CN1939174A - Hot-melt flattening binder and its temperature control - Google Patents
Hot-melt flattening binder and its temperature control Download PDFInfo
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- CN1939174A CN1939174A CN 200610116102 CN200610116102A CN1939174A CN 1939174 A CN1939174 A CN 1939174A CN 200610116102 CN200610116102 CN 200610116102 CN 200610116102 A CN200610116102 A CN 200610116102A CN 1939174 A CN1939174 A CN 1939174A
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Abstract
A plate-type thermo-fusion binding machine has a temp control mechanism, which has a touch screen connected with the data interface of PLC microprocessor and a temp sensor positioned in heating area and connected to the analog input of A/D converter module in the PLC microprocessor via temp transducer. The control port of PID control module in PLC microprocessor is connected to the control port of said heating area. Its advantages are high speed, high precision, high correctness, and real-time control.
Description
Technical field
The present invention relates to a kind of hot-melt flattening binder and temperature-controlled process thereof.
Background technology
Existing hot-melt flattening binder is a kind of various adhesion techniques are combined, controlled the equipment that carries out hot melt adhesive by computer programming, computer.Can carry out the setting of temperature and pressure and weight time with different adhesive lining according to different linings.By various sense switches, sensor the various states and the temperature value of machine are imported computer, machine cools off pressurization simultaneously along with the computer clock internal heats successively, heat pressure adhesive.But these Detection ﹠ Controling all can only be the switching value aspects, because the variation at any time of difference, mould and the bedding and padding of lining is difficult to be adapted to the kinds of processes requirement of various different linings and adhesive lining, are difficult to solve bonding firm and strike-through contradiction.
Along with the raising day by day of people's living standard, to the also constantly increase of demand of high-grade shirt, processing technology requires corresponding raising; Simultaneously the kind of lining is also enriched constantly, and hair, cotton difference different with numb content and adhesive lining make its micelle melting temperature etc. propose new requirement to the temperature control of bonder, require to be controlled in positive and negative 3 ℃.And temperature can't realize when adopting instrument control complete machine centralized Control, can not fundamentally solve on the technology the existing contradiction of temperature requirement; Also can't realize simultaneously the same management of data.
Summary of the invention
Technical problem to be solved by this invention is: a kind of overcome above-mentioned deficiency, the centralized Control of being convenient to realize complete machine, hot-melt flattening binder and temperature-controlled process thereof that temperature control precision is high are provided.
Technical scheme of the present invention is:
A kind of hot-melt flattening binder, comprise temperature control mechanism, it contains the temperature sensor that is positioned at the thermal treatment zone, described temperature control mechanism also comprises the touch-screen that links to each other by the data-interface with the PLC microprocessor, and described temperature sensor links to each other with the analog quantity input of A/D modular converter in the described PLC microprocessor by temperature transmitter; The control end of pid control module links to each other with the control end of the described thermal treatment zone in the described PLC microprocessor;
The temperature data that described temperature transmitter transmits described temperature sensor is processed into the analog quantity input that inputs to A/D modular converter in the PLC microprocessor behind the standard electric signal;
The A/D modular converter converts the standard electric signal to digital quantity in the described PLC microprocessor, according to predefined duty and control corresponding parameter heating is controlled; In the policer operation process, to the duty of described bonder in addition logistic discrimination and logical process, temperature controlling accounts for according to hot pressing that the rate of carrying is different to adopt different control parameters.
Switching input module in the described PLC microprocessor links to each other with detection signal input line, and switching output module links to each other with the control signal output line.
Another technical scheme of the present invention is:
A kind of temperature-controlled process of hot-melt flattening binder comprises the steps:
1) data acquisition: the temperature data that temperature sensor in real time detects the thermal treatment zone is sent to temperature transmitter, and temperature transmitter is processed into temperature data the analog quantity input that inputs to A/D modular converter in the PLC microprocessor behind the standard electric signal:
2) A/D conversion: the A/D modular converter converts analog quantity to digital quantity and enters the processing of PLC participation data in the described PLC microprocessor;
3) temperature deviation is proofreaied and correct: the mould to each thermal treatment zone carries out temperature test earlier, temperature show value with test value and each corresponding thermal treatment zone compares again, the difference that will compare is separately proofreaied and correct by temperature deviation and is provided with at last, makes that respectively to distinguish the temperature show value consistent with measured value;
4) centralized Control: described PLC microprocessor is controlled heating according to predefined duty and control corresponding parameter; In the policer operation process, to the duty of described bonder in addition logistic discrimination and logical process, temperature controlling accounts for according to hot pressing that the rate of carrying is different to adopt different control parameters.
In central controlled process, pid control module at first preestablishes two kinds of duties according to the working clearance of hot pressing film, respectively these two kinds of duties is carried out adjusting certainly of temperature pid control parameter, obtains two groups of parameters; Described then PLC microprocessor for different duties, calls the corresponding parameter that obtains by adjusting certainly and realizes temperature control when detecting the duty of described bonder.
Beneficial effect of the present invention is: realized that temperature high speed acquisition, high accuracy become and sent and operation of data and processing, the real-time control of the differentiation of duty, the automatic adjusting of pid parameter and temperature, the control heating-up temperature is accurate, mold temperature is even, reach adhesive glue and melt uniform purpose, solved bonding firmly and the contradiction of strike-through.The present invention simultaneously is based on the PLC microprocessor, have that volume is little, function by force, high reliability and advantage such as easy to maintenance.
Description of drawings
Now the invention will be further described in conjunction with an embodiment and accompanying drawing thereof.
Accompanying drawing 1 is the structure principle chart of temperature control mechanism in the hot-melt flattening binder.
The automatic adjusting parameter of the temperature pid control parameter when accompanying drawing 2 is continuous duty.
The automatic adjusting parameter of the temperature pid control parameter when accompanying drawing 3 is the discontinuous operation state.
The specific embodiment
Referring to accompanying drawing, the temperature control mechanism of hot-melt flattening binder of the present invention mainly is made up of the temperature sensor that is installed in the thermal treatment zone, temperature transmitter, PLC microprocessor and touch-screen.After temperature transmitter converts the non-electrical signal of temperature sensor the signal of telecommunication of standard to, be sent to the analog quantity input of PLC microprocessor again, convert the computing that digital quantity participates in pid control module to by the A/D in the PLC microprocessor, to realize control to the thermal treatment zone.
Concrete hot-melt flattening binder realizes that the method for temperature control is, the mold heated plate of 400mm*800mm is divided into four adds the district, that is: A district heating, the heating of B district, heat in the C district and heat in the D district.Temperature sensor is installed in separately electrical heating district, converts its non-electrical signal the signal of telecommunication of 0～20mA of standard to by temperature transmitter, send the analog quantity input of PLC again to, PLC converts digital quantity to by A/D and participates in computing, control.But, directly influence bonding effect should be with mould that adhesive lining and lining directly contact on temperature, the temperature of the temperature on the mould and our thermal treatment zone must exist difference, respectively A district mould, B district mould, C district mould and D district mould are carried out temperature test with the temperature test instrument, simultaneously test value is compared with the temperature show value in each corresponding district, the difference that will compare is separately proofreaied and correct by temperature deviation and is provided with at last, makes that respectively to distinguish the temperature show value consistent with measured value.Wherein temperature sensor is selected commercially available highly sensitive temperature sensor Pt100 for use, temperature transmitter is selected commercially available SBWZ series RTD temperature transmitter for use, the PLC microprocessor is selected the CP1H type PLC of Japan OMRON for use, this PLC belongs to 32 machines, data operation and disposal ability at a high speed arranged, it has concentrated numerous functions in one, and built-in analog quantity input (A/D) and analog quantity output (D/A) function, reach and carried input of 4 tunnels analogy amounts and the output of 2 passages, especially its A/D and D/A are high-resolution, high response is implemented in for intellectuality is temperature controlled assurance is provided on the hardware.
By the PLC microprocessor duty of bonder is judged in the control of hot-die, the hot-die operation range is surpassed 3 minutes and be considered as the service intermittent state, 3 minutes with the interior continous way duty that is considered as.
Owing to have continuous duty and discontinuous operation state, the thermal balance of these two kinds of duties also exists difference, just should take different control datas when temperature is controlled so.CH1H type PLC microprocessor provides band from adjusting PID operational order " PIDAT (191) ", carry out adjusting certainly under the particular state by this instruction, instruct by this PIDAT of subroutine call (191), and the data that get of will adjusting certainly preserve, and PID (190) instruction is used when operating in the particular job state.Since adopt centralized Control such as temperature, action, might as well be 500.00==1 (ON) when the service intermittent state; During the continous way duty 500.00==0 (OFF).
Therefore under the different operating state, the process that PID control is handled is as follows:
The automatic adjusting parameter of the temperature pid control parameter by continuous duty the time is referring to accompanying drawing 2.
So, when the PLC microprocessor detected the bonder running status and is in continuous duty, the PLC microprocessor just carried out the control of PID temperature by this parameter of subroutine call, makes temperature be controlled in the desired scope of adhesion technique,
The automatic adjusting parameter of the temperature pid control parameter by the discontinuous operation state time is referring to accompanying drawing 3.
So, when the PLC microprocessor detects the bonder running status and is in the discontinuous operation state, the PLC microprocessor just carries out PID temperature control by this parameter of subroutine call, make temperature control can overshoot, be controlled in the desired scope of adhesion technique.
Claims (4)
1, a kind of hot-melt flattening binder comprises temperature control mechanism, and it contains the temperature sensor that is positioned at the thermal treatment zone, it is characterized in that:
Described temperature control mechanism also comprises the touch-screen that links to each other by the data-interface with the PLC microprocessor, and described temperature sensor links to each other with the analog quantity input of A/D modular converter in the described PLC microprocessor by temperature transmitter; The control end of pid control module links to each other with the control end of the described thermal treatment zone in the described PLC microprocessor;
The temperature data that described temperature transmitter transmits described temperature sensor is processed into the analog quantity input that inputs to A/D modular converter in the PLC microprocessor behind the standard electric signal;
The A/D modular converter converts the standard electric signal to digital quantity in the described PLC microprocessor, according to predefined duty and control corresponding parameter heating is controlled; In the policer operation process, to the duty of described bonder in addition logistic discrimination and logical process, temperature controlling accounts for according to hot pressing that the rate of carrying is different to adopt different control parameters.
2, hot-melt flattening binder according to claim 1 is characterized in that: the switching input module in the described PLC microprocessor links to each other with detection signal input line, and switching output module links to each other with the control signal output line.
3, the temperature-controlled process of the described hot-melt flattening binder of a kind of claim 1 comprises the steps:
1) data acquisition: the temperature data that temperature sensor in real time detects the thermal treatment zone is sent to temperature transmitter, and temperature transmitter is processed into temperature data the analog quantity input that inputs to A/D modular converter in the PLC microprocessor behind the standard electric signal;
2) A/D conversion: the A/D modular converter converts analog quantity to digital quantity and enters the processing of PLC participation data in the described PLC microprocessor;
3) temperature deviation is proofreaied and correct: the mould to each thermal treatment zone carries out temperature test earlier, temperature show value with test value and each corresponding thermal treatment zone compares again, the difference that will compare is separately proofreaied and correct by temperature deviation and is provided with at last, makes that respectively to distinguish the temperature show value consistent with measured value;
4) centralized Control: described PLC microprocessor is controlled heating according to predefined duty and control corresponding parameter; In the policer operation process, to the duty of described bonder in addition logistic discrimination and logical process, temperature controlling accounts for according to hot pressing that the rate of carrying is different to adopt different control parameters.
4, according to the temperature-controlled process of the described hot-melt flattening binder of claim 3, it is characterized in that: in central controlled process, pid control module at first preestablishes two kinds of duties according to the working clearance of hot pressing film, respectively these two kinds of duties are carried out adjusting certainly of temperature pid control parameter, obtain two groups of parameters; Described then PLC microprocessor for different duties, calls the corresponding parameter that obtains by adjusting certainly and realizes temperature control when detecting the duty of described bonder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101161025A CN100521995C (en) | 2006-09-15 | 2006-09-15 | Hot-melt flattening binder and its temperature control |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101161025A CN100521995C (en) | 2006-09-15 | 2006-09-15 | Hot-melt flattening binder and its temperature control |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1939174A true CN1939174A (en) | 2007-04-04 |
| CN100521995C CN100521995C (en) | 2009-08-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2006101161025A Expired - Fee Related CN100521995C (en) | 2006-09-15 | 2006-09-15 | Hot-melt flattening binder and its temperature control |
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| CN (1) | CN100521995C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107087833A (en) * | 2017-06-01 | 2017-08-25 | 苏州千义服饰科技有限公司 | Fiber heating garment based on intelligent control and preparation method thereof |
| CN108741360A (en) * | 2018-06-25 | 2018-11-06 | 池州市佳山信息技术有限公司 | A kind of clothes processing waist of trousers upper ELASTIC SEWING MACHINE automatically |
-
2006
- 2006-09-15 CN CNB2006101161025A patent/CN100521995C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107087833A (en) * | 2017-06-01 | 2017-08-25 | 苏州千义服饰科技有限公司 | Fiber heating garment based on intelligent control and preparation method thereof |
| CN108741360A (en) * | 2018-06-25 | 2018-11-06 | 池州市佳山信息技术有限公司 | A kind of clothes processing waist of trousers upper ELASTIC SEWING MACHINE automatically |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100521995C (en) | 2009-08-05 |
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Granted publication date: 20090805 Termination date: 20130915 |