CN1988762A - Control method and its structure for base plate through hole residual section effect - Google Patents
Control method and its structure for base plate through hole residual section effect Download PDFInfo
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- CN1988762A CN1988762A CN 200510135328 CN200510135328A CN1988762A CN 1988762 A CN1988762 A CN 1988762A CN 200510135328 CN200510135328 CN 200510135328 CN 200510135328 A CN200510135328 A CN 200510135328A CN 1988762 A CN1988762 A CN 1988762A
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Abstract
The invention discloses an inhibition method for substrate via residual effect and its structure, applying to the substrate with via and electric connection with the first and second wire. The invention mainly uses the change of local line width that the first and second wire connects the via, to change the impedance value of them matching that of the Via residual, reduce the mismatch effect of via residual impedance, achieve the impedance matching of frequency point, enhance the integrity of signals after transmitting through the first wire, via and the second wire. The invention uses the way of impedance matching to improve the signal transmission integrity, and avoid the residual capacitance, resistance and other negative effects without any additional costs and influence of available wiring space on substrate.
Description
Technical field
The invention relates to the inhibition technology of through hole stub effect, particularly about a kind of inhibition method and structure thereof of substrate through-hole stub effect.
Background technology
Along with the frequency range demand continue is grown up, the loss that the system of two-forty derived, reflect, crosstalk and problem such as deflection, influence the integrality in the signals transmission.Problems of Signal Integrity can reach that 3Gbps causes as top layer effect, electric intermediate value loss in the scope of 10Gbps, reflects, crosstalks at data rate, postpone poor serious problems such as (intra-pair skew) in intersymbol interference (Inter-Symbol Interference is called for short ISI) and the differential pair.
The complex environment that substrate is made up of many different elements has produced significant challenge to surpassing the above signal rate of 5Gbps at present.On the substrate each element all has its impedance variation separately, and in signal path, also has the through hole (Via) that surpasses more than 10, each through hole all has simultaneously and runs through (through) and stub (stub) composition, this has caused extra current potential impedance discontinuity and resonance limit, consequently the variation meeting highly significant of the information channel transfer function in this environment.When Nyquist (Nyquist) when frequency is lower than 2GHz, although information channel exists some differences, the phenomenon of through hole and impedance discontinuity (reflection) is not clearly.When 2GHz is above, according to the difference of signals layer (and through hole run through/the stub ratio), track lengths and electric intermediate value material, each information channel will present very big difference.Realize high data rate in the great environment of this information channel characteristic variations, it is very large challenge that high speed serialization is connected.
Please refer to Fig. 1, in multilayer board 1, generally use through hole (via) 10 and electrically connect the signal transmission wire 13,14 that is positioned at the unlike signal layer.In processing procedure now, through hole is to realize in the mode that runs through through hole (through via) mostly.Therefore, if the holding wire that connects is band line (holding wire is at an internal layer) structure, just will certainly on whole through hole, leave an open circuit stub (open stub) 15.Because this open circuit stub 15 has negative influence for the online signal quality of whole signal, just the open circuit stub of this through hole can allow the electrical coupling of integrated circuit, as resistance, unexpected variation takes place in the coupling of electric capacity and inductance, so all must be removed in processing procedure.
In the making of multilayer board 1, be with anti-(back drill) method of boring at present with the method that removes through hole open circuit stub.The method is from lower to upper, with drill bit this open circuit stub 15 is removed.But the anti-method of boring not only needs extra cost, more because the anti-hole that bores must influence the space that can connect up on the multilayer board 1 greater than the hole of script through hole 10.Moreover, this anti-processing procedure that bores also can prolong and produce the required time of multilayer board 1 and increase cost relatively.
Therefore, how to propose a kind of inhibition method and structure thereof of substrate through-hole stub effect, overcome the variety of issue that above-mentioned technology causes, in fact the problem of demanding urgently inquiring into for industry.
Summary of the invention
For solving the shortcoming of above-mentioned prior art, a purpose of the present invention is to provide a kind of inhibition method and structure thereof of substrate through-hole stub effect of the integrality that promotes the signal transmission.
Of the present invention time a purpose is to provide a kind of inhibition method and the structure thereof that can omit the substrate through-hole stub effect of extra boring process time and cost.
Another object of the present invention is to provide a kind of inhibition method and structure thereof of substrate through-hole stub effect, under the condition that does not influence available wiring space on the substrate, avoid the negative effects such as remaining electric capacity, resistance of through hole open circuit stub.
For taking off on reaching and other purpose, the invention provides a kind of inhibition method of substrate through-hole stub effect, be applied in have through hole (via) with in the substrate that electrically connects first lead and second lead, wherein, this inhibition method is by changing the width that this first lead and second lead are connected to the local line segment of this through hole, be matched with the resistance value of this through hole stub with the resistance value that changes this first lead and second lead itself, the impedance that reduces the through hole stub effect that do not match, realize the impedance matching of design frequency point, promote signal through this first lead, signal integrity after through hole and the transmission of second lead.
The invention described above provides in a kind of inhibition method of substrate through-hole stub effect, can utilize Smith's chart (Smith Chart) to adjust the impedance matching of this first lead and second lead and this through hole stub.In addition, described this through hole can be to run through through hole (Though Via), and this substrate is can be printed circuit board (PCB) (PCB) or silicon substrate (Silicon Substrate).
The present invention also provides a kind of inhibition structure of substrate through-hole stub effect, be applied in have through hole (via) with in the substrate that electrically connects first lead and second lead, this inhibition structure be this first lead and second lead be connected to this through hole locate to be provided with the different local line segment of a width, be matched with the resistance value of this through hole stub with the resistance value that changes this first lead and second lead itself, the impedance that reduces the through hole stub effect that do not match, realize the impedance matching of design frequency point, promote signal through this first lead, signal integrity after through hole and the transmission of second lead.
The inhibition method of the substrate through-hole stub effect that the present invention proposes and structure thereof are the integralities that promotes the signal transmission by the mode of impedance matching, need not increase extra cost of manufacture, and do not influence under the prerequisite of available wiring space on the substrate, avoid the remaining electric capacity of through hole open circuit stub, negative effects such as resistance.
Description of drawings
Fig. 1 is the electric connection schematic diagram of signal transmission wire and through hole or through hole stub;
Fig. 2 borrows to change the schematic diagram of signal transmission wire size with the impedance matching through hole;
Fig. 3 is Smith's chart (Smith Chart), between comparison signal transfer wire and through hole before and after the impedance matching variation schematic diagram of its reflection loss; And
Fig. 4 is a frequency response chart, between comparison signal transfer wire and through hole before and after the impedance matching, the variation schematic diagram of its reflection loss and insertion loss.
Embodiment
Embodiment
It is noted that accompanying drawing is the schematic diagram of simplification, basic structure of the present invention and method only are described in a schematic way.Therefore, only indicate the assembly relevant in this accompanying drawing with the present invention, and the assembly that shows is not, and number when implementing with reality, shape, dimension scale etc. are drawn, specification during its actual enforcement is real to be a kind of optionally design, and its assembly layout form may be more complicated, give earlier chat bright.
Fig. 2 is the reference view of the embodiment of the invention, the invention provides a kind of inhibition method of substrate through-hole stub effect, be applied in (via) 20 that have through hole with in the substrate 2 that electrically connects first lead 23 and second lead 24, this inhibition method mainly is by changing the local line segment 231 that this first lead 23 and second lead 24 are connected to this through hole 20,241 width, change the resistance value of this first lead 23 and second lead 24 itself, make it be matched with the resistance value of this through hole stub 25, the impedance that reduces through hole stub 25 effect that do not match, realize the impedance matching of design frequency point, promote signal through this first lead 23, signal integrity after through hole 20 and 24 transmission of second lead.
Provide in a kind of inhibition method of substrate through-hole stub effect in the invention described above, can utilize Smith's chart (Smith Chart) to adjust the impedance matching of this first lead and second lead and this through hole stub.In addition, above-mentioned this through hole is can be to run through through hole (Though Via), and this substrate is can be printed circuit board (PCB) (PCB), or is silicon substrate (Silicon Substrate).
The impedance matching structure of this embodiment is, be connected to first lead 23 of through hole 20, the width of second lead 24 by change, change the resistance value of this first lead 23, second lead 24 itself, to mate the resistance value that through hole 20 or through hole stub 25 are had, the impedance that reduces through hole 20 or through hole stub 25 effect that do not match realizes the impedance matching of design frequency point.
As shown in Figure 2, under the remaining impedance of not considering through hole stub 25, corresponding to former the design's resistance value, the design load of lead 23 outer live widths is 7mils (during an one thousandth), and its internal layer live width then is 5mils.But when the impedance of considering through hole stub 25 is remaining, borrow the estimation of impedance matching, push away the width of local line segment 231,241 of each long 250mils of these through hole two ends, become 3.5mils by script 5mil change, can realize the impedance matching of design frequency point 3GHz.
Fig. 3 is Smith Chart, shown in it be 20 of signal transmission wire first lead 23, second lead 24 and through holes before and after impedance matching, the variation schematic diagram of its reflection loss.As shown in this embodiment, when the impedance matching point fixes on 3GHz, borrow Smith's chart (Smith Chart) to adjust first lead 23, second lead 24 and the impedance matching of the through hole stub 25 that is electrically connected to each other with it, the length and the width that have obtained mating local line segment 231,241 are respectively 250mils and 3.5mils.
Fig. 4 is a frequency response chart, and shown is after first lead 23, second lead 24 have passed through impedance matching with through hole stub 25, at design frequency point 3GHz place, no matter be that S11 (reflection loss) or S21 (insertion loss) are significantly improved.Especially it is the reflection loss S11 after impedance matching, and it has significantly reduced 30dB especially with respect to the value without impedance matching.This result represents that in the shown method, the signal transmission with regard to characteristic frequency 3GHz can effectively improve its signal integrity really.Also therefore can exempt the anti-brill processing procedure that prior art adopts.
Compared with prior art, the inhibition method of the substrate through-hole stub effect of the present invention's proposition reaches Its structure promotes the integrality that signal transmits by the mode of impedance matching, need not increase additionally Cost of manufacture, and do not affect under the prerequisite of available wiring space on the substrate, can avoid through hole The remaining electric capacity of open circuit stub, the negative effects such as resistance have solved the problem that prior art exists.
Claims (10)
1. the inhibition method of a substrate through-hole stub effect, be applied in and have through hole with in the substrate that electrically connects first lead and second lead, it is characterized in that: this inhibition method is by changing the width that this first lead and second lead are connected to the local line segment of this through hole, be matched with the resistance value of this through hole stub with the resistance value that changes this first lead and second lead itself, eliminate the remaining impedance of through hole stub, realize the impedance matching of design frequency point, promote the signal integrity after signal transmits through this first lead, through hole and second lead.
2. the inhibition method of substrate through-hole stub effect as claimed in claim 1 is characterized in that, this inhibition method is to utilize Smith's chart to adjust the impedance matching of this first lead and second lead and this through hole stub.
3. the inhibition method of substrate through-hole stub effect as claimed in claim 1 is characterized in that this through hole is to run through through hole.
4. the inhibition method of substrate through-hole stub effect as claimed in claim 1 is characterized in that this substrate is a printed circuit board (PCB).
5. the inhibition method of substrate through-hole stub effect as claimed in claim 1 is characterized in that this substrate is a silicon substrate.
6. the inhibition structure of a substrate through-hole stub effect, be applied in and have through hole with in the substrate that electrically connects first lead and second lead, it is characterized in that: be connected to this through hole at this first lead and second lead and be provided with the different local line segment of a width, be matched with the resistance value of this through hole stub with the resistance value that changes this first lead and second lead itself, eliminate the remaining impedance of through hole stub, realize the impedance matching of design frequency point, promote the signal integrity after signal transmits through this first lead, through hole and second lead.
7. the inhibition structure of substrate through-hole stub effect as claimed in claim 6 is characterized in that, this through hole is for running through through hole.
8. the inhibition structure of substrate through-hole stub effect as claimed in claim 6 is characterized in that this substrate is a printed circuit board (PCB).
9. the inhibition structure of substrate through-hole stub effect as claimed in claim 6 is characterized in that this substrate is a silicon substrate.
10. the inhibition structure of substrate through-hole stub effect as claimed in claim 6 is characterized in that, the width of this part line segment is adjusted according to Smith's chart.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510135328 CN1988762A (en) | 2005-12-20 | 2005-12-20 | Control method and its structure for base plate through hole residual section effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510135328 CN1988762A (en) | 2005-12-20 | 2005-12-20 | Control method and its structure for base plate through hole residual section effect |
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| Publication Number | Publication Date |
|---|---|
| CN1988762A true CN1988762A (en) | 2007-06-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200510135328 Pending CN1988762A (en) | 2005-12-20 | 2005-12-20 | Control method and its structure for base plate through hole residual section effect |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103731990A (en) * | 2013-12-20 | 2014-04-16 | 龙芯中科技术有限公司 | Impedance matching method and device of transmission line with via hole |
-
2005
- 2005-12-20 CN CN 200510135328 patent/CN1988762A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103731990A (en) * | 2013-12-20 | 2014-04-16 | 龙芯中科技术有限公司 | Impedance matching method and device of transmission line with via hole |
| CN103731990B (en) * | 2013-12-20 | 2017-02-15 | 龙芯中科技术有限公司 | Impedance matching method and device of transmission line with via hole |
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Open date: 20070627 |