CN1835645A - Ultrasonic receiving device - Google Patents
Ultrasonic receiving device Download PDFInfo
- Publication number
- CN1835645A CN1835645A CN200510097517.8A CN200510097517A CN1835645A CN 1835645 A CN1835645 A CN 1835645A CN 200510097517 A CN200510097517 A CN 200510097517A CN 1835645 A CN1835645 A CN 1835645A
- Authority
- CN
- China
- Prior art keywords
- piezoelectric element
- housing
- receiving device
- wiring board
- ultrasonic receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention relates to an ultrasonic receiving sending device which can receive and/or send ultrasonic, with a simple structure connected with piezoelectric element and external circuit. The invention is characterized in that: the frame comprises a piezoelectric element (112) and a frame (111) containing said piezoelectric element (112), and a relay flexible print circuit board (113) to connected the piezoelectric element (112) and the outer part of frame (111).
Description
Technical field
The present invention relates to ultrasonic receiving device, particularly send and/or to receive hyperacoustic ultrasonic receiving device relevant.
Background technology
Traditional ultrasonic sensor produces ultrasonic wave, and receives the ultrasonic wave that produces.Ultrasonic sensor is used to for example be measured to the ranging system of object distance.In ranging system, detect the signal of ultrasonic sensor, measure from sending to hyperacoustic time that receives, according to the distance of the timing of measuring to object.
Fig. 5 is the structure chart of the example of expression conventional ultrasound wave sensor.
Ultrasonic sensor 1 mainly by housing 11, be configured in piezoelectric element 12 on the housing 11, piezoelectric element 12 guided into the wire 14 of terminal board 13, link daughter board 13 and piezoelectric element 12 of housing 11 outsides and the slow-action materials 15 that are filled in the housing 11 constitute (with reference to patent documentation 1,2).
[patent documentation 1] spy opens flat 11-266498 communique
[patent documentation 2] spy opens flat 10-257595 communique
But, because traditional ultrasonic sensor connects piezoelectric element 12 and terminal boards 13 by wire 14,, and needing the operation of solder etc. so number of spare parts is many, production efficiency is low.In addition, because on housing 11 grades, because of mechanical resonance produces vibration, thus aluminium used usually, thus be difficult to carry out solder, further reduced production efficiency.
Summary of the invention
The present invention carries out in view of the above problems, the ultrasonic receiving device that its purpose is to provide a kind of simple structure, connects piezoelectric element and external circuit.
The present invention is sending or is receiving in hyperacoustic ultrasonic receiving device, has piezoelectric element 112 and the housing 111 of taking in piezoelectric element 112, it is characterized in that, by relay flexible printed circuit plate 113, piezoelectric element 112 can be connected with housing 111.
Also have following feature: an end of flexible print wiring board 113 is connected with piezoelectric element 112, and the other end is connected with the connecting line 115 that stretches out from housing 111.
Also has following feature: have a part that keeps flexible print wiring board 113 and be maintained at maintenance substrate 114 in the housing 111.
Also has following feature: have the connecting pin 116 that connects flexible print wiring board 113 and housing 111.
In addition, the present invention is sending or is receiving in hyperacoustic ultrasonic receiving device, it is characterized in that, have piezoelectric element 112, take in piezoelectric element 112 housing 111, connect being connected substrate 113 and will connecting the connecting pin 116 that substrate 113 is connected with housing 111 of piezoelectric element 112 and housing 111 outsides.
Also has following feature: connect substrate 113 and constitute by flexible print wiring board.
Also have following feature: connecting pin 116 is pressed in the housing 111 and is soldered and connecting on the substrate 113.
In addition, above-mentioned reference marks is reference, does not therefore limit the scope of patent right.
According to the present invention, by the relay flexible printed circuit plate, can connect piezoelectric element and outside, thereby not need solder wire etc., so can connect piezoelectric element and external circuit with simple structure.
Description of drawings
Fig. 1 is the exploded perspective view of the present invention the 1st embodiment.
Fig. 2 is the cutaway view of the present invention the 1st embodiment.
Fig. 3 is the exploded perspective view of the present invention the 2nd embodiment.
Fig. 4 is the cutaway view of the present invention the 2nd embodiment.
Fig. 5 is the structure chart of conventional ultrasound wave sensor example.
Among the figure:
100,200-ultrasonic receiving device, 111-housing, 112-piezoelectric element, 113, the 213-flexible print wiring board, 114,214-relaying substrate, 115-shielding conductor, 116-connecting pin, 117-packing material.
Embodiment
(the 1st embodiment)
Fig. 1 is the exploded perspective view of the present invention the 1st embodiment, and Fig. 2 is the cutaway view of the present invention the 1st embodiment.
The ultrasonic receiving device 100 of present embodiment is to produce ultrasonic wave, export to the outside, and reception is made of housing 111, piezoelectric element 112, flexible print wiring board 113, relaying substrate 114, shielding conductor 115, connecting pin 116 and packing material 117 from the ultrasonic sensor of the transmission reception type of the reflected wave of outside.
On the electrode 132 of piezoelectric element 112, solder has flexible print wiring board 113.Flexible print wiring board 113 mainly is made of lead division 141 and connecting portion 142.Lead division 141 is provided with printed circuit distribution 151.Expose an end of printed circuit distribution 151 at the front end of lead division 141, the exposed portions serve of printed circuit distribution 151 is soldered on electrode 132.
Connecting portion 142 is adhered on the relaying substrate 114.Connecting portion 142 is made diameter than slightly little round-shaped of r2, has notch part 161 in arrow Y1 direction side, has notch part 162 in arrow Y2 direction side, and, form recess 163 in arrow X2 direction side.Lead division 141 extends to arrow Y1 direction from the substantial middle portion of notch part 161.In addition, on connecting portion 142, form through hole 164,165 and bonding land 166～168 and distribution 169.Around through hole 164, form bonding land 166.On bonding land 166, be connected to form the other end of the printed circuit distribution 151 on lead division 141.
In through hole 164, the holding wire 171 of shielding conductor 115 connects from the arrow Z1 direction of the opening direction of the arrow Z2 direction side direction housing 111 of the bottom surface side of housing 111.Around the arrow Z1 of through hole 164 direction side, form bonding land 166.On bonding land 166, be connected to form in the other end of the printed circuit distribution 151 of lead division 141, and solder holding wire 171.With this, holding wire 171 is connected with the electrode 132 of piezoelectric element 112 by printed circuit distribution 151.
In addition, in through hole 165, connect connecting pin 116.Around the arrow Z1 of through hole 165 direction side, form bonding land 167.On bonding land 167, connect an end of distribution 169, and solder connecting pin 116.Connecting pin 116 is pressed into the hole portion 123 on the stage portion 122 that is formed at housing 111.
The other end of distribution 169 is connected with bonding land 168.On bonding land 168, the earth connection 172 of solder shielding conductor 115.The earth connection 172 of shielding conductor 115 is connected with housing 111 by distribution 169 and connecting pin 116, and is connected with the electrode 133 of piezoelectric element 112 by housing 111.
According to above-mentioned, the holding wire 171 of shielding conductor 115 is connected with the electrode 132 of piezoelectric element 112, and earth connection 172 is connected with the electrode 133 of piezoelectric element 112.
Relaying substrate 114 is made of epoxy resin etc., and makes the flat shape identical with connecting portion 142, with through hole 164,165 same positions of flexible print wiring board 113 on have through hole 181,182.Relaying substrate 114 and flexible print wiring board 113 adhesions work as the lining substrate of flexible print wiring board 113.
In housing 111, after having taken in piezoelectric element 112, flexible print wiring board 113, relaying substrate 114, fill packing material 117.Packing material 117 for example is made of thermosetting resin or ultraviolet hardening resin etc.Packing material 117 notch part 161,162 by flexible print wiring board 113, relaying substrate 114 when filling flows between piezoelectric element 112 and the relaying substrate 114.After the filling, to packing material 117 irradiation ultraviolet radiations, make its sclerosis from the opening surface of housing 111.
According to present embodiment, utilize flexible print wiring board 113, can carry out being connected of piezoelectric element 112 and shielding conductor 115.Therefore, can be simply and carry out efficiently being connected of piezoelectric element 112 and shielding conductor 115.
In addition, in the present embodiment, used shielding conductor 115 with being connected of external circuit, but also can use lead etc.In addition, flexible print wiring board is prolonged, make it extend to the outside.
(the 2nd embodiment)
Fig. 3 is the exploded perspective view of the present invention the 2nd embodiment, and Fig. 4 is the cutaway view of the present invention the 2nd embodiment.Among this figure, partly marking same-sign with Fig. 1, Fig. 2 same structure, and omitting its explanation.
The ultrasonic receiving device 200 of present embodiment is made with flexible print wiring board 213 and has been replaced shielding conductor 115, and the structure that connecting line is stretched out to the outside from housing 111.Thereupon, the structure of flexible print wiring board 213 and relaying substrate 214 is different with the 1st embodiment.
With regard to the flexible print wiring board 213 of present embodiment, the formation of connecting portion 242 and extension 243 is different with flexible print wiring board 113, in addition, with regard to flexible print wiring board 213, integrally formed lead division 141, connecting portion 242 and extension 243.
Flexible print wiring board 213 stretches out extension 243 from the arrow Y2 direction end of connecting portion 242.On extension 243, form distribution 251,252.Distribution 251 is connected with an end of distribution 261 on connecting portion 242.The other end of distribution 261 is connected with the other end of the distribution 151 that is formed at lead division 141.Therefore, distribution 251 is connected with the electrode 132 of piezoelectric element 112 by distribution 261,151.
In addition, distribution 252 is connected with an end of distribution 262 on connecting portion 242.The other end of distribution 262 is connected with bonding land 167.With this, distribution 252 is connected with the electrode 133 of piezoelectric element 112 by distribution 262, connecting pin 116, housing 111.
In addition, because relaying substrate 214 does not need shielding conductor 115, so become the structure that does not have through hole 181 and recess 183.
According to present embodiment, can carry out being connected of piezoelectric element 112 and external circuit with a slice flexible print wiring board 213.Therefore, do not need the solder operation of shielding conductor 115 and flexible print wiring board, can simplify manufacturing process.
Claims (7)
1. a ultrasonic receiving device sends or the reception ultrasonic wave, it is characterized in that,
Have piezoelectric element and the housing of taking in described piezoelectric element, described piezoelectric element can be connected with described housing by the relay flexible printed circuit plate.
2. ultrasonic receiving device according to claim 1 is characterized in that,
One end of described flexible print wiring board is connected with described piezoelectric element, and the other end is connected with the connecting line that stretches out from described housing.
3. ultrasonic receiving device according to claim 1 and 2 is characterized in that,
Have a part that keeps described flexible print wiring board and be maintained at the interior maintenance substrate of described housing.
4. according to any one described ultrasonic receiving device in the claim 1～3, it is characterized in that,
Has the connecting pin that connects described flexible print wiring board and described housing.
5. a ultrasonic receiving device sends or the reception ultrasonic wave, it is characterized in that,
Have piezoelectric element, take in described piezoelectric element housing, connect the connecting pin that is connected base plate and has described connection substrate of connection and described housing of described piezoelectric element and described outside.
6. ultrasonic receiving device according to claim 5 is characterized in that,
Described connection substrate is made of flexible print wiring board.
7. according to claim 5 or 6 described ultrasonic receiving devices, it is characterized in that,
Described connecting pin is pressed in the described housing and is soldered on described connection substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005071548 | 2005-03-14 | ||
| JP2005071548A JP2006254360A (en) | 2005-03-14 | 2005-03-14 | Apparatus for transmitting/receiving ultrasonic wave |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1835645A true CN1835645A (en) | 2006-09-20 |
Family
ID=37003205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200510097517.8A Pending CN1835645A (en) | 2005-03-14 | 2005-12-28 | Ultrasonic receiving device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2006254360A (en) |
| CN (1) | CN1835645A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102833658A (en) * | 2011-06-15 | 2012-12-19 | 罗伯特·博世有限公司 | Ultrasonic transducer with piezoelectric element and distance sensor |
| CN103222882A (en) * | 2012-01-30 | 2013-07-31 | Ge医疗系统环球技术有限公司 | Transmission/reception circuit, ultrasonic probe, and ultrasonic image display apparatus |
| CN106558649A (en) * | 2016-11-08 | 2017-04-05 | 广东奥迪威传感科技股份有限公司 | Ultrasonic sensor and its manufacture method |
| CN106989701A (en) * | 2015-11-16 | 2017-07-28 | 台湾积体电路制造股份有限公司 | Measurement gap, the method and system of thickness |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5625498B2 (en) * | 2010-05-28 | 2014-11-19 | 株式会社村田製作所 | Ultrasonic sensor |
| TWI454668B (en) * | 2012-02-21 | 2014-10-01 | Tung Thih Electronic Co Ltd | Ultrasonic sensor device |
| JP7318495B2 (en) * | 2019-11-15 | 2023-08-01 | Tdk株式会社 | Ultrasonic device and fluid detection device |
| JP7392497B2 (en) * | 2020-01-30 | 2023-12-06 | Tdk株式会社 | ultrasound device |
| JP7452357B2 (en) | 2020-09-28 | 2024-03-19 | Tdk株式会社 | ultrasonic transducer |
-
2005
- 2005-03-14 JP JP2005071548A patent/JP2006254360A/en active Pending
- 2005-12-28 CN CN200510097517.8A patent/CN1835645A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102833658A (en) * | 2011-06-15 | 2012-12-19 | 罗伯特·博世有限公司 | Ultrasonic transducer with piezoelectric element and distance sensor |
| CN102833658B (en) * | 2011-06-15 | 2018-03-30 | 罗伯特·博世有限公司 | Ultrasonic tr-ansducer and manufacture method and range sensor with piezoelectric element |
| CN103222882A (en) * | 2012-01-30 | 2013-07-31 | Ge医疗系统环球技术有限公司 | Transmission/reception circuit, ultrasonic probe, and ultrasonic image display apparatus |
| CN103222882B (en) * | 2012-01-30 | 2015-09-16 | Ge医疗系统环球技术有限公司 | Transmission circuit, ultrasound probe and ultrasonic image display apparatus |
| CN106989701A (en) * | 2015-11-16 | 2017-07-28 | 台湾积体电路制造股份有限公司 | Measurement gap, the method and system of thickness |
| CN106558649A (en) * | 2016-11-08 | 2017-04-05 | 广东奥迪威传感科技股份有限公司 | Ultrasonic sensor and its manufacture method |
| CN106558649B (en) * | 2016-11-08 | 2019-11-26 | 广东奥迪威传感科技股份有限公司 | Ultrasonic sensor and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006254360A (en) | 2006-09-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1835645A (en) | Ultrasonic receiving device | |
| CN1237861C (en) | Electronic device of sealed electronic element and manufacturing method and printed wiring board | |
| CN1153284C (en) | Substrate provided with spherical grate array type circuit portion, and installation method therefor | |
| CN1101065C (en) | Connector for display inspection of liquid crystal display panel and method for the preparation thereof | |
| KR101498736B1 (en) | semiconductor device | |
| CN1273457A (en) | Package for electronic component | |
| CN1771637A (en) | Connector assembly and connector assembly manufacturing method | |
| EP1581037A3 (en) | Method of manufacturing a sealed electronic module | |
| CN1992808A (en) | Camera module package | |
| CN1737503A (en) | Magnetic sensor device having components mounted on magnet | |
| CN1906516A (en) | Photoelectric conversion connector for optical fiber | |
| CN1208607C (en) | Pressure sensor and its manufacturing method | |
| EP2048109A3 (en) | Electronic device, electronic module, and methods for manufacturing the same | |
| CN101080860A (en) | Microelectronics package and method | |
| CN1531170A (en) | Motor with coder | |
| CN1297583A (en) | Piezoelectric bending transducer and module made of plurality of piezoelectric bending transducers | |
| CN1230797C (en) | Electro-acoustic transducer | |
| CN1407568A (en) | Ceramic electronic element with leads | |
| CN1622730A (en) | Luminous module | |
| CN1461583A (en) | Surface mounting type electronic component | |
| CN1505844A (en) | Electromechanical transducer with at least one piezoelectricelement | |
| CN1123479A (en) | Board connector | |
| CN1484878A (en) | Surface mount connector lead | |
| CN1147938C (en) | Surface installation structure and electronic elements included inside | |
| CN1242243C (en) | Measuring device with output |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20060920 |