CN1968547A - Silicon microphone - Google Patents
Silicon microphone Download PDFInfo
- Publication number
- CN1968547A CN1968547A CN 200510114889 CN200510114889A CN1968547A CN 1968547 A CN1968547 A CN 1968547A CN 200510114889 CN200510114889 CN 200510114889 CN 200510114889 A CN200510114889 A CN 200510114889A CN 1968547 A CN1968547 A CN 1968547A
- Authority
- CN
- China
- Prior art keywords
- vibrating diaphragm
- backplane
- silicon
- polysilicon
- microphone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 82
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 82
- 239000010703 silicon Substances 0.000 title claims abstract description 82
- 230000004888 barrier function Effects 0.000 claims description 54
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 40
- 229920005591 polysilicon Polymers 0.000 claims description 39
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 24
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 24
- 239000002131 composite material Substances 0.000 claims description 22
- 239000012528 membrane Substances 0.000 claims description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 17
- 238000005260 corrosion Methods 0.000 claims description 17
- 230000007797 corrosion Effects 0.000 claims description 17
- 238000005530 etching Methods 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 10
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 9
- 229910052796 boron Inorganic materials 0.000 claims description 9
- 238000009413 insulation Methods 0.000 claims description 9
- 239000011574 phosphorus Substances 0.000 claims description 9
- 229910052698 phosphorus Inorganic materials 0.000 claims description 9
- 230000035945 sensitivity Effects 0.000 claims description 8
- 239000000377 silicon dioxide Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 230000003071 parasitic effect Effects 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims description 3
- 239000000725 suspension Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Images
Landscapes
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
Description
Claims (13)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2005101148897A CN1968547B (en) | 2005-11-18 | 2005-11-18 | Silicon microphone |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2005101148897A CN1968547B (en) | 2005-11-18 | 2005-11-18 | Silicon microphone |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1968547A true CN1968547A (en) | 2007-05-23 |
CN1968547B CN1968547B (en) | 2011-12-28 |
Family
ID=38077018
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005101148897A Active CN1968547B (en) | 2005-11-18 | 2005-11-18 | Silicon microphone |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1968547B (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101472212B (en) * | 2007-12-24 | 2012-10-10 | 北京大学 | Post-CMOS capacitance silicon-based micro-microphone and preparation method thereof |
CN101321408B (en) * | 2007-06-06 | 2012-12-12 | 歌尔声学股份有限公司 | Internal rotation beam diaphragm and microphone chip composed by the same |
CN101321407B (en) * | 2007-06-06 | 2012-12-26 | 歌尔声学股份有限公司 | Girder-type diaphragm and microphone chip composed by the same |
CN103347809A (en) * | 2011-02-03 | 2013-10-09 | 尼瓦洛克斯-法尔股份有限公司 | Method for producing complex smooth micromechanical part |
CN106412782A (en) * | 2016-11-22 | 2017-02-15 | 苏州敏芯微电子技术股份有限公司 | Micro silicon microphone and manufacturing method thereof |
CN108632731A (en) * | 2017-03-16 | 2018-10-09 | 中芯国际集成电路制造(上海)有限公司 | The forming method and MEMS microphone of MEMS microphone |
CN109261477A (en) * | 2018-10-23 | 2019-01-25 | 浙江大学 | A kind of micro electronmechanical piezoelectric supersonic wave transducer with etched hole and sectional type top electrode |
CN111246355A (en) * | 2020-03-30 | 2020-06-05 | 中芯集成电路制造(绍兴)有限公司 | MEMS device and method of forming a MEMS device |
CN112235697A (en) * | 2020-10-13 | 2021-01-15 | 歌尔微电子有限公司 | Sensitive membrane, MEMS microphone and manufacturing method thereof |
CN113494908A (en) * | 2020-03-19 | 2021-10-12 | 华为技术有限公司 | MEMS inertial sensor, inertial measurement unit and inertial navigation system |
CN114858215A (en) * | 2022-05-05 | 2022-08-05 | 中国科学院微电子研究所 | Multi-sensor combined structure, processing method thereof and combined sensor |
WO2023045827A1 (en) * | 2021-09-22 | 2023-03-30 | 通用微(深圳)科技有限公司 | Electrical structure, electronic cigarette switch, and electronic cigarette |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2935691Y (en) * | 2006-05-22 | 2007-08-15 | 潍坊歌尔电子有限公司 | Silicon microphone |
-
2005
- 2005-11-18 CN CN2005101148897A patent/CN1968547B/en active Active
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101321408B (en) * | 2007-06-06 | 2012-12-12 | 歌尔声学股份有限公司 | Internal rotation beam diaphragm and microphone chip composed by the same |
CN101321407B (en) * | 2007-06-06 | 2012-12-26 | 歌尔声学股份有限公司 | Girder-type diaphragm and microphone chip composed by the same |
CN101472212B (en) * | 2007-12-24 | 2012-10-10 | 北京大学 | Post-CMOS capacitance silicon-based micro-microphone and preparation method thereof |
CN103347809A (en) * | 2011-02-03 | 2013-10-09 | 尼瓦洛克斯-法尔股份有限公司 | Method for producing complex smooth micromechanical part |
CN103347809B (en) * | 2011-02-03 | 2015-11-25 | 尼瓦洛克斯-法尔股份有限公司 | For the production of the method for the smooth micromechanical parts of complexity |
CN106412782A (en) * | 2016-11-22 | 2017-02-15 | 苏州敏芯微电子技术股份有限公司 | Micro silicon microphone and manufacturing method thereof |
WO2018094963A1 (en) * | 2016-11-22 | 2018-05-31 | 苏州敏芯微电子技术股份有限公司 | Micro-silicon microphone and manufacturing method thereof |
CN108632731B (en) * | 2017-03-16 | 2020-06-30 | 中芯国际集成电路制造(上海)有限公司 | MEMS microphone forming method and MEMS microphone |
CN108632731A (en) * | 2017-03-16 | 2018-10-09 | 中芯国际集成电路制造(上海)有限公司 | The forming method and MEMS microphone of MEMS microphone |
CN109261477A (en) * | 2018-10-23 | 2019-01-25 | 浙江大学 | A kind of micro electronmechanical piezoelectric supersonic wave transducer with etched hole and sectional type top electrode |
CN113494908A (en) * | 2020-03-19 | 2021-10-12 | 华为技术有限公司 | MEMS inertial sensor, inertial measurement unit and inertial navigation system |
CN111246355A (en) * | 2020-03-30 | 2020-06-05 | 中芯集成电路制造(绍兴)有限公司 | MEMS device and method of forming a MEMS device |
CN111246355B (en) * | 2020-03-30 | 2021-05-25 | 中芯集成电路制造(绍兴)有限公司 | MEMS device and method of forming a MEMS device |
CN112235697A (en) * | 2020-10-13 | 2021-01-15 | 歌尔微电子有限公司 | Sensitive membrane, MEMS microphone and manufacturing method thereof |
CN112235697B (en) * | 2020-10-13 | 2022-01-14 | 歌尔微电子有限公司 | Sensitive membrane, MEMS microphone and manufacturing method thereof |
WO2023045827A1 (en) * | 2021-09-22 | 2023-03-30 | 通用微(深圳)科技有限公司 | Electrical structure, electronic cigarette switch, and electronic cigarette |
CN114858215A (en) * | 2022-05-05 | 2022-08-05 | 中国科学院微电子研究所 | Multi-sensor combined structure, processing method thereof and combined sensor |
CN114858215B (en) * | 2022-05-05 | 2024-02-13 | 中国科学院微电子研究所 | Multi-sensor combination structure, processing method thereof and combined sensor |
Also Published As
Publication number | Publication date |
---|---|
CN1968547B (en) | 2011-12-28 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20071109 Address after: Dongfang Road head, hi tech Development Zone, Shandong, Weifang Applicant after: GOERTEK Inc. Address before: Pioneer Building, hi tech Zone, Shandong, Qingdao 605 Applicant before: Qingdao Goertek Electronics Co.,Ltd. |
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C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: GOERTEK Inc. Address before: 261031 Weifang Shandong high tech Zone East North Road head Patentee before: GOERTEK Inc. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200616 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |