CN1925695A - Piezoelectric element and ultrasonic apparatus using the same - Google Patents
Piezoelectric element and ultrasonic apparatus using the same Download PDFInfo
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- CN1925695A CN1925695A CN200610094240.8A CN200610094240A CN1925695A CN 1925695 A CN1925695 A CN 1925695A CN 200610094240 A CN200610094240 A CN 200610094240A CN 1925695 A CN1925695 A CN 1925695A
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- piezoelectric element
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Abstract
Provided are a piezoelectric element, along with an ultrasonic device using the same, that comprises a dielectric substrate and an electrode pattern formed on the surface of dielectric substrate, for less space and stable characteristics. The piezoelectric element comprises a dielectric substrate (131) and electrode patterns (132 and 133) formed on the surface of the dielectric substrate (131). A part of the inside of the electrode pattern (132) comprises a land pattern (134) for soldering.
Description
Technical field
The present invention relates to piezoelectric element and use the ultrasonic unit of this piezoelectric element, relate in particular to and have dielectric base plate and be formed at the piezoelectric element of the lip-deep electrode pattern of this dielectric base plate and use the ultrasonic unit of this piezoelectric element.
Piezoelectric element is to vibrate-strength member of exchange conversion of electricity in the ultrasonic sensing device.Piezoelectric element is by the two ends silver coating electrode in the crystallization of the strong dielectric of pottery, and apply high voltage and carry out that split pole is handled and form, in receiving and transmitting signal dual-purpose ultrasonic sensing device, this component affixing makes it to vibrate with aluminium shell and receives and dispatches sound wave on the bottom surface of the aluminium shell that bottom tube-like is arranged.The sound wave of transmitting-receiving is transformed to voltage by piezoelectric element, and this signal of telecommunication is different with electrode with the distribution between the outside.By one side adhesive-applying and paste while pressurizeing and to connect shell and electrode in the shell bottom surface.Have again,, can be connected with the outside by conducting shell and lead-in wire.
On the one hand, the direct solder of an end of twisted wire is on electrode, and the other end of twisted wire is connected an end of lead-in wire, and the other end of lead-in wire is connected on the external circuit.
Have again,, be the Vibrant buffer that prevents to cause, propose to have the cylindrical side-prominent structure (patent documentation 1: the spy opens the 2004-356900 communique) that convex shape portion is set Monday in the rounded portions of surface electrode because of solder as piezoelectric element.
Yet dielectric base plate is thermo-labile and self also vibrates, and therefore, the solder of twisted wire must be with reasonable time and suitable amount solder.And existing silver electrode is circular and its diameter and element diameter about equally, thereby be difficult for the location, and have the danger of the part position skew of assembling thereafter, also have, the danger of the amount of solder and the difficult management between the heat and element breakage is big, has become the factor leading to social instability of characteristic.
Also have, in cylindrical Monday of the rounded portions of surface electrode side-prominent structure that convex shape portion is set, exist the problems such as overall dimension increase of piezoelectric element.
Summary of the invention
The present invention finishes in view of the above problems, and its purpose is, provides with less space can obtain the piezoelectric element of stable properties and use the ultrasonic unit of this piezoelectric element.
Piezoelectric element of the present invention has dielectric base plate 131 and the electrode pattern 132,133 that forms is gone up on dielectric base plate 131 surfaces, it is characterized in that the part in electrode pattern 132 inboards has the land pattern 134 that solder is used.
It is characterized in that, the land pattern 134 that solder is used, the part of its circumference is connected on the electrode pattern 132; Other parts and electrode pattern 132 insulation.
It is characterized in that solder is the circular shape with land pattern 134.
Also have, the present invention is characterized in that, utilizes above-mentioned piezoelectric element 112 to constitute ultrasonic unit 100.
Have, above-mentioned reference marks is reference after all again, is not to limit technical scope thus.
According to the present invention, by a part solder land pattern is set in the inboard of electrode pattern, have the advantages that to get stable properties etc. with little space.
Description of drawings
Fig. 1 is the exploded perspective view of one embodiment of the present of invention.
Fig. 2 is the cutaway view of one embodiment of the present of invention.
Fig. 3 is the structure chart of shell 111.
Fig. 4 is the stereogram of piezoelectric element 112.
Fig. 5 is the vertical view of piezoelectric element 112.
Fig. 6 is the figure of the connection status between expression piezoelectric element 112 and the twisted wire 113.
Fig. 7 is the stereogram of link 114.
Fig. 8 is the stereogram of the modified example of link 114.
Fig. 9 is the figure of the characteristic of the reverberation of ultrasonic unit of density of the corresponding silicone resin of expression and sensitivity.
Among the figure:
100,200-ultrasonic generator, 111-shell, 112-piezoelectric element, 113-twisted wire, 114-link, 115,116-lead-in wire, 117-silicone thin slice, 118-packing material, 119-epoxide resin adhesive, 121-end difference, 122-joint portion, 123-slot part, 124-notch, 125-hole portion, 126-bottom surface, 127-groove, 131-electrolyte plate, 132,133-electrode, 134-land pattern, 135-scolder, 141-notch, 151-through hole, 152-joint portion.
Embodiment
Fig. 1 represents the exploded perspective view of one embodiment of the present of invention, and Fig. 2 represents the cutaway view of one embodiment of the present of invention.
The ultrasonic generator 100 of present embodiment is when also outside output ultrasonic wave takes place, reception is to be made of shell 111, piezoelectric element 112, twisted wire 113, link 114, lead-in wire 115,116, silicone thin slice 117, packing material 118, epoxide resin adhesive 119 from the receiving and transmitting signal type ultrasonic sensing device of the reflection wave signal of outside.
Fig. 3 represents the pie graph of shell 111.Fig. 3 (A) represents vertical view; Fig. 3 (B) represents front view; Fig. 3 (C) expression is along A-A line side cross sectional view; Fig. 3 (D) represents end view; Fig. 3 (E) expression is along B-B line side cross sectional view.
Shell 111 is to form the roughly cylindraceous of the end by aluminium cut etc.Inner circumference portion at shell 111 is formed with end difference 121.On end difference 121, be formed with joint portion 122 on the face of a side, arrow Z1 direction one side.In the present embodiment, joint portion 122 forms the boss shape.
Also have, slot part 123 and notch 124 are formed on the side of shell 111.Have, hole portion 125 is formed on the cross section that is formed by notch 124 along the Z2 direction again.Slot part 123 and notch 124 are used for the location when mounting object is installed etc.
Have again, on the bottom surface 126 of shell 111, be formed with groove 127.By forming groove 127, can improve and piezoelectric element 112 between caking property.
Have again, by cut various piece is formed and finish, have electroless plating nickel to handle shell 111 whole implementation.
Have, shell 111 is thickeied the thickness of its side in bottom surface 126 directions, one side, arrow Z2 direction one side of configuration piezoelectric element 112 again.Thus, make ultrasonic unit possess directive property.
Fig. 4 is the stereogram of piezoelectric element 112; Fig. 5 is the vertical view of piezoelectric element 112; Fig. 6 is the figure of the state of the connection between expression piezoelectric element 112 and the twisted wire 113.The stereogram of Fig. 4 (A) expression arrow Z1 direction one side; Fig. 4 (B) expression is along the stereogram of arrow Z2 direction one side.
Part in the inboard of electrode 132 has solder with land pattern 134.Solder is the circular shape with land pattern 134, and a part of making its circumference is connected on the electrode pattern 132; The graphics shape of other parts and electrode pattern 132 insulation.
One end of twisted wire 113 is connected solder with on the land pattern 134 by solder or conducting resinl etc.
At this moment, because the location positioning of an end of solder twisted wire 113 on the land pattern 134 that solder is used, can prevent the error when part assembling thereafter.Also have,, therefore, can easily control the scolder that is used for solder, and the proficiency of disobeying solder also can use a certain amount of scolder to carry out solder owing to can make scolder be retained in solder with on the land pattern 134.Thus, can prevent excessive heat, thereby can make the stability of characteristicsization of piezoelectric element 112, and can carry out solder reliably.
Also have,, therefore, can make the part minimum except electrode 132 of dielectric base plate 131 because the excircle that solder is arranged at electrode 132 with land pattern 134 in the inner part.
Have, the notch 141 of the other end of twisted wire 113 by silicone thin slice 117 stretches out and is connected on the lead-in wire 115 by solder or conducting resinl to the Z1 direction again.Have, lead-in wire 116 is connected on the shell 111 by link 114 again.
According to the piezoelectric element 112 of present embodiment, therefore the destruction that can prevent element, can improve rate of finished products, reduces cost.
Fig. 7 represents the stereogram of link 114.
Lead-in wire 116 is to be wrapped in solder on the through hole 151 of link 114.Link 114 is made through punching processing metal plate, and contiguous through hole 151 is formed with joint portion 152.The structure that is formed with the cross otch is made in joint portion 152.The joint portion 122 that is formed on the shell 111 is pressed into joint portion 152.When the joint portion 122 of convex was pressed in the joint portion 152, each alar part 152a inner periphery that constitutes joint portion 152 was along the one side displacement of arrow Z1 direction.Thus, the edge part of inner periphery one side of alar part 152a blocks joint portion 122.Thus, can prevent that link 114 from 122 coming off along arrow Z1 direction from the joint portion, and link 114 is remained on the shell 111 reliably.
At this moment, if necessary, can with link 114 solders on shell 111, handle, use common eutectic solder just can under the solderability good state, carry out solder owing on shell 111, implement electroless plating nickel.Thus, can under lower temperature, carry out solder.Therefore, can improve assembleability.
Have, link 114 can be made terminal shape, cylindric again.
Fig. 8 represents the stereogram of the modified example of link 114.The stereogram of Fig. 8 (A) expression the 1st modified example; The stereogram of Fig. 8 (B) expression the 2nd modified example.
The link 211 of the 1st modified example shown in Fig. 8 (A) is made of pressure contact portion 221 and joint portion 222.
Under lead-in wire 116 states that are installed between the flange part 231, by with flange part 231 along arrow A 1, the bending of A2 direction, and make lead-in wire 116 be crimped on the link 211 and make lead-in wire 116 when being fixed on the link 211, connect pressure contact portion 221.
Connecting portion 222 is by constituting with the roughly the same through hole 231 of the diameter of joint portion 122, by joint portion 122 is pressed in the through hole 232, the edge of inner periphery one side of through hole 232 blocks joint portion 122, and link 211 is remained on the joint portion 122 reliably.
The link 311 of the 1st modified example shown in Fig. 8 (B) is made of cylinder joint portion 321 and solder portion 322.
Cylinder joint portion 321 is the parts that electric conducting material are shaped to the drum at the end, and circumference one side pressure within it goes into to be arranged on the convex joint portion 122 on the shell 111.Solder portion 322 is arranged at the outside, is used for solder lead-in wire 116.
Have again, at this moment, by with link 211,311 solders on shell 111, will be further keep link 211,311 securely, and can improve reliability.
Silicone thin slice 117 is approximately 0.5 spumescence silicone resin by density and constitutes, and is pasted with two-sided tape on the face of its arrow Z2 direction one side, is bonded in by two-sided tape on the face of arrow Z1 direction one side of piezoelectric element 112.At this moment, solder is passed on the face of arrow Z1 direction one side that notch 141 is drawn out to silicone thin slice 117 at the twisted wire 113 on the electrode 132 of piezoelectric element 112.
Have, above-mentioned silicone resin is not limited to ultraviolet hardening again, can be the condensed type of thermohardening type, two-component-type or one-pack type.
In the present embodiment, be stacked on the piezoelectric element 112, can improve the characteristic of ultrasonic unit 100 by the silicone thin slice 117 and the packing material 118 that will constitute by the silicone resin of different densities.
Fig. 9 is the figure of the characteristic of the reverberation of ultrasonic unit of density of the corresponding silicone resin of expression and sensitivity.
The reverberation of ultrasonic unit 100 as shown in Figure 9, has the tendency that raises and reduce with the density of the silicone resin that is filled in shell 111; Like that, has the tendency that the density with the silicone resin that is filled in shell 111 raises and increases shown in its sensitivity dotted line as shown in Figure 7.
In the present embodiment, lay and be filled on the shell 111 by combination low density silicone thin slice 117 and high density packing material 118, can improve sensitivity by silicone thin slice 117, suppress reverberation by packing material 118, therefore, it is little and highly sensitive to make it reverberation.
The following describes the assembling procedure of the ultrasonic unit 100 of present embodiment.
At first, be connected on the land pattern 134 of piezoelectric element 112 by solder or conducting resinl a end twisted wire 113.
Secondly, coating epoxide resin adhesive 119 on the bottom surface 126 of the electrode 133 of piezoelectric element 112 and/or shell 111 is bonded in piezoelectric element 112 on the bottom surface 126 of shell 111.
Secondly, on the face of the arrow Z2 of silicone thin slice 117 direction one side, paste two-sided tape, and the notch 141 that the other end of twisted wire 113 passes silicone thin slice 117 is reached on the face of Z1 direction one side of silicone thin slice 117, by two-sided tape silicone thin slice 117 is connected on the piezoelectric element 112.
Thus, silicone thin slice 117 is bonded on the piezoelectric element 112 solidly, therefore, can prevent floating of silicone thin slice 117, can obtain the stable properties of piezoelectric element 112.
Secondly, the other end solder of twisted wire 113 on lead-in wire 115, is also had, lead-in wire 116 is wrapped on the through hole 151 of link 114 after, solder is on link 114.Secondly, the joint portion 152 of link 114 is attached on the joint portion 122 of shell 111.Have again, as required also can solder link 114 and shell 111, thus, lead-in wire 116 is connected on the shell 111.
Secondly, by packing material 118 is filled in the shell 111, and from the opening surface irradiation ultraviolet radiation of shell 111 etc., curing filler material 118.
Thus, packing material 118 also have both prevent link 114, the lead-in wire 115 and 116 functions that come off.
Finish as shown in Figure 2 ultrasonic unit 100 by said process.
Have again, in the present embodiment,, also can pass through the cured foam silicone resin, make it to form the low density silicone resin bed as the silicone resin use silicone thin slice 117 of driving fit to the part of piezoelectric element 112.
Also have,, can easily make the characteristic optimization of reverberation and sensitivity by regulate the thickness or the density of silicone thin slice 117 according to the shape of shell 111 etc.
Claims (4)
1. a piezoelectric element has dielectric base plate and is formed at the lip-deep electrode pattern of this dielectric base plate, it is characterized in that:
Part in the inboard of above-mentioned electrode pattern has the land pattern that solder is used.
2. piezoelectric element according to claim 1 is characterized in that:
The land pattern that above-mentioned solder is used is connected in above-mentioned electrode pattern for the part of its circumference, the figure of other parts and the insulation of above-mentioned electrode pattern.
3. piezoelectric element according to claim 1 and 2 is characterized in that:
Above-mentioned solder land pattern is the circular shape.
4. a ultrasonic unit has any described piezoelectric element in the claim 1 to 3.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005248303A JP2007067575A (en) | 2005-08-29 | 2005-08-29 | Piezoelectric element and ultrasonic device using it |
| JP2005248303 | 2005-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1925695A true CN1925695A (en) | 2007-03-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200610094240.8A Pending CN1925695A (en) | 2005-08-29 | 2006-06-27 | Piezoelectric element and ultrasonic apparatus using the same |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2007067575A (en) |
| CN (1) | CN1925695A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5111977B2 (en) * | 2007-08-28 | 2013-01-09 | 日本セラミック株式会社 | Ultrasonic transducer |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5736099U (en) * | 1980-08-11 | 1982-02-25 | ||
| JPS6194364U (en) * | 1984-11-26 | 1986-06-18 | ||
| JP2893361B2 (en) * | 1991-07-31 | 1999-05-17 | 日本電波工業株式会社 | Piezoelectric plate for probe and ultrasonic probe using the same |
-
2005
- 2005-08-29 JP JP2005248303A patent/JP2007067575A/en active Pending
-
2006
- 2006-06-27 CN CN200610094240.8A patent/CN1925695A/en active Pending
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| Publication number | Publication date |
|---|---|
| JP2007067575A (en) | 2007-03-15 |
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Open date: 20070307 |