CN1967427A - Temperature-controlled method and module for large area planar light wave circuit - Google Patents
Temperature-controlled method and module for large area planar light wave circuit Download PDFInfo
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- CN1967427A CN1967427A CN 200510086900 CN200510086900A CN1967427A CN 1967427 A CN1967427 A CN 1967427A CN 200510086900 CN200510086900 CN 200510086900 CN 200510086900 A CN200510086900 A CN 200510086900A CN 1967427 A CN1967427 A CN 1967427A
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Abstract
This invention relates to a temperature control method and temperature control module for the large area plane light wave loop circuit and plane integrated optical passive devices and various waveguides. The module uses the multi-point temperature measurement and multiple temperature control circuit to construct the array temperature control method, its temperature control circuit partly produced in a printed circuit board, mainly comprising the five parts, the temperature difference measurement large, the ratio differential and integral control loop circuit, the frequency generation circuit, the pulse width modulation circuit, the current output, and as for large-size optical passive devices, such as planar light waveguide, which having the features such as temperature control area big, temperature control precision high, temperature control rate quick, working temperature range big, power dissipation small, and so on, it optimize the design to the circuit. And on this basis, a temperature control module is designed, the module size small and heat conductivity effect good.
Description
Technical field
The present invention relates to the temperature control technology field, particularly a kind of temperature control method and temperature control module that is used for large area planar light wave circuit.
Background technology
Planar light wave circuit (PLC:Planar Lightwave Circuit) technology is low with its cost, be convenient to batch process, good stability and be easy to advantages such as integrated, is considered in the following dense wave division multipurpose optical-fiber network the very technology of practicability.Wherein silica-based SiO
2That the light wave circuit technology has is good with existing ripe semiconductor process techniques compatibility, with optical coupling efficiency height, advantage such as with low cost, be subjected to extensive attention.In silica-based PLC, centre wavelength is with about 0.01nm/ ℃ rate drift, the temperature that the stable center wavelength just must control PLC.Development temperature control scope temperature control module big, that steady rate is fast, precision is high is to improve the indispensable committed step of PLC device performance.
In modern times control field, precision temperature control is one of most important.Along with the develop rapidly of science and technology, various industries are more and more higher to the requirement of temperature accuracy, and are more and more stricter to the temperature control system stability requirement.And temperature control system is variable element, time lag is arranged and have the dynamic system of random disturbance, often be difficult to obtain satisfied control effect, and for the optical passive component of the integrated class of large area planar light wave circuit and large scale plane, also have the temperature control area big, the variation of ambient temperature scope is big, the temperature-controlled precision height, and temperature control speed is fast, grade low in energy consumption specific (special) requirements, the difficulty of realization is higher.
Accurate temperature control system aspect mainly contains two types of traditional proportional integral derivative (PID:Proportional-Integral-Differential) control and the fuzzy controls of computer based Based Intelligent Control.PID control is most widely used general, the most basic a kind of control method in temperature controlled processes.Though control theory and control technology are gradually improved and ripe, present most of temperature controlled processes still adopt PID control, adopt the control loop number of Advanced Control technology to account for about 10%.Its reason is that this control method is simple, good stability, reliability height, can satisfy the requirement of most of temperature controls.And the essence of computer based intelligence and modeling of fuzzy control dynamic system and analysis be with the language model with algorithm structure to uncertain, big inertia, parameter drift is big and dynamic system high complexity is carried out enough qualitative accurately and description, then according to Fuzzy Set Theory, apish control experience, the utilization fuzzy reasoning method, directly map out the controlled quentity controlled variable of controlled device according to output, its shortcoming is a system complex, the process of regulating and controlling is loaded down with trivial details, the cost height is mainly used in the temperature control system of some more complicated.
The temperature control requirement of the optical passive component of the integrated class of large area planar light wave circuit and large scale plane is enough satisfied in PID control, with intelligence and Fuzzy control system ratio, have more simple, easy to operate, volume is little, low in energy consumption, low cost and other advantages, therefore temperature control module of the present invention is based on PID and controls and design and produce.
Summary of the invention
The objective of the invention is temperature control characteristics at the optical passive component of the integrated class of large area planar light wave circuit and large scale plane, and consider and the characteristics of optical communication system array, expandability on the basis of traditional PID control, designed a kind of temperature control module that is used for the optical passive component of the integrated class of planar light wave circuit and large scale plane.
Be used for the optical passive component of the integrated class of large area planar light wave circuit and plane and the temperature control method of various waveguides, optical passive components such as planar light wave circuit are worked under equilibrium temperature, make its centre wavelength be unlikely to drift about with variation of ambient temperature.
The object of the present invention is achieved like this:
A kind of temperature control method that is used for large area planar light wave circuit comprises the steps:
(1) for the mode of the bigger waveguide chip employing multi-point temperature measurement of area,, lays a plurality of points for measuring temperature, carry out temperature control according to each point for measuring temperature temperature average according to the thermal field distribution on analog chip surface;
(2) for the bigger waveguide chip of area, higher or to the uniformity requirement of temperature because the communication system expansion, the situation that the requirement of polylith chip is worked under uniform temp can adopt the mode of polylith control circuit multi-point temperature measurement, chip surface thermal field according to simulation distributes, and lays a plurality of points for measuring temperature and electrothermal refrigeration sheet.
The temperature control method of described large area planar light wave circuit, a plurality of points for measuring temperature adopt the mode thermometric of a plurality of thermistors with series connection or parallel connection.
Temperature-adjusting circuit has extensibility, should make the square wave generation circuit of each circuit that certain phase deviation is arranged during expansion, and the ripple of output current is excessive when avoiding phase place identical.
A kind of temperature-adjusting circuit that is used for large area planar light wave circuit, mainly form by differential temperature survey amplification, proportional integral derivative control loop, square wave generation circuit, pulse-width modulation circuit, these five parts of electric current output circuit, the differential temperature survey amplification is connected in proportional integral derivative control loop and pulse-width modulation circuit, and pulse-width modulation circuit is connected in electric current output circuit by driving circuit.
A kind of temperature control module that is used for large area planar light wave circuit, by temperature-adjusting circuit, electrothermal refrigeration sheet, heat radiator, and lagging casing forms, lagging casing is used for reducing ambient temperature to controlling Temperature Influence.
Described large area planar light wave circuit, its area greater than 1 square centimeter, comprise the optical passive component and the various waveguide of the integrated class in plane.
Electric current output circuit adopts the H bridge circuit to realize the forward/direction conducting of electrothermal refrigeration sheet, thereby realizes the effect of heating and refrigeration.
The described temperature-adjusting circuit that is used for large area planar light wave circuit, the expansion of polylith temperature-adjusting circuit is expanded by the square wave generation circuit synchronous output end of master control circuit temperature.
Described be used for large area planar light wave circuit temperature control module, the combination of electrothermal refrigeration sheet, heat radiator and planar light wave circuit chip, all adopt the higher heat conduction elargol bonding of thermal conductivity, and adopt stack (vertically arranging) to come reduced volume as far as possible in the plane normal direction.
The invention provides and a kind ofly be used for that large area planar light wave is led and the optical passive component of the integrated class in large scale plane and the temperature control module of various waveguides, comprise the steps:
(1) design circuit schematic diagram.
Temperature-adjusting circuit is included in the temperature control module, measures in the temperature course control temperature at temperature control module.
A complete temperature-adjusting circuit comprises three parts: 1. import correct measurement target temperature of amplifier stage and the difference between the object actual temperature accurately for one.2. equalizing network makes temperature control stable and can optimize temperature control speed.3. big electric current output stage.Because output current is bigger,, make the heat that produces because of power dissipation minimum so must improve the efficient of temperature-adjusting circuit.4. for the planar optical waveguide temperature-adjusting circuit, its supply voltage should be controlled at below the 4V, improves the degree of accuracy of temperature control to avoid bigger power consumption, and have indication when temperature reaches target temperature.
The differential temperature survey amplifier section: this part is made up of the electric bridge and the amplifier of a negative tempperature coefficient thermistor (NTCR:Negative Temperature Coefficient Resistance) and three resistance formations.These three resistance need adopt precision resistance, and its resistance is the resistance of NTCR when target temperature.NTCR will keep well contacting with electrothermal refrigeration sheet (TEC:Thermoelectric Cooler).When temperature stabilization during in the target stationary value, this part provides a high level to light emitting diode (LED:Light Emitting Diode), and the LED lamp is lighted.
The PID control section: this part controls width modulation (PWM:Pulse-Width Modulation) control circuit and a linear amplifier circuit by pid control circuit.Pwm control circuit is used for controlling the metal-oxide-semiconductor driving circuit, and the metal-oxide-semiconductor driving circuit is controlled the sense of current by TEC by the H bridge circuit, makes TEC produce the effect of heating, refrigeration, and linear amplifier circuit is then controlled the size by the TEC electric current.Feed back to the PID control circuit by the differential temperature survey amplifying circuit then, form a backfeed loop.By this backfeed loop, make temperature stabilization at last at target temperature value.
Square wave generation circuit is included in the oscillator, produces square wave by oscillator.
The electric current output: the TEC driving circuit adopts the H bridge circuit to make the amplitude of oscillation maximum of output voltage and realizes the Direct/Reverse energising of TEC.The H bridge circuit adopts low source leakage conductance energising resistance (R
DS, on) metal-oxide-semiconductor constitute, can improve electric bridge efficient like this, reduce power consumption.Driving circuit be also noted that set conducting and end between time-delay, prevent that conducting simultaneously is short-circuited and burns out metal-oxide-semiconductor.Improve the temperature control effect of circuit, an end of H bridge circuit need insert a L-C filtering circuit and come filtering PWM square wave switching frequency, makes the voltage that drives TEC stable.In order to improve electric bridge efficient, need to select the less inductance of equivalent resistance (ESR:Equivalent Series Resistance) equally.
(2) by calculating, select suitable component parameters that circuit is carried out analog simulation.If simulation result is not good then to be needed to adjust component parameters and repeats emulation, up to obtaining reasonable result.
(3) according to circuit theory diagrams, design printed circuit domain (PCB).The present invention is designed to doubling plate, and according to the design principle of disposal wires of printed circuit board, signal wire is mainly walked on the upper strata, and lower floor mainly is power lead and large-area floor file, separates with analog-and digital-, to avoid the interference of digital signal to simulating signal.
(4) through experiment measuring, further adjust component parameters, obtain net result.
(5) on heat radiator, come bonding TEC with the higher heat conduction elargol of coefficient of heat conductivity, and on TEC with elargol bonding one deck aluminium flake, and on aluminium flake, open a sulculus, thermistor is placed in the groove, and the coating elargol is to guarantee thermo-contact good between thermistor and aluminium flake.Bonding PLC chip on aluminium flake again, elargol will be coated with evenly, and thin as far as possible.Why adopting elargol, is because the coefficient of heat conductivity of common heat conductive silica gel has only 0.5～2.0W/mK, become the bottleneck of heat radiation, and the coefficient of heat conductivity of elargol is about 20W/mK, far above heat conductive silica gel, can greatly improve heat radiation, the heat-conducting effect of temperature control module.The fixing PCB of temperature-adjusting circuit thereon, and be screwed firmly.
Encapsulate with adiabatic plastic casing at last, stablize at the PCB laying temperature and stay an aperture to lay LED light on the LED light place plastic casing, get the access of an aperture as power lead in addition again, two apertures are as the IO interface of optical fiber.
Synchronous output end with master control circuit temperature square wave generation circuit when (6) needing expansion is connected to from the synchronous input end of the square wave generation circuit of temperature-adjusting circuit, makes both produce certain phase shift again.
Description of drawings
Describe the present invention below in conjunction with accompanying drawing and example:
Fig. 1 is that a plurality of points for measuring temperature carry out the temperature control synoptic diagram.
Fig. 2 is the synoptic diagram that temperature-adjusting circuit has extensibility.
Fig. 3 is a temperature control module synoptic diagram of the present invention.
Fig. 4 a and Fig. 4 b have shown the simulation drawing that the thermal field under the embodiment situation distributes.
Fig. 5 is a temperature-adjusting circuit theory diagram of the present invention.
Fig. 6 is the H bridge circuit theory diagram in the temperature-adjusting circuit of the present invention.
Fig. 7 is an embodiments of the invention temperature-adjusting circuit schematic diagram.
Fig. 8 is an embodiments of the invention printed circuit domain.
Fig. 9 is the 2nd embodiment of the present invention, adopts a plurality of thermistor multi-point temperature measurement synoptic diagram.
Figure 10 is the 3rd embodiment of the present invention, adopts star-like connection expansion synoptic diagram.
Figure 11 is the 4th embodiment of the present invention, adopts chain to connect the expansion synoptic diagram.
Embodiment
Fig. 3 has illustrated the installation process of whole temperature control module.At first on heat radiator, come bonding TEC with the higher heat conduction elargol of coefficient of heat conductivity, and on TEC with elargol bonding one deck aluminium flake, and on aluminium flake, open a sulculus, thermistor is placed in the groove, and the coating elargol is to guarantee thermo-contact good between thermistor and aluminium flake.Bonding PLC chip on aluminium flake again, elargol will be coated with evenly, and thin as far as possible.Why adopting elargol, is because the coefficient of heat conductivity of common heat conductive silica gel has only 0.5～2.0W/mK, become the bottleneck of heat radiation, and the coefficient of heat conductivity of elargol is about 20W/mK, far above heat conductive silica gel, can greatly improve heat radiation, the heat-conducting effect of temperature control module.The fixing PCB of temperature-adjusting circuit thereon, and be screwed firmly.Encapsulate with adiabatic plastic casing at last, stablize at the PCB laying temperature and stay an aperture to lay LED light on the LED light place plastic casing, when temperature stabilization during at target temperature value, pilot lamp can light.Get the access of an aperture as power lead in addition again, two apertures are as the IO interface of optical fiber.Note in the plastic casing with outside heat insulation.
Should be specifically noted that contacting of thermistor and TEC.The TEC surface generally is ceramic, and coefficient of heat conductivity is not high, is easy to generate the uneven temperature phenomenon, so need install one deck aluminium flake in the above additional.Thermistor is placed in the sulculus and fills sulculus with the heat conduction elargol is for better thermo-contact.If thermistor and aluminium flake thermo-contact are bad, and module is in refrigerating state, aluminium flake has reached target temperature value, but because thermo-contact is bad, the temperature of thermistor does not also have enough time to lower, and its temperature is higher than aluminium flake, feeds back to think in the temperature-adjusting circuit and do not reach target temperature value, then module can continue cooling, the aluminium flake temperature is dropped to be lower than target temperature; So module needs heating again, and the bad temperature that can make once more of thermo-contact is higher than target temperature, so repeatedly, makes the module temperature be difficult to settle out.The sensitivity that this shows thermistor also needs high as much as possible, and comparatively the thermal time constant of Jing Mi thermistor is less than 200ms.Thermal time constant is defined as thermistor under zero power phase, when environment temperature by a specified temp during to the sudden change of another specified temp, thermistor change in resistance 63.2% required time.
Also should be noted that simultaneously the heat dissipation problem of module.If the module heat dissipating effect is bad, in the process of refrigeration, can cause the chill surface temperature of TEC to raise, feed back to temperature-adjusting circuit the refrigeration electric current is further strengthened, thereby cause TEC chill surface temperature further to raise, cause temperature control to lose efficacy so repeatedly.
The PLC chip is 3 * 3cm in the present embodiment, and the TEC sheet of use is 4 * 4cm, and the pcb board of making is 5 * 4cm, and the aluminium flake on TEC surface is the same with pcb board big, also is 5 * 4cm, and used heat radiator is 7 * 6cm.
Fig. 4 a and Fig. 4 b have shown that the thermal field under (temperature control module) this embodiment situation distributes, and can see that the steady state thermal field distribution is very even, and whole PLC chip temperature consistance is fine, has good heat radiation, heat-conducting effect.Thermal field simulation drawing when Fig. 4 a is embodiments of the invention temperature control module refrigeration.
Thermal field simulation drawing when Fig. 4 b is this clearly demarcated embodiment temperature control module heating.
Fig. 5 has represented the theory diagram of temperature-adjusting circuit of the present invention.A complete temperature-adjusting circuit comprises three parts:
1. import correct measurement target temperature of amplifier stage and the difference between the object actual temperature accurately for one.
2. equalizing network makes temperature control stable and can optimize temperature control speed.
3. big electric current output stage.Because output current is bigger,, make the heat that produces because of power dissipation minimum so must improve the efficient of temperature-adjusting circuit.
In addition, for the PLC temperature-adjusting circuit, its supply voltage should be controlled at below the 4V, avoids bigger power consumption, and has indication when temperature reaches target temperature.
The differential temperature survey amplifier section is made up of electric bridge and amplifier that a negative tempperature coefficient thermistor and three resistance constitute.These three resistance need adopt precision resistance, and its resistance is the resistance of NTCR when target temperature.
The PID control section is controlled pwm control circuit and a linear amplifier circuit by pid control circuit.Pwm control circuit is used for controlling the metal-oxide-semiconductor driving circuit, and the metal-oxide-semiconductor driving circuit is controlled the sense of current by TEC by H bridge circuit shown in Figure 6, makes TEC produce the effect of heating, refrigeration, and linear amplifier circuit is then controlled the size by the TEC electric current.Feed back to the PID control circuit by the differential temperature survey amplifying circuit then, form a backfeed loop.By this backfeed loop, make temperature stabilization at last at target temperature value.In automatic control system, total hope has higher quality under stable working condition, and promptly temperature control speed is fast, overshoot is little, number of oscillations is few.The component parameters of adjusting pid control circuit is a difficult point, responded not have over control when slow, but it is long to arrive the required time of target temperature, will produce a lot of error codes in optical communication, does not meet the standard of optical communication system; Respond and then have over control when too fast, can near damped oscillation target temperature, need the long period could arrive target temperature equally, also be worthless.Therefore need constantly to adjust component parameters until the evaluation criterion that meets corresponding control system.
The H bridge circuit adopts the metal-oxide-semiconductor of low source leakage conductance energising resistance to constitute, and can improve electric bridge efficient like this, reduces power consumption.The metal-oxide-semiconductor driving circuit makes Q1, and the conducting of Q4 pipe realizes the forward power supply of TEC; Q2, then oppositely power supply in the time of the Q3 conducting; Then stop power supply when all ending.Driving circuit be also noted that set conducting and end between time-delay, prevent that conducting simultaneously is short-circuited and burns out metal-oxide-semiconductor.Improve the temperature control effect of circuit, an end of H bridge circuit need insert a L-C filtering circuit and come filtering PWM square wave switching frequency, makes the voltage that drives TEC stable.There is a relational expression between output ripple electric current and inductance parameters, PWM dutycycle and switching frequency:
Δ I
LBe ripple current, V
DDBe the temperature-adjusting circuit supply voltage, D is the dutycycle of PWM square wave, f
CLKIt is the clock frequency of square wave.Because it is bigger to drive the electric current of TEC, the maximum current of inductance needs to reach 1.5A at least, in order to improve electric bridge efficient, needs to select the less inductance of equivalent resistance.By selecting suitable parameters, actual measurement is passed through the voltage ripple of TEC less than ± 0.5%.
Adopt more powerful TEC can strengthen the temperature control scope of temperature control module, but can cause two problems thus.The one, by the increase of TEC electric current, can increase the power consumption of whole temperature control module, thereby need the heat dissipation problem of the chip of the whole module of solution, burn to prevent chip overheating.The more important thing is the temperature control scope and the temperature control speed that adopt powerful TEC can improve temperature control module, but the precision of temperature control is reduced, and the precision of temperature control is an index important in the optical communication system.Need select the TEC of appropriate power by this compromise consideration of temperature control scope, temperature control speed, temperature-controlled precision and power consumption.Because temperature variation is comparatively slow in the practical application, 0～70 ℃ temperature control scope has satisfied most needs of using, therefore should select to satisfy the TEC of the minimum power of above-mentioned requirements, to improve temperature-controlled precision as much as possible.
Fig. 7 and Fig. 8 have represented design circuit theory diagrams and final PCB domain under Printed Circuit Board Design software Pro tel.
Embodiment 2:
When the chip area of temperature control is big, its temperature homogeneity and unlike the present invention, show among the embodiment so good, but still wish to realize temperature control with a temperature-adjusting circuit, can take the mode of multi-point temperature measurement as shown in Figure 9 at this moment.Thermistor should distribute according to the thermal field of simulation, evenly puts the true medial temperature that obtains chip surface at high temperature and low warm spot.Thermistor can be taked to connect or mode in parallel.As shown in Figure 9, adopted 5 thermistors altogether, if employing is the mode of polyphone, then the resistance of three of the temperature survey amplifier section precision resistances should change original 5 times into; If what adopt is mode in parallel, then the resistance of those three precision resistances should change into originally 1/5, can come thermometric according to the medial temperature of chip surface like this.
Embodiment 3 and embodiment 4:
When optical communication system is expanded, have other chip of light waveguide to need and original chip controls when uniform temp, or chip area is bigger, bad by the temperature field simulation temperature homogeneity, when not reaching the requiring of application, at this moment need to adopt Figure 10 and mode shown in Figure 11 to expand temperature-adjusting circuit.The synchronous output end of master control circuit temperature square wave generation circuit is connected to from the synchronous input end of the square wave generation circuit of temperature-adjusting circuit, make both that certain phase difference is arranged again, be to jump like this for fear of there being the temperature-adjusting circuit square wave generation circuit to go up simultaneously, thereby cause the supply voltage of power supply to produce extra ripple, and then reduce the precision of temperature control.When adopting star-like connection as shown in figure 10, have four temperature-adjusting circuits, should be set to 90 °, 180 ° and 270 ° to three phase deviations respectively from the square wave generation circuit of temperature-adjusting circuit, the square wave generation circuit of such four temperature-adjusting circuits has identical phase differential, can make power supply more stable.When adopting chain connection as shown in figure 11, each phase deviation unification from the square wave generation circuit of temperature-adjusting circuit is set to 90 °, can guarantee that so also the square wave generation circuit of these four temperature-adjusting circuits has identical phase differential.
Claims (10)
1. a temperature control method that is used for large area planar light wave circuit comprises the steps:
(1) for the mode of the bigger waveguide chip employing multi-point temperature measurement of area,, lays a plurality of points for measuring temperature, carry out temperature control according to each point for measuring temperature temperature average according to the thermal field distribution on analog chip surface;
(2) for the bigger waveguide chip of area, higher or to the uniformity requirement of temperature because the communication system expansion, the situation that the requirement of polylith chip is worked under uniform temp can adopt the mode of polylith control circuit multi-point temperature measurement, chip surface thermal field according to simulation distributes, and lays a plurality of points for measuring temperature and electrothermal refrigeration sheet.
2. the temperature control method of large area planar light wave circuit as claimed in claim 1 is characterized in that, a plurality of points for measuring temperature adopt the mode thermometric of a plurality of thermistors with series connection or parallel connection.
3. temperature-adjusting circuit that is used for large area planar light wave circuit, it is characterized in that, temperature-adjusting circuit mainly is made up of differential temperature survey amplification, proportional integral derivative control loop, square wave generation circuit, pulse-width modulation circuit, these five parts of electric current output circuit, the differential temperature survey amplifying circuit is connected in proportional integral derivative control loop and pulse-width modulation circuit, and pulse-width modulation circuit is connected in electric current output circuit by driving circuit.
4. a temperature control module that is used for large area planar light wave circuit is characterized in that, by temperature-adjusting circuit, thermistor, electrothermal refrigeration sheet, heat radiator, and lagging casing forms, lagging casing is used for reducing ambient temperature to controlling Temperature Influence.
5. the temperature-adjusting circuit that is used for large area planar light wave circuit as claimed in claim 3 is characterized in that, large area planar light wave circuit, its area greater than 1 square centimeter, comprise the optical passive component and the various waveguide of the integrated class in plane.
6. the temperature-adjusting circuit that is used for large area planar light wave circuit as claimed in claim 3 is characterized in that, the differential temperature survey amplifier section is made up of electric bridge and amplifier that a negative tempperature coefficient thermistor and three precision resistances constitute.
7. the temperature-adjusting circuit that is used for large area planar light wave circuit as claimed in claim 3, it is characterized in that, proportional integral derivative control loop control control circuit for pulse-width modulation and a linear amplifier circuit, control circuit for pulse-width modulation is used for controlling the metal-oxide-semiconductor driving circuit.
8. the temperature-adjusting circuit that is used for large area planar light wave circuit as claimed in claim 3 is characterized in that, electric current output circuit adopts the H bridge circuit to realize the forwards/reverse conducting of electrothermal refrigeration sheet, thereby realizes the effect of heating and refrigeration.
9. the temperature-adjusting circuit that is used for large area planar light wave circuit as claimed in claim 3 is characterized in that, the expansion of polylith temperature-adjusting circuit is expanded by the square wave generation circuit synchronous output end of master control circuit temperature.
10. the temperature control module that is used for large area planar light wave circuit as claimed in claim 4, it is characterized in that, the combination of electrothermal refrigeration sheet, heat radiator and planar light wave circuit chip, all adopt the higher heat conduction elargol bonding of thermal conductivity, and adopt stack to come reduced volume as far as possible in the plane normal direction.
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| Application Number | Priority Date | Filing Date | Title |
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| CNB2005100869003A CN100524138C (en) | 2005-11-17 | 2005-11-17 | Temperature-controlled method and module for large area planar light wave circuit |
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| CNB2005100869003A CN100524138C (en) | 2005-11-17 | 2005-11-17 | Temperature-controlled method and module for large area planar light wave circuit |
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| CN1967427A true CN1967427A (en) | 2007-05-23 |
| CN100524138C CN100524138C (en) | 2009-08-05 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101592961B (en) * | 2008-05-26 | 2012-02-15 | Ls产电株式会社 | Temperature control module and method thereof |
| CN106787735A (en) * | 2017-03-02 | 2017-05-31 | 成都优博创通信技术股份有限公司 | H bridges TEC controls circuit |
| CN107678113A (en) * | 2017-11-10 | 2018-02-09 | 江苏天兴光电科技有限公司 | A kind of good PLC shunts of thermal diffusivity |
| CN108255211A (en) * | 2017-12-29 | 2018-07-06 | 北京国科世纪激光技术有限公司 | A kind of TEC refrigerating plants |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86206532U (en) * | 1986-11-21 | 1987-11-07 | 唐骐 | Refrigerator temp. display and controller |
| WO2003058368A1 (en) * | 2002-01-08 | 2003-07-17 | Photon-X, Inc. | Temperature controller module |
| CN1181420C (en) * | 2003-05-23 | 2004-12-22 | 华中科技大学 | High-precision temperature control circuit for thermoelectric cooler |
| CN1297070C (en) * | 2003-05-29 | 2007-01-24 | 凹凸电子（武汉）有限公司 | Two-directional loading driving circuit without zero crossover current wave |
-
2005
- 2005-11-17 CN CNB2005100869003A patent/CN100524138C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101592961B (en) * | 2008-05-26 | 2012-02-15 | Ls产电株式会社 | Temperature control module and method thereof |
| CN106787735A (en) * | 2017-03-02 | 2017-05-31 | 成都优博创通信技术股份有限公司 | H bridges TEC controls circuit |
| CN107678113A (en) * | 2017-11-10 | 2018-02-09 | 江苏天兴光电科技有限公司 | A kind of good PLC shunts of thermal diffusivity |
| CN108255211A (en) * | 2017-12-29 | 2018-07-06 | 北京国科世纪激光技术有限公司 | A kind of TEC refrigerating plants |
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| Publication number | Publication date |
|---|---|
| CN100524138C (en) | 2009-08-05 |
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