CN1924985A - Flat display and method for correcting display panel and drive chip combined deviation - Google Patents
Flat display and method for correcting display panel and drive chip combined deviation Download PDFInfo
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- CN1924985A CN1924985A CN 200510093627 CN200510093627A CN1924985A CN 1924985 A CN1924985 A CN 1924985A CN 200510093627 CN200510093627 CN 200510093627 CN 200510093627 A CN200510093627 A CN 200510093627A CN 1924985 A CN1924985 A CN 1924985A
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Abstract
This invention relates to correction method of plane display panel and drive chip, which combines plane display panel touch pad and drive chip protruding block, wherein, the plane panel display comprises several calibration marks around each touch pad; through comparing calibration mark and block to estimate LCD panel and drive chip binding bias for correction.
Description
Technical field
The present invention relates to a kind of bearing calibration that is used for the combined deviation of flat-panel screens, and be particularly related to the bearing calibration of a kind of flat-panel screens display panel and chip for driving combined deviation.
Background technology
Advantages such as LCD has gently, approaches, volume is little, low voltage drive, low consumption electric power and applied range, thereby for the most widely used at present, particularly notebook (notebook PC) or portable computer consumer electronics or computer products such as (portable PC).
And recent a kind of glass top chip (chip on glass, design COG) be because can significantly reduce the thickness of LCD, and keeps good reliability, so widely adopt gradually.The connected mode of the driving circuit of so-called glass top chip is that the direct hot pressing of chip for driving (gate or source IC) on glass substrate, replace band and carry encapsulation (tape carrier package, TCP) structure or cover brilliant film (chip on film, COF) traditional connected mode such as encapsulation.Carry the necessary circuit board of encapsulating structure because save the tradition band,, and can reduce cost so the design of glass top chip can be more compact on thickness and weight.In addition, the circuit connecting mode of glass top chip is the attaching mode of tradition band year encapsulating structure, can increase the reliability of LCD in humidity and vibrations, please refer to the explanation of following Figure 1A, Figure 1B and Fig. 2.
Figure 1A and Figure 1B are respectively the vertical view and the side view of known a kind of chip for driving.Please refer to Figure 1A and Figure 1B, comprising chip for driving 100 and as the projection (bump) 110 of the usefulness of electric signal connection.
Fig. 2 then is the projection and the correct diagrammatic cross-section that engages of the contact mat on the glass substrate of Figure 1B.Please refer to Fig. 2, the joint of glass top chip is projection 110 earlier in alignment with behind the contact mat on the glass substrate 200 (contact pad) 210, utilize hot pressing technology, (anisotropic conductive film ACF) 220 is bonded with each other to make chip for driving 100 and glass substrate 200 see through anisotropic conductive film.
In general, the tens of approximately microns of above-mentioned projection 110 sizes are square, are no more than 100 microns in twos apart.But following when high-resolution panel is made, the size of projection 110 and gap certainly will reduce widely; The technology qualification rate of in the technology to be taken place in hot pressing also will descend, and the cost of display panels certainly will increase.
In the technology in aforementioned hot pressing, because equipment (particularly thermal head) process deviation that precision caused may cause situation as shown in Figure 3, please refer to Fig. 3, it is the projection 110 of Figure 1B and the diagrammatic cross-section of contact mat 210 offset splice on the glass substrate 200.Because obviously skew takes place at the abutment, causes the electric signal transmission to be subjected to unnecessary impedance, it is defective to cause panel to show.And, engage (bonding) failure after, the projection 110 of chip for driving promptly produces deformation, rejoin if chip for driving pulled up again, between projection 110 and the contact mat 210 to contact meeting poorer, even cause short circuit between signal, so it is quite difficult to do over again again.Particularly the scrap of engineering failure this stage near a complete LCD panel module, can effectively reduce manufacturing cost so increase the qualification rate that the hot pressing of glass top chip.
Summary of the invention
The purpose of this invention is to provide a kind of flat-panel screens, have the alignment mark of unique layout, so that know the bias of two-d display panel when engaging by inference with chip for driving.
Another purpose of the present invention provides the bearing calibration of a kind of two-d display panel and chip for driving combined deviation, can know bias by inference by the position of observing projection and alignment mark, the qualification rate of technology with the hot pressing that increases glass top chip, and help improving and the steady display quality.
The present invention proposes a kind of flat-panel screens, comprises two-d display panel, at least one chip for driving and a plurality of alignment mark.Wherein, have a plurality of contact mats on the two-d display panel.Have a plurality of projections on the chip for driving, and chip for driving pastes on two-d display panel, and make the contact mat of two-d display panel be electrically connected with the projection of chip for driving.Each alignment mark then is provided with around each contact mat.
The present invention reintroduces the bearing calibration of a kind of two-d display panel and chip for driving combined deviation, comprises contact mat on the composition plane display panel and the projection on the chip for driving, and wherein two-d display panel also comprises a plurality of alignment marks around each contact mat.Afterwards, the position of comparison alignment mark and projection, to know the bias that engages of display panels and chip for driving by inference, the bias of foundation joint is proofreaied and correct again.
The present invention is because of adopting the layout of alignment mark, therefore be easy to observe chip for driving and be bonded on bias on the transparency carrier, follow-up when desiring to carry out the engaging of chip for driving and transparency carrier, can remove to revise board with reference to this bias, error when reducing following the joint, and boost productivity.
State with other purpose, feature and advantage and can become apparent on the present invention for allowing, a preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Figure 1A and Figure 1B are respectively the vertical view and the side view of known a kind of chip for driving.
Fig. 2 is the projection and the correct diagrammatic cross-section that engages of the contact mat on the glass substrate of Figure 1B.
Fig. 3 is the diagrammatic cross-section of the projection of Figure 1B and the contact mat offset splice on the glass substrate.
Fig. 4 A and Fig. 4 B are vertical view and the side view according to the LCD of one of the present invention preferred embodiment.
Fig. 5 is the diagrammatic cross-section of display panels and the chip for driving combined deviation of Fig. 4 B.The main element description of symbols
100: chip for driving
110: projection
200: glass substrate
210,410: contact mat
220: anisotropic conductive film
400: transparency carrier
430a, 430b, 430c, 430d: alignment mark
500: flat-panel screens
Embodiment
Fig. 5 is the partial cutaway schematic according to the flat-panel screens of the present invention's preferred embodiment.Fig. 4 A is the partial top view according to the two-d display panel of a preferred embodiment of the present invention, wherein clipped well known member in the technology for this reason.And Fig. 4 B is the diagrammatic cross-section of the B-B ' section of Fig. 4 A.Please refer to Fig. 5, Fig. 4 A and Fig. 4 B, the flat-panel screens 500 of present embodiment comprises two-d display panel 400, at least one chip for driving 100 and a plurality of alignment mark (alignmentmark) 430a, 430b, 430c, 430d.
In a preferred embodiment, two-d display panel 400 for example is display panels, active organic electroluminescent panel or other two-d display panel.And have a plurality of contact mats 410 on the two-d display panel 400, contact mat 410 usefulness so that the elements (pixel cell) in the two-d display panel 400 can be electrically connected with external circuitry.
Have a plurality of projections 110 on the chip for driving 100, wherein the material of projection 110 can be gold, but not as limit.And chip for driving 100 pastes on two-d display panel 400, and (anisotropic conductive film ACF) 220 makes the contact mat 410 of two-d display panel 400 be electrically connected with the projection 110 of chip for driving 100 to see through anisotropic conductive film.
In addition, each alignment mark 430a～430d (shown in Fig. 4 A and 4B) is arranged on the two-d display panel 400, and is provided with around each contact mat 410, with the usefulness as correction.In addition, alignment mark 430a～430d can have different shape, for example ring texture (as alignment mark 430a, 430b), relative two ㄇ shape structures (as alignment mark 430c), lay respectively at four L shape structures (as alignment mark 430d) etc. of four angle peripheries of each contact mat 410.And the alignment mark on the two-d display panel 400 can be the combination of the alignment mark or the multiple shape and structure of single a kind of shape and structure.And above-mentioned alignment mark 430a～430d can be arranged on around the plan contact mat (dummy pad), can also be arranged on around the true contact mat (real pad).In addition, the material of alignment mark 430a～430d can for example be conductor or insulator; If the material of alignment mark 430a～430d is a conductor, preferably the alignment mark 430a～430d of conductive material is arranged on and intends around the contact mat.
Please continue with reference to Fig. 4 A and Fig. 4 B, alignment mark 430a～430d can be identical or different with the spacing of corresponding each contact mat 410.For example the alignment mark 430a among Fig. 4 B and 430b respectively with corresponding contact mat 410 at a distance of 12 μ m and 8 μ m, by the arrangement of progressive mode, know bias by inference.In other words, by arranging the mode of different spacing (spacing between alignment mark and the corresponding contact mat), the staff can easierly judge this bias what are.In addition, the live width of alignment mark 430a～430d also can change according to required, and is not limited to this figure those shown.
And Fig. 5 is the diagrammatic cross-section of two-d display panel 400 with the chip for driving combined deviation of Fig. 4 B.Please refer to Fig. 5, general glass top chip (chip on glass, COG) engage be earlier with the contact mat on the two-d display panel 400 410 in alignment with the projection on the chip for driving 100 110, utilize hot pressing technology again, (anisotropic conductive film ACF) 220 is bonded with each other to make chip for driving 100 and display panels 400 see through anisotropic conductive film.And for example equipment (particularly thermal head) that technology adopts when precision has skew when two-d display panel 400 and chip for driving 100 because of hot pressing, only need the position of comparison aforesaid alignment mark 430a, 430b and projection 110, to know the bias that engages of two-d display panel 400 and chip for driving 100 by inference.For example shown in Figure 5, the projection 110 on the chip for driving 100 overlaps with alignment mark 430b, but does not reach alignment mark 430a, therefore can know the bias of joint by inference between 8 μ m～12 μ m.And follow-up machine can engage bias according to this and removes to revise board, the error when reducing following the joint, and boost productivity.
In addition, alignment mark 430a～430d can only be arranged on around some specific contact mats 410, or around intending contact mat (dummy pad) on every side.Do not transmit any signal owing to intend contact mat, so, can not influence normal signal transmission even alignment mark 430a～430d and projection 110 and plan contact mat are electrically connected because of producing skew yet.Certainly, alignment mark 430a～430d also can be arranged at existing pattern on the two-d display panel 400 around, and be not limited to the described position of present embodiment.
In sum, the present invention's characteristics are layouts that alignment mark is set around existing pattern, therefore be easy to observe chip for driving and be bonded on bias on the display panels, follow-up when desiring to carry out the engaging of chip for driving and display panels, can go to carry out the correction of board with reference to this bias, error when reducing following the joint, and boost productivity.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; any person of ordinary skill in the field; without departing from the spirit and scope of the present invention; when can doing a little change and improvement, so protection scope of the present invention is as the criterion when looking the claim person of defining.
Claims (18)
1. flat-panel screens is characterized in that comprising:
Two-d display panel has a plurality of contact mats on this two-d display panel; And
At least one chip for driving has a plurality of projections on this chip for driving, this chip for driving pastes on this two-d display panel, states these projections on above-mentioned these contact mats and this chip for driving and is electrically connected; And
A plurality of alignment marks, respectively this alignment mark is provided with around each contact mat respectively.
2. the flat-panel screens according to claim 1 is characterized in that above-mentioned these alignment marks comprise ring texture.
3. the flat-panel screens according to claim 1 is characterized in that above-mentioned these alignment marks comprise two relative Jiong shape structures.
4. the flat-panel screens according to claim 1 is characterized in that above-mentioned these alignment marks comprise to lay respectively at respectively four L shape structures of four angle peripheries of this contact mat.
5. the flat-panel screens according to claim 1 is characterized in that the material of above-mentioned these alignment marks comprises conductor or insulator.
6. the flat-panel screens according to claim 1 is characterized in that respectively this alignment mark is identical with the spacing of its corresponding respectively this contact mat.
7. the flat-panel screens according to claim 1 is characterized in that respectively this alignment mark is different with the spacing of its corresponding respectively this contact mat.
8. the flat-panel screens according to claim 1 is characterized in that this two-d display panel is display panels or active organic electroluminescent display panel.
9. the flat-panel screens according to claim 1 is characterized in that also comprising anisotropic conductive film, is arranged between this projection of this contact mat of this two-d display panel and this chip for driving.
10. the bearing calibration of two-d display panel and chip for driving combined deviation is characterized in that comprising:
A plurality of contact mats on the composition plane display panel and a plurality of projections on the chip for driving, wherein this two-d display panel also comprises respectively around a plurality of alignment marks of this contact mat respectively;
Compare the position of above-mentioned these alignment marks and above-mentioned these projections, to know the bias that engages of this two-d display panel and this chip for driving by inference; And
Proofread and correct according to this joint bias.
11., it is characterized in that above-mentioned these alignment marks comprise ring texture according to the described two-d display panel of claim 10 and the bearing calibration of chip for driving combined deviation.
12., it is characterized in that above-mentioned these alignment marks comprise two relative Jiong shape structures according to the described two-d display panel of claim 10 and the bearing calibration of chip for driving combined deviation.
13., it is characterized in that above-mentioned these alignment marks comprise to lay respectively at respectively four L shape structures of four angle peripheries of this contact mat according to the described two-d display panel of claim 10 and the bearing calibration of chip for driving combined deviation.
14., it is characterized in that the material of above-mentioned these alignment marks comprises conductor or insulator according to the described two-d display panel of claim 10 and the bearing calibration of chip for driving combined deviation.
15., it is characterized in that providing the step of this two-d display panel to comprise making that respectively this alignment mark is identical with the spacing of its corresponding respectively this contact mat according to the described two-d display panel of claim 10 and the bearing calibration of chip for driving combined deviation.
16., it is characterized in that providing the step of this two-d display panel to comprise making that respectively this alignment mark is different with the spacing of its corresponding respectively this contact mat according to the described two-d display panel of claim 10 and the bearing calibration of chip for driving combined deviation.
17. according to the described two-d display panel of claim 10 and the bearing calibration of chip for driving combined deviation, it is characterized in that engaging above-mentioned these contact mats on this two-d display panel and the step of above-mentioned these projections on this chip for driving, comprising:
With above-mentioned these contact mats on this two-d display panel in alignment with above-mentioned these projections on this chip for driving; And
Utilize hot pressing technology, make this chip for driving and this two-d display panel see through anisotropic conductive film and be bonded with each other.
18., it is characterized in that this two-d display panel is display panels or active organic electroluminescent display panel according to the described two-d display panel of claim 10 and the bearing calibration of chip for driving combined deviation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510093627 CN1924985A (en) | 2005-08-31 | 2005-08-31 | Flat display and method for correcting display panel and drive chip combined deviation |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510093627 CN1924985A (en) | 2005-08-31 | 2005-08-31 | Flat display and method for correcting display panel and drive chip combined deviation |
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| CN1924985A true CN1924985A (en) | 2007-03-07 |
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| CN 200510093627 Pending CN1924985A (en) | 2005-08-31 | 2005-08-31 | Flat display and method for correcting display panel and drive chip combined deviation |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102012571A (en) * | 2010-10-13 | 2011-04-13 | 苏州凯蒂亚半导体制造设备有限公司 | A location method of pasting ACF membrane on screen substrate of flat-panel display |
| CN102164460A (en) * | 2011-01-20 | 2011-08-24 | 苏州凯蒂亚半导体制造设备有限公司 | Alignment method for attaching chip or flexible circuit board to circuit substrate |
| CN101673524B (en) * | 2008-09-10 | 2012-06-27 | 奇景光电股份有限公司 | Data de-skew block device and method of de-skewing transmitted data |
| CN105321457A (en) * | 2014-07-21 | 2016-02-10 | 乐金显示有限公司 | Display device and method for forming the same |
-
2005
- 2005-08-31 CN CN 200510093627 patent/CN1924985A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101673524B (en) * | 2008-09-10 | 2012-06-27 | 奇景光电股份有限公司 | Data de-skew block device and method of de-skewing transmitted data |
| CN102012571A (en) * | 2010-10-13 | 2011-04-13 | 苏州凯蒂亚半导体制造设备有限公司 | A location method of pasting ACF membrane on screen substrate of flat-panel display |
| CN102012571B (en) * | 2010-10-13 | 2012-08-29 | 苏州凯蒂亚半导体制造设备有限公司 | A location method of pasting ACF membrane on screen substrate of flat-panel display |
| CN102164460A (en) * | 2011-01-20 | 2011-08-24 | 苏州凯蒂亚半导体制造设备有限公司 | Alignment method for attaching chip or flexible circuit board to circuit substrate |
| CN102164460B (en) * | 2011-01-20 | 2012-10-24 | 苏州凯蒂亚半导体制造设备有限公司 | Alignment method for attaching chip or flexible circuit board to circuit substrate |
| CN105321457A (en) * | 2014-07-21 | 2016-02-10 | 乐金显示有限公司 | Display device and method for forming the same |
| CN105321457B (en) * | 2014-07-21 | 2018-12-04 | 乐金显示有限公司 | Display device and the method for forming display device |
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