CN1995459A - Solution for removing printing board surface adhesion palladium and removing method - Google Patents
Solution for removing printing board surface adhesion palladium and removing method Download PDFInfo
- Publication number
- CN1995459A CN1995459A CN 200610097973 CN200610097973A CN1995459A CN 1995459 A CN1995459 A CN 1995459A CN 200610097973 CN200610097973 CN 200610097973 CN 200610097973 A CN200610097973 A CN 200610097973A CN 1995459 A CN1995459 A CN 1995459A
- Authority
- CN
- China
- Prior art keywords
- solution
- palladium
- board surface
- surface adhesion
- printing board
- Prior art date
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Links
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title claims abstract description 142
- 229910052763 palladium Inorganic materials 0.000 title claims abstract description 73
- 238000007639 printing Methods 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 title claims description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 39
- 239000002184 metal Substances 0.000 claims abstract description 39
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052802 copper Inorganic materials 0.000 claims abstract description 21
- 239000010949 copper Substances 0.000 claims abstract description 21
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 9
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910017604 nitric acid Inorganic materials 0.000 claims abstract description 8
- 239000003054 catalyst Substances 0.000 claims abstract description 7
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 claims abstract description 6
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims abstract description 6
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 claims abstract description 6
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 claims abstract description 3
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 claims abstract description 3
- 238000005507 spraying Methods 0.000 claims abstract description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 12
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 claims description 10
- -1 nitrogenous organic compound Chemical class 0.000 claims description 6
- 239000004202 carbamide Substances 0.000 claims description 5
- 229910000042 hydrogen bromide Inorganic materials 0.000 claims description 5
- 229940071870 hydroiodic acid Drugs 0.000 claims description 5
- VTLYFUHAOXGGBS-UHFFFAOYSA-N Fe3+ Chemical compound [Fe+3] VTLYFUHAOXGGBS-UHFFFAOYSA-N 0.000 claims description 4
- 229910001447 ferric ion Inorganic materials 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims description 4
- AVWRKZWQTYIKIY-UHFFFAOYSA-N urea-1-carboxylic acid Chemical compound NC(=O)NC(O)=O AVWRKZWQTYIKIY-UHFFFAOYSA-N 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 241000282326 Felis catus Species 0.000 claims description 3
- MGJKQDOBUOMPEZ-UHFFFAOYSA-N N,N'-dimethylurea Chemical compound CNC(=O)NC MGJKQDOBUOMPEZ-UHFFFAOYSA-N 0.000 claims description 3
- OHJMTUPIZMNBFR-UHFFFAOYSA-N biuret Chemical compound NC(=O)NC(N)=O OHJMTUPIZMNBFR-UHFFFAOYSA-N 0.000 claims description 3
- 150000002357 guanidines Chemical class 0.000 claims description 3
- 229940083094 guanine derivative acting on arteriolar smooth muscle Drugs 0.000 claims description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract 2
- BMYNFMYTOJXKLE-UHFFFAOYSA-N 3-azaniumyl-2-hydroxypropanoate Chemical compound NCC(O)C(O)=O BMYNFMYTOJXKLE-UHFFFAOYSA-N 0.000 abstract 1
- 241001597008 Nomeidae Species 0.000 abstract 1
- KCLANYCVBBTKTO-UHFFFAOYSA-N Proparacaine Chemical compound CCCOC1=CC=C(C(=O)OCCN(CC)CC)C=C1N KCLANYCVBBTKTO-UHFFFAOYSA-N 0.000 abstract 1
- 229940087458 alcaine Drugs 0.000 abstract 1
- 229940059741 aqua care Drugs 0.000 abstract 1
- 239000000411 inducer Substances 0.000 abstract 1
- 229910052757 nitrogen Inorganic materials 0.000 abstract 1
- 150000002894 organic compounds Chemical class 0.000 abstract 1
- 239000003755 preservative agent Substances 0.000 abstract 1
- 230000002335 preservative effect Effects 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 32
- 239000004020 conductor Substances 0.000 description 18
- 239000000203 mixture Substances 0.000 description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 150000002940 palladium Chemical class 0.000 description 6
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 230000004913 activation Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 150000002460 imidazoles Chemical class 0.000 description 3
- 150000002475 indoles Chemical class 0.000 description 3
- 150000003233 pyrroles Chemical class 0.000 description 3
- KDCGOANMDULRCW-UHFFFAOYSA-N 7H-purine Chemical compound N1=CNC2=NC=NC2=C1 KDCGOANMDULRCW-UHFFFAOYSA-N 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- LPAGFVYQRIESJQ-UHFFFAOYSA-N indoline Chemical class C1=CC=C2NCCC2=C1 LPAGFVYQRIESJQ-UHFFFAOYSA-N 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 150000003217 pyrazoles Chemical class 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- OXHNLMTVIGZXSG-UHFFFAOYSA-N 1-Methylpyrrole Chemical compound CN1C=CC=C1 OXHNLMTVIGZXSG-UHFFFAOYSA-N 0.000 description 1
- OUYLXVQKVBXUGW-UHFFFAOYSA-N 2,3-dimethyl-1h-pyrrole Chemical compound CC=1C=CNC=1C OUYLXVQKVBXUGW-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 238000003321 atomic absorption spectrophotometry Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 230000002328 demineralizing effect Effects 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 150000004885 piperazines Chemical class 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 150000003212 purines Chemical class 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 150000003222 pyridines Chemical class 0.000 description 1
- 150000003248 quinolines Chemical class 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 231100000167 toxic agent Toxicity 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
- 229910021654 trace metal Inorganic materials 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a removing liquid of metal palladium in the printing circuit manufacturing course, which comprises the following parts: 65% nitric acid with density at 1-100g/L, 36% alcaine or hydrobromic acid or hydriodic acid with density at 10-300g/L, organic compound with nitrogen as copper preservative with density at 0.01-10g/L and aquacare or inducer or guanidine derivant as control agent of NO2. The printing circuit board is placed in the solution, which removes catalyst palladium on the insulating surface through spraying the circuit.
Description
Technical field
The present invention relates to removing solution and removing method of a kind of printing board surface adhesion palladium, it after substrate surface forms the metallic conductor loop, removes the chemical plating catalyst palladium metal that residues in surface of insulating layer at making in the production process at printed circuit board.
Background technology
In the manufacturing processed of printed circuit board; its manufacturing process is roughening treatment (surface is coordinated concavo-convex), activation treatment (adhesion metal palladium catalyst), electroless copper and the electro-coppering of substrate; then cover the part that forms conductor circuit with etching protective film; after remaining part is removed by etching; remove etching protective film, form conductor circuit.At idioelectric surface of insulating layer, the reaction of activating process is as follows, separates out in idioelectric surface of insulating layer palladium metal thus.
Sn
2++Pd
2+→Sn
4++Pd
By the palladium metal of surface of insulating layer, come that catalytic chemistry is copper-plated separates out, after electroless copper, electro-coppering and the etch processes, form circuitous pattern at substrate surface.The surface of insulating layer that is exposing, the residual of palladium catalyst will be arranged, because the existence of kish palladium, to become the activation source of next step chemical nickel plating, make and cause short circuit between the copper conductor loop, in addition, because the existence of trace metal palladium between the circuit, can cause the specific inductivity of substrate to reduce, influence the transmission speed of signal.
In order to remove the palladium metal that is attached to surface of insulating layer, the clear 63-72198 of Japanese Patent Te Open has proposed to remove palladium metal with fluoroboric acid-sodium-chlor mixing solutions, the flat 7-207466 of Te Open has proposed to remove palladium metal with cyanide solution in addition, but the removal solution of above-mentioned these residual palladiums, shortcoming with corroding metal conductor circuit, and contain deleterious prussiate, the flat 8-186351 of Japanese Patent Te Open has proposed to have proposed with the flat 11-135918 of method Te Open of oxide treatment the method for usefulness laser radiation in addition, remove the kish palladium of surface of insulating layer, but this method there is damage to dielectric laminated substrate.
Summary of the invention
The objective of the invention is to overcome the problem of above-mentioned technical existence, provide a kind of and can remove palladium metal rapidly, and do not destroy solution and the method that constitutes the loop metallic copper.
This solution is the mixing solutions that contains nitric acid and hydrochloric acid, in order to remove printed circuit board surface metal palladium, pending printed circuit board can be positioned in this solution of removing palladium metal or with this solution to the printed circuit board processing of spraying, reach the catalyst metal palladium of removing residual surface of insulating layer, the insulativity between conductor circuit is improved.
The solution of removal palladium of the present invention is made of following material, 65% nitric acid, 1～100g/L; 10～300g/L such as 36% hydrochloric acid, 48% Hydrogen bromide or 57% hydroiodic acid HI; The metallic copper anticorrosive agent is that nitrogenous organic compound, polyvalent alcohol and nonionogenic tenside thereof or one or more mixing in the cats product are used, and its concentration range is at 0.01～10g/L.
For the nitric acid in this palladium metal removal solution, optimum concentration range is the concentration of 10～80g/L.
The hydrochloric acid that the present invention uses not only has the synergy with nitric acid, reinforcement is removed the kish palladium, and the palladium ion that prevents to dissolve removal simultaneously in addition is attached to the surface of substrate again, outside the demineralizing acid, can also use Hydrogen bromide and hydroiodic acid HI etc., optimum concentration range is 50～200g/L.
Anticorrosive metal agent used in the present invention mainly is at copper, and wherein as nitrogenous class organic compound, the compound that can select for use is as follows, pyrroles, 1-methylpyrrole, dimethyl pyrrole and pyrroles's derivative; The derivative of indoles and indoles; The derivative of dihydroindole and dihydroindole; The derivative of pyridine and pyridine; The derivative of quinoline and quinoline; The derivative of piperazine and piperazine; The derivative of purine and purine; The derivative of pyrazoles and pyrazoles; The derivative of imidazoles and imidazoles etc.; For polyvalent alcohol, the compound that can select for use has, ethylene glycol, polyoxyethylene glycol, propylene glycol, polypropylene glycol and glycerine etc.For nonionogenic tenside, can use polyethylene oxide etc., can select amine salt class tensio-active agent for use for cats product.More than cited anticorrosive metal agent, can select for use a kind of, also can be two or more mixing use, its concentration range is suitably adjusted use in 0.01～10g/L concentration range.
Remove in the solution in this palladium metal, in order to quicken the dissolving to palladium metal, can add ferric ion, ferric ion can be selected iron trichloride for use, and its effective concentration scope is 0.01～10g/L, and optimum concentration range is the concentration of 0.1～10g/L.
Remove in the solution in palladium metal of the present invention, also can add NO
2Gas is emitted control agent, in order to reach control NO
2The purpose that gas is emitted can be used urea or its inductor or guanidine derivatives, and operable have urea, dimethyl urea, allophanic acid, biuret, guanidines etc., the working concentration of these compounds are 0.1～30g/L for well, and optimum concentration range is 1～10g/L.
Advantage of the present invention is: owing to do not contain the strong objectionable impurities of environment in this palladium metal removal liquid; so this solution does not pollute the environment; remove in the liquid in this palladium metal in addition; owing to added the anticorrosive agent of metallic copper; so copper metallic conductor loop has obtained good protection; this palladium metal is removed also wounded substrate not of liquid simultaneously, has guaranteed the reliability of printed circuit board.
Embodiment
Followingly according to embodiment effect of the present invention is described, the present invention is not limited only to following embodiment, also can remove solution to palladium metal according to above-mentioned explanation and carry out suitable adjustment.
Embodiment 1
After at first printed circuit board (FR-4) being carried out roughening treatment, carry out degreasing and washing, after further being dipped in tin/palladium colloid (U.S. shiply company) activation 5 minutes (45 ℃), removed photoresist under 40 ℃ the condition 3 minutes, remove solution by the palladium of embodiment in the table 11 and remove the palladium processing.For the residual palladium that remains in the printed circuit board surface is estimated, to remove in the solution in the wang aqueous solution that before and after treatment epoxy resin base plate is dipped in 50 ℃ 3 minutes in palladium metal respectively, before residual palladium is removed and after content analyze by atomic absorption spectrophotometry.Remove with palladium metal that the palladium concentration on epoxy resin base plate surface is 9.8mg/dm before the solution-treated
2, remove solution-treated with palladium metal after, the palladium content in the wang aqueous solution is lower than minimum detectable level, does not detect the existence of palladium, so can think that this palladium metal removes the palladium metal that solution will pay fully and remove.Simultaneously through observe remove solution-treated with palladium metal after, the conductor circuit of metallic copper not have to be corroded and the phenomenon that opens circuit and narrow down with wire loop.
Embodiment 2
Working method such as embodiment 1, palladium metal is removed the composition such as the table 1 of solution, and it is as shown in table 2 that printed wiring is handled forward and backward residual palladium result and copper conductor loop state.
Embodiment 3
Working method such as embodiment 1, palladium metal is removed the composition such as the table 1 of solution, and it is as shown in table 2 that printed wiring is handled forward and backward residual palladium result and copper conductor loop state.
Embodiment 4
Working method such as embodiment 1, palladium metal is removed the composition such as the table 1 of solution, and it is as shown in table 2 that printed wiring is handled forward and backward residual palladium result and copper conductor loop state.
Embodiment 5
Working method such as embodiment 1, palladium metal is removed the composition such as the table 1 of solution, and it is as shown in table 2 that printed wiring is handled forward and backward residual palladium result and copper conductor loop state.
Embodiment 6
Working method such as embodiment 1, palladium metal is removed the composition such as the table 1 of solution, and it is as shown in table 2 that printed wiring is handled forward and backward residual palladium result and copper conductor loop state.
Embodiment 7
Working method such as embodiment 1, palladium metal is removed the composition such as the table 1 of solution, and it is as shown in table 2 that printed wiring is handled forward and backward residual palladium result and copper conductor loop state.
Embodiment 8
Working method such as embodiment 1, palladium metal is removed the composition such as the table 1 of solution, and it is as shown in table 2 that printed wiring is handled forward and backward residual palladium result and copper conductor loop state.
The invention effect
The present invention is the removal solution that is related to printed circuit board remained on surface palladium catalyst, compare with technology in the past, show good removal effect, because copper conductor loop and insulating resin are not encroached on, and the toxic substance that does not contain contaminate environment, so guaranteed the insulativity between printed circuit board metallic copper conductor circuit, significant on the industrial production of printed circuit board.
Table 1 palladium metal is removed the composition of solution
| Reagent name | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 | Embodiment 7 | Embodiment 8 |
| Hydrochloric acid (g/L) | 100 | 150 | 150 | 100 | 100 | 100 |
| Hydrogen bromide (g/L) | 80 | |||||||
| Hydroiodic acid HI (g/L) | 50 | |||||||
| Nitric acid (g/L) | 25 | 25 | 25 | 30 | 30 | 25 | 25 | 25 |
| FeCl 3(g/L) | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Polyoxyethylene glycol (molecular weight 6000) (g/L) | 5 | 5 | 5 | 5 | 5 | 2 | 0.5 | |
| Pyrroles (g/L) | 1 | 2 | ||||||
| Indoles (g/L) | 1 | |||||||
| Imidazoles (g/L) | 1 | 1 | ||||||
| Urea (g/L) | 5 | 5 | 5 | |||||
| Biuret (g/L) | 3 | 1 | ||||||
| Guanidine (g/L) | 2 | 2 | ||||||
| Dimethyl urea (g/L) | 5 |
The residual result of table 2 embodiment solution-treated printed circuit board surface palladium
| Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 | Embodiment 7 | Embodiment 8 | |
| Palladium concentration mg/dm before handling 2 | 9.8 | 9.1 | 9.3 | 9.9 | 10.5 | 9.4 | 9.6 | 9.1 |
| Handle back palladium concentration | Do not detect | Do not detect | Do not detect | Do not detect | Do not detect | Do not detect | Do not detect | Do not detect |
| Copper conductor loop after processed) | Well | Well | Well | Well | Well | Well | Well | Well |
Claims (8)
- Printing board surface adhesion palladium remove solution, it is characterized in that constituting: nitric acid 1～100g/L of 65%, 36% hydrochloric acid or Hydrogen bromide or hydroiodic acid HI 10～300g/L by following material; The metallic copper anticorrosive agent is that nitrogenous organic compound, polyvalent alcohol and nonionogenic tenside thereof or one or more mixing in the cats product are used, and its concentration range is at 0.01～10g/L.
- Printing board surface adhesion palladium according to claim 1 remove solution, it is characterized in that adding ferric ion, its concentration range is 0.01～10g/L.
- Printing board surface adhesion palladium according to claim 1 remove solution, it is characterized in that adopting urea or its inductor or guanidine derivatives as for NO 2Gas is emitted control agent, and its concentration range is 0.1～30g/L.
- Printing board surface adhesion palladium according to claim 1 remove solution, it is characterized in that described concentration of nitric acid scope is 10～80g/L.
- Printing board surface adhesion palladium according to claim 1 remove solution, it is characterized in that described hydrochloric acid, Hydrogen bromide and hydroiodic acid HI concentration range are 50～200g/L.
- Printing board surface adhesion palladium according to claim 2 remove solution, it is characterized in that adding ferric ion is iron trichloride, concentration range is 0.1～10g/L.
- Printing board surface adhesion palladium according to claim 3 remove solution, it is characterized in that described NO 2Gas is emitted control agent urea, dimethyl urea, allophanic acid, biuret, guanidine, and its concentration range is 1～10g/L.
- 8. based on the method for removing of removing solution of the described printing board surface adhesion palladium of claim 1, it is characterized in that pending printed circuit board is positioned in the described solution of removing palladium metal or with this solution to the printed circuit board processing of spraying, remove the catalyst metal palladium of residual surface of insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100979737A CN100543187C (en) | 2006-11-24 | 2006-11-24 | The removing solution and remove method of printing board surface adhesion palladium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100979737A CN100543187C (en) | 2006-11-24 | 2006-11-24 | The removing solution and remove method of printing board surface adhesion palladium |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1995459A true CN1995459A (en) | 2007-07-11 |
| CN100543187C CN100543187C (en) | 2009-09-23 |
Family
ID=38250660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100979737A Expired - Fee Related CN100543187C (en) | 2006-11-24 | 2006-11-24 | The removing solution and remove method of printing board surface adhesion palladium |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100543187C (en) |
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| CN102191501A (en) * | 2010-03-10 | 2011-09-21 | 比亚迪股份有限公司 | Palladium remover and preparation method thereof, and plastic surface activation method |
| CN102392232A (en) * | 2011-10-28 | 2012-03-28 | 深南电路有限公司 | Method for removing activating agents on nonmetal surfaces, electroless nickel/immersion gold method and electroless nickel/electroless palladium/immersion gold method |
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| CN108588719A (en) * | 2015-10-19 | 2018-09-28 | 江苏理工学院 | Deplating liquid for deplating copper-based palladium-nickel alloy plating layer |
| CN113957442A (en) * | 2021-02-01 | 2022-01-21 | 江苏悦锌达新材料有限公司 | Nickel removing liquid medicine for nickel electroplating anti-corrosion layer, preparation method and chemical nickel removing process |
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- 2006-11-24 CN CNB2006100979737A patent/CN100543187C/en not_active Expired - Fee Related
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