CN1925719A - Module, method of manufacturing module, and electronic apparatus using module - Google Patents
Module, method of manufacturing module, and electronic apparatus using module Download PDFInfo
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- CN1925719A CN1925719A CN 200610126170 CN200610126170A CN1925719A CN 1925719 A CN1925719 A CN 1925719A CN 200610126170 CN200610126170 CN 200610126170 CN 200610126170 A CN200610126170 A CN 200610126170A CN 1925719 A CN1925719 A CN 1925719A
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Abstract
A module includes a circuit board, a first terminal on a lower surface of the circuit board, a first electronic component on an upper surface of the circuit board, a first cover made of metal covering the first electronic component, a second electronic component on the lower surface of the circuit board, a terminal board provided under the lower surface of the circuit board, a second terminal on an upper surface of the terminal board, a third terminal provided on the lower surface of the terminal board, and a second cover made of metal covering the second electronic component. The second terminal faces the first terminal and is connected to the first terminal. The third terminal is connected to the second terminal. The terminal board has an opening therein surrounding the second electronic component. The second cover includes a top plate portion located under the second electronic component, and a side plate portion extending from the top plate portion toward the lower surface of the circuit board. The side plate portion is positioned between the second electronic component and an inner periphery of the opening. This module occupies a small area.
Description
Technical field
The present invention relates to module and the manufacture method thereof that possesses circuit substrate and be assemblied in a plurality of electronic devices on this circuit substrate, the electronic equipment that reaches this module of use.
Background technology
Figure 10 is the profile of existing module 1.Module 1 possesses circuit substrate 3, and uses paste soldering material 7 to be assemblied in a plurality of electronic devices 9 of top 5 of circuit substrate 3.Be equipped with metal cover 11 with overlay electronic device 9, and via paste soldering material, the cover pin 15 that will be provided with in the side 13 of cover 11 is connected with the otch 17 that the side at circuit substrate 3 is provided with.Below circuit substrate 3 19, be formed with and be used for and mother substrate connection terminals 21.
In existing module 1, because electronic device 9 is installed on single face, so the area of circuit substrate increases.Thereby when carrying module on mother substrate, the occupied area of module 1 increases in mother substrate.
Summary of the invention
A kind of module, it possesses: circuit substrate; The first terminal, its be arranged on circuit substrate below; First electronic device, its be assemblied in circuit substrate above; Metal first cover, it covers first electronic device; Second electronic device, its be assemblied in circuit substrate below; Terminal row substrate, it is arranged on the following below of circuit substrate; Second terminal, its be arranged on terminal row substrate above; The 3rd terminal, its be arranged on terminal row substrate below; And metal second cover, it covers second electronic device.Second terminal and the first terminal are opposed, are connected with the first terminal.The 3rd terminal is connected with second terminal.Be formed with the hole that surrounds second electronic device at terminal row substrate.Second cover has top plate portion, and the side plate that extends towards circuit substrate from top plate portion of the below that is positioned at second electronic device.Side plate is between the inner peripheral surface in second electronic device and hole.
Can reduce the occupied area of this module.
Description of drawings
Fig. 1 is the circuit block diagram of the module of embodiments of the present invention;
Fig. 2 A and Fig. 2 B are the profiles of the module of execution mode;
Fig. 2 C is the profile that carries the module of the execution mode on mother substrate;
Fig. 3 is the manufacturing flow chart of the module of execution mode;
Fig. 4 is the profile in the manufacturing process of module of execution mode;
Fig. 5 is the profile in the manufacturing process of module of execution mode;
Fig. 6 is the profile in the manufacturing process of module of execution mode;
Fig. 7 is the back view in the manufacturing process of module of execution mode;
Fig. 8 A and Fig. 8 B are the profiles in the manufacturing process of module of execution mode;
Fig. 9 A and Fig. 9 B are the profiles of other modules of execution mode;
Fig. 9 C is the profile that is assemblied in the module shown in Fig. 9 A on the mother substrate;
Figure 10 is the profile of existing module.
Embodiment
Fig. 1 is the circuit block diagram of the module 23 of embodiments of the present invention.Module 23 formation high-frequency receiving device 29, the high-frequency signal of the television broadcasting electric wave that 29 pairs of this high-frequency receiving devices are supplied with from antenna 25A, 25B etc. carries out channel selection, and to the signal after the channel selection synthesize, demodulation, thereby from lead-out terminal 27 outputs.High-frequency receiving device 29 comprises high-frequency circuits such as the electronic tuning unit 31A, the 31B that are used for the receiving digital television broadcast signal and demodulator circuit 33.High-frequency receiving device 29 adopts and is fit to move the diversity mode that receives.The output of antenna 25A, 25B is supplied in electronic tuning unit 31A, 31B respectively.Demodulator circuit 33 can be realized the high-frequency receiving device 29 good to mobile receiving sensitivity by the signal of synthetic electronic tuning unit 31A, 31B output.
Then, electronic tuning unit 31A, 31B are described.The high-frequency signal that is input to antenna 25A, 25B is supplied in separately input terminal 35A, the 35B of electronic tuning unit 31A, 31B respectively.The high-frequency signal that is input to input terminal 35A, 35B is supplied in band pass filter 37A, 37B respectively, and band pass filter 37A, 37B remove the unwanted signal outside the frequency acceptance band from these high-frequency signal.The output of band pass filter 37A, 37B is supplied in the side's of frequency mixer 41A, 41B input respectively respectively via amplifier 39A, 39B.The output of local oscillator 43 is supplied in the opposing party's of frequency mixer 41A, 41B input, thereby frequency mixer 41A, 41B export I signal and Q signal respectively.That is, frequency mixer 41A, 41B are the frequency mixers of direct conversion (direct conversion) mode.I signal that frequency mixer 41A, 41B export respectively and Q signal are supplied in demodulator circuit 33 via low pass filter 45A, 45B.Be connected with Phase-Locked-Loop (PLL) circuit 47 at local oscillator 43.
Be supplied to the demodulator circuit 33 of the output of electronic tuning unit 31A, 31B, I signal, the Q signal that will be transfused to are transformed to digital signal, and carry out demodulation, synthetic.And, the signal after synthetic has been implemented error correction and the signal that obtains from lead-out terminal 27 output.
Therefore module 23 requires miniaturization to module 23 owing to be built in the portable set of receiving television broadcasting such as portable phone.Particularly, as nearest portable phone,, and on mother substrate, form than multicircuit for built-in more multi-functional.The area that the module 23 of execution mode can reduce to install at mother substrate is an occupied area.Also have, the module 23 of present embodiment is the tuner that digital television broadcasting receives usefulness, receives the tuner of usefulness or is used in the transmission in other communication equipments or receives the module of usefulness and use but also can be used as analog broadcasting.
Structure to the module 23 that comprises such high-frequency circuit describes.Fig. 2 A and Fig. 2 B are the profiles of module 23.51 constitute electronic tuning unit 31A on as the circuit substrate 49 of six layers multilager base plate, 53 constitute electronic tuning unit 31B and demodulator circuit 33 below.51 are equipped with the electronic device 57 (first electronic device) of the circuit that constitutes electronic tuning unit 31A by paste soldering material on circuit substrate 49.53 be equipped with the electronic device 61 (second electronic device) that constitutes electronic tuning unit 31B and demodulator circuit 33 below by paste soldering material.
53 flip-over types are equipped with integrated circuit component 63 below circuit substrate 49, are electrically connected by braze projection 65 between integrated circuit component 63 and the circuit substrate 49.Flow between the epoxy resin 67 bonding integrated circuit components 63 and circuit substrate 49 in the gap between integrated circuit component 63 and the circuit substrate 49.
The 53 terminal row substrates 69 that are equipped with the frame shape below circuit substrate 49.53 are formed with splicing ear 73 (the first terminal) below circuit substrate 49.71 are formed with and splicing ear 73 opposed splicing ears 173 (second terminal) on terminal row substrate 69.Splicing ear 173 is connected with splicing ear 73 by the paste soldering material 59 as connecting elements.That is, top 71 following 53 opposed with circuit substrate 49 of terminal row substrate 69, terminal row substrate 69 is arranged on following 53 below.
In the central portion of the terminal row substrate 69 of frame shape, form porosely 75, in hole 75, dispose metal cover 77 (second cover).Hole 75 above terminal row substrate 69 71 run through below 95.The top plate portion 81 that cover 77 has an overlay electronic device 61, and the end of bending top plate portion 81 and the side plate 83 that forms.Inner peripheral surface 75A in the hole 75 of terminal row substrate 69 is provided with notch 85.Be formed with bonding conductor 87 at notch 85.At bonding conductor 87 with cover between 77 the side plate 83 and be formed with gap 89.Be filled in the paste soldering material 191 as connecting elements in gap 89, connect cover 77 and terminal row substrate 69.
The front end 83A of side plate 83 preferably contacts with following 53 of circuit substrate 49.Thus, be difficult for to take place paste soldering material 191 through the front end 83A of side plates 83 and circuit substrate 49 following 53 between and flow into situations in the cover 77, can prevent the cover 77 that causes because of paste soldering material 191 and the short circuit between the electronic device 61.Side plate 83 covers below circuit substrate 49 53 and the space 93 that produces between 71 above the terminal row substrate 69, and thus, the high-frequency signal of 53 electronic tuning unit 31B that form or demodulator circuit 33 is difficult for from the space 93 and sews below circuit substrate 49.
The top plate portion 81 of cover 77 is positioned at the below of electronic device 61.Cover 77 side plate 83 53 extends below circuit substrate 49 from top plate portion 81, and between the inner peripheral surface 75A in electronic device 61 and hole 75.
Be provided with ground plane 249 in the inside of circuit substrate 49.Thus, the top plate portion 81 of electronic device 61 or integrated circuit component 63 quilt covers 77, side plate 83 and ground plane 249 surround, and therefore can realize that high-frequency signal more is difficult for the module of sewing 23.
Fig. 2 C is the profile that carries the module 23 on mother substrate 501.501A is formed with circuit pattern 502,503 on mother substrate 501.95 are provided with assembling terminal 97 (the 3rd terminal) below terminal row substrate 69, and assembling terminal 97 is fixedly connected on circuit pattern 502 by braze 505.Below 95 outstanding than the highland from covering 77 top plate portion 81.Be assemblied in module 23 under the situation of mother substrate 501, be difficult for produce the circuit pattern 502 on the mother substrate 501 and cover short circuit between 77.At terminal row substrate 69, assembling terminal 97 is connected by through hole 273 with splicing ear 73.The fusing point of braze 59,91,191 is higher than the fusing point with the braze 505 of module soldering on mother substrate 501.Thus, braze 59,91,191 no longer fusions when module 23 is connected with mother substrate 501, thus be difficult for producing short circuit.
Outside 177 at cover 77 is formed with dielectric film 201.Thus, can reduce following 95, therefore can reduce the height of module 23, and then produce short circuit between can preventing circuit pattern 502 more reliably and covering 77 from covering the outstanding height in 77 outside 177.
51 covers 104 that are equipped with overlay electronic device 57 on circuit substrate 49 (first cover).Cover 104 has top plate portion 105, the side plate 107 that forms from top plate portion 105 bendings, reaches the pin 109 that extends from side plate 107.Periphery at circuit substrate 49 is provided with the notch 111 that is used to insert pin 109.At terminal row substrate 69, be formed with notch 113 in notch 111 opposed positions with incision size bigger than notch 111 with circuit substrate 49.The difference in the footpath of notch 113,111 or the difference of width preferably are made as more than the assembling deviation size of 69 pairs of circuit substrates 49 of terminal row substrate.Thus, the side 113A of notch 113 is difficult for more outstanding than the side 111A of notch 111, so pin 109 can easily insert circuit substrate 49.
The notch 111 of circuit substrate 49 via circuit substrate 49 above 51, side 111A and below 53 be provided with conductor 111B.The notch 113 of terminal row substrate 69 via terminal row substrate 69 above 71, side 113A and below 95 be formed with conductor 113B.The pin 109 of cover 104 is fixedly connected on conductor 111B, 113B by the paste soldering material 91 as connecting elements.Conductor 111B, 113B also can be as the earth terminals of electronic tuning unit 31A, 31B or demodulator circuit 33 and are used.Thus, can guarantee the ground connection of the high-frequency circuit on the circuit substrate 49, therefore can realize the good shielding of high-frequency circuit by cover 104.
In the module 23 of execution mode,, therefore can form high-frequency circuit on the two sides of circuit substrate 49 owing in the hole 75 of terminal row substrate 69, be equipped with electronic device 61.Thereby, can reduce the area of circuit substrate 49, so can reduce the occupied area of the module 23 on mother substrate 501.
In module 23, the side plate 83 of cover 77 inserts between electronic device 61 and the terminal row substrate 69.Thus, the signal of 53 electronic tuning unit 31B that form or demodulator circuit 33 is difficult for being leaked to via assembling terminal 97 circuit of mother substrate 501 below, therefore also can be below circuit substrate 49 53 forms high-frequency circuits.Thus, can reduce the area of circuit substrate 49, therefore can reduce the occupied area of the module 23 on mother substrate 501.Because cover 77 can screening electron tuner 31 or demodulator circuit 33, therefore can access the module 23 of strong interference immunity.
Fig. 3 is the flow chart of the manufacturing engineering of module 23.Based on operation as shown in Figure 3, the manufacture method of module 23 is described.
In operation 123 as shown in Figure 3, on plate shape substrates 121, print paste soldering material or solder flux (flux) 60.Fig. 5 is the profile of the module 23 of operation 123.In the later operation 123 of operation 119,53 by printing paste soldering material 59 or solder flux 60 such as screen printings below plate shape substrates 121 (circuit substrate 49).Then, in operation 125 as shown in Figure 3, electronic devices such as chip device 61 or integrated circuit component 63 are installed near the position following 53 the peripheral part of having removed circuit substrate 49 of plate shape substrates 121 (circuit substrate 49).That is, 53 peripheral part forms and is unkitted the non-assembly area 121A that is furnished with electronic device 61 or integrated circuit component 63 below circuit substrate 49.
In operation 127, terminal row substrate 69 is assemblied in plate shape substrates 121 (circuit substrate 49).Fig. 6 is the profile of the module 23 of operation 127.After operation 125,53 non-assembly area 121A assembling terminal row substrate 69 below plate shape substrates 121.Electronic device 61 or integrated circuit 63 are positioned at the hole 75 of terminal row substrate 69, are that terminal row substrate 69 surrounds by hole 75.The footpath of the through hole 139 that is provided with at terminal row substrate 69 is greater than the footpath of the through hole 137 that is provided with at plate shape substrates 121.The through hole 139 that is provided with at terminal row substrate 69 is located on the through hole 137 of plate shape substrates 121 settings.
In operation 129, the plate shape substrates 121 that electronic device 61 and integrated circuit component 63 or terminal row substrate 69 are installed is dropped in the reflow stove.By paste soldering material 59 or braze projection 65 with electronic device 61, integrated circuit component 63 or terminal row substrate 69 reflow solderings in plate shape substrates 121, thereby on each circuit substrate 49, form the circuit of high-frequency receiving device 29.
After operation 129, whether the circuit of confirming high-frequency receiving device 29 in operation 131 operate as normal.Fig. 7 is the upward view of the module 23 of operation 131.Test pin is contacted with terminal 97 on the terminal row substrate 69, and supply with assigned voltages and make each loop works to high-frequency receiving device 29.And, supply with the inspection signal from input terminal 35A, 35B, check and whether export the output signal of stipulating from lead-out terminal.By this inspection, check that to have or not soldering bad.Plate shape substrates 121 has nine modules 23, can check module 23 effectively.
Fig. 8 A and Fig. 8 B are the profiles of the module 23 of operation 133 as shown in Figure 3.As shown in Figure 3, operation 133 has operation 135,141,143.In operation 135, assembling cover 104 and cover 77 on the module 23 that is equipped with the high-frequency receiving device 29 that is judged as operate as normal by operation 131.The pin 109 of cover 104 connects the through hole 137 of plate shape substrates 121, and arrives the through hole 139 of terminal row substrate 69.Pin 109 is applied in pressure and is inserted into through hole 137, and is kept by through hole 137.
Cover the hole 75 of 77 process terminal row substrates 69 and be assemblied in following 53 of plate shape substrates 121 (circuit substrate 49).The front end 83A of cover 77 side plate 83 contacts with following 53 of circuit substrate 49, make front end 83A and below do not produce the gap between 53.Thus, can prevent following situation: thus the signal leakage of the 53 electronic tuning unit 31B that form or demodulator circuit 33 brings interference to other circuit such as oscillating circuit of portable phone below; Or the signal of other circuit is scurried into electronic tuning unit 31A, 31B or demodulator circuit 33.
In operation 141 as shown in Figure 3,, use screen printing that terminal row substrate 69 and cover 77 are applied paste soldering material 91,191 in the lump from following 95 directions.At this moment, shown in Fig. 8 A, be fixedly connected on through hole 139, and 95 part 139A applies paste soldering material 91 below through hole 139 in order to cover 104.In addition, shown in Fig. 8 B, be brazed in terminal row substrate 69 in order to cover 77, and via following 95 part 85A of notch 85 with cover coating paste soldering material 91 between 77 the top plate portion 81.
Then, in operation 143, under coated paste soldering material 191 state up, in the reflow stove, heat plate shape substrates 121.Thus, the paste soldering material 91 of supply flows between pin 109 and the through hole 137 and between pin 109 and the through hole 139, pin 109 is fixedly connected on plate shape substrates 121 or terminal row substrate 69.Paste soldering material flows into gap 89, and the side plate 83 that covers 77 is fixedly connected on bonding conductor 87.By the dielectric film 201 that is provided with on the top plate portion 81 of cover 77, paste soldering material 191 is protuberance on top plate portion 81 not, flows into gap 89 reliably.By the reflow stove, cover 104 and cover 77 can be brazed in plate shape substrates 121 (circuit substrate 49) and terminal row substrate 69 in the lump efficiently.Also have, in order to be equipped with plate shape substrates 121 by paste soldering material 91,191 solderings, and make the fusing point of paste soldering material 59 be higher than the fusing point of paste soldering material 91,191 by the electronic device of paste soldering material 59 solderings.
Before inserting the through hole 137 of plate shape substrates 121, the inside dimension between the pin 109 of cover 104 is less than the distance between the through hole 137, and pin 109 is applied in pressure and inserts and remain in the through hole 137.Thus, in operation 143, enter in the reflow stove in the mode towards the below even cover 104, cover 104 does not fall yet.The medial surface 109B towards circuit substrate 69 of the front end 109A of pin 109 is implemented chamfering, thereby easily pin 109 is pressed in the through hole 137.
In operation 145 as shown in Figure 3, plate shape substrates 121 is split into module 23.After being cut apart, in operation 146, check the characteristic of each module 23, finish module 23.In execution mode, in operation 145, utilize the diamond of rotation to cut off sword with predetermined distance cut-out plate shape substrates 121, be divided into nine modules 23.By this cut-out, shown in Fig. 2 A and Fig. 2 B, form section 147A, 147B in the side of circuit substrate 49 and terminal row substrate 69.Because plate shape substrates 121 and terminal row substrate 69 are cut off blade by diamond and cut off simultaneously, so section 147A, 147B and be listed in the plane, the profile of circuit substrate 49 and terminal row substrate 69 is cut off with roughly the same shape, same size.At this moment, through hole 139,137 is also cut apart, thereby forms notch 113 at terminal row substrate 69, forms notch 111 at circuit substrate 49.
Because terminal row substrate 69 is cut off simultaneously with plate shape substrates 121, therefore can increase the width 149 of terminal row substrate 69, thereby terminal row substrate 69 is adsorbed easily by automatic mounting machine and is installed on effectively on the plate shape substrates 121 in operation 127.Because terminal row substrate 69 is cut off under the state that is brazed in circuit substrate 49, even therefore the width 151 shown in Fig. 2 A, Fig. 2 B is less, terminal row substrate 69 also is difficult for breaking.Owing to can reduce the width 151 of terminal row substrate 69, therefore can reduce the area of module 69, thereby can reduce the occupied area of the module 23 on the mother substrate 501.Also have, in the present embodiment, in operation 145 the circumferential lateral surface of distance cover 104 only the diamond of the outer sideway swivel of 0.2mm cut off sword and cut apart terminal row substrate 69 and plate shape substrates 121.
In execution mode, in operation 133, carried out in operation 145, cutting apart terminal row substrate 69 and plate shape substrates 121 after the soldering to covering 77,104.In execution mode, also can be before soldering cover 77,104 and in operation 129 terminal row substrate 69 be brazed in plate shape substrates 121 after, cut apart terminal row substrate 69 and plate shape substrates 121.Thus, in operation 145, on cover 104, do not produce scar.
In execution mode, form the footpath of through hole 139 of the notch 111 of circuit substrate 49, greater than the footpath of the through hole 137 of the notch 113 that forms terminal row substrate 69.In execution mode, form the footpath of through hole 139 of the notch 111 of circuit substrate 49, also can be less than the footpath of the through hole 137 of the notch 113 that forms terminal row substrate 69.In this case, can easily insert the pin 109 of cover 104, will cover 104 with automaton easily and be assemblied in terminal row substrate 69.
Because the circuit substrate 49 of the module 23 of present embodiment and section 147A, the 147B of terminal row substrate 69 side by side, do not produce step in a plane, therefore can improve the dimensional accuracy of the profile of module 23.Because the precision of the profile of module 23 is higher, therefore on the mother substrate 501 of installed module 23, can reduce the interval between module 23 and the adjacent device.Thus, installing device to high-density on mother substrate 501, thus can make mother substrate 501 miniaturizations.
Fig. 9 A and 9B are the profiles of other modules 1023 of execution mode.Also have, in Fig. 9 A, 9B, to the identical identical symbol of part mark of part shown in Fig. 2 A, Fig. 2 B, omit its detailed explanation.In Fig. 9 A, Fig. 9 B, 51 constitute electronic tuning unit 31A on circuit substrate 49,53 constitute electronic tuning unit 31B and demodulator circuit 33 below.Promptly, 51 are equipped with electronic devices 57 such as the chip device 57A that constitutes electronic tuning unit 31A or integrated circuit component 57B on circuit substrate 49,53 are equipped with electronic devices such as the chip device 61A that constitutes electronic tuning unit 31B and demodulator circuit 33 or integrated circuit component 61B below.Constitute chip device 57A, the 61A of these circuit, all be assemblied on the circuit substrate 49 by braze 59. Integrated circuit component 57B, 61B are assemblied on the circuit substrate 49 by flip-over type. Integrated circuit component 57B, 61B are electrically connected with circuit substrate 49 by braze projection 301.Between integrated circuit component 57B and the circuit substrate 49, and the epoxy resin 67 of between integrated circuit component 61B and circuit substrate 49, filling integrated circuit component 57B, 61B are connected on the circuit substrate 49 securely.
To at bonding conductor 87 with cover the gap that forms between 77 the side plate 83 and supply with braze 59, connect cover 77 and terminal row substrate 69.
Because therefore configuration braze 59 forms the gap at the part 75B that is not formed with splicing ear 73 between terminal row substrate 69 and circuit substrate 49.By below the front end 83B of side plate 83 and circuit substrate 49, between 53 gap 151 being set, can make the cross-ventilation in the spaces that surrounded by circuit substrate 49 and cover 77, thereby heats improves.In the part that is formed with bonding conductor 87, the front end 83A of side plate 83 contacts with following 53 of circuit substrate 49.Thus, can prevent that braze 59 from flowing in the cover 77 between 53 below the front end 83A of side plate 83 and circuit substrate 49, thereby be difficult for causing the cover 77 that causes because of braze 59 and the short circuit of chip device 61A or integrated circuit spare 61B.Since can by side plate 83 cover circuit substrate 49 following 53 and terminal row substrate 69 top 71 between, therefore the 53 electronic tuning unit 31B that form or the high-frequency signal of demodulator circuit 33 are difficult for being leaked to the outside below circuit substrate 49.
On cover 77, be formed with outstanding projection 152 towards integrated circuit component 61B.Projection 152 forms in the existed side by side mode of top plate portion 81 of cut-out, and contacts with integrated circuit component 61B.Coating is as the lubricating grease (grease) 153 of heat conduction component between projection 152 and integrated circuit component 61B.Projection 152 is owing to form and have elasticity in the mode of cutting off and erect, the deviation of height that therefore can absorption integrated circuit element 61B.
Fig. 9 C is the profile that is assemblied in the module 1023 on the mother substrate 601.On mother substrate 601, be formed with circuit pattern 602,603,604 on the 601A.The cover 77 in the reflow stove by braze 605 solderings on the circuit pattern 603 of mother substrate 601.The fusing point of braze 605 is lower than the fusing point of braze 59, braze 59 not fusions when module 1023 is assemblied in mother substrate 601, thus can prevent short circuit.
Because at integrated circuit component 61B with cover between 77 the projection 152 and be provided with lubricating grease 153, so the heat of integrated circuit component 61B is delivered to cover 77.Because cover 77 is brazed in mother substrate 601, therefore can make the heat that in integrated circuit component 61B, produces from mother substrate 601 heat radiations.
Notch 111,113 and bonding conductor 87 are in abutting connection with configuration, and bonding conductor 87 is electrically connected with the conductor 113B of notch 113 via conductive pattern 113C.Thereby the heat that produces in integrated circuit component 61B is transmitted in cover 77, braze 59 and cover bonding conductor 87, and then is delivered to notch 111,113, and dispels the heat from covering 104 via pin 109.By this heat radiation, the electronic device as 53 assemblings below circuit substrate 49 can use heater members, thereby can access small-sized high-frequency model 1023.
The module 23,1023 of execution mode can increase the device mounting density on the mother substrate 501,601, thereby can be used in small-sized carrying equipment.
Claims (35)
1. module, wherein,
Possess: circuit substrate, its have above and below;
The first terminal, it is arranged on below described circuit substrate described;
First electronic device, it is assemblied in above described circuit substrate described;
Metal first cover, it covers described first electronic device;
Second electronic device, it is assemblied in below described circuit substrate described;
Terminal row substrate, its have following, and below described circuit substrate described opposed above, and be arranged on the described following below of described circuit substrate;
Second terminal, itself and described the first terminal are opposed, and be connected with described the first terminal, and be arranged on above described terminal row substrate described,
The 3rd terminal, it is connected with described second terminal, and is arranged on below described terminal row substrate described; And
Metal second cover, it covers described second electronic device,
Form porosely at described terminal row substrate, described hole connects above described terminal row substrate described and below described, and surrounds described second electronic device and have inner peripheral surface,
Described second cover has: top plate portion, and it is positioned at the below of described second electronic device; And
Side plate, it extends below described circuit substrate described from described top plate portion, and between the described inner peripheral surface in described second electronic device and described hole.
2. module according to claim 1, wherein,
Also possess: bonding conductor, it is arranged on the described inner peripheral surface in described hole; And
Connecting elements, it is filled between the described side plate of described bonding conductor and described second cover, and described second cover is fixed in described terminal row substrate.
3. module according to claim 1, wherein,
Also possess dielectric film, described dielectric film is arranged on the outside of the described top plate portion of described second cover.
4. module according to claim 1, wherein,
Also possess dielectric film, described dielectric film is arranged on the inner face of the described top plate portion of described second cover.
5. module according to claim 1, wherein,
The described following described top plate portion from described second cover of described terminal row substrate is outstanding.
6. module according to claim 1, wherein,
Described first cover has the pin that extends above described circuit substrate described,
Be formed with first notch that described pin passes through at described circuit substrate.
7. module according to claim 6, wherein,
Described pin is connected with described first notch.
8. module according to claim 6, wherein,
Described pin has the face towards described circuit substrate and chamfering.
9. module according to claim 6, wherein,
Be formed with second notch that described pin passes through at described terminal row substrate.
10. module according to claim 9, wherein,
Described pin is connected with described second notch.
11. module according to claim 9, wherein,
Between described pin and described second notch, be formed with first gap,
Between described pin and described first notch, be formed with second gap greater than described first gap.
12. module according to claim 9, wherein,
Between described pin and described second notch, be formed with first gap,
Between described pin and described first notch, be formed with second gap less than described first gap.
13. module according to claim 1, wherein,
Contact below described side plate and described circuit substrate described.
14. module according to claim 1, wherein,
Described terminal row substrate has lateral surface,
Described circuit substrate has the described lateral surface lateral surface arranged side by side in a plane with described terminal row substrate.
15. module according to claim 1, wherein,
Also possess heat conduction component, described heat conduction component is arranged between the described top plate portion of described second electronic device and described second cover, and contacts with described top plate portion with described second electronic device.
16. module according to claim 15, wherein,
Described heat conduction component is a lubricating grease.
17. module according to claim 15, wherein,
Described second cover has projection, and described projection is outstanding towards described second electronic device from described top plate portion, and contacts with described heat conduction component.
18. module according to claim 1, wherein,
Be formed with the gap between below the front end of described side plate of described second cover and described circuit substrate described.
19. module according to claim 1, wherein,
Also possess heat conduction component, described heat conduction component be arranged on described second the cover described side plate and described terminal row substrate between, and with described side plate and described terminal row substrate contacts.
20. module according to claim 19, wherein,
Also possess the bonding conductor that the described inner peripheral surface in described hole is provided with, described heat transfer member is filled between the described side plate of described bonding conductor and described second cover, and contacts with described side plate with described bonding conductor.
21. according to the described module of claim 20, wherein,
Described heat conduction component is a braze.
22. module according to claim 1, wherein,
Described first cover has the pin that extends above described circuit substrate described,
Be formed with the notch that described pin passes through at described terminal row substrate,
Also possess: conductor, it is arranged on described notch; And
Heat conduction component, it connects described pin and described conductor.
23. module according to claim 22, wherein,
Also possess: bonding conductor, it is arranged on the described inner peripheral surface in described hole;
Conductive pattern, it connects described conductor and described bonding conductor.
24. module according to claim 22, wherein,
Described pin is connected with described notch.
25. an electronic equipment, wherein,
Possess: circuit substrate, its have above and below;
The first terminal, it is arranged on below described circuit substrate described;
First electronic device, it is assemblied in above described circuit substrate described;
Metal first cover, it covers described first electronic device;
Second electronic device, it is assemblied in below described circuit substrate described;
Terminal row substrate, its have following, and below described circuit substrate described opposed above, and be arranged on the described following below of described circuit substrate;
Second terminal, itself and described the first terminal are opposed, are connected with described the first terminal, and are arranged on above described terminal row substrate described;
The 3rd terminal, it is connected with described second terminal, and is arranged on below described terminal row substrate described; And
Metal second cover, it covers described second electronic device,
Form porosely at described terminal row substrate, described hole connects above described terminal row substrate described and below described, and surrounds described second electronic device, and has inner peripheral surface,
Described second cover has: top plate portion, and it is positioned at the below of described second electronic device; And
Side plate, it extends below described circuit substrate described from described top plate portion, and between the described inner peripheral surface in described second electronic device and described hole,
Possess: heat conduction component, it is arranged between the described top plate portion of described second electronic device and described second cover, and contacts with described top plate portion with described second electronic device;
Mother substrate; And
Circuit pattern, its described top plate portion with described second cover is connected, and is arranged on the described mother substrate.
26. electronic equipment according to claim 25, wherein,
Also possess first braze, described first braze is connected in described circuit pattern with the described top plate portion of described second cover.
27. electronic equipment according to claim 26, wherein,
Also possess second braze, described second braze is connected in described terminal row substrate with the described side plate of described second cover, and has the fusing point that is higher than described first braze.
28. the manufacture method of a module, wherein,
Comprise: the step of installation first electronic device on the plate shape substrates of a plurality of circuit substrates with mutual binding;
The step of installation second electronic device below described plate shape substrates;
The mode of surrounding described second electronic device with described hole is installed the step that forms porose terminal row substrate below described plate shape substrates described;
After the step that described first electronic device is installed, metal first step of covering that assembling covers described first electronic device;
In the step that described second electronic device is installed with after the step of described terminal row substrate is installed, assembling is with the step of metal second cover of described second electronic device covering;
With first connecting elements connect in described circuit substrate and the described terminal row substrate either party and described be assembled first the cover step;
The step that connects described terminal row substrate and described second cover that has been assembled with second connecting elements;
After the step of described first electronic device being installed, the step of described second electronic device is installed and the step of described terminal row substrate is installed, described plate shape substrates is divided into the step of described a plurality of circuit substrates.
29. the manufacture method of module according to claim 28, wherein,
Described first and second connecting elements is a paste soldering material,
With described first connecting elements connect in described circuit substrate and the described terminal row substrate described either party comprise with the step of described first cover that has been assembled: in the reflow stove with described first connecting elements be connected in described circuit substrate and the described terminal row substrate described either party with described first step of covering that has been assembled
The step that connects described terminal row substrate and described second cover that has been assembled with described second connecting elements comprises: with in described reflow stove with described first connecting elements be connected in described circuit substrate and the described terminal row substrate described either party carry out simultaneously with the step of described first cover that has been assembled, in described reflow stove, be connected described terminal row substrate and described second step of covering that has been assembled with described second connecting elements.
30. the manufacture method of module according to claim 28, wherein,
Described first and second connecting elements is a paste soldering material,
The step that connects described either party and described first cover that has been assembled in described circuit substrate and the described terminal row substrate with described first connecting elements comprises: below described terminal row substrate described, apply the step of described first connecting elements,
The step that connects described terminal row substrate and described second cover that has been assembled with described second connecting elements comprises: the step that applies described second connecting elements below described terminal row substrate described.
31. module manufacture method according to claim 28, wherein,
Also comprise step that carry out simultaneously with the step of cutting apart described plate shape substrates, the described terminal row substrate of cut-out.
32. the manufacture method of module according to claim 31, wherein,
The step of carrying out simultaneously with the step of cutting apart described plate shape substrates, cut off described terminal row substrate comprises: cut off described plate shape substrates and described terminal row substrate simultaneously, make the step of section in a plane of the section and the described terminal row substrate of described plate shape substrates.
33. the manufacture method of module according to claim 32, wherein,
The step of cutting off described plate shape substrates and described terminal row substrate simultaneously comprises: cut off sword with a slice and cut off the step of described plate shape substrates and described terminal row substrate simultaneously.
34. the manufacture method of module according to claim 28, wherein,
The step of cutting apart described plate shape substrates is carried out in the step that described first cover is installed with after described second step of covering is installed.
35. the manufacture method of module according to claim 28, wherein,
The step of cutting apart described plate shape substrates is carried out in the step that described first cover is installed with before described second step of covering is installed.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005247112 | 2005-08-29 | ||
| JP2005247112A JP2007066936A (en) | 2005-08-29 | 2005-08-29 | High-frequency module and method of manufacturing same |
| JP2005331063 | 2005-11-16 | ||
| JP2006131339 | 2006-05-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1925719A true CN1925719A (en) | 2007-03-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610126170 Pending CN1925719A (en) | 2005-08-29 | 2006-08-29 | Module, method of manufacturing module, and electronic apparatus using module |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2007066936A (en) |
| CN (1) | CN1925719A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101803477B (en) * | 2007-09-21 | 2011-11-16 | 松下电器产业株式会社 | Electronic component package and method for producing the same |
| CN102510701A (en) * | 2006-08-18 | 2012-06-20 | 德尔菲技术公司 | Lightweight audio system for automotive applications and method |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009147415A (en) * | 2007-12-11 | 2009-07-02 | Sharp Corp | Receiving apparatus, and board installing member |
| JP2010171307A (en) * | 2009-01-26 | 2010-08-05 | Panasonic Corp | Imaging device |
| JP2010206680A (en) * | 2009-03-05 | 2010-09-16 | Sharp Corp | Tuner unit |
| JP2010212481A (en) * | 2009-03-11 | 2010-09-24 | Panasonic Corp | Imaging device |
| JP2014165210A (en) * | 2013-02-21 | 2014-09-08 | Fujitsu Component Ltd | Module substrate |
-
2005
- 2005-08-29 JP JP2005247112A patent/JP2007066936A/en active Pending
-
2006
- 2006-08-29 CN CN 200610126170 patent/CN1925719A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102510701A (en) * | 2006-08-18 | 2012-06-20 | 德尔菲技术公司 | Lightweight audio system for automotive applications and method |
| CN101803477B (en) * | 2007-09-21 | 2011-11-16 | 松下电器产业株式会社 | Electronic component package and method for producing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007066936A (en) | 2007-03-15 |
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