CN1958849A - Technical method for alloying surface of pure copper based plates - Google Patents

Technical method for alloying surface of pure copper based plates Download PDF

Info

Publication number
CN1958849A
CN1958849A CN 200610048372 CN200610048372A CN1958849A CN 1958849 A CN1958849 A CN 1958849A CN 200610048372 CN200610048372 CN 200610048372 CN 200610048372 A CN200610048372 A CN 200610048372A CN 1958849 A CN1958849 A CN 1958849A
Authority
CN
China
Prior art keywords
pill
rolling
pure copper
copper based
based plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN 200610048372
Other languages
Chinese (zh)
Other versions
CN100545315C (en
Inventor
卫英慧
林万明
侯利锋
杜华云
杨海燕
许并社
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyuan University of Technology
Original Assignee
Taiyuan University of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyuan University of Technology filed Critical Taiyuan University of Technology
Priority to CNB2006100483727A priority Critical patent/CN100545315C/en
Publication of CN1958849A publication Critical patent/CN1958849A/en
Application granted granted Critical
Publication of CN100545315C publication Critical patent/CN100545315C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Rolling Contact Bearings (AREA)

Abstract

This invention relates to a process for surface-alloying pure Cu plate. The process comprises: adopting a vibrational pellet-roller, placing surface-polished pure Cu plate in the pellet-rolling chamber of the pellet-roller, utilizing bearing alloy rolling pellets (8 mm in diameter), knocking the surface of the pure Cu plate by irregular jumping and rolling of the rolling pellets under Ar protection with 3000/min vibration frequency, and permeating the bearing alloy molecules into the surface of the pure Cu plate to achieve surface-alloying of the pure Cu plate. The alloy layer has no interface with the Cu matrix, thus such phenomena as cracking, crimping and flaking do not occur. The alloyed surface has Cr content of 8.51% and Fe content of 80.99%, and has improved surface strength and hardness (3.2 GPA). After annealing, the inner structure is compact and stable. The method has such advantages as few devices, simple process and no pollution.

Description

A kind of processing method of alloying surface of pure copper based plates
Technical field
The present invention relates to a kind of processing method of alloying surface of pure copper based plates, belong to the technical field of non-ferrous metal copper substrate surface crystal grain nanometer, alloyage process.
Background technology
Nano material is by crystal, quasicrystal, the noncrystal composition, its elementary cell in the size of one dimension direction less than 100nm, be present in metallic substance, inorganic materials, macromolecular material, atom in the nanocrystal is positioned on the lattice position and crystal boundary of crystal grain inside, nano crystal material has the high-density interface, in grain-size is in the nanocrystalline metal of 1-10nm, and crystal boundary density can reach 10 25m -3, nanocrystal is owing to crystalline grains ultra, and a large amount of atoms are on the crystal boundary of intergranule, show physicals, mechanical property and the mechanical property of a series of excellences, for example high purity, high flow, high specific heat, high heat expansion etc.
Metal nano material is machinery manufacturing industry and the most noticeable type material of high-tech area, in ferrous metal and non-ferrous metal, all there is multiple metal nano material to be employed, in non-ferrous metal, fine copper sheet material is non-ferrous metal the most commonly used, because it has good electrical conductivity, erosion resistance, often by the first-selected use of mechanotronic, but because its quality is soft, intensity is low, hardness is not high, oxidation-resistance is poor, in industrial application, often be subjected to great limitation, can't use as high-strength material, surface hardness is low, intensity is low, more can't make high-strength products.
Because the limitation of fine copper sheet material mechanical property, caused the great attention of scientific and technological circle, in order to improve the surface strength of fine copper sheet material, hardness, oxidation-resistance, adopt the kinds of processes method to improve its mechanical property, electroless plating for example, electron beam, laser beam is introduced the metallic surface, make it modification, also has vapour deposition, thermospray, sol-gel method etc., to improve the solidity to corrosion of fine copper sheet material, wear resistance and mechanical and physical performance, but these methods are all not ideal enough, technical deficiency is all arranged, the equipment complexity that has, process cycle is long, seriously polluted, energy consumption is big, the processing cost height, and all can not change the surface strength of fine copper sheet material significantly, the compactness alloying of hardness and surface microstructure.
In the research of fine copper sheet material alloying, the employing two step method that also has, earlier carry out making Nano surface on the surface of copper base, carry out surface alloying again, adopt the microcosmic surface mode of texturing earlier, make copper base interface crystal grain become 30nm by 10um, carrying out surface alloying on the making Nano surface basis again handles, processing sequence is complicated, has both increased work step, working hour, make the surface alloying program discontinuous again, but also can form new interface on the surface, cause cracking, peeling, phenomenon such as peel off, the processing sequence of copper base surface alloying is increased, the alloying effect is not ideal enough.
Summary of the invention
Goal of the invention
Purpose of the present invention is exactly at disadvantages of background technology; adopt a kind of processing method of surface alloying of new copper base material; use pill-rolling physics method; under vacuum state; under rare gas element-argon shield; directly carry out the single stage method Alloying Treatment on the surface of pure copper based plates; making Nano surface and alloying are carried out simultaneously; surface hardness, the intensity of pure copper based plates are greatly improved; make the compactness of surface of pure copper based plates tissue reach alloying level; reach and reduce operation, minimizing pollution, processing continuously, the purpose that a step finishes.
Technical scheme
Equipment, pure copper based plates, raw chemical material that the present invention uses are as follows:
Oscillatory type finisher,pill: main frame, controlling machine
Pure copper based plates: Cu 100 * 100 * 6mm
Bearing metal pill-rolling: GCr15 φ 8mm ± 0.01mm, 300 ± 5 of pill-rolling quantity
Dehydrated alcohol: C 2H 6O 150ml ± 5ml
Argon gas: Ar 4000cm 3± 10cm 3
Processing method is as follows:
(1) selected material, chemical substance
To carry out selectedly to pure copper based plates, pill-rolling, dehydrated alcohol, the argon gas that uses, and carry out shape, size, purity, precision control:
Pure copper based plates: copper content Cu 〉=99.95%, square
Bearing metal pill-rolling: GCr15 chromium content 1.4～1.63%, deviation from spherical form Δ S Ph≤ 0.25 μ m, roughness Ra0.02-0.04 μ m
Dehydrated alcohol: 〉=99.95%
Argon gas: 〉=99.95%
(2) pure copper based plates annealing
Pure copper based plates 100 * 100 * 6mm is placed warm vacuum heat treatment furnace, carry out the starting material anneal;
Annealing temperature: 650 ℃ ± 1 ℃
Annealing time: 120min ± 1min
Eliminate the materials statement in-plane stress, adjust the starting material surface microstructure;
(3) pure copper based plates grinds
The sand paper of pure copper based plates after the annealing with 200,400,600 granularities is ground respectively successively, make working-surface roughness Ra0.16-0.32 μ m;
(4) pure copper based plates mechanical polishing
Pure copper based plates after grinding is polished with mechanical polisher, make surface roughness Ra 0.01-0.02 μ m, polishing back pure copper based plates working-surface becomes minute surface;
(5) clean finisher,pill pill-rolling chamber
Open finisher,pill pill-rolling chamber, add dehydrated alcohol 30ml ± 1ml, scrub pill-rolling chamber interior walls, top cover, bottom, make its cleaning with fine, soft fur;
(6) clean pure copper based plates
Pure copper based plates after grinding, polishing is placed clean container, add dehydrated alcohol 30ml ± 1ml, it is extremely clean to scrub six of sheet materials with fine, soft fur;
(7) bearing cleaning alloy pill-rolling
With 300 ± 5 of bearing metal pill-rollings, place ultrasonic cleaner, add dehydrated alcohol 40ml ± 1ml, stir repeatedly, make the pill-rolling surface cleaning;
(8) pure copper based plates is installed
Pure copper based plates after grinding, polish, cleaning is installed on the top cover of pill-rolling chamber the holding bolt fixation of four bights;
(9) put the bearing metal pill-rolling
300 ± 5 of the bearing metal pill-rollings of φ 8mm ± 0.01mm are placed bottom, pill-rolling chamber, and the volume ratio of pill-rolling and pill-rolling chamber is 1: 25;
(10) close the pill-rolling chamber
The pill-rolling chamber that pure copper based plates, bearing metal pill-rolling are housed is reinforced and sealed with turn-buckle;
(11) the pill-rolling chamber vacuumizes
Pill-rolling chamber air is extracted with vacuum pump, valve tube in the pill-rolling chamber of sealing, make pill-rolling chamber vacuum tightness reach 1 * 10 -3Pa, the pumpdown time is 2min ± 0.2min, and controls its pressure values with vacuum pressure gauge;
(12) the defeated argon gas in pill-rolling chamber
Open the argon bottle tunger tube, to the pill-rolling chamber input rare gas element-argon gas that is in vacuum state, input flow rate is 1500cm 3/ min, be 2min ± 0.01min input time, the pill-rolling constant pressure rises to 1 * 10 by force 2During Pa, close tunger tube;
(13) alloying surface of pure copper based plates
1. open motor, power transfers to 50Hz;
2. open the motor frequency conversion device, drive vibrator, make it vibration, the vibrator vibrational frequency is 50 times/second, 3000 times/minute, and vibrator makes the pill-rolling chamber do all around, regular, at the uniform velocity vibration up and down with vibrator by rocking beam, vibration spring, pull bar;
3. about the indoor pill-rolling of pill-rolling is done with the vibration of vibrator, the irregular rotation in the left and right sides and beating, irregular intermittent cycle bump surface of pure copper based plates is made in pill-rolling;
4. to clash into the surface of pure copper based plates time under argon gas atmosphere be 30min ± 0.5min in pill-rolling, in the process of pill-rolling bump plate surface, bearing metal pill-rolling molecular physics penetrates into plate surface, and accumulation, when bearing metal molecule depth of penetration is 20 μ m ± 0.5 μ m, promptly finished alloying surface of pure copper based plates;
5. in the process of pill-rolling bump surface of pure copper based plates, the pill-rolling chambers temp rises to 80 ℃ ± 3 ℃ by 20 ℃ ± 3 ℃ of normal temperature, and by thermometer displays temperature value, it is 20min ± 0.5min that temperature continues the constant time;
(14) cooling
After the alloying surface of pure copper based plates operation is finished, disable motor, vibrator, the pill-rolling chamber under argon shield, makes it naturally cool to 20 ℃ ± 3 ℃ under sealed state, and be 120min cooling time;
(15) take out product
Open the pill-rolling chamber of sealing shape after the cooling, the pure copper based plates after the taking-up alloying places the environment of drying, cleaning;
(16) alloying after annealing
To carry out vacuum annealing to the pure copper based plates of alloying and handle, 500 ℃ ± 1 ℃ of annealing temperature, annealing time is 360min ± 1min, the distribution that becomes band of annealing back alloying condition of surface;
(17) detect, analyze, characterize
Will carry out intensity, hardness, the degree of depth, area, alloying constituent, content, color and luster to the alloying layer surface of the pure copper based plates after the annealing and profile tomography detects, analyzes and characterize;
With x-ray diffractometer surface tissue and composition are analyzed;
With transmission electron microscope microtexture is analyzed;
Carry out the surface topography analysis with scanning electron microscope;
(18) store
Will be stored in the special container the pure copper based plates behind the surface alloying, storing temp is 20 ℃ ± 3 ℃, and relative humidity≤40% places the environment of drying, cleaning, waterproof, protection against the tide, anti-oxidation, anti-soda acid to corrode.
Described alloying surface of pure copper based plates is to finish under the oscillatory regime of finisher,pill, and the frequency of finisher,pill vibrator is 50 times/s, 3000 times/min, and duration of oscillation is 30min ± 0.5min, and the pill-rolling chamber is done the top to bottom, left and right, front and rear regularity and at the uniform velocity vibrated.
Described alloying surface of pure copper based plates is that the bearing metal pill-rolling is done vibration and beated and rotate in the pill-rolling chamber, and bump surface of pure copper based plates, the bump form is irregular intermittent cycle bump, the bearing metal molecular physics of pill-rolling penetrates into plate surface and accumulation, and depth of penetration is 20 μ m ± 0.5 μ m.
Described alloying surface of pure copper based plates is to finish under the whole process protection of rare gas element-argon gas, and input flow rate is 1500cm 3/ min, be 2min ± 0.01min input time, the pressure values of pill-rolling chamber in argon gas atmosphere is 1 * 10 2Pa.
The bearing metal pill-rolling diameter of described alloying surface of pure copper based plates is φ 8mm ± 0.01mm, surface roughness Ra 0.02-0.04 μ m, deviation from spherical form Δ S Ph≤ 0.25 μ m, quantity is 300 ± 5, the total amount volume of pill-rolling number is 1: 25 with the ratio of the volume of pill-rolling chamber.
Beneficial effect
The present invention compares with background technology has tangible advance; it has adopted new technical process; use the oscillatory type finisher,pill; place the pill-rolling of finisher,pill indoor pure copper based plates; with diameter is the bearing metal GCr15 pill-rolling of φ 8mm; under rare gas element-argon gas whole process protection; in oscillation frequency is under the vibration of 3000 times/min; the indoor pill-rolling of pill-rolling is done irregular circulation up and down and is beated and rotate; the surface of pure copper based plates of bump mirror-like; bearing metal molecule physical property in the process of bump penetrates into the mirror-like surface of pure copper based plates; directly single stage method is finished alloying surface of pure copper based plates; do not need to carry out earlier the making Nano surface of pure copper based plates; carry out alloying again; but nanometer and alloying are carried out simultaneously; make the compactness of surface of pure copper based plates reach alloying level; surface hardness can reach 3.2GPa; the surface chrome content can reach 8.51%; iron-holder can reach 80.99%; surface strength; hardness; wear resistance; solidity to corrosion has all obtained increasing substantially; single stage method is infiltrated and has been overcome the defective that two step method is infiltrated; surface of pure copper based plates is nanocrystalline after the alloying; there is not new interface between alloying layer and the matrix; cracking can not appear; peeling; phenomenon such as peel off; all carry out the anneal under the vacuum state before and after the pure copper based plates alloying; eliminated the internal stress of sheet material effectively; stablized the interior tissue after the pure copper based plates alloying; and the compactness that makes its interior tissue has kept constant; this processing method uses equipment few; operation is simplified; processing ease; free from environmental pollution; mechanical property behind the alloying surface of pure copper based plates; physicals is very good; can use at multiple industrial circle, be the processing method of very good alloying surface of pure copper based plates.
Description of drawings
Fig. 1 is a process flow sheet
Fig. 2 changes the coordinate graph of a relation for the pill-rolling chambers temp
Fig. 3 is the finisher,pill front view
Fig. 4 is the finisher,pill front view that removes loam cake
Fig. 5 is the finisher,pill vertical view that removes loam cake
Fig. 6 is a pill-rolling chamber front view
Fig. 7 is a pill-rolling chamber vertical view
Fig. 8 is the A-A sectional view of Fig. 6
Fig. 9 is the controlling machine front view
Figure 10 is the scanning electron microscope diagram of pure copper based plates profile after the alloying
Figure 11 is surface of pure copper based plates transmission electron microscope figure after the alloying
Figure 12 is the diffraction contrast collection of illustrative plates of surface of pure copper based plates before and after the alloying
Figure 13 is a pure copper based plates alloying rear surface alloy content combination distribution table
Shown in the figure, the code name inventory is as follows:
1, shotblasting machine, 2, controlling machine, 3, universal wheel, 4, universal wheel, 5, gusset plate, 6, vacuum pressure gauge, 7, the argon gas table, 8, the vacuum key, 9, the argon gas key, 10, temperature controller, 11, thermometer, 12, timing register, 13, reset key, 14, the rotating knob, 15, rapid stop key, 16, the work indication, 17, the power supply indication, 18, frequency transformer, 19, internal lock, 20, vacuum exhaust, 21, the argon gas exhaust, 22, warning light, 23, base, 24, back header, 25, motor, 26, vibrator, 27, wheel abrator cabinet, 28, wheel abrator cabinet, 29, pull bar, 30, draw-bar seat, 31, draw-bar seat, 32, clamp, 33, pole, 34, pole, 35, rocking beam, 36, the vibration seat, 37, the vibration seat, 38, the vibration spring, 39, the vibration spring, 40, spring abutment, 41, spring abutment, 42, prop up dish, 43, prop up dish, 44, vacuum port, 45, vacuum port, 46, valve tube, 47, valve tube, 48, the argon gas mouth, 49, the argon gas mouth, 50, tunger tube, 51, tunger tube, 52, electric motor clutch, 53, the vibration seat, 54, the vibration seat, 55, rocking beam, 56, tie rod hole, 57, the shot-peening chamber, 58, shot-peening, 59, supporting plate, 60, copper base, 61, fixed block, 62, holding bolt, 63, pitman shaft, 64, pitman shaft, 65, top cover, 66, operation board, 67, spring abutment, 68, spring abutment, 69, the vibration spring, 70, the vibration spring, 71, pole, 72, pole, 73, prop up dish, 74, prop up dish, 75, power key, 76 start keys.
Embodiment
The present invention will be further described below in conjunction with accompanying drawing:
Shown in Figure 1, be process method flow chart, each preparation parameter is wanted strict control, operation according to the order of sequence.
Want strict selected to preparing required pure copper based plates, bearing metal pill-rolling, dehydrated alcohol, argon gas, and carry out shape, size, purity, precision, roughness, circularity control, to guarantee the high precision of processing method.
The existing protective atmosphere of inert protective gas-argon gas has the effect of driving away other obnoxious flavoures again, so operational throughput must be sufficient, and guarantees that its pill-rolling chamber pressure values is 1 * 10 2Pa, and can guarantee to descend in working order the alloying surface not oxidized.
To grind before the pure copper based plates alloying, mechanical polishing, make any surface finish, roughness reaches minute surface, surfaceness requires Ra0.01-0.02 μ m, finishes the infiltration of bearing metal molecule to guarantee in alloying process single stage method.
The pill-rolling chamber of finisher,pill, pure copper based plates, bearing metal pill-rolling will be cleaned respectively with dehydrated alcohol, make its cleaning.
The ratio of the volume of bearing metal pill-rolling quantity and the volume of pill-rolling chamber is 1: 25, do irregular circulation and beat and rotate in that pill-rolling is indoor to guarantee pill-rolling, and certain space arranged, pill-rolling too much can influence beating the cycle of pill-rolling, cross that I haven't seen you for ages and cause the collision frequency of pill-rolling to reduce, the pill-rolling diameter is good with φ 8mm, also visual alloying requirement, select φ 4mm, φ 6mm pill-rolling for use, the also visual alloying of its pill-rolling material requires to select for use other alloys.
The vibration of finisher,pill vibrator is crucial, strict oscillation frequency with Frequency Converter Control motor revolution and vibrator, is good with 50 times/s, 3000 times/min, and also variation is adjusted in the requirement of visual alloying.
The pill-rolling of pill-rolling chamber temperature in alloying process will raise, and can rise to 80 ℃ ± 3 ℃ by 20 ℃ ± 3 ℃, after preparation is finished, naturally cool to 20 ℃ ± 3 ℃ under argon shield, opens the pill-rolling chamber again, takes out the pure copper based plates after the alloying.
The value of the pure copper based plates that this processing method is used, bearing metal pill-rolling, dehydrated alcohol, argon gas is the value in the test, when industrialization is produced, will adopt new value in proportion.
Shown in Figure 2, be temperature variation coordinate diagram in the alloying process of pill-rolling chamber, temperature is warming up to 80 ℃ ± 3 ℃ by 20 ℃ ± 3 ℃, and then is cooled to 20 ℃ ± 3 ℃, cooling time 120min, the A-B interval is temperature duration 20min ± 0.5min.
Fig. 3,4, shown in 5, be the finisher,pill structure iron, the profile bottom of finisher,pill 1 is a universal wheel 3, the centre is a gusset plate 5, top is back header 24, warning light 22, the inner bottom part of finisher,pill is a base 23, spring abutment 40 is equipped with in four bights of base 23 respectively, 41,67,68, vibration spring 38,39,69,70, vibration seat 36,37,53,54, vibration seat 36,37,53, pole 33 is equipped with on 54 tops respectively, 34,71,72, prop up dish 42,43,73,74, vibration seat 36,37,53, it between 54 rocking beam 35,55, vibrator 26 is equipped with at the middle part of base 23, vibrator 26 connects motor 25 by clutch coupling 52, the both ends of vibrator 26 connect rocking beam 35,55, the middle part of vibrator 26 connects pull bar 29, pull bar 29 connects pill-rolling chamber 27,28, pill-rolling chamber 27,28 by pitman shaft 63,64 with vibration seat 36,37,53,54 connect, pill-rolling chamber 27,28 by valve tube 46,47, vacuum port 44,45 connect with vacuum pump, pill-rolling chamber 27,28 by tunger tube 50,51, argon gas mouth 48,49 connect with argon bottle, and finisher,pill 1 connects with controlling machine 2 by lead.
Shown in Fig. 6,7,8, be pill-rolling chamber 27,28 structure iron, pill-rolling chamber 27,28 is whole cylinder barrel shaped, top is top cover 65, draw-bar seat 30, vacuum port 44, argon gas mouth 48 are arranged on the top cover 65, between pill-rolling chamber and the top cover 65 by four symmetrically arranged clamp 32 fixing seals, pill-rolling chamber 27,28 internal upper parts have supporting plate 59, and connecting draw-bar seat 30, supporting plate 59 bottoms are pure copper based plates 60, and by fixed block 61, four holding bolts 62 are fixing, pill-rolling chamber 27,28 is inner for pill-rolling chamber 57, pill-rolling 58 is arranged in the pill-rolling chamber 57, and be in the argon gas atmosphere.
Shown in Figure 9, be controlling machine 2 front views, top is operation board 66, it is vacuum exhaust key 20, argon gas exhausting key 21, power key 75, start key 76 that operation board 66 is arranged side by side vacuum pressure gauge 6, argon gas table 7, vacuum key 8, argon gas key 9, temperature controller 10, thermometer 11, timing register 12, reset key 13, rotating knob 14, rapid stop key 15, relay indicating light 17, frequency transformer 18, middle part, the bottom is an internal lock 19, the bottom is a universal wheel 4, and controlling machine 2 connects control by lead with finisher,pill 1.
Shown in Figure 10, be that the profile scanning electronic microscope is amplified 1000 times of alloy distribution figure behind the alloying surface of pure copper based plates, among the figure as can be known: alloying element is irregular infiltration at surface of pure copper based plates, and alloying depth is 20 μ m, ruler units 100 μ m.
Shown in Figure 11, for alloying surface of pure copper based plates rear surface transmission electron microscope amplifies 50,000 times surface topography map, among the figure as can be known: alloying surface microstructure mean sizes is 30nm, and ruler units is 200nm.
Shown in Figure 12, be diffracted intensity collection of illustrative plates after the pure copper based plates alloying, ordinate zou is the relative intensity index, X-coordinate be diffraction angle 2 θ (°), among the figure as can be known: after the surface of pure copper based plates Nanoalloyization, grain refining, average grain size is 30nm, and have new diffraction peak to occur, alloying is obvious.
Shown in Figure 13, be alloy content combination distribution table behind the alloying surface of pure copper based plates, in the table as can be known: iron level is 80.99%, and chromium content is 8.51%, and nickel content is 4.865%, and copper content is 5.635%, and its hardness, intensity obviously increase.

Claims (5)

  1. The processing method of 1 one kinds of alloying surface of pure copper based plates is characterized in that: equipment, pure Cu substrate, raw chemical material that the present invention uses are as follows:
    Oscillatory type finisher,pill: main frame, controlling machine
    Pure copper based plates: Cu 100 * 100 * 6mm
    Bearing metal pill-rolling: GCr15 φ 8mm ± 0.01mm, 300 ± 5 of pill-rolling quantity
    Dehydrated alcohol: C 2H 6O 150ml ± 5ml
    Argon gas: Ar 4000cm 3± 10cm 3
    Processing method is as follows:
    (1) selected material, chemical substance
    To carry out selectedly to pure copper based plates, pill-rolling, dehydrated alcohol, the argon gas that uses, and carry out shape, size, purity, precision control:
    Pure copper based plates: copper content Cu 〉=99.95%, square
    Bearing metal pill-rolling: GCr15 chromium content 1.4～1.63%, deviation from spherical form Δ S Ph≤ 0.25 μ m, roughness Ra0.02-0.04 μ m
    Dehydrated alcohol: 〉=99.95%
    Argon gas: 〉=99.95%
    (2) pure copper based plates annealing
    Pure copper based plates 100 * 100 * 6mm is placed warm vacuum heat treatment furnace, carry out the starting material anneal;
    Annealing temperature: 650 ℃ ± 1 ℃
    Annealing time: 120min ± 1min
    Eliminate the materials statement in-plane stress, adjust the starting material surface microstructure;
    (3) pure copper based plates grinds
    The sand paper of pure copper based plates after the annealing with 200,400,600 granularities is ground respectively successively, make working-surface roughness Ra0.16-0.32 μ m;
    (4) pure copper based plates mechanical polishing
    Pure copper based plates after grinding is polished with mechanical polisher, make surface roughness Ra 0.01-0.02 μ m, polishing back pure copper based plates working-surface becomes minute surface;
    (5) clean finisher,pill pill-rolling chamber
    Open finisher,pill pill-rolling chamber, add dehydrated alcohol 30ml ± 1ml, scrub pill-rolling chamber interior walls, top cover, bottom, make its cleaning with fine, soft fur;
    (6) clean pure copper based plates
    Pure copper based plates after grinding, polishing is placed clean container, add dehydrated alcohol 30ml ± 1ml, it is extremely clean to scrub six of sheet materials with fine, soft fur;
    (7) bearing cleaning alloy pill-rolling
    With 300 ± 5 of bearing metal pill-rollings, place ultrasonic cleaner, add dehydrated alcohol 40ml ± 1ml, stir repeatedly, make the pill-rolling surface cleaning;
    (8) pure copper based plates is installed
    Pure copper based plates after grinding, polish, cleaning is installed on the top cover of pill-rolling chamber the holding bolt fixation of four bights;
    (9) put the bearing metal pill-rolling
    300 ± 5 of the bearing metal pill-rollings of φ 8mm ± 0.01mm are placed bottom, pill-rolling chamber, and the volume ratio of pill-rolling and pill-rolling chamber is 1: 25;
    (10) close the pill-rolling chamber
    The pill-rolling chamber that pure copper based plates, bearing metal pill-rolling are housed is reinforced and sealed with turn-buckle;
    (11) the pill-rolling chamber vacuumizes
    Pill-rolling chamber air is extracted with vacuum pump, valve tube in the pill-rolling chamber of sealing, make pill-rolling chamber vacuum tightness reach 1 * 10 -3Pa, the pumpdown time is 2min ± 0.2min, and controls its pressure values with vacuum pressure gauge;
    (12) the defeated argon gas in pill-rolling chamber
    Open the argon bottle tunger tube, to the pill-rolling chamber input rare gas element-argon gas that is in vacuum state, input flow rate is 1500cm 3/ min, be 2min ± 0.01min input time, the pill-rolling constant pressure rises to 1 * 10 by force 2During Pa, close tunger tube;
    (13) alloying surface of pure copper based plates
    1. open motor, power transfers to 50Hz;
    2. open the motor frequency conversion device, drive vibrator, make it vibration, the vibrator vibrational frequency is 50 times/second, 3000 times/minute, and vibrator makes the pill-rolling chamber do all around, regular, at the uniform velocity vibration up and down with vibrator by rocking beam, vibration spring, pull bar;
    3. about the indoor pill-rolling of pill-rolling is done with the vibration of vibrator, the irregular rotation in the left and right sides and beating, irregular intermittent cycle bump surface of pure copper based plates is made in pill-rolling;
    4. to clash into the surface of pure copper based plates time under argon gas atmosphere be 30min ± 0.5min in pill-rolling, in the process of pill-rolling bump plate surface, bearing metal pill-rolling molecular physics penetrates into plate surface, and accumulation, when bearing metal molecule depth of penetration is 20 μ m ± 05 μ m, promptly finished alloying surface of pure copper based plates;
    5. in the process of pill-rolling bump surface of pure copper based plates, the pill-rolling chambers temp rises to 80 ℃ ± 3 ℃ by 20 ℃ ± 3 ℃ of normal temperature, and by thermometer displays temperature value, it is 20min ± 0.5min that temperature continues the constant time;
    (14) cooling
    After the alloying surface of pure copper based plates operation is finished, disable motor, vibrator, the pill-rolling chamber under argon shield, makes it naturally cool to 20 ℃ ± 3 ℃ under sealed state, and be 120min cooling time;
    (15) take out product
    Open the pill-rolling chamber of sealing shape after the cooling, the pure copper based plates after the taking-up alloying places the environment of drying, cleaning;
    (16) alloying after annealing
    To carry out vacuum annealing to the pure copper based plates of alloying and handle, 500 ℃ ± 1 ℃ of annealing temperature, annealing time is 360min ± 1min, the distribution that becomes band of annealing back alloying condition of surface;
    (17) detect, analyze, characterize
    Will carry out intensity, hardness, the degree of depth, area, alloying constituent, content, color and luster to the alloying layer surface of the pure copper based plates after the annealing and profile tomography detects, analyzes and characterize;
    With x-ray diffractometer surface tissue and composition are analyzed;
    With transmission electron microscope microtexture is analyzed;
    Carry out the surface topography analysis with scanning electron microscope;
    (18) store
    Will be stored in the special container the pure copper based plates behind the surface alloying, storing temp is 20 ℃ ± 3 ℃, and relative humidity≤40% places the environment of drying, cleaning, waterproof, protection against the tide, anti-oxidation, anti-soda acid to corrode.
  2. 2. the processing method of a kind of alloying surface of pure copper based plates according to claim 1, it is characterized in that: described alloying surface of pure copper based plates is to finish under the oscillatory regime of finisher,pill, the frequency of finisher,pill vibrator is 50 times/s, 3000 times/min, duration of oscillation is 30min ± 0.5min, and erratic behavior at the uniform velocity vibrated before and after the pill-rolling chamber was done up and down.
  3. 3. the processing method of a kind of alloying surface of pure copper based plates according to claim 1, it is characterized in that: described alloying surface of pure copper based plates is that the bearing metal pill-rolling is done vibration and beated and rotate in the pill-rolling chamber, and bump surface of pure copper based plates, the bump form is irregular intermittent cycle bump, the bearing metal molecular physics of pill-rolling penetrates into plate surface and accumulation, and depth of penetration is 20 μ m ± 0.5 μ m.
  4. 4. the processing method of a kind of alloying surface of pure copper based plates according to claim 1, it is characterized in that: described alloying surface of pure copper based plates is to finish under the whole process protection of rare gas element-argon gas, the argon gas input flow rate is 1500cm 3/ min, be 2min ± 0.01min input time, the pressure values of pill-rolling chamber in argon gas atmosphere is 1 * 10 2Pa.
  5. 5. the processing method of a kind of alloying surface of pure copper based plates according to claim 1, it is characterized in that: the bearing metal pill-rolling diameter of described alloying surface of pure copper based plates is φ 8mm ± 0.01mm, surface roughness Ra 0.02-0.04 μ m, deviation from spherical form Δ S Ph≤ 0.25 μ m, quantity is 300 ± 5, the total amount volume of pill-rolling number is 1: 25 with the ratio of the volume of pill-rolling chamber.
CNB2006100483727A 2006-09-27 2006-09-27 A kind of processing method of alloying surface of pure copper based plates Expired - Fee Related CN100545315C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB2006100483727A CN100545315C (en) 2006-09-27 2006-09-27 A kind of processing method of alloying surface of pure copper based plates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2006100483727A CN100545315C (en) 2006-09-27 2006-09-27 A kind of processing method of alloying surface of pure copper based plates

Publications (2)

Publication Number Publication Date
CN1958849A true CN1958849A (en) 2007-05-09
CN100545315C CN100545315C (en) 2009-09-30

Family

ID=38070698

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2006100483727A Expired - Fee Related CN100545315C (en) 2006-09-27 2006-09-27 A kind of processing method of alloying surface of pure copper based plates

Country Status (1)

Country Link
CN (1) CN100545315C (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101787418A (en) * 2010-03-15 2010-07-28 长沙电机厂有限责任公司 Metal material continuous- molding on-line anti-oxidation method and device thereof
CN101591784B (en) * 2009-06-01 2010-11-10 太原理工大学 Mechanical infiltration method for surface alloying of pure iron-based plate
CN103878703A (en) * 2014-03-18 2014-06-25 广州大学 Strengthened grinding method for wear-resisting alloy steel workpiece surface
CN104233181A (en) * 2012-12-18 2014-12-24 太原理工大学 Method for mechanical infiltration of Ni in surface mechanical attrition process of pure Mg-based sheet material
CN104368817A (en) * 2014-10-24 2015-02-25 苏州莱特复合材料有限公司 Copper-based powder metallurgical product surface processing process
CN107299302A (en) * 2016-04-15 2017-10-27 南京理工大学 A kind of method for improving metal gradient structural strength and plasticity matching degree

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4272570A (en) * 1980-04-11 1981-06-09 Sunbeam Corporation Provision of surface layers of copper or copper alloyed with zinc on die castings of zinc or zinc alloys

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101591784B (en) * 2009-06-01 2010-11-10 太原理工大学 Mechanical infiltration method for surface alloying of pure iron-based plate
CN101787418A (en) * 2010-03-15 2010-07-28 长沙电机厂有限责任公司 Metal material continuous- molding on-line anti-oxidation method and device thereof
CN104233181A (en) * 2012-12-18 2014-12-24 太原理工大学 Method for mechanical infiltration of Ni in surface mechanical attrition process of pure Mg-based sheet material
CN103878703A (en) * 2014-03-18 2014-06-25 广州大学 Strengthened grinding method for wear-resisting alloy steel workpiece surface
CN103878703B (en) * 2014-03-18 2016-03-02 广州大学 A kind of strengthening Ginding process of antifriction alloy steel workpiece surface
CN104368817A (en) * 2014-10-24 2015-02-25 苏州莱特复合材料有限公司 Copper-based powder metallurgical product surface processing process
CN104368817B (en) * 2014-10-24 2016-09-14 宁夏鸿裕机械科技有限公司 A kind of process of surface treatment of copper-base powder metallurgy part
CN107299302A (en) * 2016-04-15 2017-10-27 南京理工大学 A kind of method for improving metal gradient structural strength and plasticity matching degree
CN107299302B (en) * 2016-04-15 2020-02-28 南京理工大学 Method for improving metal gradient structure strength and plasticity matching degree

Also Published As

Publication number Publication date
CN100545315C (en) 2009-09-30

Similar Documents

Publication Publication Date Title
CN1958849A (en) Technical method for alloying surface of pure copper based plates
CN107523740B (en) CuCrFeNiTi high-entropy alloy material and preparation method thereof
CN104511595B (en) A kind of preparation method of high-purity titanium valve
CN104846229B (en) A kind of preparation method of granule enhancement type aluminium alloy base high-abrasive material
CN108660352A (en) A kind of enhanced AlCoCrFeNi2The preparation method and application of high-entropy alloy-base neutron absorber material
CN102703853B (en) Surface strengthening method for titanium alloy
CN112195420B (en) Method for preparing wear-resistant Ti-based amorphous alloy block through cold treatment
CN1705761A (en) Alloy containing rare earth element, production method thereof, magnetostrictive device, and magnetic refrigerant material
CN108950560A (en) The two-sided heat-resisting composite polycrystal-diamond of one kind and its preparation process
CN101650274A (en) High pass tissue grinder and grinding method
CN107699830B (en) Method that is a kind of while improving industrially pure titanium intensity and plasticity
CN1876896A (en) Boron-Chromium-rare earth co-infiltration process combined with pre-infiltration cold deformation for workpiece
CN1710153A (en) Method for preparing zinc oxide hollow four-foot whisker beam
CN108823448A (en) A kind of nanometer SiC reinforced aluminum base composite material and preparation method thereof
Zhai et al. Effect of Si content on microstructure and properties of Si/Al composites
CN1970825A (en) Surface low-temperature boriding process for hot-work die steel
CN112553517B (en) Preparation method and process of wear-resistant CrMoNiTaHfW high-entropy alloy
CN104232961B (en) A kind of high-strength height hard Cu-Cr composite and its preparation method and application
CN101591784B (en) Mechanical infiltration method for surface alloying of pure iron-based plate
CN111606711B (en) Polycrystal B 4 C-SiC double-layer composite material and preparation method thereof
CN105568023A (en) Preparation method for Al6Mn quasicrystal
CN108190880B (en) A kind of preparation method of graphite composite powder and its graphite composite powder of preparation
CN1277611C (en) Tungsten carbide catalyst and its preparation method and special retort
CN1270857C (en) Method for synthesizing TiNi-TiN gradient material by laser-induction self-spreading under high temperature
CN112979288B (en) Preparation method of sapphire grinding material

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
EE01 Entry into force of recordation of patent licensing contract

Assignee: Foshan Kangze Metal Material Co., Ltd.

Assignor: Taiyuan University of Technology

Contract fulfillment period: 2009.10.9 to 2014.11.9 contract change

Contract record no.: 2010440000006

Denomination of invention: Technical method for alloying surface of pure copper based plates

Granted publication date: 20090930

License type: Exclusive license

Record date: 20091231

LIC Patent licence contract for exploitation submitted for record

Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2009.10.9 TO 2014.11.9; CHANGE OF CONTRACT

Name of requester: FOSHAN KANGZE METAL MATERIALS CO., LTD.

Effective date: 20091231

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090930

Termination date: 20110927