CN1949497A - Flexible substrate for packaging - Google Patents
Flexible substrate for packaging Download PDFInfo
- Publication number
- CN1949497A CN1949497A CN 200510113204 CN200510113204A CN1949497A CN 1949497 A CN1949497 A CN 1949497A CN 200510113204 CN200510113204 CN 200510113204 CN 200510113204 A CN200510113204 A CN 200510113204A CN 1949497 A CN1949497 A CN 1949497A
- Authority
- CN
- China
- Prior art keywords
- lead
- base plate
- flexible base
- wire
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004806 packaging method and process Methods 0.000 title abstract description 4
- 239000000758 substrate Substances 0.000 title abstract description 4
- 239000002245 particle Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 238000012536 packaging technology Methods 0.000 claims 2
- 238000005538 encapsulation Methods 0.000 description 14
- 238000005516 engineering process Methods 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- -1 PI) Polymers 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Connection Of Batteries Or Terminals (AREA)
Abstract
The invention provides a tube core packaging flexible substrate, where the tube core has an active surface and a column of first pads formed on the active surface; the flexible substrate comprises a flexible insulating film and plural first leads; these first leads are formed on the flexible insulating film; each first lead corresponds to a first pad and has a first main body part, a first bonding part and a first extension part, where the first bonding part is wider than the first main body part and the first extension part. When packaging the tube core, the first bonding part of each first lead is connected through a first raised block with a corresponding first pad.
Description
Technical field
The present invention relates to the flexible base plate (Flexible substrate) of a kind of confession one tube core (Die) encapsulation usefulness, be particularly related to a kind of flexible base plate of avoiding lead-in wire (Lead) in sealing adhesive process, to break away from the projection on the chip, and this flexible base plate can provide the calibration of lead joint technology board, the usefulness that aligns.
Background technology
In the encapsulation field of integrated circuit (IC) chip, using flexible base plate is one of at present common mode as the carrier of encapsulation, and for example a band year encapsulation is to utilize one to have the flexible base plate of component hole and a plurality of leads as chip carrier.The structure that band carries encapsulation is best suited for the semiconductor element that will have a plurality of joints and is packaged into miniature dimensions, and therefore, it is to drive the packaged type of normal application of the semiconductor element of LCD that band carries encapsulation.
Have a plurality of lead-in wires on the flexible base plate,, flexible base plate is electrically connected with chip in order to link the projection on the chip as a path.Projection on this chip is generally golden projection, and (Inner Lead Bonding, ILB) technology engages a plurality of lead-in wires on this flexible base plate through lead joint.
Existing described a plurality of lead-in wires are elongated shape and its width is narrower than described a plurality of projections, when number of leads increases, wire widths also reduce thereupon influence each other to avoid going between and other lead joint technology on consideration.Thus, the encapsulation of multilead is usually because lead-in wire is meticulous, and causes the adhesive force deficiency between lead-in wire and the projection of chip and come off.Especially be positioned at the lead-in wire in corner, often come off, cause to be electrically connected and interrupt because of the flexible base plate expanded by heating is subjected to an influence of shear force.
Therefore, the invention provides the flexible base plate that a kind of confession one die package is used, flexible base plate according to the present invention can overcome the problem that above-mentioned lead-in wire is easy to break away from the technology projection, and this flexible base plate can provide the calibration of lead joint technology board, the usefulness that aligns.
Summary of the invention
In order to reach above-mentioned purpose and to solve shortcoming discussed above, the invention provides the flexible base plate that a kind of confession one die package is used.
According to the flexible base plate of the of the present invention first preferred specific embodiment, this flexible base plate is used for a die package.This tube core has an active face (Active surface) and a plurality of first pad (Bondpad), and these a plurality of first pads are formed on this active face with the form of lining up at least one row.This flexible base plate comprises a pliability dielectric film (Flexible insulating film) and a plurality of first lead-in wire.These many first lead-in wires are formed at the usefulness of doing to be electrically connected for this tube core on this pliability dielectric film, each root first lead-in wire is to one first pad in should a plurality of first pads and have one first main part (Bodyportion), one first joint portion (Bond portion) and one first extension (Extension portion), and the width of this first joint portion is greater than the width of this first main part and the width of this first extension.
Wherein when this tube core encapsulated, first joint portion of each root first lead-in wire was done by pairing first pad of one first projection (Bump) and its and is connected.
The flexible base plate of using according to confession one die package of the of the present invention second preferred specific embodiment, this tube core has an active face, a plurality of first pad and at least one second pad, and these a plurality of first pads are formed on this active face with the form of lining up at least one row.This flexible base plate comprises a pliability dielectric film, a plurality of first lead-in wire and at least one bridge shape lead-in wire (Bridge lead).Described a plurality of first lead-in wire is formed on this pliability dielectric film for this tube core does the usefulness that is electrically connected, and each root first lead-in wire is to one first pad in a plurality of first pads on should tube core.This at least one bridge shape lead-in wire is formed on this pliability dielectric film.Each root bridge shape lead-in wire is to one second pad in should at least one second pad and have at least two bodies and at least one bridge part, and this at least one bridge part is between this at least two body and connect this at least two body.
Wherein when this tube core encapsulates, each root first lead-in wire is done by pairing first pad of one first projection and its and is connected, each root bridge shape lead-in wire is done by pairing second pad of one second projection and its and is connected, and the particle diameter of this second projection is greater than the particle diameter of this first projection.
The flexible base plate that confession one die package provided by the present invention is used is improved the shape of described a plurality of lead-in wires, increases guarantee to go between the binding with projection of area that lead-in wire contacts with projection; For the lead-in wire that is positioned at this pliability dielectric film edge, then avoid it to be subjected to influence of shear force and the projection that comes off with the lead-in wire of bridge shape, avoid because of the lead-in wire caused circuit interruption that comes off, promote the reliability of flexible base plate encapsulation, and this flexible base plate further can provide the calibration of lead joint technology board, the usefulness that aligns.
Can be further understood by the following detailed description and accompanying drawings about the advantages and spirit of the present invention.
Description of drawings
Fig. 1 illustrates the schematic diagram of the flexible base plate of using according to confession one die package of the of the present invention first preferred specific embodiment.
Fig. 2 illustrates the schematic diagram of the flexible base plate of using according to confession one die package of the of the present invention second preferred specific embodiment.
The main element symbol description
10,50: flexible base plate 12,52: pliability dielectric film
14,16: the second lead-in wires of 54: the first lead-in wires
56: 142: the first main parts of bridge shape lead-in wire
146: the first extensions in 144: the first joint portions
164: the second joint portions of 162: the second main parts
564: bridge part 20: tube core
22: 30: the first projections of active face
32: the second projections
Embodiment
The invention provides the flexible base plate that a kind of confession one die package is used.See also Fig. 1, Fig. 1 illustrates the schematic diagram of the flexible base plate that confession one die package of the first preferred specific embodiment according to the present invention uses.In this embodiment, this flexible base plate 10 be used for band carry encapsulation (Tape carrier package, TCP).As shown in Figure 1, this flexible base plate 10 comprises a pliability dielectric film 12 and a plurality of first lead-in wire 14.The material of this pliability dielectric film 12 be polyimides (Polyimide, PI), polyester (Polyester, PET) or other similar material.These pliability dielectric film 12 both sides are formed with the chain hole 18 of a plurality of equidistant arrangements, for carrying and the location.This tube core 20 has an active face 22 and a plurality of first pad (not being illustrated among the figure), and these a plurality of first pads are formed on this active face 22 with the form that forms a line.
These many first lead-in wires 14 are formed on this pliability dielectric film 12, use for this tube core 20 and do the usefulness that is electrically connected.14 pairs in each root first lead-in wire, one first pad in should a plurality of first pads, each root first lead-in wire 14 has one first main part 142, one first joint portion 144 and one first extension 146 of fine strip shape (Strip-shaped).The width of this first joint portion 144 is greater than the width of this first main part 142 and the width of this first extension 146, and the width of first extension 146 of each root first lead-in wire 14 is similar to the width of this first main part 144.When this tube core 20 encapsulated, first joint portion 144 of each root first lead-in wire 14 was done by pairing first pad of one first projection 30 and its and is connected.
By this, in the process that this tube core 20 encapsulates, described a plurality of first lead-in wire 14 can be more than or equal to the particle diameter with connected first projection 30 because of the width of its first joint portion 144, can increase the adhesive force of described a plurality of first lead-in wires 14, avoid its this first projection 30 that comes off, therefore can promote the reliability of encapsulation.And because of the width of first joint portion 144 is bigger, the amount of conducting of described a plurality of first lead-in wires 14 also increases than prior art.
In this embodiment, this tube core 20 also has a plurality of second pads (not being illustrated among the figure), these a plurality of second pads are formed on this active face 22 with the form that forms a line, and these a plurality of second pads are than the edge of a plurality of first pads near this flexible base plate 10.This flexible base plate 10 further comprises many second lead-in wires 16.16 pairs in each root second lead-in wire in should a plurality of second pads one second pad 26 and have second main part 162, one second joint portion 164 and one second extension 166 of a fine strip shape.The width of this second joint portion 164 is greater than the width of this second main part 162 and the width of this second extension 166, and the width of second extension 166 of each root second lead-in wire 16 is similar to the width of second main part 162 of itself.
These many second lead-in wires 16 are formed on this pliability dielectric film 12 and with these many first lead-in wires 14 and are staggered, in other words, second joint portion 164 of each root second lead-in wire 16 is placed between the main part 142 adjacent to two first lead-in wires 14 of this root second lead-in wire 16.When this tube core 20 encapsulated, second joint portion 164 of each root second lead-in wire 16 was connected by pairing second pad of one second projection 32 and its.
According to flexible base plate 10 of the present invention, utilize being staggered of described a plurality of second lead-in wires 16 and described a plurality of first lead-in wires 14, can realize the encapsulation of multilead.And because of the width that increases by first joint portion 144 and the width of second joint portion 164, can avoid in the prior art, the lead-in wire adhesive force deficiency that is produced because of the multilead encapsulation, and therefore the problem that comes off on projection easily can promote the reliability that encapsulates.And this flexible base plate 10 connects projection because of having than large tracts of land, and the amount of conducting of described a plurality of lead-in wires also increases than prior art.
See also Fig. 2, Fig. 2 illustrates the schematic diagram of the flexible base plate of using according to confession one die package of the of the present invention second preferred specific embodiment.In this embodiment, this flexible base plate 50 is used for a band year encapsulation.As shown in Figure 2, this flexible base plate 50 comprises a pliability dielectric film 52, a plurality of first lead-in wire 54 and at least one bridge shape lead-in wire 56 that is fine strip shape.This tube core 20 has an active face 22, a plurality of first pad (not being illustrated among the figure) and at least one second pad (not being illustrated among the figure).These a plurality of first pads are formed on this active face 22 with the form that forms a line.
These many first lead-in wires 54 are formed on this pliability dielectric film 52,54 pairs in each root first lead-in wire, one first pad in should a plurality of first pads.This at least one bridge shape lead-in wire 56 is formed on this pliability dielectric film 52,56 pairs in each root bridge shape lead-in wire, one second pad in should at least one second pad.Each root bridge shape lead-in wire 56 has at least two bodies 562 and at least one bridge part 564, and each body 562 is same as one first lead-in wire 54 in these a plurality of first lead-in wires 54 haply.This at least one bridge part 564 is between this at least two body 562 and connect this at least two body 562.When this tube core 20 encapsulated, each root first lead-in wire 54 was connected by pairing first pad of one first projection 30 and its, and each root bridge shape goes between and 56 is connected by pairing second pad of one second projection 32 and its.The particle diameter of this second projection 32 is greater than the particle diameter of this first projection 30.
By this, in the process that this tube core 20 encapsulates, this bridge shape lead-in wire 56 can avoid being subjected to the circuit interruption that influence of shear force causes that lead-in wire comes off and goes between and come off and caused because of its shape, therefore can promote the reliability of encapsulation.In addition, this bridge shape lead-in wire 56 can make this flexible base plate 50 that the calibration of lead joint technology board, the usefulness that aligns can be provided because of its shape for the usefulness of aligning in the lead joint technology.
The flexible base plate that confession one die package provided by the present invention is used also can be applicable to Chip Packaging on the film, and (Chip-on-film package, COF) technology encapsulates.
The flexible base plate that confession one die package of the present invention is used, utilizing increases the area that lead-in wire is connected with projection, makes the lead-in wire of flexible base plate have enough adhesive force in technology, and is difficult for coming off on projection, can increase the amount of conducting of lead-in wire simultaneously.For the larger area projection, flexible base plate of the present invention then has bridge shape lead-in wire, can increase its adhesive force because of its at least one bridge part, and minimizing is because of the come off chance of projection of influence of shear force.Simultaneously, this bridge shape lead-in wire is also done to calibrate and align because of its special shape provides the board of lead joint technology.
By the detailed description of above preferred specific embodiment, hope can be known description feature of the present invention and spirit more, and is not to come category of the present invention is limited with above-mentioned disclosed preferred specific embodiment.On the contrary, its objective is that hope can contain in the category of claim of being arranged in of various changes and tool equality institute of the present invention desire application.
Claims (13)
1. flexible base plate of using for die package, this tube core has an active face and a plurality of first pad, and these a plurality of first pads are formed on this active face with the form that forms a line, and this flexible base plate comprises:
One pliability dielectric film; And
Many first lead-in wires, these many first lead-in wires are formed on this pliability dielectric film, each root first lead-in wire is to one first pad in should a plurality of first pads and have one first main part, one first joint portion and one first extension, and the width of this first joint portion is greater than the width of this first main part and the width of this first extension;
Wherein when this tube core encapsulated, first joint portion of each root first lead-in wire was connected by pairing first pad of one first projection and its.
2. flexible base plate as claimed in claim 1, wherein the width of first extension of each root first lead-in wire is similar to the width of first main part of itself.
3. flexible base plate as claimed in claim 1, wherein this tube core also has a plurality of second pads, and these a plurality of second pads are formed on this active face with the form that forms a line, and this flexible base plate further comprises:
Many second lead-in wires, these many second lead-in wires are formed on this pliability dielectric film and with these many first lead-in wires and are staggered, each root second lead-in wire is to one second pad in should a plurality of second pads and have one second main part, one second joint portion and one second extension, and the width of this second joint portion is greater than the width of this second main part and the width of this second extension;
Wherein when this tube core encapsulated, second joint portion of each root second lead-in wire was connected by pairing second pad of one second projection and its.
4. flexible base plate as claimed in claim 3, wherein the width of second extension of each root second lead-in wire is similar to the width of second main part of itself.
5. flexible base plate as claimed in claim 4, wherein second joint portion of each root second lead-in wire is placed between the main parts of two first lead-in wires that go between adjacent to this root second.
6. flexible base plate as claimed in claim 4, wherein second main part of first main part of these a plurality of first lead-in wires and these a plurality of second lead-in wires is fine strip shape.
7. flexible base plate as claimed in claim 4, wherein this tube core encapsulates by a band year packaging technology with this flexible base plate.
8. flexible base plate as claimed in claim 4, wherein this tube core encapsulates by chip package process on the film with this flexible base plate.
9. flexible base plate of using for die package, this tube core has an active face, a plurality of first pad and at least one second pad, and these a plurality of first pads are formed on this active face with the form that forms a line, and this flexible base plate comprises:
One pliability dielectric film;
A plurality of first lead-in wires, these many first lead-in wires are formed on this pliability dielectric film, and each root first goes between to one first pad in should a plurality of first pads; And
At least one bridge shape lead-in wire, this at least one bridge shape lead-in wire is formed on this pliability dielectric film, each root bridge shape lead-in wire is to one second pad in should at least one second pad and have at least two bodies and at least one bridge part, and this at least one bridge part is between this at least two body and connect this at least two body;
Wherein when this tube core encapsulates, each root first lead-in wire is connected by pairing first pad of one first projection and its, each root bridge shape lead-in wire is connected by pairing second pad of one second projection and its, and the particle diameter of this second projection is greater than the particle diameter of this first projection.
10. flexible base plate as claimed in claim 9, wherein these a plurality of first lead-in wires are fine strip shape.
11. flexible base plate as claimed in claim 9, wherein this tube core encapsulates by a band year packaging technology with this flexible base plate.
12. flexible base plate as claimed in claim 9, wherein this tube core encapsulates by chip package process on the film with this flexible base plate.
13. flexible base plate as claimed in claim 9, wherein each body of this bridge shape lead-in wire is similar to one first lead-in wire in these a plurality of first lead-in wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101132047A CN100442495C (en) | 2005-10-12 | 2005-10-12 | Flexible substrate for packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101132047A CN100442495C (en) | 2005-10-12 | 2005-10-12 | Flexible substrate for packaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1949497A true CN1949497A (en) | 2007-04-18 |
| CN100442495C CN100442495C (en) | 2008-12-10 |
Family
ID=38018950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101132047A Expired - Fee Related CN100442495C (en) | 2005-10-12 | 2005-10-12 | Flexible substrate for packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100442495C (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106572598A (en) * | 2016-10-31 | 2017-04-19 | 努比亚技术有限公司 | Surface-mount element |
| CN107359148A (en) * | 2016-05-09 | 2017-11-17 | 南茂科技股份有限公司 | Chip packaging structure |
| CN110391192A (en) * | 2018-04-19 | 2019-10-29 | 南茂科技股份有限公司 | Package structure membrane of flip chip package |
| WO2020232690A1 (en) * | 2019-05-23 | 2020-11-26 | 深圳市柔宇科技有限公司 | Pin structure and flexible panel |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5016082A (en) * | 1988-09-16 | 1991-05-14 | Delco Electronics Corporation | Integrated circuit interconnect design |
| JP4454814B2 (en) * | 2000-08-29 | 2010-04-21 | Ｎｅｃエレクトロニクス株式会社 | Resin-sealed semiconductor device and manufacturing method thereof |
| TWI226111B (en) * | 2003-11-06 | 2005-01-01 | Himax Tech Inc | Semiconductor packaging structure |
-
2005
- 2005-10-12 CN CNB2005101132047A patent/CN100442495C/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107359148A (en) * | 2016-05-09 | 2017-11-17 | 南茂科技股份有限公司 | Chip packaging structure |
| CN106572598A (en) * | 2016-10-31 | 2017-04-19 | 努比亚技术有限公司 | Surface-mount element |
| CN110391192A (en) * | 2018-04-19 | 2019-10-29 | 南茂科技股份有限公司 | Package structure membrane of flip chip package |
| WO2020232690A1 (en) * | 2019-05-23 | 2020-11-26 | 深圳市柔宇科技有限公司 | Pin structure and flexible panel |
| CN113330561A (en) * | 2019-05-23 | 2021-08-31 | 深圳市柔宇科技股份有限公司 | Pin structure and flexible panel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100442495C (en) | 2008-12-10 |
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