model relates to a kind of water-heater system, is specifically related to a kind of afterheat recovery type electronic water heater system.
Background technology:
Existing water heater such as gas heater, heat storing type electric water heater, direct-heating type electric heater, not only bulky, and all have a safety problem and energy consumption is big, operating cost is high problem: gas heater uses coal gas to make fuel, gas poisoning and anaerobic chamber breath accident take place easily, and the electric heater supply load is big, and subscribers' line is difficult to bear, and directly adopts 220V electric heating, there is Danger Electric shock risk, poor safety performance.Particularly existing water heater does not all have heat reclaiming system, thereby goes back the problem that ubiquity heat energy utilization rate is low, energy waste is serious.
Summary of the invention:
Technical problem to be solved in the utility model is: solve the problem that above-mentioned prior art exists, a kind of volume is little, easy to install, power load is little, security performance good, the thermal efficiency is high, the afterheat recovery type electronic water heater system of energy savings and provide.
The technical solution adopted in the utility model is: pipe is gone into by running water by this afterheat recovery type electronic water heater system, the production capacity device, spray thrower, effluent filter, the single-chip microcomputer electric controller is formed, running water is gone into pipe and is connected production capacity device hot junction aquaporin water inlet end, aquaporin water side, production capacity device hot junction connects spray thrower by pipeline, effluent filter is installed in the spray thrower below, effluent filter is by the filter delivery pump, connecting pipe is connected to production capacity device cold junction water circulation channel, production capacity device of the present utility model adopts integrated heat radiation type high-power semiconductor thermoelectric chip component production capacity device, and go out between end and the spray thrower also to have connected heat storage water tank at the hot junction of production capacity device aquaporin water, pipeline is passed through in the heat storage water tank lower end, heat accumulation circulating pump and production capacity device hot junction aquaporin water inlet end connect.
In the technique scheme, production capacity device cold junction water circulation channel also is parallel with heat exchanger and cold junction circulating pump, and heat exchanger places hot-air or vapours or hot water.
In the technique scheme, the single-chip microcomputer electric controller is a prior art.
In the technique scheme, integrated heat radiation type high-power semiconductor thermoelectric chip component production capacity device is connected and fixed fin respectively on the baffle upper plate of high-power semiconductor thermoelectric chip component and chin spoiler, perhaps baffle upper plate and chin spoiler thickening directly processes fin on thick deflector.
In the technique scheme, the structure that is connected and fixed that baffle upper plate and chin spoiler are connected and fixed fin respectively is: insulating is handled on the deflector, generates insulating barrier, and metalized on insulating barrier generates metal level again, and metal level is fixing with the fin welding again.
In the technique scheme, insulating is handled on the fin that directly processes on the thick deflector, generates insulating barrier.
In the technique scheme, high-power semiconductor thermoelectric chip component is by middle laminar substrate, the semiconductor heat electric device, baffle upper plate, chin spoiler is formed, middle laminar substrate is insulating materials profiled sheeting or insulating materials casting plate, have a plurality of perforation that match with thermoelectric element on the middle laminar substrate, be separately installed with P-type semiconductor thermoelectric element and N-type semiconductor thermoelectric element in the perforation, on, chin spoiler and middle laminar substrate and semiconductor heat electric device are connected and fixed, and baffle upper plate is electrically connected with semiconductor heat electric device upper end, chin spoiler is electrically connected with semiconductor heat electric device lower end, on, chin spoiler is processed into the water conservancy diversion fritter of some mutual insulatings, on some mutual insulatings, following water conservancy diversion fritter and P-type semiconductor thermoelectric element, N-type semiconductor thermoelectric element be electrically connected to form the in parallel of semiconductor heat electrical chip or series connection or string, combination in parallel.
In the technique scheme, the upper and lower water conservancy diversion fritter of some mutual insulatings and being combined as of thermoelectric element:
One group of P-type semiconductor thermoelectric element upper end is gone up the water conservancy diversion fritter with one group of adjacent N-type semiconductor thermoelectric element upper end by one and is connected in parallel, and this group N-type semiconductor thermoelectric element lower end and adjacent other one group of P-type semiconductor thermoelectric element lower end are connected in parallel by a following water conservancy diversion fritter, so analogize, form many group P-type semiconductor thermoelectric elements and many group N-type semiconductor thermoelectric elements also, tandem compound.
In the technique scheme, the water conservancy diversion fritter that upper and lower deflector is processed into some mutual insulatings can adopt the processing method of printed circuit board (PCB) to process.
In the technique scheme, middle laminar substrate adopts epoxy resin board, fiber, paper offset plate, blowing agent dielectric panel or other dielectric panel to make.
In the technique scheme, upper and lower deflector is aluminium plate or copper clad plate.
In the technique scheme, upper and lower deflector and P, N-type semiconductor thermoelectric element low-temperature welding.
Advantage of the present utility model and beneficial effect:
1, the utility model has greatly improved the thermal efficiency, its thermal efficiency of traditional electric heater can only be below 100%, and afterheat recovery type electronic water heater of the present utility model system, its heat production efficiency is the 350%-1000% of pure resistor load heating form, not only operating cost is low, and the much extensive scope of application is arranged than mechanical heat pump, almost there is not geographic restrictions, so long as that water just may be heated to is temperature required for use.
2, residual neat recovering system flexibility of the present utility model is big, no matter be spent hot water or hot-air or all recyclable utilization of vapours, is an energy-conservation new science and technology.
3, operating voltage of the present utility model is that civil power is converted to the safe voltage of human body not being had injury, and does not use coal gas, avoids electric shock, gas poisoning, anoxic chamber breath, and security performance is good.
4, the utility model is easy to use, can use hot water after the unlatching, need not to wait for that the water outlet water temperature is pressed the preset temperature target setting, need not to transfer to convert water temperature, and constant temperature is permanent thermally-stabilised reliable.
5, production capacity device of the present utility model adopts integrated heat radiation type high-power semiconductor thermoelectric chip component, greatly increased the area of dissipation of high-power semiconductor thermoelectric chip component, improve the heat exchange performance with chilled water, heat medium water, improved the actual cooling and heating type efficient of high-power semiconductor thermoelectric chip component greatly.
6, integrated heat radiation type high-power semiconductor thermoelectric chip component of the present utility model has changed traditional thermoelectric chip structure and manufacturing process, the perforation that laminar substrate has in the employing is the semiconductor heat electric device fixedly, go up then, chin spoiler and base plate bonding, be electrically connected with thermoelectric element, the parallel connection of semiconductor heat electric device or tandem compound, the some water conservancy diversion fritters that are processed into mutual insulating by deflector are realized, thereby greatly optimized processing technology thereof, operation is installed easily, accurately put in place, product reliability is good, realized non-maintaining, reduce cost, improved production efficiency and product percent of pass, be suitable for industrialized mass.
Description of drawings:
Fig. 1 is the utility model structural representation
Fig. 2 is the utility model production capacity device structure principle chart
Fig. 3 is the integrated heat radiation type high-power semiconductor thermoelectric chip component schematic perspective view
Fig. 4 is the integrated heat radiation type high-power semiconductor thermoelectric chip component generalized section
Fig. 5 is the high-power semiconductor thermoelectric chip component perspective exploded view
The specific embodiment:
Referring to Fig. 1, Fig. 2, this afterheat recovery type electronic water heater system goes into pipe 1, production capacity device 2, spray thrower 3, effluent filter 4, single-chip microcomputer electric controller 5 by running water and forms, running water is gone into pipe 1 and is connected production capacity device 2 hot junction aquaporin water inlet ends 6 by water intaking valve 16, aquaporin water side 7, production capacity device 2 hot junction connects spray thrower 3 by pipeline, effluent filter 4 is connected to production capacity device cold junction water circulation channel 10 by filter delivery pump 8, connecting pipe 9, and the water side 11 of production capacity device cold junction water circulation channel 10 effluxes by pipeline 12.Production capacity device 2 of the present utility model adopts integrated heat radiation type high-power semiconductor thermoelectric chip component production capacity device, and between aquaporin water side 7, the hot junction of production capacity device 2 and spray thrower 3, also connect heat storage water tank 13, pipeline 14 is passed through in heat storage water tank 13 lower ends, the hot junction aquaporin water inlet end 6 of heat accumulation circulating pump 15 and production capacity device 2.Production capacity device 2 cold junction water circulation channels 10 also are parallel with heat exchanger 17 and cold junction circulating pump 18, and 19 is the hot junction water circulation channel among the figure, and heat exchanger 17 can place hot-air or vapours or hot water.
Referring to Fig. 3, Fig. 4, this integrated heat radiation type high-power semiconductor thermoelectric chip component is connected and fixed fin 23 respectively on the baffle upper plate 21 of high-power semiconductor thermoelectric chip component 20 and chin spoiler 22, perhaps baffle upper plate 21 and chin spoiler 22 thickenings directly process fin 23 on thick deflector.Above-mentioned fin 23 can adopt aluminium to make.
The syndeton of taking to be connected and fixed fin 23 on above-mentioned the former baffle upper plate 21 and the chin spoiler 22 respectively is: insulating is handled as ceramic treatment on the deflector 21,22, generating insulating barrier is ceramic layer, low-priced metal level aluminium or the copper penetrated of metalized such as vacuum on ceramic layer is fixing with fin 23 welding on metal level at last again.
Take 22 thickenings of above-mentioned latter's baffle upper plate 21 and chin spoiler, directly process fin 23 on thick deflector, in case of necessity, insulating is handled again on fin, i.e. ceramic treatment, and generating insulating barrier is ceramic layer.
Referring to Fig. 5, high-power semiconductor thermoelectric chip component is by middle laminar substrate 24, semiconductor heat electric device 25, baffle upper plate 21, chin spoiler 22 is formed, middle laminar substrate 24 is insulating materials profiled sheeting or insulating materials casting plate, have a plurality of perforation 25 that match with the thermoelectric element size on the middle laminar substrate 24, be separately installed with P-type semiconductor thermoelectric element and N-type semiconductor thermoelectric element in the perforation 25, baffle upper plate 21, chin spoiler 22 and fixing or hot-forming being connected and fixed of middle laminar substrate 24 gummeds, and baffle upper plate 21 is realized being electrically connected with semiconductor heat electric device upper end low-temperature welding, chin spoiler 22 is realized being electrically connected with semiconductor heat electric device lower end low-temperature welding, then, on, the mode of fluting or cutting or printed circuit board (PCB) corrosion that adopts chin spoiler is processed into the plurality of small blocks of mutual insulating, on these mutual insulatings, following water conservancy diversion fritter and P-type semiconductor thermoelectric element, N-type semiconductor thermoelectric element be electrically connected to form the in parallel of semiconductor heat electric device or series connection or string, combination in parallel.As shown in Figure 5, one group of P-type semiconductor thermoelectric element upper end and adjacent one group of N-type semiconductor thermoelectric element upper end are electrically connected by water conservancy diversion fritter on and are connected in parallel, and the N-type semiconductor thermoelectric element lower end of this group is electrically connected by a following water conservancy diversion fritter with adjacent other one group of P-type semiconductor thermoelectric element lower end and is connected in parallel, as analogize, form many group P-type semiconductor thermoelectric elements and many group N-type semiconductor thermoelectric elements also, tandem compound.That is: taking one group of parallel way is a plurality of P types or the parallel connection of N type thermoelectric element, again with another the group parallel way be that a plurality of N types or P type thermoelectric element are in parallel, these two groups of parallel waies are series connection mutually again, and another that has so just formed one group of P type in parallel or N type thermoelectric element and parallel connection organizes N type or P type thermoelectric element is connected to reach the bridge mode.
Claims (4)
1, a kind of afterheat recovery type electronic water heater system, go into pipe by running water, the production capacity device, spray thrower, effluent filter, the single-chip microcomputer electric controller is formed, running water is gone into pipe and is connected production capacity device hot junction aquaporin water inlet end, aquaporin water side, production capacity device hot junction connects spray thrower by pipeline, effluent filter is by the filter delivery pump, connecting pipe is connected to production capacity device cold junction water circulation channel, it is characterized in that: the production capacity device adopts integrated heat radiation type high-power semiconductor thermoelectric chip component production capacity device, and between aquaporin water side, the hot junction of production capacity device and spray thrower, also having connected heat storage water tank, pipeline is passed through in the heat storage water tank lower end, heat accumulation circulating pump and production capacity device hot junction aquaporin water inlet end connect.
2, according to the afterheat recovery type electronic water heater system of claim 1, it is characterized in that production capacity device cold junction aquaporin also is parallel with heat exchanger and cold junction circulating pump, heat exchanger places hot-air or heat steam or hot water.
3, afterheat recovery type electronic water heater system according to claim 1, it is characterized in that integrated heat radiation type high-power semiconductor thermoelectric chip component production capacity device is connected and fixed fin respectively on the baffle upper plate of high-power semiconductor thermoelectric chip component and chin spoiler, baffle upper plate and chin spoiler thickening, on thick deflector, directly process fin, on the fin again insulating handle to generate insulating barrier, perhaps baffle upper plate and chin spoiler are connected and fixed the structure that is connected and fixed of fin respectively and are: insulating is handled on the deflector, generate insulating barrier, metalized on insulating barrier again, generate metal level, metal level is fixing with the fin welding again.
4, afterheat recovery type electronic water heater system according to claim 3, it is characterized in that high-power semiconductor thermoelectric chip component is by middle laminar substrate, the semiconductor heat electric device, baffle upper plate, chin spoiler is formed, middle laminar substrate is insulating materials profiled sheeting or insulating materials casting plate, have a plurality of perforation that match with thermoelectric element on the middle laminar substrate, be separately installed with P-type semiconductor thermoelectric element and N-type semiconductor thermoelectric element in the perforation, on, chin spoiler and middle laminar substrate and semiconductor heat electric device are connected and fixed, and baffle upper plate is electrically connected with semiconductor heat electric device upper end, chin spoiler is electrically connected with semiconductor heat electric device lower end, on, chin spoiler is processed into the water conservancy diversion fritter of some mutual insulatings, on some mutual insulatings, following water conservancy diversion fritter and P-type semiconductor thermoelectric element, N-type semiconductor thermoelectric element be electrically connected to form the in parallel of semiconductor heat electric device or series connection or string, combination in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620052056 CN200946897Y (en) | 2006-08-28 | 2006-08-28 | Residual heat recovering type water heater system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620052056 CN200946897Y (en) | 2006-08-28 | 2006-08-28 | Residual heat recovering type water heater system |
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| Publication Number | Publication Date |
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| CN200946897Y true CN200946897Y (en) | 2007-09-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620052056 Expired - Fee Related CN200946897Y (en) | 2006-08-28 | 2006-08-28 | Residual heat recovering type water heater system |
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| CN (1) | CN200946897Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106524105A (en) * | 2016-11-30 | 2017-03-22 | 刘文治 | Semiconductor module set type cyclic heating system |
| CN108489078A (en) * | 2018-03-26 | 2018-09-04 | 苏州蓝色弹珠智能科技有限公司 | Heating system |
-
2006
- 2006-08-28 CN CN 200620052056 patent/CN200946897Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106524105A (en) * | 2016-11-30 | 2017-03-22 | 刘文治 | Semiconductor module set type cyclic heating system |
| CN108489078A (en) * | 2018-03-26 | 2018-09-04 | 苏州蓝色弹珠智能科技有限公司 | Heating system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |