CN1996566A - A monitoring method for base plate carving and corrosion - Google Patents
A monitoring method for base plate carving and corrosion Download PDFInfo
- Publication number
- CN1996566A CN1996566A CNA2005101122628A CN200510112262A CN1996566A CN 1996566 A CN1996566 A CN 1996566A CN A2005101122628 A CNA2005101122628 A CN A2005101122628A CN 200510112262 A CN200510112262 A CN 200510112262A CN 1996566 A CN1996566 A CN 1996566A
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- Prior art keywords
- eps
- base plate
- substrate
- transducer
- corrosion
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Abstract
This invention discloses one baseboard etch monitor method, which sets one EPS sensor in relative position of baseboard side and sets at least one EPS sensor at other position of tee etch baseboard. This invention uses multiple EPS sensors to monitor baseboard etch situations to reflect baseboard current status to avoid different etch situations.
Description
Technical field
The present invention relates to a kind of method that base plate carving and corrosion is monitored.
Background technology
Use an EPS that the etching situation of substrate is monitored during the TFT-LCD etching, but EPS can only monitoring substrate in the etching situation among a small circle, progress along with the TFT-LCD manufacturing process, substrate area is increasing, film thickness distribution is restive in the substrate, and an interior among a small circle etching situation can't the interior etching situation of accurate response whole base plate.Prior art is only monitored interior among a small circle etching situation in the substrate with an EPS.When possible this interior among a small circle EPS detects, thereby other zone also has film not caused etching residual by complete etching in the substrate.
Summary of the invention
The purpose of this invention is to provide a kind of monitoring method, that can judge substrate more accurately can be according to circumstances.
The objective of the invention is to be achieved through the following technical solutions:
A kind of monitoring method for base plate carving and corrosion, it is provided with an EPS transducer in the position corresponding with a side of the substrate that is etched, and with the corresponding position of another side of substrate that is etched at least one EPS transducer is being set.
Wherein, respectively this EPS transducer is arranged on the oscillation center of its substrate regions of monitoring.And respectively this EPS transducer is located on the position in the outside of pattern of the substrate that is etched.
When the minimum value in the signal value that each EPS transducer obtains during, think that then base plate carving and corrosion finishes more than or equal to threshold value.
Positive progressive effect of the present invention is: utilize a plurality of EPS transducers that the etching situation of substrate is monitored, can reflect the state that substrate is current more accurately, avoid occurring the incomplete situation of etching.
Description of drawings
Fig. 1 is the schematic diagram of one embodiment of the invention.
Embodiment
Provide preferred embodiment of the present invention below in conjunction with accompanying drawing, to describe technical scheme of the present invention in detail.
A kind of monitoring method for base plate carving and corrosion, it is provided with one the one EPS transducer 2 in the position corresponding with a side of the substrate 1 that is etched, and with the corresponding position of substrate 1 another side that is etched one the 2nd EPS transducer 3 is being set.A plurality of EPS transducers 2 and the 2nd EPS transducer 3 also can be set.The one EPS transducer is identical device with the 2nd EPS transducer.
Wherein, respectively this EPS transducer is arranged on the oscillation center of its substrate regions of monitoring (as shown in phantom in Figure 1).And respectively this EPS transducer is located on the position in the outside of pattern (shown in chain-dotted line among Fig. 1) of the substrate that is etched.
When the minimum value in the signal value that each EPS transducer obtains during, think that then base plate carving and corrosion finishes more than or equal to threshold value.
Claims (4)
1, a kind of monitoring method for base plate carving and corrosion, it is provided with an EPS transducer in the position corresponding with a side of the substrate that is etched, and it is characterized in that, with the corresponding position of another side of substrate that is etched at least one EPS transducer is being set.
2, monitoring method for base plate carving and corrosion according to claim 1 is characterized in that, respectively this EPS transducer is arranged on the oscillation center of its substrate regions of monitoring.
3, monitoring method for base plate carving and corrosion according to claim 2 is characterized in that, respectively this EPS transducer is located on the position in the outside of pattern of the substrate that is etched.
4, monitoring method for base plate carving and corrosion according to claim 3 is characterized in that, when the minimum value in the signal value that each EPS transducer obtains during more than or equal to threshold value, thinks that then base plate carving and corrosion finishes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNA2005101122628A CN1996566A (en) | 2005-12-28 | 2005-12-28 | A monitoring method for base plate carving and corrosion |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNA2005101122628A CN1996566A (en) | 2005-12-28 | 2005-12-28 | A monitoring method for base plate carving and corrosion |
Publications (1)
Publication Number | Publication Date |
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CN1996566A true CN1996566A (en) | 2007-07-11 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNA2005101122628A Pending CN1996566A (en) | 2005-12-28 | 2005-12-28 | A monitoring method for base plate carving and corrosion |
Country Status (1)
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CN (1) | CN1996566A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101562121B (en) * | 2008-04-17 | 2010-08-18 | 上海华虹Nec电子有限公司 | Method for monitoring end point of small opening density structure by dry etching |
CN105914172A (en) * | 2016-06-15 | 2016-08-31 | 苏州众显电子科技有限公司 | Substrate etching monitoring method |
-
2005
- 2005-12-28 CN CNA2005101122628A patent/CN1996566A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101562121B (en) * | 2008-04-17 | 2010-08-18 | 上海华虹Nec电子有限公司 | Method for monitoring end point of small opening density structure by dry etching |
CN105914172A (en) * | 2016-06-15 | 2016-08-31 | 苏州众显电子科技有限公司 | Substrate etching monitoring method |
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