CN1942084A - Homogeneouslly-radiating electronic device - Google Patents
Homogeneouslly-radiating electronic device Download PDFInfo
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- CN1942084A CN1942084A CN 200510107673 CN200510107673A CN1942084A CN 1942084 A CN1942084 A CN 1942084A CN 200510107673 CN200510107673 CN 200510107673 CN 200510107673 A CN200510107673 A CN 200510107673A CN 1942084 A CN1942084 A CN 1942084A
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- wall
- electronic installation
- homogeneouslly
- radiating
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Abstract
The invention comprises: a case with two flutes respectively at its two inner sides; a circuit board located in the case; and a metal wall located between the case and the circuit board and extending outward a bulge from its each side to closely fit the flutes. By closely coupling the metal wall with the case, the heat radiation efficiency can be improved.
Description
Technical field
The present invention relates to a kind of electronic installation, refer in particular to a kind of electronic installation of Homogeneouslly-radiating.
Background technology
Portable type electronic product or other electronics and IT products, for example personal handheld computer or personal digital assistant etc. become indispensable electronic product in people's daily life gradually.Because these electronic products need often be carried at the user at one's side, for keeping electric power ready for using, the periphery that power-supply adapter (Adapter), power supply unit (power supply) or charging device (Charger) just become necessity when using is equipped with.
With the power-supply adapter is example, can consume the electrical power of part during the power-supply adapter operation, generation heat energy that simultaneously also can be relative.Along with the development of electronic product technology and in order to adapt to user's demand, the electronic building brick quantity of institute's load increases gradually on the printed circuit board (PCB) of electronic product inside, the integration of assembly improves constantly, make the electrical power of the required use of present most power-supply adapter reach between 100～200 watts, have in addition also above 200 watts.Not hard to imagine, as long as power-supply adapter increases in the wattage of required consumption of when running, the relative heat energy that produces also can increase certainly, so just and then improve the temperature of whole power-supply adapter, and has to begin to note the problem of dispelling the heat.
See also Fig. 1, it is the section of structure of known power-supply adapter.This power-supply adapter 1 comprises a circuit board assembly 11 and a housing 12, and wherein this circuit board assembly 11 has a printed circuit board (PCB) 13 and several heat generating components 14, and its outside is coated by a metal screen-wall 15.After power-supply adapter 1 and electronic product and mains supply binding and entry into service, each heat generating component 14 in the circuit board assembly 11 can begin to produce heat, principle according to the heat conduct radiation, the heat of these generations can be to transmitting all around, the heat that heat generating component 14 is produced through metal screen-wall 15 conducts to housing 12 backs to outdiffusion, to dispel the heat again.
Yet,,, can in plastics demoulding processing procedure, form a drafting angle ψ usually in the both sides of last lower house 121,122, in order to withdrawing pattern for the convenience on the processing procedure because the housing 12 of power-supply adapter 1 is to be combined by 121,122 of last lower houses.Therefore, housing after the combination 12 can form the cambered surface that contract at medial surface, and the medial surface that causes housing 12 is with the vertical side formation gap 16 of circuit board assembly 11 and can't fit.
When heat generating component 14 produces heat energy, hot-fluid can flow towards the less direction of thermal resistance, owing to exist gap 16 between the medial surface of housing 12 and the side of circuit board assembly 11, and have air in the gap 16, as known to, the coefficient of heat conduction of air is much smaller than the coefficient of heat conduction of the metal screen-wall 15 of fitting with housing 12 end faces, therefore cause the thermal resistance of the thermal resistance in zone, housing 12 two sides greater than housing 12 top surface areas, cause most hot-fluid to flow towards the top surface areas of housing 12, and make the top surface temperature of power-supply adapter 1 be higher than the situation of the two sides of housing 12, also just can't make power-supply adapter 1 reach the state of samming certainly.
The temperature distributing disproportionation of power-supply adapter 1, can cause the high temperature of heat regional temperature too high, and the too high zone of temperature is near the important electronic building brick on the circuit board, just originally be exactly that heat produces maximum places on the circuit board, so, be easy to just cause power-supply adapter 1 to break down or the problem that the life-span shortens because of overheated situation, but more serious accidents such as also fire hazard of person very.Therefore, how to develop a kind of electronic installation that improves the Homogeneouslly-radiating of above-mentioned known technology defective, real in pressing for the problem of solution at present.
Summary of the invention
Main purpose of the present invention is to provide a kind of electronic installation of Homogeneouslly-radiating, it is by cooperatively interacting between the housing of metal screen-wall and electronic installation, thereby improve traditional electronic devices and form gas gap, cause high thermal resistance and the problem that causes poor heat radiation and can't reach samming because of the housing drafting angle makes between its medial surface and inner circuit board assembly.
For reaching above-mentioned purpose, a kind of electronic installation of Homogeneouslly-radiating, it comprises: a housing, its two inboard respectively has a groove; One circuit board, it is arranged at this enclosure interior; And a metal screen-wall, it is between this housing and this circuit board, and two outsides protuberance that respectively stretches out, and it matches with this groove respectively; So as to, thereby this metal screen-wall is closely cooperated in fact with around this housing.
According to conception of the present invention, wherein this electronic installation is power-supply adapter, power supply unit or charger.
According to conception of the present invention, wherein this housing is to be formed by a upper shell and shell combination once.
According to conception of the present invention, wherein this groove be located at this upper shell and this lower house at least one of them.
According to conception of the present invention, wherein this circuit board also comprises several heat generating components.
According to conception of the present invention, wherein this metal screen-wall is to be combined by screen-wall on one and screen-wall once.
According to conception of the present invention, wherein should go up screen-wall with and/or this time screen-wall respectively form by the recessed folding of a metallic plate.
According to conception of the present invention, wherein this protuberance be located at screen-wall and this time screen-wall on this at least one of them.
According to conception of the present invention, wherein this metal screen-wall and this protuberance thereof are integrally formed by the recessed folding of a metallic plate.
According to conception of the present invention, wherein also comprise an insulating case, it is between this circuit board and this metal screen-wall.
Description of drawings
Fig. 1: it is the section of structure of known power-supply adapter;
Fig. 2: it is the STRUCTURE DECOMPOSITION schematic diagram of the electronic installation of the Homogeneouslly-radiating of preferred embodiment of the present invention;
Fig. 3 (a): it is the shell structure schematic diagram of the electronic installation of the Homogeneouslly-radiating of preferred embodiment of the present invention;
Fig. 3 (b): it is the partial enlarged drawing of the shell structure shown in Fig. 3 (a);
Fig. 3 (c): it is the structural representation of the metal screen-wall of the electronic installation of the Homogeneouslly-radiating of preferred embodiment of the present invention;
Fig. 4 (a): it is the combination generalized section of the electronic installation of the Homogeneouslly-radiating of preferred embodiment of the present invention;
Fig. 4 (b): it is the partial enlarged drawing of Fig. 4 (a);
Fig. 5 (a): it is the structural representation of second embodiment of metal screen-wall of the electronic installation of Homogeneouslly-radiating of the present invention;
Fig. 5 (b): it is the structural representation of the 3rd embodiment of metal screen-wall of the electronic installation of Homogeneouslly-radiating of the present invention.
Wherein, description of reference numerals is as follows:
Power-supply adapter: 1 circuit board assembly: 11
Housing: 12 printed circuit board (PCB)s: 13
Heat generating component: 14 metal screen-walls: 15
Gap: 16 upper shells: 121
Lower house: 122
Housing: 21 metal screen-walls: 22
Insulating case: 23 circuit boards: 24
Upper shell: 211 lower houses: 212
Last screen-wall: 221 times screen-walls: 222
Offset: S1, S2 groove: 25
Protuberance: 26 metal screen-walls: 32
Protuberance: 321 metal screen-walls: 33
Protuberance: 331
Embodiment
Some exemplary embodiments that embody feature of the present invention and advantage will be described in detail in the explanation of back segment.Be understood that the present invention can have various variations on different aspects, its neither departing from the scope of the present invention, and explanation wherein and accompanying drawing be when the usefulness that explain in itself, but not in order to restriction the present invention.
Please consult Fig. 2 earlier, it is the STRUCTURE DECOMPOSITION schematic diagram of the electronic installation of the Homogeneouslly-radiating of preferred embodiment of the present invention.As shown in Figure 2; wherein the electronic installation of Homogeneouslly-radiating of the present invention comprises a housing 21, a circuit board 24, a metal screen-wall 22 and an insulating case 23; its middle shell 21 is made up of a upper shell 211 and a lower house 212; 22 of metal screen-walls are combined by screen-wall 221 on one and screen-wall 222 once; mainly in order to as the electromagnetic interference (EMI) protective cover; insulating case 23 then is used for insulating circuit board 24 to protect the safety of electronic installation; it is arranged on this between the screen-wall 221 and this time screen-wall 222, and circuit board 24 is placed in wherein.
Then, below will describe syntagmatic between each assembly in detail.Please cooperate Fig. 2 to consult Fig. 3 (a) and Fig. 3 (b), its be respectively preferred embodiment of the present invention Homogeneouslly-radiating electronic installation the shell structure schematic diagram with and the partial enlarged drawing of shell structure.As shown in the figure, its middle shell 21 is made up of a upper shell 211 and a lower house 212, and should go up lower house 211,212 have the offset S1 that extends laterally near the medial surface that makes up the end place, make and go up after lower house 211,212 combinations that the both sides of housing 21 respectively form a groove 25.See Fig. 3 (c) in addition again, it is the structural representation of the metal screen-wall of the electronic installation of the Homogeneouslly-radiating of preferred embodiment of the present invention, shown in Fig. 3 (c), the metal screen-wall 22 of the electronic installation of Homogeneouslly-radiating of the present invention also can be combined by screen-wall on one 221 and screen-wall 222 once, wherein going up screen-wall 221 is respectively formed by the recessed folding of a metallic plate with this time screen-wall 222, and the two side of the last screen-wall 221 offset S2 that also stretches out, screen-wall 221 about making, 222 be combined as metal screen-wall 22 after, its both sides can respectively have a protuberance 26, so that this protuberance 26 closely cooperates mutually with the groove 25 of the housing 21 shown in Fig. 3 (a).Certainly, when recessed folding metal screen-wall 22, multinomial variation can be arranged, get final product so long as can form the protuberance 26 that is cooperated with the groove 25 of housing 21 in its both sides, in addition, protuberance 26 in Fig. 3 (c) also can change into and be arranged on the both sides of screen-wall 222 down, or screen-wall 221 up and down, but 222 respectively be located at also (not shown) of a side.
See also Fig. 4 (a) and Fig. 4 (b), it is respectively the combination generalized section and the partial enlarged drawing thereof of electronic installation of the Homogeneouslly-radiating of preferred embodiment of the present invention.According to aforesaid explanation, not hard to imagine, because the groove 25 of housing 21 matches with the protuberance 26 of metal screen-wall 22, distance between metal screen-wall 22 and the housing 21 just can be dwindled, and the close-fitting in fact kenel of formation, with traditional electronic installation shown in Figure 1 relatively, gap 16 between the medial surface that originally is present in housing 12 and the side of metal screen-wall 11 will be therefore and quilt be filled up, that is to say, significantly reduced the air that is present between housing 21 and the metal screen-wall 22, and then reduce the thermal resistance of this heat dissipation direction, so circuit board 24 just is subjected to the obstruct of air never again because of the heat energy that running is produced, and is able to be distributed by the both sides and the upper and lower surface of housing 21.
In other words, when electronic installation of the present invention connects electronic product and mains supply and when using, because between the lateral surface of the medial surface of housing 21 and metal screen-wall 22 is to become close-fitting in fact state, so, just having air hardly is blocked in middle, so the thermal resistance of the heat dissipation path of circuit board 24 both sides and known can obviously reduce by comparison many, thus, hot-fluid just can be equably by the heat generating component of circuit board 24 end face and side Homogeneouslly-radiating via housing 21, and then promote the radiating efficiency of electronic installation, also can avoid the problem of electronic installation temperature distributing disproportionation.
In addition, as mentioned above, the metal screen-wall of the electronic installation of Homogeneouslly-radiating of the present invention can also utilize other sample attitude to design, and sees also Fig. 5 (a) and Fig. 5 (b), and it is the structural representation of the second and the 3rd embodiment of metal screen-wall of the electronic installation of Homogeneouslly-radiating of the present invention.Shown in Fig. 5 (a), wherein metal screen-wall 32 and this protuberance 321 thereof are integrally formed by the recessed folding of a metallic plate, and be similar with metal screen-wall 33 and protuberance 331 thereof among Fig. 5 (b).So design all can make metal screen-wall both sides be provided with the protuberance that matches with the groove of housing, so just can avoid the gap described in the known technology, and avoid the air in the gap to have influence on radiating efficiency.Be with, no matter be form metal screen-wall how, so long as the design that matches with the groove of housing all can be able to be included in the disclosed technical scope.
In sum, the principal character of the electronic installation of Homogeneouslly-radiating of the present invention is that the groove that the both sides of the metal screen-wall of this electronic installation have both sides of protuberance and housing closely cooperates mutually, so just can be under the situation that does not increase any assembly or material, make the housing of traditional electronic installation and the gap between the metal screen-wall no longer exist, do not intercept and can not be subjected to air again, not only reduced thermal resistance, increase the flow through ratio of electronic installation both sides of hot-fluid, can increase area of dissipation again and improve radiating efficiency.And the hot-fluid of the housing end face of originally flowing through is transferred to the housing both sides with part, therefore can make electronic installation reach the effect of samming, the surface temperature of reduction electronic installation.And its inner electronic building brick also can not surpass safety standard because of local temperature is too high, the useful life that causes the electronic building brick fault or reduce electronic installation.Moreover so designing in assembling can not increase step, and the cost of processing procedure and material all need not to increase, and can deserve to be called a much progress.
The present invention is by any modification that those skilled in the art did, the scope of neither disengaging such as the desire protection of claims institute.
Claims (10)
1. the electronic installation of a Homogeneouslly-radiating, it comprises:
One housing, its two inboard respectively has a groove;
One circuit board, it is arranged at this enclosure interior; And
One metal screen-wall, it is between this housing and this circuit board, and two outsides protuberance that respectively stretches out, and it matches with this groove respectively;
Thereby this metal screen-wall is closely cooperated in fact with around this housing.
2. the electronic installation of Homogeneouslly-radiating as claimed in claim 1, wherein this electronic installation is power-supply adapter, power supply unit or charger.
3. the electronic installation of Homogeneouslly-radiating as claimed in claim 1, wherein this housing is to be formed by a upper shell and shell combination once.
4. the electronic installation of Homogeneouslly-radiating as claimed in claim 3, wherein this groove be located at this upper shell and this lower house at least one of them.
5. the electronic installation of Homogeneouslly-radiating as claimed in claim 1, wherein this circuit board also comprises several heat generating components.
6. the electronic installation of Homogeneouslly-radiating as claimed in claim 1, wherein this metal screen-wall is to be combined by screen-wall on one and screen-wall once.
7. the electronic installation of Homogeneouslly-radiating as claimed in claim 6, wherein should go up screen-wall with and/or this time screen-wall respectively form by the recessed folding of a metallic plate.
8. the electronic installation of Homogeneouslly-radiating as claimed in claim 6, wherein this protuberance be located at screen-wall and this time screen-wall on this at least one of them.
9. the electronic installation of Homogeneouslly-radiating as claimed in claim 1, wherein this metal screen-wall and this protuberance thereof are integrally formed by the recessed folding of a metallic plate.
10. the electronic installation of Homogeneouslly-radiating as claimed in claim 1 wherein also comprises an insulating case, and it is between this circuit board and this metal screen-wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101076738A CN100574590C (en) | 2005-09-29 | 2005-09-29 | The electronic installation of Homogeneouslly-radiating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101076738A CN100574590C (en) | 2005-09-29 | 2005-09-29 | The electronic installation of Homogeneouslly-radiating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1942084A true CN1942084A (en) | 2007-04-04 |
| CN100574590C CN100574590C (en) | 2009-12-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101076738A Active CN100574590C (en) | 2005-09-29 | 2005-09-29 | The electronic installation of Homogeneouslly-radiating |
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| Country | Link |
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| CN (1) | CN100574590C (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103828499A (en) * | 2011-08-30 | 2014-05-28 | 苹果公司 | Electronic device enclosures and heatsink structures with thermal management features |
| CN106208188A (en) * | 2015-05-28 | 2016-12-07 | 株式会社搜路研 | The charger of heat dispersion raising and manufacture method thereof |
| JP2019145576A (en) * | 2018-02-16 | 2019-08-29 | トヨタ自動車株式会社 | Heat dissipation housing structure |
| JP2021051905A (en) * | 2019-09-25 | 2021-04-01 | 富士高分子工業株式会社 | Heat conductive sheet for sealing material and heat-generating electrical/electronic part incorporated with the same |
-
2005
- 2005-09-29 CN CNB2005101076738A patent/CN100574590C/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103828499A (en) * | 2011-08-30 | 2014-05-28 | 苹果公司 | Electronic device enclosures and heatsink structures with thermal management features |
| CN103828499B (en) * | 2011-08-30 | 2016-03-16 | 苹果公司 | There is electronic equipment casing and the heat spreader structures of thermal management feature |
| CN105899041A (en) * | 2011-08-30 | 2016-08-24 | 苹果公司 | Electronic device enclosures and heatsink structures with thermal management features |
| CN105899041B (en) * | 2011-08-30 | 2018-06-05 | 苹果公司 | Electronic equipment casing and heat spreader structures with thermal management feature |
| CN106208188A (en) * | 2015-05-28 | 2016-12-07 | 株式会社搜路研 | The charger of heat dispersion raising and manufacture method thereof |
| CN106208188B (en) * | 2015-05-28 | 2021-07-27 | 株式会社搜路研 | Charger with improved heat dissipation performance and manufacturing method thereof |
| JP2019145576A (en) * | 2018-02-16 | 2019-08-29 | トヨタ自動車株式会社 | Heat dissipation housing structure |
| JP7197274B2 (en) | 2018-02-16 | 2022-12-27 | トヨタ自動車株式会社 | Heat dissipation housing structure |
| JP2021051905A (en) * | 2019-09-25 | 2021-04-01 | 富士高分子工業株式会社 | Heat conductive sheet for sealing material and heat-generating electrical/electronic part incorporated with the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100574590C (en) | 2009-12-23 |
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