CN1924096A - Forming method for anti-corrosion layer - Google Patents
Forming method for anti-corrosion layer Download PDFInfo
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- CN1924096A CN1924096A CN 200510096698 CN200510096698A CN1924096A CN 1924096 A CN1924096 A CN 1924096A CN 200510096698 CN200510096698 CN 200510096698 CN 200510096698 A CN200510096698 A CN 200510096698A CN 1924096 A CN1924096 A CN 1924096A
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- stupalith
- forming method
- molten tin
- tin bath
- corrosion layer
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Abstract
The invention discloses a corrosion resistance layer forming method to prevent lead-free tin solder corrosively, which comprises the following steps: providing an object (tin groove, external object of tin groove or temperature-sensing bar) with metal surface; supplying a ceramic material with oxide, nitride, carbide, boride or compound of oxide, nitride, carbide and boride; adhering ceramic material on the metal surface of object; generating bond connection between ceramic material and object.
Description
Technical field
The present invention relates to a kind of forming method for anti-corrosion layer, particularly a kind of at Pb-free solder highly corrosive and the forming method for anti-corrosion layer developed, being applied to the peripheral objects of molten tin bath, molten tin bath, or sensing rod for temperature.
Background technology
Traditional tinsel scolding tin is because mechanical properties, welding compatibility, wettability and engagement characteristics etc. are all good, and cost is low, can make the scolding tin of the high, medium and low fusing point of many differences again because of the adjustment of composition, therefore, be widely used for example comparatively known electronic packaging grafting material for a long time always.
Yet because very harmful to HUMAN HEALTH of contained lead in the scolding tin composition, the decree of being correlated with just actively revise in countries in the world at present, bans use of plumbiferous material, and therefore, each correlative study mechanism actively drops into the research and development of Pb-free solder invariably.From research and development achievement in the past few years, concentrate on unleaded new scolding tin exploitation mostly, though yet Pb-free solder can meet unleaded requirement, but has higher corrosive problem on the contrary, cause meetings such as molten tin bath (comprising general weld groove and wave soldering groove or the like) or molten tin bath peripheral objects to be corroded, but do not obtain adequate solution always by these Pb-free solders.
For example, as shown in Figure 1, it is the disclosed utility model patent of TaiWan, China patent TW421094, should existing patent disclosure one molten tin bath structure, this molten tin bath structure has a molten tin bath 1, this molten tin bath 1 outside then is provided with a motor 12, this motor 12 drives a rotating shaft 14 that is set up in molten tin bath 1 opening edge place by a belt 13 and rotates, the inboard of this molten tin bath 1 also is provided with a splitter box 15, and an end of this rotating shaft 14 then stretches in molten tin bath 1, also is provided with a runner 16 on this splitter box 15.Wherein, this is arranged at the motor 12 on the not shown permanent seat, can drive rotating shaft 14 rotations by belt 13, this splitter box 15 can make scolding tin flow out in splitter box 15 again, and overflow, and then contact and realize the effect of scolding tin with circuit card (not shown) on being set up in substrate via runner 16.
If in the time of should having patent use Pb-free solder now, not only its molten tin bath 1 subjects to the Pb-free solder corrosion, and every any molten tin bath peripheral objects that contacts to some extent with Pb-free solder (for example used agitating vane in the wave soldering groove, or splitter box 15 and runner 16 or the like), all will suffer the corrosion of Pb-free solder.
Relevant Sn-Cu, Sn-Bi, studies show that of Sn-Ag-Cu lead-free alloy wave soldering, the main problem of these Pb-free solders is poor for welding production efficiency, soldering tin block is peeled off (fillet lifting), the wettability of scolding tin on the PCB assembly is not good, the welding slag amount increases, the stripping of the change of manufacturing processed interalloy composition and pollution continuously, molten tin bath metal and the equipment that lacks enough warm-up ability are the molten tin bath material with the stainless steel of 300 series mostly, some manufacturers carries out special processing with it, and some then is material with the grey cast iron.Under general regular service condition, the molten tin bath life-span of plumber's solder can be for 5～6 years.As for Pb-free solder; then owing to have higher tin content; and service temperature exceeds about 50 ℃ of traditional tinsels; its fused tin attacks and dissolves the chromic oxide protective layer of stainless steel surface easily; and the molten tin bath metal is dissolved in the fusion scolding tin gradually; cause the corrosion of molten tin bath at last, even bore a hole, break.This is Pb-free solder and has higher corrosive one of them reason.
Therefore, have for higher corrosive Pb-free solder, how to make the peripheral objects of molten tin bath (general weld groove and wave soldering groove etc.), molten tin bath or sensing rod for temperature or the like can have anticorrosive function, desire a big problem that overcomes and solve for the present invention for described.
Summary of the invention
Forming method for anti-corrosion layer of the present invention mainly is can resist the higher corrosive etch resistant layer of Pb-free solder to be shaped by with all or part of metallic surface of stupalith attached to an object so that the work-ing life of object unlikely shortening.
For solving above-mentioned all problems, the invention provides a kind of forming method for anti-corrosion layer, in order to resist the higher corrodibility of Pb-free solder, this forming method for anti-corrosion layer comprises:
One object is provided, and this object has the metallic surface;
One stupalith with mixture of oxide compound, nitride, carbide, boride or this oxide compound, nitride, carbide and boride is provided;
This stupalith is attached to the metallic surface of this object; And
Make between the metallic surface of this stupalith and this object and produce bond.
According to technical conceive of the present invention, wherein this stupalith is aqueous or paste, and this stupalith is attached to the metallic surface of this object by the mode of spraying, spilling, being coated with, smearing.
According to technical conceive of the present invention, wherein this stupalith is lump shape or hard sheet, and this stupalith is by metallic surface glutinous, that mode that paste is attached to this object.
According to technical conceive of the present invention, wherein the principal constituent of this stupalith comprises SiO
2, Al
2O
3, B
2O
2, Na
2O, K
2O, Li
2O, CaO and CoO, MgO, Fe
2O
3, TiO
2, SiC, AlN and NiO mixture.
According to technical conceive of the present invention, wherein this Pb-free solder is the Pb-free solder of Sn base, for example Sn-Ag-Cu, Sn-Cu or Sn-Ag.
According to technical conceive of the present invention, wherein this stupalith is attached to the part metals surface of this object, and this part metals surface contacts with Pb-free solder.
According to technical conceive of the present invention, wherein this object is the peripheral objects of sensing rod for temperature, molten tin bath or molten tin bath.
According to technical conceive of the present invention, wherein the peripheral objects of this molten tin bath is splitter box, runner, nozzle or agitating vane.
According to technical conceive of the present invention, wherein this object is a molten tin bath, this molten tin bath has a plurality of inwalls, wherein between the opposed inner walls further cross-over connection the outer tube of at least one hollow is arranged, the middle vacancy of this outer tube is interspersed with a heating tube, and each inwall of this molten tin bath and the outer tube wall of this outer tube are the metallic surface, and this stupalith is attached to the inwall of this molten tin bath and the outer tube wall of this outer tube.
Advantage of the present invention and beneficial effect are: because the environmental protection factor, and need use the higher Pb-free solder of corrodibility, by method of the present invention, can the peripheral objects of molten tin bath, molten tin bath or sensing rod for temperature etc. can with object that Pb-free solder contacts on, be formed with etch resistant layer, with the higher corrodibility of antagonism Pb-free solder, Pb-free solder will be difficult to corrode or corrode described each object, and shorten with regard to unlikely the work-ing life of described each object.
Secondly with regard to being subject to Pb-free solder corrosive stainless steel, when its by method of the present invention after stainless steel surface or part surface are formed with etch resistant layer, then can be and continue under the situation that the contact Pb-free solder reaches 1000 hours at 500 ℃ high temperature, still can not corrode situation, say nothing of only about about 260 ℃ of the service temperature of general wave soldering, so more reaction does not take place, and really can have longer work-ing life.
In sum, a kind of forming method for anti-corrosion layer provided by the present invention can solve Pb-free solder and be easy to corrode the various significant problems that are in contact with it object.
Description of drawings
Fig. 1 is the schematic appearance of existing molten tin bath.
Fig. 2 is the first pass figure of forming method for anti-corrosion layer of the present invention.
Fig. 3 is second schema of forming method for anti-corrosion layer of the present invention.
Fig. 4 is applied to the cross-sectional schematic of a molten tin bath for forming method for anti-corrosion layer of the present invention.
Wherein, description of reference numerals is as follows:
1 molten tin bath
12 motors, 13 belts
14 rotating shafts, 15 splitter boxs
16 runners
2 molten tin baths
21 inwalls, 22 outer tubes
23 heating tubes, 3 sensing rod for temperature
4 etch resistant layer 4a etch resistant layers
The 4a etch resistant layer
Embodiment
For further understanding feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing.
See also Fig. 2～Fig. 4, the invention provides a kind of forming method for anti-corrosion layer, be higher corrodibility in order to the antagonism Pb-free solder, it comprises first to the 3rd totally three kinds of embodiment, first embodiment is this etch resistant layer that is shaped on existing object, second embodiment further comprises the manufacturing and the processing of predetermined object, and the 3rd embodiment then is formed with this etch resistant layer at a molten tin bath with a plurality of heating tubes.
＜the first embodiment 〉
See also Fig. 2, it is for being formed with the method for this etch resistant layer on an existing object.The manufacturing process of this etch resistant layer comprises provides an object earlier, and this object has metallic surface (S201); And then a stupalith is attached to the metallic surface (S203) of this object, wherein, this stupalith has oxide compound or nitride or carbide or boride, again or the mixture of this oxide compound, nitride, carbide and boride etc.; Last then make between the metallic surface of this stupalith and this object and produce bond (S205), on the metallic surface of this object, to be shaped by the etch resistant layer that stupalith was constituted.
Wherein, produce the mode of bond between this stupalith and the metallic surface, for making the stupalith drying of having adhered to earlier, again the stupalith on this object and this object is heat-treated and burnt till, make stupalith firmly be difficult to peel off attached to the metallic surface.This stupalith is attached to all or part of metallic surface of this object, and the part metals surface of so-called this object refers to arbitrary part that this object can contact with Pb-free solder.
Moreover this object can be the peripheral objects of molten tin bath (general weld groove or wave soldering groove), molten tin bath or sensing rod for temperature or the like.And agitating vane that this peripheral objects is splitter box, runner, nozzle or wave soldering groove to be used or the like, it all can use the inventive method and the etch resistant layer that is shaped.
As for this stupalith, it can be aqueous or paste, therefore can be attached to the metallic surface (or part metals surface) of this object by the mode of spray, spilling, being coated with, smearing, can also starch the metallic surface that mode that spraying plating, thermospraying or slurry be coated with is attached to this object with electricity; This stupalith also can be lump shape or hard sheet, therefore can be by metallic surface (or part metals surface) glutinous, that mode that paste is attached to this object.Wherein, with spraying plating of electricity slurry or the prepared etch resistant layer of thermospraying, do not need again in addition thermal treatment; Ceramic size coating layer with various artificial coatings or mechanical coating method then needs through Overheating Treatment, the ceramic size coating layer is fired on steel surface and the etch resistant layer that is shaped, before burning till the object of coating can be with drying oven with 60 to 120 ℃ of warm airs or radiant drying to 150 to 250 ℃, carried out drying in 5 to 25 minutes, generally between 600 to 1000 ℃, surface ceramic slurry firing temperature is then between 700 to 2000 ℃ for bottom ceramic size firing temperature; Even also can be heated to more than the sintering temperature of pottery (powder) material.
＜the second embodiment 〉
See also Fig. 3, it has further comprised the manufacturing and the processing of predetermined object.The manufacturing process of this etch resistant layer comprises provides a stainless steel plate (S301) earlier, and this stainless steel plate for example can be that the Austenite of SUS301, SUS304 and SUS316 etc. is a stainless steel plate; Utilize this stainless steel plate to be processed into a predetermined object (S303) again, this predetermined object can be the peripheral objects or the sensing rod for temperature of molten tin bath, molten tin bath, and its processing units can be punch press, welding machine etc.; Then clean the predetermined object of being processed into (S305) that is somebody's turn to do again, be beneficial to adhering to of etch resistant layer, and its cleaning equipment can be rinse bath etc.; Then then whole the or predetermined portion of this predetermined object is carried out surface treatment (S307), the so-called predetermined portion that should be scheduled to object, be meant arbitrary part that this predetermined object can contact with Pb-free solder, as for the surface-treated method, promptly providing a ceramic material layer and this ceramic material layer to comprise various for example oxide compounds or nitride or carbide or boride, again or the stupalith of the mixture of this oxide compound, nitride, carbide and boride or the like, and its surface treatment utilize surface processing equipment to carry out; And then described stupalith is attached to the whole or predetermined portion (S309) of this predetermined object, and the purpose in order to realize adhering to is used ceramic adhering tool or ceramic attachment device; And wait for accompanying stupalith drying (S311), and its drying can be used drying oven; Last then this predetermined object that has been attached with stupalith is heat-treated and burn till (S313), make stupalith can and this predetermined surface between produce bond, being shaped on this predetermined object surfaces by the etch resistant layer that stupalith was constituted, and its thermal treatment can be used process furnace.
＜the three embodiment 〉
See also Fig. 4, it is for to be formed with this etch resistant layer 4,4a at a molten tin bath 2 with a plurality of heating tubes 23.This forming method for anti-corrosion layer comprises: a molten tin bath 2 at first is provided, and this molten tin bath 2 has the inwall 21 of a plurality of metals, and wherein between the opposed inner walls 21 cross-over connection the metal outer pipe 22 of a plurality of hollows is arranged, and respectively the hollow inside of this outer tube 22 is interspersed with a heating tube 23; Provide one to have oxide compound or nitride or carbide or boride, again or the stupalith (not shown) of the mixture of this oxide compound, nitride, carbide and boride etc. again; Then this stupalith is attached to the inwall 21 of this molten tin bath 2 and the outer tube wall of this outer tube 22; Last then make and produce bond between the inwall 21 of this stupalith and this molten tin bath 2 and as shown in the figure the etch resistant layer 4 of being shaped, in addition and produce bond between the outer tube wall of this outer tube 22 and as shown in the figure the etch resistant layer 4a of being shaped, so can on the outer tube wall of the inwall 21 of this molten tin bath 2 and this outer tube 22, be shaped by etch resistant layer 4 and the 4a that stupalith constituted.
Wherein, between the inwall 21 of this stupalith and this molten tin bath 2 and and the outer tube wall of this outer tube 22 between produce the mode of bond, make the stupalith drying of having adhered to earlier, again this is had the molten tin bath 2 of a plurality of outer tubes 22 and the stupalith on this molten tin bath 2 and the stupalith on the outer tube 22 and heat-treat and burn till, make stupalith can be firmly be difficult to peel off attached to the outer tube wall of the inwall 21 of molten tin bath 2 and outer tube 22.This stupalith is attached to all or part of metal inner surface 21 of this molten tin bath 2, and the part metals inwall 21 of so-called this molten tin bath 2 is meant arbitrary part that this inwall 21 can contact with Pb-free solder.
Moreover, further probeing into a sensing rod for temperature 3 in this molten tin bath 2, described stupalith also further is attached on this sensing rod for temperature 3, makes between this sensing rod for temperature 3 and this stupalith to produce bond and as shown in the figure the etch resistant layer 4b of being shaped again.As everyone knows, molten tin bath 2 is not single only to have sensing rod for temperature 3 to contact with Pb-free solder, every a plurality of peripheral objects that are applied to molten tin bath 2 also can contact with Pb-free solder, therefore, these peripheral objects that comprise splitter box, runner, nozzle or be used for the agitating vane or the like of wave soldering groove also all can be used the inventive method and the etch resistant layer that is shaped.
As for this stupalith, it can be aqueous or paste, therefore can be attached to the inwall 21 (or part inwall) of this molten tin bath 2 and the outer tube wall of this outer tube 22 by the mode of spray, spilling, being coated with, smearing, can also starch the mode that spraying plating, thermospraying or slurry be coated with electricity and be attached to the inwall (or part inwall) of this molten tin bath 2 and the outer tube wall of outer tube 22; This stupalith also can be lump shape or hard sheet, therefore can be attached to the inwall 21 of this molten tin bath 2 and the outer tube wall of this outer tube 22 by mode glutinous, that paste.Wherein, with spraying plating of electricity slurry or the prepared etch resistant layer of thermospraying, do not need again in addition thermal treatment; Ceramic size coating layer with various artificial coatings or mechanical coating method then needs through Overheating Treatment, the ceramic size coating layer is fired on steel surface and the etch resistant layer that is shaped, before burning till the molten tin bath of coating can be with drying oven with 60 to 120 ℃ of warm airs or radiant drying to 150 to 250 ℃, carried out drying in 5 to 25 minutes, generally between 600 to 1000 ℃, surface ceramic slurry firing temperature is then between 700 to 2000 ℃ for bottom ceramic size firing temperature; Even also can be heated to more than the sintering temperature of pottery (powder) material.Aforesaid first～the 3rd embodiment all can be by the etch resistant layer of formed thereby, and can resist the higher corrodibility of Pb-free solder, work-ing life unlikely shortening.As for the stupalith among this first～the 3rd embodiment, its principal constituent comprises SiO
2, Al
2O
3, B
2O
2, Na
2O, K
2O, Li
2O, CaO and CoO, MgO, Fe
2O
3, TiO
2, SiC, AlN and NiO mixture; And the etch resistant layer by the inventive method formed thereby, the Pb-free solder that it was suitable for is many Pb-free solders of Sn base such as Sn-Ag-Cu, Sn-Cu or Sn-Ag for example.
Characteristics of the present invention and advantage are as follows:
Even because environmental protection factor, and need use the higher Pb-free solder of corrodibility, yet by method of the present invention, can the peripheral objects of molten tin bath, molten tin bath or sensing rod for temperature etc. can with object that Pb-free solder contacts on, be formed with etch resistant layer, with the higher corrodibility of antagonism Pb-free solder, Pb-free solder will be difficult to corrode or corrode each object, and shorten with regard to unlikely the work-ing life of each object.
Secondly with regard to being subject to Pb-free solder corrosive stainless steel, when its by the inventive method after stainless steel surface or part surface are formed with etch resistant layer, then can be at 500 ℃ high temperature, and continue under the situation that the contact Pb-free solder reaches 1000 hours, the corrosive situation can not take place still, say nothing of only about about 260 ℃ of the service temperature of general wave soldering, more reaction takes place, and really can have longer work-ing life.
In sum, a kind of forming method for anti-corrosion layer provided by the present invention, can solve Pb-free solder and be easy to corrode the various significant problems that contact object with it, belong to an inventive method with high industrial utilization, go for the object that any need contact with Pb-free solder, increased effect really.
Yet the above only is preferable feasible embodiment of the present invention, and is not to be used to limit the scope of the present invention that the equivalent variations that every utilization specification sheets of the present invention and accompanying drawing are done all should be contained in the scope of the present invention.
Claims (10)
1, a kind of forming method for anti-corrosion layer, in order to the higher corrodibility of antagonism Pb-free solder, this forming method for anti-corrosion layer comprises:
One object is provided, and this object has the metallic surface;
One stupalith with mixture of oxide compound, nitride, carbide, boride or this oxide compound, this nitride, this carbide and this boride is provided;
This stupalith is attached to the metallic surface of this object; And
Make between the metallic surface of this stupalith and this object and produce bond.
2, forming method for anti-corrosion layer as claimed in claim 1, wherein this stupalith is aqueous or paste, and this stupalith is attached to the metallic surface of this object by the mode of spraying, spilling, being coated with, smearing.
3, forming method for anti-corrosion layer as claimed in claim 1, wherein this stupalith is lump shape or hard sheet, and this stupalith is by metallic surface glutinous, that mode that paste is attached to this object.
4, forming method for anti-corrosion layer as claimed in claim 1, wherein the principal constituent of this stupalith comprises SiO
2, Al
2O
3, B
2O
2, Na
2O, K
2O, Li
2O, CaO and CoO, MgO, Fe
2O
3, TiO
2, SiC, AlN and NiO mixture.
5, forming method for anti-corrosion layer as claimed in claim 1, wherein this Pb-free solder is the Pb-free solder of Sn base.
6, forming method for anti-corrosion layer as claimed in claim 5, wherein the Pb-free solder of this Sn base is Sn-Ag-Cu, Sn-Cu or Sn-Ag.
7, forming method for anti-corrosion layer as claimed in claim 1, wherein this stupalith is attached to the part metals surface of this object, and this part metals surface contacts with Pb-free solder.
8, forming method for anti-corrosion layer as claimed in claim 1, wherein this object is the peripheral objects of sensing rod for temperature, molten tin bath or molten tin bath.
9, forming method for anti-corrosion layer as claimed in claim 8, wherein the peripheral objects of this molten tin bath is splitter box, runner, nozzle or agitating vane.
10, forming method for anti-corrosion layer as claimed in claim 1, wherein this object is a molten tin bath, this molten tin bath has a plurality of inwalls, wherein between the opposed inner walls further cross-over connection the outer tube of at least one hollow is arranged, the middle vacancy of this outer tube is interspersed with a heating tube, and each inwall of this molten tin bath and the outer tube wall of this outer tube are the metallic surface, and this stupalith is attached to the inwall of this molten tin bath and the outer tube wall of this outer tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510096698 CN1924096A (en) | 2005-08-30 | 2005-08-30 | Forming method for anti-corrosion layer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510096698 CN1924096A (en) | 2005-08-30 | 2005-08-30 | Forming method for anti-corrosion layer |
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| Publication Number | Publication Date |
|---|---|
| CN1924096A true CN1924096A (en) | 2007-03-07 |
Family
ID=37816913
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|---|---|---|---|
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102260086A (en) * | 2011-05-19 | 2011-11-30 | 武汉长利玻璃有限责任公司 | Ceramic coating capable of resisting high-temperature corrosion for protecting hanging part in tin bath of float glass and preparation method thereof |
| CN102560490A (en) * | 2010-12-28 | 2012-07-11 | 鸿富锦精密工业（深圳）有限公司 | Antiseptic treatment method for surfaces of aluminum and aluminum alloy and products thereof |
| CN107335882A (en) * | 2017-08-28 | 2017-11-10 | 山东鸿荣电子有限公司 | Dip-soldering machine and production line |
| CN107858627A (en) * | 2017-11-24 | 2018-03-30 | 安徽江南泵阀有限公司 | A kind of method for improving fracturing pump anti-stress corrosiveness |
-
2005
- 2005-08-30 CN CN 200510096698 patent/CN1924096A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102560490A (en) * | 2010-12-28 | 2012-07-11 | 鸿富锦精密工业（深圳）有限公司 | Antiseptic treatment method for surfaces of aluminum and aluminum alloy and products thereof |
| CN102260086A (en) * | 2011-05-19 | 2011-11-30 | 武汉长利玻璃有限责任公司 | Ceramic coating capable of resisting high-temperature corrosion for protecting hanging part in tin bath of float glass and preparation method thereof |
| CN102260086B (en) * | 2011-05-19 | 2013-06-19 | 武汉长利玻璃有限责任公司 | Ceramic coating capable of resisting high-temperature corrosion for protecting hanging part in tin bath of float glass and preparation method thereof |
| CN107335882A (en) * | 2017-08-28 | 2017-11-10 | 山东鸿荣电子有限公司 | Dip-soldering machine and production line |
| CN107858627A (en) * | 2017-11-24 | 2018-03-30 | 安徽江南泵阀有限公司 | A kind of method for improving fracturing pump anti-stress corrosiveness |
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