CN1967830A - Mounting structure and method of electronic component - Google Patents
Mounting structure and method of electronic component Download PDFInfo
- Publication number
- CN1967830A CN1967830A CN 200610146402 CN200610146402A CN1967830A CN 1967830 A CN1967830 A CN 1967830A CN 200610146402 CN200610146402 CN 200610146402 CN 200610146402 A CN200610146402 A CN 200610146402A CN 1967830 A CN1967830 A CN 1967830A
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- electronic unit
- epithelium
- substrate
- substrate filler
- installation constitution
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
- H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/921—Connecting a surface with connectors of different types
- H01L2224/9212—Sequential connecting processes
- H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
- H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The present invention provides a mounting structure and method of electronic component with high processing rate and productivity rate, wherein no air bubble (interspace) exists in substrate bulking agents. In the mounting structure of electronic component in accordance with the present invention where it is not necessary to provide penetrating holes used for suction in an insulating substrate 1 which has been provided with a plurality of terminals, then the miniaturization of a insulating substrate 1 is capable of being realized due to the disappearing of dead-zone arising from an opening process and penetrating holes. The insulating derms 3 comprises a first derm removing part 4 set at a condition where terminals 2 are avoided, and a second derm removing part 5 which is connected to the first derm removing part and extends toward the periphery of the noumenon part 7a of said electronic components 7. Then substrate bulking agent 8 provided between the insulating substrate and said electronic components is in liquid phase, where air existing in the first derm removing part is extruded toward the side of the second derm removing part. Therefore, substrate bulking agent with no air bubble (interspace) is obtained.
Description
Technical field
The present invention relates to be suitable for various electric equipments or electronic circuit cell etc. electronic unit installation constitution with and installation method.
Background technology
The installation constitution that existing electronic unit is described with and the accompanying drawing of installation method, Figure 19 be the existing electronic unit of expression installation constitution with and the key diagram of installation method, then, the structure of the installation constitution of existing electronic unit is described based on Figure 19, it constitutes, on insulated substrate 51 with through hole 51a, under the state relative, electronic unit 52 is installed with through hole 51a, between this insulated substrate 51 and electronic unit 52, be provided with the substrate filler (under-fill) 53 that constitutes by resin.
In addition, the installation method of existing electronic unit, as shown in figure 19, at the periphery configuration distributor (dispenser) 54 of the electronic unit 52 that is installed on insulated substrate 51, and at the bottom of through hole 51a configuration suction device 55, at first, utilize distributor 54 aqueous substrate filler 53 to be injected into the full week of electronic unit 52, then, by suction device 55, substrate filler 53 is attracted to the central portion side of electronic unit 53 from through hole 51a.
But, in the installation constitution of existing electronic unit, owing to be provided with through hole 51a at insulated substrate 51, so need implement perforate processing to insulated substrate 51, and the position of through hole 51a becomes the dead band, can't realize miniaturization, in addition, in this installation method, owing to utilize distributor 54 aqueous substrate filler 53 to be injected into the full week of electronic unit 52, then by suction device 55, from through hole 51a substrate filler 53 is attracted to the central portion side of electronic unit 53, thus need carry out substrate filler 53 is injected into the full week of electronic unit 52, and utilize suction device 55 to attract the operation of substrate filler 53, this operation is more loaded down with trivial details, the problem that exists productivity ratio to descend.
Summary of the invention
The present invention is the invention that proposes in view of the actual conditions of such prior art, and its purpose is to provide a kind of processability and productivity ratio good, do not have at the substrate filler bubble (space) electronic unit installation constitution with and installation method.
In order to reach above-mentioned purpose, the invention is characterized in to possess: the insulated substrate that is provided with a plurality of terminals; The insulating coating that under the state of having avoided terminal, on insulated substrate, is provided with; Be arranged on the electronic unit that the following electrode of body is connected with described terminal; And between insulating coating and the electronic unit, and the substrate filler that constitutes by resin that between insulated substrate and electronic unit, is provided with,
Insulating coating has: under the state of having avoided terminal along the arrangement of terminal and first epithelium that is provided with is removed portion; Be connected in this first epithelium and remove portion and remove portion to second epithelium that the periphery of body extends.
The present invention of Gou Chenging like this, there is no need the through hole that is provided for attracting on the insulated substrate of a plurality of terminals being provided with, therefore, do not need perforate processing, and eliminated the dead band that causes by through hole, can realize the miniaturization of insulated substrate, and owing to insulating coating has: first epithelium that is provided with along the arrangement of terminal under the state of having avoided terminal is removed portion; Be connected in this first epithelium and remove portion and remove portion to second epithelium that the periphery of body extends, so remove the part of portion at second epithelium, the filling speed of substrate filler is slack-off, consequently fill the moment postponement of substrate filler, obtain not having the substrate filler of bubble (space) in the inboard at periphery.
In addition, the invention is characterized in that in foregoing invention, the thickness of insulating coating forms thicklyer than terminal.The present invention of Gou Chenging like this, than between the body of insulation tunicle and electronic unit because of the mobile aqueous substrate filler of capillarity, (first epithelium is removed portion) is slack-off because of the mobile aqueous substrate filler of capillarity between the body of insulated substrate and electronic unit, therefore, be present in first epithelium and remove the air of portion and can be expressed into second epithelium reliably and remove portion's side, can obtain not having the substrate filler of bubble (space).
In addition, the invention is characterized in that in foregoing invention, the first epithelium portion of removing forms band shape, and insulating coating is provided with by membranous part in the position relative with central portion below the body.The present invention of Gou Chenging like this, between the body of insulation tunicle and electronic unit because of the mobile aqueous substrate filler of capillarity, become than between the body of insulated substrate and electronic unit (first epithelium is removed portion) because of the mobile aqueous substrate filler of capillarity flow piece, the air that is present in the central portion of body outer circumferential side can be expressed into as soon as possible, the substrate filler of bubble (space) of the central portion of body can be obtained not having.
In addition, the invention is characterized in that in foregoing invention, terminal also is arranged at the position of epithelium portion under the state that has exposed from insulating coating, and is connected with electrode.The present invention of Gou Chenging like this even also can be connected in terminal in the position of the central portion of the body of electronic unit, also can increase linking number.
In addition, the invention is characterized in that in foregoing invention, second epithelium is removed portion and extended and form to the outside of the periphery of body.The present invention of Gou Chenging like this, the air that is present in the following side of body is discharged to outside the body reliably by the second epithelium portion of removing, and can obtain not having the substrate filler of bubble (space).
In addition, the invention is characterized in that in foregoing invention, terminal is configured to four horn shapes along four linea angulatas, the first epithelium portion of removing has: be positioned at be parallel to each other first-line first eliminate portion; Be connected in this first eliminate portion, be positioned at be parallel to each other second-line second eliminate portion.The present invention of Gou Chenging like this eliminates portion by connecting first, second, can obtain not having in the parts with the terminal that is four horn shapes (mouthful word shape) configuration the substrate filler of bubble (space).
In addition, the invention is characterized in foregoing invention, to have second epithelium that is connected with a side first portion of eliminating and remove portion, second epithelium portion of removing extends and forms to the outside of the periphery of body eliminate the central authorities of portion from a side first near.The present invention of Gou Chenging like this removes portion by near the central authorities that eliminate portion a side first second epithelium being set, and can remove the last air of portion and is discharged to outside the body being present in first epithelium, can obtain not having the substrate filler of bubble (space).
In addition, the invention is characterized in that in foregoing invention, second tunicle is removed portion, eliminate under the state at two ends of portion being connected in first that a linearity ground extends and forms to the outside of the periphery of body.The present invention of Gou Chenging like this removes portion by second epithelium be connected with first both ends that eliminate portion is set, and can remove the air of portion and is discharged to reliably outside the body being present in first epithelium, can obtain not having the substrate filler of bubble (space).
In addition, the invention is characterized in that in foregoing invention, second tunicle is removed portion, eliminate under the state of portion being connected in second, extend and form to the outside of the periphery of body.The present invention of Gou Chenging like this, remove portion owing to there is second tunicle that is connected with second portion of eliminating, so under the situation of the wettability good (good fluidity) of substrate filler, the flowing of substrate filler at the following peripheral part place of (delaying) body can be controlled, the air of the following central portion of body can be discharged reliably.
In addition, the invention is characterized in that in foregoing invention, insulating coating has the 3rd epithelium that forms in the mode of surrounding body and removes portion, is connected with second epithelium in the 3rd epithelium portion of removing and removes portion.The present invention of Gou Chenging like this, utilize the 3rd epithelium to remove portion, can suppress the diffusion of substrate filler, and because the substrate filler is removed the edge portion prevention of portion by the 3rd epithelium, the 3rd epithelium portion of removing forms shallowly, width is narrow so can make, and can realize miniaturization.
In order to reach above-mentioned purpose, the invention is characterized in, the installation constitution that possesses technical scheme 1 described electronic unit, and has the periphery that is configured in electronic unit, be used to inject the distributor of substrate filler, this distributor is removed under the state of position of portion's quadrature being configured in first epithelium, injects the substrate filler.
The present invention of Gou Chenging like this, do not need to utilize distributor with around the substrate filler injection electronic unit, or utilize suction device to attract the operation of substrate filler, good work, the productivity ratio height, and, inject the substrate filler because distributor is removed under the state of position of portion's quadrature being configured in first epithelium, so can remove the air of portion and push reliably to second epithelium and remove portion's side being present in first epithelium, can obtain not having the substrate filler of bubble (space).
In addition, the invention is characterized in, in foregoing invention, the installation constitution of the scheme that possesses skills 6 described electronic units, and have the periphery that is disposed at electronic unit, the distributor that is used to inject the substrate filler, this distributor eliminates under the state of position of a quadrature in the portion being configured in first, second, injects the substrate filler.
The present invention of Gou Chenging like this, do not need to utilize distributor with around the substrate filler injection electronic unit, or utilize suction device to attract the operation of substrate filler, good work, the productivity ratio height, and because distributor eliminates under the state of position of a quadrature in the portion being configured in first, second, inject the substrate filler, so eliminate portion by connecting first, second, can obtain in parts, not having the substrate filler of bubble (space) with the terminal that is four horn shapes (mouthful word shape) configuration.
In addition, the invention is characterized in, in foregoing invention, the installation constitution that possesses technical scheme 7 described electronic units, and have the periphery that is disposed at electronic unit, the distributor that is used to inject the substrate filler, this distributor injects the substrate filler under the state that is configured in following position, this position is: perpendicular to near central authorities, be provided with described second epithelium and remove a described side's of portion first described first position that eliminates portion that eliminates the opposing party of relative another of portion.
The present invention of Gou Chenging like this, do not need to utilize distributor with around the substrate filler injection electronic unit, or utilize suction device to attract the operation of substrate filler, good work, the productivity ratio height, and because this distributor injects the substrate filler under the state that is configured in following position, this position is: perpendicular to near central authorities, be provided with described second epithelium and remove a described side's of portion first described first position that eliminates portion that eliminates the opposing party of relative another of portion, so can remove the last air of portion and be discharged to outside the body being present in first epithelium, can obtain not having the substrate filler of bubble (space).
The present invention is owing to being provided with on insulated substrate: arrange first epithelium that is provided with along terminal and remove portion; Be connected in this first epithelium and remove portion and remove portion to second epithelium that the periphery of the body of electronic unit extends, so not be used in through hole is set on the insulated substrate, can obtain not having the substrate filler of bubble (space).
Description of drawings
Fig. 1 is the major part profile of the installation constitution of electronic unit of the present invention;
Fig. 2 is the vertical view of insulated substrate of the installation constitution of electronic unit of the present invention;
Fig. 3 is the enlarged drawing of the A part of Fig. 1;
Fig. 4 is the front view of the installation method of expression electronic unit of the present invention;
Fig. 5 is the vertical view of the installation method of expression electronic unit of the present invention;
Fig. 6 is the key diagram of first flow regime of substrate filler installation method, aqueous of expression electronic unit of the present invention;
Fig. 7 is the key diagram of second flow regime of substrate filler installation method, aqueous of expression electronic unit of the present invention;
Fig. 8 is the key diagram of the 3rd flow regime of substrate filler installation method, aqueous of expression electronic unit of the present invention;
Fig. 9 is the key diagram of the 4th flow regime of substrate filler installation method, aqueous of expression electronic unit of the present invention;
Figure 10 is the major part profile of other execution modes of the installation constitution of electronic unit of the present invention;
Figure 11 is the vertical view of insulated substrate of other execution modes of the installation constitution of electronic unit of the present invention;
Figure 12 is the front view of other execution modes of the installation method of expression electronic unit of the present invention;
Figure 13 is the vertical view of other execution modes of the installation method of expression electronic unit of the present invention;
Figure 14 is the key diagram of first flow regime of substrate filler other execution modes, aqueous of the installation method of expression electronic unit of the present invention;
Figure 15 is the key diagram of second flow regime of substrate filler other execution modes, aqueous of the installation method of expression electronic unit of the present invention;
Figure 16 is the key diagram of the 3rd flow regime of substrate filler other execution modes, aqueous of the installation method of expression electronic unit of the present invention;
Figure 17 is the key diagram of the 4th flow regime of substrate filler other execution modes, aqueous of the installation method of expression electronic unit of the present invention;
Figure 18 is the key diagram of the 5th flow regime of substrate filler other execution modes, aqueous of the installation method of expression electronic unit of the present invention;
Figure 19 be the existing electronic unit of expression installation constitution with and the key diagram of installation method.
Symbol description:
The 1-insulated substrate; The 2-terminal; The 2a-terminal; The 3-insulating coating; 3a-epithelium portion; 4-first epithelium is removed portion; 4a-first eliminates portion; 4b-second eliminates portion; 5-second epithelium is removed portion; 6-the 3rd epithelium is removed portion; The 7-electronic unit; The 7a-body; The 7b-electrode; 8-substrate filler; The 9-distributor
Embodiment
Describe for the working of an invention mode with reference to the accompanying drawings, Fig. 1 is the major part profile of the installation constitution of electronic unit of the present invention, Fig. 2 is the vertical view of insulated substrate of the installation constitution of electronic unit of the present invention, Fig. 3 is the enlarged drawing of the A part of Fig. 1, Fig. 4 is the front view of the installation method of expression electronic unit of the present invention, Fig. 5 is the vertical view of the installation method of expression electronic unit of the present invention, Fig. 6 is the installation method of expression electronic unit of the present invention, the key diagram of first flow regime of aqueous substrate filler, Fig. 7 is the installation method of expression electronic unit of the present invention, the key diagram of second flow regime of aqueous substrate filler, Fig. 8 is the installation method of expression electronic unit of the present invention, the key diagram of the 3rd flow regime of aqueous substrate filler, Fig. 9 are the installation methods of expression electronic unit of the present invention, the key diagram of the 4th flow regime of aqueous substrate filler.
In addition, Figure 10 is the major part profile of other execution modes of the installation constitution of electronic unit of the present invention, Figure 11 is the vertical view of insulated substrate of other execution modes of the installation constitution of electronic unit of the present invention, Figure 12 is the front view of other execution modes of the installation method of expression electronic unit of the present invention, Figure 13 is the vertical view of other execution modes of the installation method of expression electronic unit of the present invention, Figure 14 is other execution modes of the installation method of expression electronic unit of the present invention, the key diagram of first flow regime of aqueous substrate filler, Figure 15 is other execution modes of the installation method of expression electronic unit of the present invention, the key diagram of second flow regime of aqueous substrate filler, Figure 16 is other execution modes of the installation method of expression electronic unit of the present invention, the key diagram of the 3rd flow regime of aqueous substrate filler, Figure 17 is other execution modes of the installation method of expression electronic unit of the present invention, the key diagram of the 4th flow regime of aqueous substrate filler, Figure 18 is other execution modes of the installation method of expression electronic unit of the present invention, the key diagram of the 5th flow regime of aqueous substrate filler
Then, the structure of the installation constitution of electronic unit of the present invention is described based on Fig. 1～Fig. 3, the insulated substrate 1 that is made of multilayer board etc. is provided with a plurality of terminals 2 as a Wiring pattern part, and this terminal 2 is four horn shapes along four linea angulatas and is arranged in two row (mouthful word shape).
In addition, on this insulated substrate 1, being arranged with by epoxy at the state of having avoided terminal 2 is the insulating coating 3 of anti-solder flux of constituting of resin etc., this insulating coating 3 has first epithelium of the band shape that is provided with along the arrangement of terminal 2 and removes portion 4, this first epithelium is removed portion 4 and is four horn shapes (mouthful word shape), and has: be positioned at four horn shapes be parallel to each other first-line first eliminate the 4a of portion and be connected in this first eliminate the 4a of portion and be positioned at four horn shapes be parallel to each other second-line second eliminate the 4b of portion.
And then, insulating coating 3 has at the 3a of epithelium portion that is removed the island that position that portion 4 centers on is provided with by first epithelium, and has: eliminate from first end and first that eliminates the 4a of portion the 4a of portion in line second epithelium that extends of shape eliminate portion 5 and eliminate near the central authorities of the 4a of portion squarely laterally second epithelium of extension from a side first and remove portion 5; Be connected in this second epithelium and remove the 3rd epithelium of the ring-type of portion 5 and remove portion 6.
And insulating coating 3 has the thickness about 25 μ m, and thicker than the thickness (10 μ m) of terminal 2, in addition, the width that first, second epithelium is removed portion 4,5 is formed on more than the 10 μ m.
The rectangular-shaped electronic unit 7 that constitutes by semiconductor chip etc., have: body 7a and be arranged on the lower surface of body 7a and be arranged in a plurality of electrode 7b of four horn shapes (mouthful word shape), this electronic unit 7 is mounted by utilizing solder flux or ball grid array (ball grid array) etc. that electrode 7 is connected in terminal 2.
At this moment, the 3a of epithelium portion is positioned at the central portion of body 7a, it is outstanding laterally from the periphery of body 7a that second epithelium is removed portion 5, the 3rd epithelium remove portion 6 be configured to be centered around body 7a near, and leave the gap of the size that is about 50～80 μ m between the lower surface of insulated substrate 1 and body 7a.
By epoxy is that the substrate filler 8 that resin constitutes is arranged on: between the lower surface of insulating coating 3 and body 7a, between the lower surface of insulated substrate 1 and body 7a, and the circumference of body 7a, strengthen the installation of electronic unit 7, and expose from the circumference of body 7a, the substrate filler 8 that has exposed, the 3rd epithelium that is suppressed diffusion usefulness in its edge portion is removed portion's 6 inhibition diffusions, the 3rd epithelium is removed the aqueous substrate filler 8 of the edge portion of portion 6, as shown in Figure 3, the contact angle that is become with substrate filler 8 by insulating coating 3 is spent the scope of～135 degree 90.
If the contact angle deficiency of this aqueous substrate filler 8 90 degree, then the flowability of substrate filler 8 uprises, become the state that substrate filler 8 flows out significantly, in addition, if the contact angle of aqueous substrate filler 8 surpasses 135 degree, the then mobile step-downs of substrate filler 8, the mobile variation of substrate filler 8, and, if contact angle then becomes the state that insulating coating 3 and substrate filler 8 are not easy to make moist in the scope of 90 degree～135 degree.
Then, the installation method of electronic unit of the present invention is described based on Fig. 4～Fig. 9, at first, as Fig. 4, shown in Figure 5, the distributor 9 that is used to inject aqueous substrate filler 8 is configured in as upper/lower positions: at the periphery of electronic unit 7, perpendicular to near central authorities, be provided with second epithelium and remove a side's of portion 5 first first position that eliminates the 4a of portion that eliminates the opposing party of relative another of the 4a of portion.
Under this state, if utilize distributor 9 to inject aqueous substrate filler 8, then as shown in Figure 6, because the gap between insulating coating 3 and the body 7a is little, so substrate filler 8 is owing to capillarity flows between them, then, the substrate filler 8 that overflows between this insulating coating 3 and body 7a approaches first of distributor 9 and eliminates the 4a of portion owing to capillarity flows into.
Then, eliminating the substrate filler 8 that the 4a of portion overflows from first flows between the gaps little 3a of epithelium portion and body 7a, and be positioned at the substrate filler 8 that second epithelium is removed the edge portion of portion 5, because its amount is few, so stop the edge portion of removing portion 5 in second epithelium because of the viscosity of substrate filler 8, become and can not flow into second epithelium and remove state in the portion 5.
Further, if inject aqueous substrate filler 8, then as shown in Figure 7, substrate filler 8 flows into earlier between the gap little insulating coating 3 and body 7a, simultaneously little by little the gap big second eliminate the 4b of portion by substrate filler 8 landfills, become residual being positioned at down and eliminate the state that the 4a of portion and second eliminates the part of the 4b of portion, and during this period, air is removed portion 5 from second epithelium and discharged away from first of the position of distributor 9.
Further, if inject aqueous substrate filler 8, then as shown in Figure 8, become residual being positioned at down and remove the state of portion 5 away from first part and second epithelium that eliminates the 4a of portion of the position of distributor 9, then if inject aqueous substrate filler 8, then be present in and be in the air that eliminates the part of the 4a of portion away from first of the position of distributor 9 and remove portion 5 from second epithelium and discharge, become state shown in Figure 9.
Then, under the state of Fig. 9, the substrate filler 8 that below body 7a, overflows, bury the periphery of body 7a, and a part flows out to the 3rd epithelium and removes portion's 6 sides, and the 3rd epithelium is removed the burrock that portion 6 becomes substrate filler 8, keeps contact angle as shown in figure 3, stop substrate filler 8 further to flow out, finish the installation of electronic unit of the present invention.
In addition, Figure 10, Figure 11 represents other execution modes of the installation constitution of electronic unit of the present invention, the structure of these other execution modes is described, except being configured to mouthful terminal of word shape 2, also have a plurality of terminal 2a under the state that has exposed from insulating coating 3, to be set at the position of the 3a of epithelium portion, 7b is connected with electrode, in addition, second tunicle is removed portion 5 near being formed on the central authorities that a side first eliminates the 4a of portion and first the eliminating the both ends of the 4a of portion of both sides, also forms at right angles being connected in second to eliminate under the state of the 4b of portion and extend to the periphery outside of body 7a.
So, owing to exist and second eliminate second tunicle that the 4b of portion is connected and remove portion 5, under the situation of the wettability of substrate filler 8 good (good fluidity), flowing of the substrate filler 8 at the lower surface peripheral part place of control (delaying) body 7a can be discharged the air of the lower surface central portion of body 7a reliably.
Other structure has structure same as the previously described embodiments, for same parts mark same-sign, omits its explanation at this.
Then, other embodiment of the installation method of electronic unit of the present invention are described based on Figure 12～Figure 18, at first, as shown in Figure 12 and Figure 13, the distributor 9 that is used to inject aqueous substrate filler 8 is configured in as upper/lower positions: at the periphery of electronic unit 7, perpendicular to near central authorities, be provided with second epithelium and remove first another first position that eliminates the 4a of portion that eliminates relative another of the 4a of portion of a side of portion 5.
Under this state, if utilize distributor 9 to inject the substrate filler 8 of aqueous wettability good (good fluidity), then as shown in figure 14, because the gap between insulating coating 3 and the body 7a is little, so substrate filler 8 is owing to capillarity flows between them, then, the substrate filler 8 that overflows between this insulating coating 3 and body 7a approaches owing to capillarity flows into that first of distributor 9 eliminates the 4a of portion and second tunicle is removed portion 5, thus, get rid of between insulating coating 3 and the body 7a or first eliminate the 4a of portion and second tunicle is removed the air of portion 5.
Then, eliminate the 4a of portion and second tunicle is removed the good substrate filler 8 of wettability that portion 5 overflows from first, as shown in figure 14, flow between the following central portion and following peripheral part and insulation tunicle 3 of the little body 7a in gap.
If further inject aqueous substrate filler 8, then as shown in figure 15, substrate filler 8 flows into earlier between the gap little insulating coating 3 and body 7a, simultaneously little by little the gap big second eliminate the 4b of portion by substrate filler 8 landfills, and at right angles eliminating the position that second tunicle that the 4b of portion is connected is removed portion 5, the mobile Be Controlled (slowing down) of the substrate filler 8 that wettability is good with second.
By controlling this substrate filler 8, the air that the following central portion of body 7a and second eliminates the 4b of portion is by at right angles eliminating second tunicle that the 4b of portion is connected and remove portion 5 and discharged reliably with second.
If further inject aqueous substrate filler 8, then as shown in figure 16, substrate filler 8 landfills at right angles eliminate second tunicle that the 4b of portion is connected and remove portion 5 with second, and overflow, and substrate filler 8 flows into earlier between the gap little insulating coating 3 and body 7a, simultaneously little by little the gap big second eliminate the 4b of portion by substrate filler 8 landfills, become only residual being positioned at down and eliminate the state that the 4a of portion and second eliminates the part of the 4b of portion away from first of the position of distributor 9, and, remove portion's 5 air-outs from second epithelium during this period.
If further inject aqueous substrate filler 8, then as shown in figure 17, become residual being positioned at down and remove the state of portion 5 away from first part and second epithelium that eliminates the 4a of portion of the position of distributor 9, then, if inject aqueous substrate filler 8, then be present in to be positioned at and removed portion 5 from second epithelium away from first air that eliminates the part of the 4a of portion of the position of distributor 9 and discharge, become state shown in Figure 180.
Then, under the state of Figure 18, the periphery of the substrate filler 8 landfill body 7a that below body 7a, overflow, and a part flows out removes portion's 6 sides to the 3rd epithelium, but the 3rd epithelium is removed the burrock that portion 6 becomes substrate filler 8, have contact angle shown in Figure 3, stop substrate filler 8 to continue to flow out, finish the installation of electronic unit of the present invention.
Claims (13)
1. the installation constitution of an electronic unit is characterized in that,
Possess: the insulated substrate that is provided with a plurality of terminals; At the insulating coating that on described insulated substrate, is provided with under the state of having avoided described terminal; Be arranged on the electronic unit that the following electrode of body is connected with described terminal; And between described insulating coating and the described electronic unit and the substrate filler that constitutes by resin that is provided with between described insulated substrate and the described electronic unit,
Described insulating coating has: under the state of having avoided described terminal along the arrangement of described terminal and first epithelium that is provided with is removed portion; Be connected in this first epithelium and remove portion and remove portion to second epithelium that the periphery of described body extends.
2. the installation constitution of electronic unit according to claim 1 is characterized in that,
The thickness of described insulating coating is than the more heavy back formation of described terminal.
3. the installation constitution of electronic unit according to claim 1 and 2 is characterized in that,
The described first epithelium portion of removing forms band shape, and described insulating coating is provided with epithelium portion in the position relative with central portion below the described body.
4. the installation constitution of electronic unit according to claim 3 is characterized in that,
Described terminal also is arranged at the position of described epithelium portion under the state that has exposed from described insulating coating, and is connected with described electrode.
5. the installation constitution of electronic unit according to claim 1 is characterized in that,
Described second epithelium is removed portion and is extended and form to the outside of the periphery of described body.
6. the installation constitution of electronic unit according to claim 5 is characterized in that,
Described terminal is configured to four horn shapes along four linea angulatas, and the described first epithelium portion of removing has: be positioned at be parallel to each other first-line described first eliminate portion; Be connected in this first eliminate portion, be positioned at be parallel to each other second-line described second eliminate portion.
7. the installation constitution of electronic unit according to claim 6 is characterized in that,
Have described second epithelium that is connected with described first portion of eliminating of the side and remove portion, described second epithelium portion of removing extends and forms to the outside of the periphery of described body eliminate the central authorities of portion from a described side's first near.
8. the installation constitution of electronic unit according to claim 7 is characterized in that,
Described second tunicle is removed portion, eliminates under the state at two ends of portion being connected in described first, and a linearity ground extends and forms to the outside of the periphery of described body.
9. the installation constitution of electronic unit according to claim 7 is characterized in that,
Described second tunicle is removed portion, eliminates under the state of portion being connected in described second, extends and forms to the outside of the periphery of described body.
10. the installation constitution of electronic unit according to claim 5 is characterized in that,
Described insulating coating has the 3rd epithelium that forms in the mode of surrounding described body and removes portion,
Be connected with described second epithelium in the 3rd epithelium portion of removing and remove portion.
11. the installation method of an electronic unit is characterized in that,
The installation constitution that possesses the described electronic unit of claim 1, and has the periphery that is configured in described electronic unit, be used to inject the distributor of described substrate filler, this distributor is removed under the state of position of portion's quadrature being configured in described first epithelium, injects described substrate filler.
12. the installation method of an electronic unit is characterized in that,
The installation constitution that possesses the described electronic unit of claim 6, and have the periphery that is disposed at described electronic unit, the distributor that is used to inject described substrate filler, this distributor eliminates under the state of position of a quadrature in the portion being configured in described first, second, injects described substrate filler.
13. the installation method of an electronic unit is characterized in that,
The installation constitution that possesses the described electronic unit of claim 7, and have the periphery that is disposed at described electronic unit, the distributor that is used to inject described substrate filler, this distributor injects described substrate filler under the state that is configured in following position, this position is perpendicular to and is provided with described second epithelium removes a described side's of portion first described first position that eliminates portion that eliminates the opposing party of relative another of portion near central authorities.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005331830 | 2005-11-16 | ||
| JP2005331830 | 2005-11-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1967830A true CN1967830A (en) | 2007-05-23 |
| CN100539108C CN100539108C (en) | 2009-09-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610146402 Expired - Fee Related CN100539108C (en) | 2005-11-16 | 2006-11-13 | The installation constitution of electronic unit with and installation method |
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| Country | Link |
|---|---|
| CN (1) | CN100539108C (en) |
| TW (1) | TW200737468A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101821842B (en) * | 2007-10-10 | 2013-07-24 | 日本电气株式会社 | Semiconductor device |
-
2006
- 2006-10-27 TW TW095139743A patent/TW200737468A/en unknown
- 2006-11-13 CN CN 200610146402 patent/CN100539108C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101821842B (en) * | 2007-10-10 | 2013-07-24 | 日本电气株式会社 | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200737468A (en) | 2007-10-01 |
| CN100539108C (en) | 2009-09-09 |
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