CN1929128A - Illuminating source device - Google Patents
Illuminating source device Download PDFInfo
- Publication number
- CN1929128A CN1929128A CNA2005100990657A CN200510099065A CN1929128A CN 1929128 A CN1929128 A CN 1929128A CN A2005100990657 A CNA2005100990657 A CN A2005100990657A CN 200510099065 A CN200510099065 A CN 200510099065A CN 1929128 A CN1929128 A CN 1929128A
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- light
- emitting diode
- backlight unit
- diode chip
- supply apparatus
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Abstract
This invention relates to light source device, which comprises baseboard, first light diode and second and third light diodes and light wave guide element, wherein, first diode is set on one side of baseboard and second electrode is set relative to first one on other side of baseboard; the third diode chip is located between first and second light diodes on baseboard; light wave guide element is set on third diode between first and second ones.
Description
Technical field
The present invention relates to a kind of light supply apparatus, relate in particular to behind a kind of mixed light that carries out three light-emitting diode chip for backlight unit with optical waveguide components and the light supply apparatus of comprehensive equal white light is provided.
Background technology
Be applied in the light supply apparatus on backlight module or the image projection device at present, all provide light with cathode fluorescent tube or thermal cathode fluorescent tube.
Yet,, be difficult for resource after permanent the use to reclaim, and cause environmental pollution easily because cathode fluorescent tube or thermal cathode fluorescent tube have the material of hostile environment such as mercury.
In addition, surging and red-hot along with global environmental consciousness, and the modern stresses for electronic product under the trend that can resource reclaims, and with mercurous cathode fluorescent tube or the thermal cathode fluorescent tube backlight module as light source, will seem does not quite conform with environmental protection.Thus, will reduce the practicality of light supply apparatus widely.
Summary of the invention
In view of this, purpose of the present invention is providing a kind of light supply apparatus exactly.It carries out the mixed light design of three light-emitting diode chip for backlight unit with optical waveguide components, can reach good mixed light effect, and omnibearing equal white light is provided.In addition, present embodiment uses light-emitting diode chip for backlight unit with as light source, can exempt the resource that faces as fluorescent tube and reclaim difficulty and mercury pollution problem of environment, quite meets the environmental protection demand.
According to purpose of the present invention, a kind of light supply apparatus is proposed, comprise a substrate, one first light-emitting diode chip for backlight unit, one second light-emitting diode chip for backlight unit, one the 3rd light-emitting diode chip for backlight unit and an optical waveguide components.First light-emitting diode chip for backlight unit is arranged at a side of substrate, and second light-emitting diode chip for backlight unit is arranged at the opposite side of substrate with respect to first light-emitting diode.The 3rd light-emitting diode chip for backlight unit is arranged on the substrate in the mode between first light-emitting diode chip for backlight unit and second light-emitting diode chip for backlight unit.Optical waveguide components is arranged on the 3rd light-emitting diode, and between first light-emitting diode chip for backlight unit and second light-emitting diode chip for backlight unit.Optical waveguide components has one first incidence surface, one second incidence surface and one the 3rd incidence surface that corresponds respectively to first light-emitting diode chip for backlight unit, second light-emitting diode chip for backlight unit and the 3rd light-emitting diode chip for backlight unit, and an exiting surface.Optical waveguide components is in order to receive the light that first light-emitting diode chip for backlight unit, second light-emitting diode chip for backlight unit and the 3rd light-emitting diode chip for backlight unit are launched accordingly from first incidence surface, second incidence surface and the 3rd incidence surface, and the light that is received carried out mixed light, with the light after launching mixed light at exiting surface.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Fig. 1 is the profile that illustrates according to the light supply apparatus of the preferred embodiments of the present invention; And
Fig. 2 illustrates the substrate of Fig. 1 and the right side view of optical waveguide components.
The primary clustering symbol description
10: light supply apparatus
11: substrate
11a: second heat radiation is to discharge orifice
12a: first light-emitting diode chip for backlight unit
12b: second light-emitting diode chip for backlight unit
12c: the 3rd light-emitting diode chip for backlight unit
13: optical waveguide components
13a: first incidence surface
13b: second incidence surface
13c: the 3rd incidence surface
13d: exiting surface
14a: first support component
14b: second support component
14c: the 3rd support component
14d: the 4th support component
15: ponding
15a: bottom
15b: top
15c: accommodation space
16: reflecting material
17: camera lens
17a: first heat radiation is to discharge orifice
18: fin
18a: the 3rd heat radiation is to discharge orifice
19: fan
20: circuit board
21a～21c: lead
Embodiment
Please be simultaneously with reference to Fig. 1～Fig. 2, Fig. 1 is the profile that illustrates according to the light supply apparatus of the preferred embodiments of the present invention, Fig. 2 illustrates the substrate of Fig. 1 and the right side view of optical waveguide components.In Fig. 1～Fig. 2, light supply apparatus 10 comprises a substrate 11, one first light-emitting diode chip for backlight unit 12a, one second light-emitting diode chip for backlight unit 12b, one the 3rd light-emitting diode chip for backlight unit 12c and an optical waveguide components 13.The first light-emitting diode chip for backlight unit 12a is arranged at a side of substrate 11, and the second light-emitting diode chip for backlight unit 12b is arranged at the opposite side of substrate 11 with respect to the first light-emitting diode chip for backlight unit 12a.The 3rd light-emitting diode chip for backlight unit 12c is arranged on the substrate 11 in the mode between the first light-emitting diode chip for backlight unit 12a and the second light-emitting diode chip for backlight unit 12b.Optical waveguide components 13 is arranged on the 3rd light-emitting diode 12c, and between the first light-emitting diode chip for backlight unit 12a and the second light-emitting diode chip for backlight unit 12b.Optical waveguide components 13 has one first relative incidence surface 13a and one second incidence surface 13b and relative one the 3rd an incidence surface 13c and an exiting surface 13d, and the first incidence surface 13a and the second incidence surface 13b connect the 3rd incidence surface 13c and exiting surface 13d.The first incidence surface 13a, the second incidence surface 13b and the 3rd incidence surface 13c correspond respectively to the first light-emitting diode chip for backlight unit 12a, the second light-emitting diode chip for backlight unit 12b and the 3rd light-emitting diode chip for backlight unit 12c.Optical waveguide components 13 is in order to receive the light that the first light-emitting diode chip for backlight unit 12a, the second light-emitting diode chip for backlight unit 12b and the 3rd light-emitting diode chip for backlight unit 12c are launched accordingly from the first incidence surface 13a, the second incidence surface 13b and the 3rd incidence surface 13c, and the light that is received carried out mixed light, with the light after launching mixed light at exiting surface 13d.
How to be arranged on the substrate 11 as for the first light-emitting diode chip for backlight unit 12a, the second light-emitting diode chip for backlight unit 12b, the 3rd light-emitting diode chip for backlight unit 12c and optical waveguide components 13, be simply described as follows at this, but the technology of present embodiment not to be confined to this.For example, light supply apparatus 10 also comprises one first support component 14a, one second support component 14b, one the 3rd support component 14c and one the 4th support component 14d, the first support component 14a, the second support component 14b, the 3rd support component 14c and the 4th support component 14d are arranged on the substrate 11 with being spaced from each other, in order to support the first light-emitting diode chip for backlight unit 12a, the second light-emitting diode chip for backlight unit 12b, the 3rd light-emitting diode chip for backlight unit 12c and optical waveguide components 13 respectively on substrate 11.
In the present embodiment, light supply apparatus 10 also comprises a ponding 15, and ponding 15 has the accommodation space 15c that a bottom 15a, a top 15b and run through bottom 15a and top 15b.Bottom 15a can be connected with substrate 11 by adhesive agent or clip connection device, and accommodation space 15c is in order to hold the first light-emitting diode chip for backlight unit 12a, the second light-emitting diode chip for backlight unit 12b, the 3rd light-emitting diode chip for backlight unit 12c, optical waveguide components 13, the first support component 14a, the second support component 14b, the 3rd support component 14c and the 4th support component 14d.Wherein, ponding 15 can comprise a reflective metal or metal alloy, as highly reflective aluminium, in order to reflection ray.In addition, in order to strengthen the albedo of ponding 15 for light, light supply apparatus 10 also comprises a reflecting material 16, and reflecting material 16 is arranged on the inwall of ponding 15, in order to reflection ray.Above-mentioned reflecting material 16 is arranged at coating or the mode pasted on the inwall of ponding 15 and among the accommodation space 15c.
In addition, light supply apparatus 10 also comprises a camera lens 17, and camera lens 17 can be by adhesive agent or clip connection device with on top 15b be connected the exiting surface that is positioned at optical waveguide components 13, in order to the upper end open of sealing accommodation space 15c and increase the light diffusion effect.Though the upper surface of camera lens 17 is a nonreentrant surface at this, for the light that optical waveguide components 13 is launched, camera lens 17 has the concavees lens effect.In order to increase the radiating effect of light supply apparatus 10, camera lens 17 or ponding 15 also have at least one first heat radiation to discharge orifice 17a.At this, dispelling the heat to discharge orifice 17a with first of camera lens 17 is that example explains, and substrate 11 has at least one second heat radiation to discharge orifice 11a.In addition, light supply apparatus 10 also comprises a fin 18, and fin 18 is arranged at substrate 11 times, and has at least one the 3rd heat radiation to discharge orifice 18a.Wherein, the 3rd heat radiation is dispelled the heat to discharge orifice 11a corresponding to second to discharge orifice 18a, and fin 18 for example is a radiating fin.In addition, light supply apparatus 10 also comprises a fan 19, and fan 19 is arranged at fin 18 times, and dispels the heat to discharge orifice 18a corresponding to the 3rd.By circuit design, also can be according to the rotating speed of the temperature modulation fan 19 of light supply apparatus 10.Or light supply apparatus 10 can omit the design of fin 18, and fan 19 directly is set in substrate 11 times, make fan 19 directly corresponding to second heat radiation to discharge orifice 11a.Therefore, light supply apparatus 10 can reach radiating effect to the design of any collocation of discharge orifice, fin and fan by heat radiation, makes the first light-emitting diode chip for backlight unit 12a, the second light-emitting diode chip for backlight unit 12b, the 3rd light-emitting diode chip for backlight unit 12c suitably keep good luminous mass under the ambient temperature.
How be electrically connected and luminous as for the first light-emitting diode chip for backlight unit 12a, the second light-emitting diode chip for backlight unit 12b, the 3rd light-emitting diode chip for backlight unit 12c, be simply described as follows at this, but the technology of present embodiment be not limited thereto with extraneous power supply.For example, light supply apparatus 10 also comprises a circuit board 20, and circuit board 20 is arranged on the substrate 11, in order to be electrically connected with the first light-emitting diode chip for backlight unit 12a, the second light-emitting diode chip for backlight unit 12b and the 3rd light-emitting diode chip for backlight unit 12c.Therefore, circuit board 20 will be powered to the first light-emitting diode chip for backlight unit 12a, the second light-emitting diode chip for backlight unit 12b and the 3rd light-emitting diode chip for backlight unit 12c after receiving extraneous power supply, and the first light-emitting diode chip for backlight unit 12a, the second light-emitting diode chip for backlight unit 12b and the 3rd light-emitting diode chip for backlight unit 12c are emitted beam to optical waveguide components 13.Wherein, when if the first support component 14a, the second support component 14b and the 3rd support component 14c comprise three metal support element, the first light-emitting diode chip for backlight unit 12a, the second light-emitting diode chip for backlight unit 12b and the 3rd light-emitting diode chip for backlight unit 12c can be electrically connected with circuit board 20 by a lead and a metal support element respectively.For example, the first light-emitting diode chip for backlight unit 12a is electrically connected with circuit board 20 by the one first lead 21a and the first support component 14a, the second light-emitting diode chip for backlight unit 12b is electrically connected with circuit board 20 by the one second lead 21b and the second support component 14b, and the 3rd light-emitting diode chip for backlight unit 12c is electrically connected with circuit board 20 by a privates 21c and the 3rd support component 14c.Wherein, the positive pole of the first light-emitting diode chip for backlight unit 12a, the second light-emitting diode chip for backlight unit 12b and the 3rd light-emitting diode chip for backlight unit 12c can be electrically connected with three metal support element such as the first support component 14a, the second support component 14b and the 3rd support component 14c accordingly.Or the negative pole of the first light-emitting diode chip for backlight unit 12a, the second light-emitting diode chip for backlight unit 12b and the 3rd light-emitting diode chip for backlight unit 12c can be electrically connected with three metal support element such as the first support component 14a, the second support component 14b and the 3rd support component 14c accordingly.In addition, the first light-emitting diode chip for backlight unit 12a, the second light-emitting diode chip for backlight unit 12b and the 3rd light-emitting diode chip for backlight unit 12c can be electrically connected with circuit board 20 by two leads respectively.
Right present embodiment the technical staff in the technical field can understand that also the technology of present embodiment is not confined to this, and for example, optical waveguide components 14 comprises a light-combining prism (X-cube) or a colour splitting prism (dichroic prism).In addition, substrate 11 comprises a metal substrate or a sapphire substrate, can help light supply apparatus 10 heat radiations to extraneous.In addition, the first light-emitting diode chip for backlight unit 12a, the second light-emitting diode chip for backlight unit 12b and the 3rd light-emitting diode chip for backlight unit 12c comprise the combination of a ruddiness (R) light-emitting diode chip for backlight unit, a green glow (G) light-emitting diode chip for backlight unit and a blue light (B) light-emitting diode chip for backlight unit, then optical waveguide components 13 can carry out the mixed light effect of ruddiness, green glow and blue light, and launches the white light that is blended together in exiting surface 13d.Moreover the first light-emitting diode chip for backlight unit 12a, the second light-emitting diode chip for backlight unit 12b and the 3rd light-emitting diode chip for backlight unit 12c are three white light emitting diode chips.Again, light supply apparatus 10 can be applied on backlight module, camera head, image projection device or the large-scale advertisement plate.
Present embodiment also can form a line several light supply apparatuses 10 or an array, so that wider planar backlight to be provided.
The disclosed light supply apparatus of the above embodiment of the present invention, it carries out the mixed light design of three light-emitting diode chip for backlight unit with optical waveguide components, can reach good mixed light effect, and omnibearing equal white light is provided.In addition, present embodiment uses light-emitting diode chip for backlight unit with as light source, can exempt the resource that faces as fluorescent tube and reclaim difficulty and mercury pollution problem of environment, quite meets the environmental protection demand.
In sum; though the present invention with a preferred embodiment openly as above; right its is not in order to limit the present invention; those skilled in the art; without departing from the spirit and scope of the present invention; when can doing various changes and retouching, so protection scope of the present invention is as the criterion when looking the claim person of defining.
Claims (10)
1. light supply apparatus comprises:
One substrate;
One first light-emitting diode chip for backlight unit is arranged at a side of this substrate;
One second light-emitting diode chip for backlight unit is arranged at the opposite side of this substrate with respect to this first light-emitting diode chip for backlight unit;
One the 3rd light-emitting diode chip for backlight unit is arranged on this substrate in the mode between this first light-emitting diode chip for backlight unit and this second light-emitting diode chip for backlight unit; And
One optical waveguide components, be arranged on the 3rd light-emitting diode, and between this first light-emitting diode chip for backlight unit and this second light-emitting diode chip for backlight unit, this optical waveguide components has and corresponds respectively to this first light-emitting diode chip for backlight unit, first incidence surface of this second light-emitting diode chip for backlight unit and the 3rd light-emitting diode chip for backlight unit, second incidence surface and the 3rd incidence surface, and exiting surface, this optical waveguide components is in order to from this first incidence surface, this second incidence surface and the 3rd incidence surface receive this first light-emitting diode chip for backlight unit accordingly, the light that this second light-emitting diode chip for backlight unit and the 3rd light-emitting diode chip for backlight unit are launched, and the light that is received carried out mixed light, with the light after launching mixed light at this exiting surface.
2. light supply apparatus as claimed in claim 1 also comprises:
One first support component, one second support component, one the 3rd support component and one the 4th support component, be arranged on this substrate, in order to support this first light-emitting diode chip for backlight unit, this second light-emitting diode chip for backlight unit, the 3rd light-emitting diode chip for backlight unit and this optical waveguide components respectively on this substrate.
3. light supply apparatus as claimed in claim 2 also comprises:
One ponding, have a bottom, a top and and run through the accommodation space at this bottom and this top, this bottom is connected with this substrate, and this accommodation space is in order to hold this first light-emitting diode chip for backlight unit, this second light-emitting diode chip for backlight unit, the 3rd light-emitting diode chip for backlight unit, this optical waveguide components, this first support component, this second support component, the 3rd support component and the 4th support component.
4. light supply apparatus as claimed in claim 3, wherein this ponding comprises a reflective metal or metal alloy.
5. light supply apparatus as claimed in claim 3 also comprises:
One camera lens is connected with this top, in order to seal the upper end open of this accommodation space.
6. light supply apparatus as claimed in claim 5, wherein this camera lens or this ponding have one first heat radiation to discharge orifice, and this substrate has one second heat radiation to discharge orifice.
7. light supply apparatus as claimed in claim 6 also comprises:
One fin is arranged under this substrate, and have one the 3rd the heat radiation to discharge orifice, the 3rd the heat radiation to discharge orifice corresponding to this second the heat radiation to discharge orifice.
8. light supply apparatus as claimed in claim 1 also comprises:
One circuit board is arranged on this substrate, in order to be electrically connected with this first light-emitting diode chip for backlight unit, this second light-emitting diode chip for backlight unit and the 3rd light-emitting diode chip for backlight unit.
9. light supply apparatus as claimed in claim 1, wherein this first light-emitting diode chip for backlight unit, this second light-emitting diode chip for backlight unit and the 3rd light-emitting diode chip for backlight unit comprise the combination of a ruddiness (R) light-emitting diode chip for backlight unit, a green glow (G) light-emitting diode chip for backlight unit and a blue light (B) light-emitting diode chip for backlight unit.
10. light supply apparatus as claimed in claim 1, wherein this first light-emitting diode chip for backlight unit, this second light-emitting diode chip for backlight unit and the 3rd light-emitting diode chip for backlight unit are three white light emitting diode chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005100990657A CN1929128A (en) | 2005-09-06 | 2005-09-06 | Illuminating source device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005100990657A CN1929128A (en) | 2005-09-06 | 2005-09-06 | Illuminating source device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1929128A true CN1929128A (en) | 2007-03-14 |
Family
ID=37859012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2005100990657A Pending CN1929128A (en) | 2005-09-06 | 2005-09-06 | Illuminating source device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1929128A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110989105A (en) * | 2019-12-23 | 2020-04-10 | 武汉福地科技有限公司 | Mounting, fixing and heat dissipation structure for optical module |
-
2005
- 2005-09-06 CN CNA2005100990657A patent/CN1929128A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110989105A (en) * | 2019-12-23 | 2020-04-10 | 武汉福地科技有限公司 | Mounting, fixing and heat dissipation structure for optical module |
| CN110989105B (en) * | 2019-12-23 | 2021-04-27 | 武汉飞沃科技有限公司 | Mounting, fixing and heat dissipation structure for optical module |
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