CN1940608A - Light waveguide-layer inputting-outputting coupling interface assembly in EO-PCB board and its production - Google Patents
Light waveguide-layer inputting-outputting coupling interface assembly in EO-PCB board and its production Download PDFInfo
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- CN1940608A CN1940608A CN 200610019602 CN200610019602A CN1940608A CN 1940608 A CN1940608 A CN 1940608A CN 200610019602 CN200610019602 CN 200610019602 CN 200610019602 A CN200610019602 A CN 200610019602A CN 1940608 A CN1940608 A CN 1940608A
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Abstract
A method for preparing I/O light couple interface component of light waveguide layer in EO-PCB board includes using two-step from module as said component, setting through holes for positioning pin and optical fiber positioning at boundary position, cutting V-shape positioning groove at external tangent plane of surface on bottom step, placing optical fiber in said hole and said groove and injecting UV photochemical glue from port of each optical fiber, grinding two ends of optical fiber after curing, grinding one end to be 45 degree optical plane to optical fiber axle and another end to be optical plane vertical to optical fiber axle.
Description
Technical field
Cao Mingcui
The present invention relates to light waveguide-layer input and output optically-coupled interface module and preparation method in the EO-PCB plate.
Background technology
Because the needs of space flight, spaceborne, military modernization and scientific technological advance, information equipment of future generation must be towards the development of T bit magnitude processing speed, and the processing speed between processor is necessary for 10-40Gbps.The delay of signal interconnection and bandwidth are the key issues that must at first solve, and the high-speed interconnect switching technology has also become the most important thing of high-performance computer system research.
The advantages such as maturation, interface are realized easily relatively, transmission bandwidth is high, switching delay is little, cost the is relatively low though transmission of high bandwidth electric signal possesses skills, but because the band-limited physical cause of electrical interconnection, during transmit high-speed signals, aspects such as interconnection density, skewed clock, energy consumption, anti-interference, transmission range are limited, the transmission bandwidth that further improves electric signal faces " electronics " bottleneck, is difficult to satisfy high-performance computer and high speed information equipment to more high-transmission bandwidth and the more requirement of longer transmission distance.Light is as information carrier, has very high bandwidth, there are not distorted signals, cross-talk and clock skew problem, and have advantages such as bandwidth height, energy consumption is low, transmission range is long, interconnection density is high, antijamming capability is strong, light interconnection techniques such as the highdensity optical fiber network back board in broadband have obtained to use widely in the interconnection of multimachine cabinet.
Microminiature of future generation, broadband, at a high speed, in the bulky information equipment, same multilayer board is the interconnection between the at a high speed extensive IC chip of polylith on the pcb board, because the finite bandwidth of the electronic interconnection of PCB printed board, become the bottleneck of high speed transmission of signals.For head it off, developing a kind of new technology at present, be with optical channel layer EO-PCB plate technique exactly, promptly in pcb board, embed one deck light waveguide-layer, the transmitting high speed light signal that is to say, the high-speed electrical signals between the at a high speed extensive IC chip of polylith, be transformed into light signal and in light waveguide-layer, transmit, and low speed signal is still in traditional pcb board transmission.This band optical channel layer EO-PCB plate technique has become the effective way that overcomes this bottleneck, sees Fig. 1.This band optical channel layer EO-PCB plate technique mainly solves two large problems, and first problem is to embed large tracts of land, light waveguide-layer cheaply, second input and output optically-coupled interface module that gordian technique is a light waveguide-layer in traditional PCB technology.This input and output optically-coupled interface module will satisfy following requirement: one, light signal in the waveguide network layer is in surface level direction transmission information, and input and output optically-coupled interface will change 90 ° with the transmission direction of letter light number, and transmission direction up or down; Its two since the high speed signal of the ultra-large IC chip of high speed be with light window VCSEL and PIN chip as the light signal input and output port, the spacing strictness between the parallel picture dot in VCSEL and the PIN chip is 250 μ m, its error is 0.2 μ m.The optical port array of the parallel input and output optically-coupled interface module of the light waveguide-layer in the EO-PCB plate, corresponding one by one with the ultra-large IC chip of high speed light window VCSEL and the parallel picture dot of PIN chip, and the strictness of the positioning error of each bar input and output optical position is 0.2-0.5 μ m; Its three, to carry out one to one optically-coupled efficiently between the parallel input and output optical port of ultra-large IC chip light window and light waveguide-layer; Its four, the parallel input and output optical port of light waveguide-layer can be tested easily to the performance of each bar optical waveguide of waveguide network layer.At present, some papers have proposed the structure of input and output interfaces, as adopt the free space coupled structure etc. of 45 ° of catoptrons and microlens array, and these structures all can not strictly simultaneously satisfy above four big requirements.So the structure and the manufacture craft of the parallel input and output optically-coupled interface module of light waveguide-layer have become the crucial difficult point of EO-PCB plate technique.
Summary of the invention
Purpose of the present invention proposes light waveguide-layer input and output optically-coupled interface module and preparation method in a kind of EO-PCB plate, the input and output optically-coupled interface module of light waveguide-layer not only can satisfy above-described four big requirements in this novel EO-PCB plate, and this coupling interface assembly is a kind of integrated package, easily assembles.
Technical scheme of the present invention is as follows:
Light waveguide-layer input and output optically-coupled interface module is integrated modular structure in the EO-PCB plate.At first design mould, the plastic module that its Mold Making goes out has following feature: this module is one two a notch cuttype module, divide appear on the stage terrace and leave from office terrace, be provided with two class dowel holes, a n fiber orientation hole at upper and lower two step interface places, be distributed in 2 dowel holes of both sides respectively, and this two classes hole is through hole.On the surface of getting out of a predicament or an embarrassing situation,, be carved with n V-arrangement fiber orientation groove along the outer tangent plane in n second garden of through hole.Each bar optical fiber in n bar fibre ribbon respectively from each V-arrangement locating slot, is inserted in n the fiber orientation hole, and allows n bar optical fiber expose outside the end face.Inject photochemical glue of UV or heat-curable glue curing from each bar fiber port, when annotating curing glue, will carry out strictness control to the glue amount, glue surrounds optical fiber fully in the hole, and strict control of the glue amount on the V-shaped groove allows glue can only account for the latter half of each bar optical fiber.During curing, be fixed on each bar V-shaped groove surface, and the first half of each bar optical fiber is exposed fully outside with allowing each bar optical fiber lower part close and firm.
After the curing, be positioned at the two ends of optical fiber in the module, promptly the two ends of module will be ground, and the fiber end face that is shelved on V-shaped groove one end grinds to form the optical flat at 45 with fiber axis.And plane lapping is carried out in the other end that is positioned at the optical fiber of pilot hole, is processed into the optical flat of vertical fiber axle, and wherein n is a natural number.
Described two class through holes the interface that is centered close to two ladders on, the upper and lower two halves of through hole are respectively in upper and lower two steps.
The aperture ф in described fiber orientation hole is 126 μ m, and the aperture Φ of dowel hole is 0.7mm.
The angle of described V-arrangement fiber orientation groove is about 60 °.
The stratum's length of appearing on the stage of described two notch cuttype modules is 1-1.5mm, and the length of leave from office stratum is 0.8-1mm.
Describedly be distributed in 2 dowel holes that aperture, both sides Φ is 0.7mm respectively, be to transmit and receive the dowel hole of module testing light source coupling as walking abreast with 1xnVCSEL/PIN, the parallel dowel hole that transmits and receives module is aimed at fully with the dowel hole of light waveguide-layer input and output optically-coupled interface module, and with aperture Φ be the positioning pin rod of 0.7mm fixing after, each picture dot in Here it is parallel emission or the receiver module has been aimed at one by one with each the bar optical fiber in the optically-coupled interface module.Each VCSEL emitted laser in the parallel transmitter module of 1xn by each the bar optical fiber in the optically-coupled interface module, is sent to corresponding each bar optical waveguide of light waveguide-layer in the EO-PCB plate, therefore, just can test the performance of each bar optical waveguide.
The preparation method of light waveguide-layer input and output optically-coupled interface module in the EO-PCB plate, carry out according to the following steps:
(1), at first designs mould, the plastic module that its Mold Making goes out has following feature: appear on the stage two notch cuttype modules of terrace and leave from office terrace of a module branch, at upper and lower two step interface places two class through holes are arranged, two dowel holes and n fiber orientation hole, on the surface of getting out of a predicament or an embarrassing situation,, n V-arrangement fiber orientation groove arranged along the outer tangent plane in n second garden of through hole;
(2) with each bar optical fiber in the n bar fibre ribbon respectively from each V-arrangement locating slot, insert in n the fiber orientation hole, and allow n bar optical fiber expose outside the end face;
(3) from being shelved on the V-arrangement locating slot, insert in n the fiber orientation hole, and expose outer n bar optical fiber one port of end face, inject photochemical glue of UV or heat-curable glue and solidify.When annotating curing glue, to carry out strictness control to the glue amount, glue surrounds optical fiber fully in the hole, and the strict control of the glue amount on the V-shaped groove allows glue can only account for the latter half of each bar optical fiber, during curing, be fixed on each bar V-shaped groove surface, and the first half of each bar optical fiber is exposed fully outside with allowing each bar optical fiber lower part close and firm.
(4) will be positioned at the two ends of optical fiber in the module, promptly the both ends of the surface of module will be ground, and the fiber end face that is shelved on V-shaped groove one end grinds to form the optical flat at 45 with fiber axis.And plane lapping is carried out in the other end that is positioned at the optical fiber of pilot hole, is processed into the optical flat of vertical fiber axle.
(5) be distributed in 2 dowel holes that aperture, both sides Φ is 0.7mm respectively, mate fully with the parallel dowel hole that transmits and receives the module testing light source of corresponding 1xn VCSEL/PIN.So that in the time of need testing the performance of each bar optical waveguide, the parallel dowel hole that transmits and receives module is aimed at fully with the dowel hole of light waveguide-layer input and output optically-coupled interface module, and with aperture Φ be the positioning pin rod of 0.7mm with the two fixing after, each picture dot in Here it is parallel emission or the receiver module has been aimed at one by one with each the bar optical fiber in the optically-coupled interface module.Each VCSEL emitted laser in the parallel transmitter module of 1xn by each the bar optical fiber in the optically-coupled interface module, is sent to corresponding each bar optical waveguide of light waveguide-layer in the EO-PCB plate, just can test the performance of each bar optical waveguide.
The present invention proposes light waveguide-layer input and output optically-coupled interface module in a kind of novel EO-PCB plate, this coupling interface assembly not only can satisfy four of the following stated and require greatly: one, at the input and output interface optical signal transmission direction is changeed 90 °, from surface level transmission signals directional steering up or down; Its two, be that the array picture dot is corresponding one by one in the light window VCSEL of 250 μ m and the PIN chip fully with the spacing strictness, the positioning error strictness of each bar input and output optical port position less than 0.5 μ m about; Its three, efficient, compact one to one optically-coupled between the parallel input and output optical port of ultra-large IC chip light window and light waveguide-layer; Its four, the parallel input and output optical port of light waveguide-layer can be tested easily to the performance of each bar optical waveguide of waveguide network layer.And this optically-coupled interface module is integrated modular structure, easily assembles.
Description of drawings
Fig. 1 is the structural representation of existing strip optical waveguide layer EO-PCB plate.
Fig. 2 is the structural representation of two notch cuttype modules of the present invention.
Fig. 3 is n bar bare fibre n V-type groove and a n light-seeking hole location map.
Fig. 4 is for annotating at the optical fiber in n V-type groove and n light-seeking hole, solidifying.
Fig. 5 processes the parallel input and output optically-coupled interface module of the light waveguide-layer at 45 and plane respectively for both ends of the surface.
Fig. 6 is the accurate coupling of light waveguide-layer in this optically-coupled interface module and the EO-PCB plate.
Fig. 7 is the input and output optically-coupled interface module figure with 90 ° of bracing frames.
Embodiment
Light waveguide-layer input and output optically-coupled interface module is integrated modular structure, as shown in Figure 2 in the EO-PCB plate of the present invention.At first design mould, the plastic module that its Mold Making goes out has following feature: this plastic module is a kind of two notch cuttype modules, outboard profile is ABCDEF, and A1B1C1D1E1F1, divide appear on the stage terrace and leave from office terrace, the above step surface and the hand-deliver interface of getting out of a predicament or an embarrassing situation are central plane, and two class through holes are arranged, middle n through hole is fiber orientation hole 001, and aperture φ is about 126 μ m.Be distributed in two holes of both sides, be dowel hole 002, aperture Φ is about 0.7mm.The interface DD that is centered close to two ladders of these through holes
1On, the upper and lower two halves of through hole are respectively in upper and lower two steps.On the surface of getting out of a predicament or an embarrassing situation,, be carved with n the about 60 ° of V-shaped grooves of angle, be fiber orientation groove 003, the about 1-1.5mm of the length h of stratum that appears on the stage, the about 0.8-1mm of the length f of leave from office stratum along the outer tangent plane in 6 second gardens of through hole; After finishing plastic module and making, along center n fiber orientation groove, be respectively 125 μ m bare fibres with external diameter, be inserted in n the hole 004 from V-shaped groove 003, fiber lengths is (h+f), as shown in Figure 3.A n bar bare fibre part is in the hole, and another part is shelved on the V-shaped groove, and an end exposes plastic module AFF
1A
1End face, and the other end exposes CBB
1C
1End face.From AFF
1A
1Each bar fiber port of end face injects the photochemical glue of UV, or heat-curable glue.Annotate when solidifying glue, will carry out strictness control to the glue amount, glue surrounds optical fiber fully in the hole, and the strict control of the glue amount on the V-shaped groove can only allow glue account for each bar optical fiber the latter half.During curing, make each bar optical fiber lower part tight, and be securely fixed in each bar V-shaped groove surface, and the first half of each bar optical fiber is exposed fully outside, as shown in Figure 4.
Insert n bar optical fiber in plastic module fiber orientation hole, and the other end of optical fiber is shelved on the V-shaped groove, after the injection UV adhesive curing, the two ends of optical fiber will be ground.Expose AFF at plastic module
1A
1The fiber end face of end carries out plane lapping, is processed into the optical flat of vertical fiber axle.And the fiber end face that is shelved on V-shaped groove one end grinds to form the optical flat at 45 with fiber axis, as shown in Figure 5.When making plane one end of laser beam parallel optical fibre axle vertical incidence optical fiber, the 45 ° end faces of light along Optical Fiber Transmission to optical fiber carry out total reflection at 45 ° of end faces of optical fiber, become 90 ° of vertical output optical fiber surfaces.As the planar ends of plane radio frequency channel is tight-lipped thickly near 45 ° of end faces of optical fiber, then the light that carries out total reflection from 45 ° of end faces of optical fiber is directly coupled to the radio frequency channel of plane and transmits.The dowel hole that transmits and receives module is aimed at fully with the dowel hole of light waveguide-layer input and output optically-coupled interface module if will walk abreast, and with aperture Φ be the positioning pin rod of 0.7mm with the two fixing after, Here it is will walk abreast the emission or receiver module in each picture dot, aimed at one by one with each the bar optical fiber in the optically-coupled interface module.Each VCSEL emitted laser in the parallel transmitter module of 1xn, by each the bar optical fiber in the optically-coupled interface module, be sent to corresponding each bar optical waveguide of light waveguide-layer in the EO-PCB plate, just can test, as shown in Figure 6 the performance of each bar optical waveguide.For coupling is aimed in corresponding each bar waveguide of light waveguide-layer in each bar optical fiber of making this optically-coupled interface module and the EO-PCB plate accurately, closely, at its AKK
1A
1The outside adds 90 ° of right angle bracing frames 005, as shown in Figure 7.Light waveguide-layer 006 corresponding each bar waveguide becomes 90 ° in each bar optical fiber that can guarantee on the one hand the optically-coupled interface module and the EO-PCB plate, can reinforce the intensity of the two coupling interface on the other hand.
Claims (8)
1, light waveguide-layer input and output optically-coupled interface module in the EO-PCB plate, be integrated modular structure, it is characterized in that: this module is one two a notch cuttype module, divide appear on the stage terrace and leave from office terrace, last, two step interface places are provided with two dowel holes down, n fiber orientation hole, and this two classes hole is through hole, on the surface of getting out of a predicament or an embarrassing situation along the outer tangent plane in n second garden of through hole, be carved with n V-arrangement fiber orientation groove, n bar optical fiber is inserted respectively in n the fiber orientation hole and is shelved on the V-arrangement locating slot, inject photochemical glue of UV or heat-curable glue curing from each bar fiber port, after the curing, the two ends of optical fiber will be ground, the fiber end face that is shelved on V-shaped groove one end grinds to form the optical flat at 45 with fiber axis, plane lapping is carried out in the other end of optical fiber, be processed into the optical flat of vertical fiber axle, wherein n is a natural number.
2, assembly according to claim 1 is characterized in that: described two class through holes the interface that is centered close to two ladders on, the upper and lower two halves of through hole are respectively in upper and lower two steps.
3, assembly according to claim 1 is characterized in that: the aperture φ in described fiber orientation hole is 126 μ m, and the aperture Φ of dowel hole is 0.7mm.
4, assembly according to claim 1 is characterized in that: the angle of described V-arrangement fiber orientation groove is 60 °.
5, assembly according to claim 1 is characterized in that: the stratum's length of appearing on the stage of described two notch cuttype modules is about 1-1.5mm, and the length of leave from office stratum is about 0.8-1mm.
6, assembly according to claim 1 is characterized in that: described aperture Φ is the dowel hole of 0.7mm, should mate fully with the parallel dowel hole that transmits and receives module.
7, the preparation method of light waveguide-layer input and output optically-coupled interface module in the EO-PCB plate, carry out according to the following steps:
(1), at first designs mould, the plastic module that its Mold Making goes out has following feature: appear on the stage two notch cuttype modules of terrace and leave from office terrace of a branch, get through two dowel holes and n fiber orientation hole at upper and lower two step interface places, on the surface of getting out of a predicament or an embarrassing situation,, be carved with n V-arrangement fiber orientation groove along the outer tangent plane in n second garden of through hole; (2) n bar optical fiber is inserted in n the fiber orientation hole from the V-arrangement locating slot respectively, and allow optical fiber head expose end face; Inject photochemical glue of UV or heat-curable glue from each bar fiber port, be solidified into an integral body with module; (3) two ends of optical fiber are ground, the fiber end face that is shelved on V-shaped groove one end grinds to form the optical flat at 45 with fiber axis, and the other end of optical fiber is carried out plane lapping, is processed into the optical flat of vertical fiber axle.
8, method according to claim 7, it is characterized in that: when annotating curing glue, to carry out strictness control to the glue amount, glue surrounds optical fiber fully in the hole, and the strict control of the glue amount on the V-shaped groove allows glue can only account for the latter half of each bar optical fiber, during curing, be fixed on each bar V-shaped groove surface with allowing each bar optical fiber lower part close and firm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100196027A CN100443935C (en) | 2006-07-11 | 2006-07-11 | Light waveguide-layer inputting-outputting coupling interface assembly in EO-PCB board and its production |
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| Application Number | Priority Date | Filing Date | Title |
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| CNB2006100196027A CN100443935C (en) | 2006-07-11 | 2006-07-11 | Light waveguide-layer inputting-outputting coupling interface assembly in EO-PCB board and its production |
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| CN1940608A true CN1940608A (en) | 2007-04-04 |
| CN100443935C CN100443935C (en) | 2008-12-17 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112327419A (en) * | 2020-11-03 | 2021-02-05 | 中航光电科技股份有限公司 | Waveguide vertical optical coupling structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| FR2525777B1 (en) * | 1982-04-21 | 1985-11-15 | Renault | LATERAL OR TRANSVERSE COUPLER FOR OPTICAL FIBERS |
| JPS63289509A (en) * | 1987-05-22 | 1988-11-28 | Furukawa Electric Co Ltd:The | Multi-cored optical parts and its production |
| CA2272751A1 (en) * | 1996-12-31 | 1998-07-09 | Honeywell Inc. | Flexible optic connector assembly |
| JP4351130B2 (en) * | 2004-09-07 | 2009-10-28 | 学校法人東海大学 | Manufacturing method of optical connection device and optical connection device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112327419A (en) * | 2020-11-03 | 2021-02-05 | 中航光电科技股份有限公司 | Waveguide vertical optical coupling structure |
| CN112327419B (en) * | 2020-11-03 | 2022-06-28 | 中航光电科技股份有限公司 | Waveguide vertical optical coupling structure |
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